TC72-5.0MUATR - Microchip Technology, Inc.

TC72

Features

• Temperature - to-Di gital Converter

• SPI Compatible Interface

• 10-Bit Resolution (0.25°C/Bit)

• ±2°C (maximum) Accuracy from -40°C to +85°C

• ±3°C (maximum ) Accuracy from -55°C to +125°C

• 2.65V to 5.5V Operating Range

• Low Power Consumption:

- 250 µA (typic al) C onti nuo us Tempera ture

Conve r si on Mo de

- 1 µA (maximum) Shutdown Mode

• Power Saving One-Shot Temperature

Measurement

• Industry Standard 8-Pin MSOP Package

• Space Saving 8-Pin DFN (3x3 mm) Package

Typical Applications

• Personal Computers and Servers

• Hard Disk Drives and Other PC Peripherals

• Entertainment Systems

• Office Equipment

• Datacom Equipment

• Mobile Phones

• General Purpose Temperature Monitoring

Package Types

General Description

TC72 is a digital temperature sensor capable of

reading temperatures from -55°C to +125°C. This

sensor features a serial interface that allows

communication with a host controller or other

peripherals. The TC72 interface is compatible with the

SPI protocol, and does not require any additional

external componen ts. Howe ver , it is recommend ed that

a decoupling capacitor of 0.01 µF to 0.1 µF be provided

between the VDD and GND pins.

TC72 can be used either in a Continuous Temperature

Conversion mode or a One-Shot Conversion mode.

The Continuous Conversion mode measures the

temperature approximately every 150 ms and stores

the data in the temperature registers. In contrast, the

One-Shot mode performs a single temperature

measurement and returns to the power saving

shutdown mode.

TC72 fea tures high tem perature ac curacy, ease-o f-use

and is the ideal solution for implementing thermal

management in a variety of systems. The device is

available in both 8-pin MSOP and 8-pin DFN space-

saving packages. TC72 also features a Shutdown

mode for low power operation.

Block Diagram

SCK

GND

SDI

5SDO

VDD

TC72

3x3 DFN*

SCK

GND

SDO

5SDI

VDD

* Includes Exposed Thermal Pad (EP); see Table 3-1.

TC72

MSOP

TC72

Diode

Temperature

Sensor

VDD

SCK

Serial

Port

Interface

10-Bit

Sigma Delta

A/D Converte r

Temperature

Internal

Control

Manufacturer

ID Register

GND

SDO

SDI

Digital Temperature Sensor with SPI Interface

TC72

NOTES:

TC72

1.0 ELECTRICAL

CHARACTERISTICS

1.1 Maximum Ratings†

VDD........................................................................6.0V

All inputs and outputs w.r.t. GND ...-0.3V to VDD +0.3V

Storage temperature..........................-65°C to +150°C

Ambient tem p. with powe r appli ed.....-55°C to +125°C

Junction Temperature ........................................ 150°C

ESD protection on all pins:

Human Body Model (HBM).............................> 4 kV

Man Machine Model (MM).............................> 400V

Latch-Up Current at each pin ........................±200 mA

Maximum Power Dissipation...........................250 mW

† Notice: Stresses above those listed under "Maximum

Ratings" may cause permanent damage to the device. This is

a stress rating only and functional operation of th e device at

those or any other conditions above those indicated in the

operation listings of this specification is not implied. Exposure

to maximum rating conditions for extended periods may affect

device reliability.

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, all parameters apply at VDD = 2.65V to 5.5V,

TA = -55°C to +125°C.

Parameters Sym Min Typ Max Units Conditions

Power Supply

Operati ng Voltage Ran ge VDD 2.65 — 5.5 V Note 1

Operati ng Curren t:

Normal Mode, ADC Active IDD-CON — 250 400 µA Continuous Temperature Conversion

mode (Shutdown Bit = ‘0’)

Shut-Down Supply Current ISHD — 0.1 1.0 µ A Shutdown mode (Shutdown Bit = ‘1’)

Temperature Sensor and Analog -to-Digi tal Converter

Temperature Accuracy

(Note 1)TACY -2.0 — +2.0 °C -40°C < TA < +85°C

-3.0 — +3.0 -55°C < TA < +125°C

Resolution — 10 — Bits Note 4

ADC Conversion Ti me tCONV — 150 200 ms

Digital Input / Output

High Level Input Voltage VIH 0.7 VDD —— V

Low Level Input Voltage VIL ——0.2 V

DD V

High Level Output Voltage VOH 0.7 VDD —— VI

OH = 1 mA

Low Level Output Voltage VOL ——0.2 V

DD VI

OL = 4 mA

Input Resistance RIN 1.0 — — MΩ

Pin Capacitance CIN —15—pF

COUT —50—

Note 1: The TC72 -2.8 MXX, TC7 2-3.3MXX and TC72-5.0MXX will operate from a sup ply vol t ag e of 2. 65V to 5.5V.

However, the TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal

operating voltages of 2.8V, 3.3V and 5.0V respectively. As VDD varies from the nominal operating value,

the accuracy may be degraded. Refer to Figure 2-5 and Figure 2-6.

2: Measured with a load of CL = 50 pF on the SDO output p in of the TC72.

3: All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise

and fall times. The rise and fall times are defined as the 10% to 90% transition time.

4: Resolution = Temperature Range/No. of Bits = (+127°C – -128°C) / (210) = 256/1024 = 0.25°C/Bit

TC72

Serial Port AC Timing (Note 2,3)

Clock Frequency fCLK DC — 7.5 MHz

SCK Low Time tCL 65 — — ns

SCK High Time tCH 65 — — ns

CE to SCK Setup tCC 400 — — ns

SCK to Data Out Valid tCDD — — 55 ns

CE to Output Tri-state tCDZ — — 40 ns

SCK to Data Hold Time tCDH 35 — — ns

Data to SCK Set-up Time tDC 35 — — ns

SCK to CE Hold Time tCCH 100 — — ns

SCK Rise Time tR——200ns

SCK Fall Time tF——200ns

CE Inactive Time tCWH 400 — — ns

TEMPE RATURE SPECIFICATION

Electrical Specifications: Unless otherwise noted, all parameters apply at VDD = 2.65V to 5.5V,

TA = -55°C to +125°C.

Parameters Sym Min Typ Max Units Conditions

Temperature Ranges

Specified Temperature Range TA-55 — +125 °C

Operati ng Tempe rature Range TA-55 — +125 °C

Storage Temperature Range TA-65 — +150 °C

Thermal Package Resistances

Thermal Resistance 8-L 3x3 DFN θJA —56.7—°C/W

Thermal Resistance 8-L MSOP θJA —211—°C/W

DC CHARACTERISTICS (CONTINUE D)

Electrical Specifications: Unless otherwise noted, all parameters apply at VDD = 2.65V to 5.5V,

TA = -55°C to +125°C.

Parameters Sym Min Typ Max Units Conditions

Note 1: The TC72 -2.8 MXX, TC72-3.3MXX and TC72-5.0MXX will operate from a sup ply vol t ag e of 2.65V to 5.5V.

However, the TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal

operating voltages of 2.8V, 3.3V and 5.0V respectively. As VDD varies from the nominal operating value,

the accuracy may be degraded. Refer to Figure 2-5 and Figure 2-6.

2: Measured with a load of CL = 50 pF on the SDO output pin of th e TC72.

3: All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise

and fall times. The rise and fall times are defined as the 10% to 90% transition time.

4: Resolution = Temperature Range/No. of Bits = (+127°C – -128°C) / (210) = 256/1024 = 0.25°C/Bit

TC72

FIGURE 1-1: Serial Port Timing Diagrams.

1/fCLK

tCL

tCH

D7 D0

HIGH Z

SDI

SPI READ DATA TRANSFER

1/fCLK

tCC

A7 = 1

tCL

tCH

D7 D0

SDI A0

tDC tCDH

tFtR

tDC tCDH

SCK tCC

(CP = 0, data shifted on rising edge of SCK, data clo cked on falling edge of SCK, A7 = 0)

(CP = 0, data shifted on rising edge of SCK, data clo cked on falling edge of SCK, A7 = 1)

tCDD

SDO

SCK

tCCH

tCWH

tCDZ

HIGH Z

tCWH

tCCH

Note: The timing diagram is drawn with CP = 0. The TC72 also functions with CP = 1;

however, the edges of SCK are reversed as defined in Table 4-3 and Figure 4-2.

SPI WRITE DATA TRANSFER

MSb LSb

MSb LSb MSb LSb

TC72

NOTES:

TC72

2.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125°C.

FIGURE 2-1: Accuracy vs. Temperature

(TC72-X.XMXX).

FIGURE 2-2: Supply Current vs. Supply

Voltage.

FIGURE 2-3: Supply Cur rent vs .

Temperature.

FIGURE 2-4: Shutdown Current vs.

Temperature.

FIGURE 2-5: Temperature Accuracy vs.

Supply Voltage (TC72-2.8MX X).

FIGURE 2-6: Temperature Accuracy vs.

Supply Voltage (TC72-5.0MX X).

Note: The gra phs and tab les prov ided fo llow ing this note are a sta tistic al sum mary b ased on a limit ed numb er of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

-3.5

-3

-2.5

-2

-1.5

-1

-0.5

0.5

1.5

2.5

3.5

-55 -25 5 35 65 95 125

Reference Temperature (°C)

Temperature Error (°C)

Lower Specification Limit

Upper Specification Limit

Mean + 3

Mean - 3

Mean

200

210

220

230

240

250

260

2.5 3.0 3.5 4.0 4.5 5.0 5.5

Supply Current (µA)

Supply Voltage (V)

TA= +25°C

TA= +125°C

TA= -55°C

TC72-X.XMXX

100

150

200

250

300

350

400

-55 -25 5 35 65 95 125

Supply Current (uA)

Temperature (°C)

TC72-5.0MXX

VDD = 5.0V

TC72-3.3MXX

VDD = 3.3V

TC72-2.8MXX

VDD = 2.8V

0.00

0.05

0.10

0.15

0.20

-55 -25 5 35 65 95 125

Shutdown Current (µA)

Temperature (°C)

TC72-5.0MXX

VDD = 5.0V

TC72-5.0MXX

VDD = 2.8V

TC72-3.3MXX

VDD = 3.3V

-0.4

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3

0.4

2.6 2.7 2.8 2.9 3.0

Temperature Change (°C)

Supply Voltage (V)

TA= +25°C

TA= -25°C

TA= +85°C

TC72-2.8MXX

-1.0

-0.8

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0.8

1.0

4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5

Temperature Change (°C)

Supply Voltage (V)

TA= +25°C

TA= -25°C

TA= +85°C

TC72-5.0MXX

TC72

Note: Unless otherwise indicated, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125°C.

FIGURE 2-7: Histogram of Temperature

Accuracy at -55 Degrees C.

FIGURE 2-8: Histogram of Temperature

Accuracy at -40 Degrees C.

FIGURE 2-9: Histogram of Temperature

Accuracy at +25 Degrees C.

FIGURE 2-10: Histogram of Temperature

Accurac y at +65 Degree s C.

FIGURE 2-11: Histogram of Temperature

Accurac y at +85 Degree s C.

FIGURE 2-12: Histogram of Temperature

Accuracy at +125 Degrees C.

-3

-2.5

-2

-1.5

-1

-0.5

0.5

1.5

2.5

Percentage of Occurances (%)

Temperature Error (°C)

TC72-X.XMXX

Sample Size = 166

TA= -55°C

-2 -1.5 -1 -0.5 0 0.5 1 1.5 2

Percentage of Occurances (%)

Temperature Error (°C)

TC72-X.XMXX

Sample Size = 166

TA= -40°C

-1.50

-1.25

-1.00

-0.75

-0.50

-0.25

0.00

0.25

0.50

0.75

1.00

1.25

1.50

Percentage of Occurances (%)

Temperature Error (°C)

TC72-X.XMXX

Sample Size = 166

TA= +25°C

-1.50

-1.25

-1.00

-0.75

-0.50

-0.25

0.00

0.25

0.50

0.75

1.00

1.25

1.50

Percentage of Occurances (%)

Temperature Error (°C)

TC72-X.XMXX

Sample Size = 166

TA= +65°C

-2 -1.5 -1 -0.5 0 0.5 1 1.5 2

Percentage of Occurances (%)

Temperature Error (°C)

TC72-X.XMXX

Sample Size = 166

TA= +85°C

-3

-2.5

-2

-1.5

-1

-0.5

0.5

1.5

2.5

Percentage of Occurances (%)

Temperature Error (°C)

TC72-X.XMXX

Sample Size = 166

TA= +125°C

TC72

3.0 PIN DESCRIPTION

Pin functio nal iti es are des cri be d in Table 3-1.

3.1 No Connection (NC)

This pin is not internally connected to the die.

3.2 Serial Clock Input (SCK)

The SCK pin is an Input pin. All communication and

timing is relative to the signal on this pin. The clock is

generated by the host controller on the SPI bus (see

Section 4.3 “Serial Bus Interface”).

3.3 Chip Enable Input (CE)

The CE is a Chip Enable pin. This is an active high

input, therefore the device is enabled when CE is

toggled to VDD. Once the device is enabled, all serial

communication begins (see Section 4.3 “Serial Bus

Interface”).

3.4 Ground (GND)

The GND is the system Ground pin.

3.5 Serial Data Input (SDI)

The SDI i s a Da t a In pu t pin , us ed to tra ns mi t data from

the host to the device (see Section 4.3 “Serial Bus

Interface”).

3.6 Serial Data Output (SDO)

The SDO is a Data Output pin, used to transmit data

from the device to the host (see Section 4.3 “Serial

Bus Interface”).

3.7 Power Supply (VDD)

VDD is the Power pin. The operating voltage range, as

specified in the DC electrical specification table, is

applied on this pin.

3.8 Exposed Pad (EP)

There is an internal electrical connection between the

Exposed Therma l Pad (EP) and the GN D pin; they can

be connected to the same potential on the Printed

Circuit Board (PCB). This provides better thermal

conduction from the PCB to the die.

TABLE 3-1: PIN FUNCTION TABLE

TC72 Symbol Function

3x3 DFN MSOP

1 1 NC No internal connection

2 3 SCK Serial Clock input

3 2 CE Chip Enable input, the device is selected when this input is high

4 4 GND Ground

5 6 SDI Serial Data i npu t

6 5 SDO Serial Data outp ut

7 7 NC No internal connection

88V

DD Power supply

9 — EP Exposed pad (Ground)

TC72

NOTES:

TC72

4.0 FUNCTIONAL DESCRIPTION

TC72 c onsis ts of a band-gap type tempera ture sensor,

a 10-bit Sigma Delta Analog-to-Digital Converter

(ADC), an internal conversion oscillator and a double

buff er digit al output po rt. The 10-bi t ADC is sc aled from

-128°C to +127°C; therefore, the resolution is 0.25°C

per bit. The ambient temperature operating range of

the TC72 is specified from -55°C to +125°C.

This device features a four-wire serial interface that is

fully compatible with the SPI specification and, there-

fore, allows simple communications with common

microcontrollers and processors. TC72 can be used

either in a Continuous Temperature Conversion mode

or a One-Shot Conversion mode. TC72 temperature

measurements are performed in the background and,

therefore, reading the temperature via the serial I/O

lines does not affect the measurement in progress.

The Continuous Conversion mode measures the

temperature approximately every 150 ms and stores

the data in the temperature registers. TC72 has an

internal clock generator that controls the automatic

temperature conversion sequence. The automatic

temperat ure sampling operation is repeated indefinitely

until TC72 is placed in Shutdown mode by a write

operation to the Control register. TC72 will remain in

Shutdown mode until the shutdown bit in the Control

In contrast, the One-Shot mode performs a single

temperature measurement and returns to the power-

saving shut dow n mode. T his mode is espec ially us eful

for low power applications.

FIGURE 4-1: Temperature-To-Digital Transfer Function (Non-Linear Scale).

Temp

Output

Code

+125°C

-55°C

+25°C

-25°C

+0.25°C

-0.125°C

0111 1101 / 0000 0000

MSB LSB

Note: The ADC converter is scaled from -128°C to +127°C, but the ope rating range of the

TC72 is sp eci fie d from -55°C to +125 °C.

0001 1001 / 0000 0000

MSB LSB

0000 0000 / 0100 0000

MSB LSB

0000 0000 / 0000 0000

MSB LSB

1111 1111 / 1100 0000

MSB LSB

1110 0111 / 0000 0000

MSB LSB

1100 1001 / 0000 0000

MSB LSB

0°C

TC72

4.1 Temperature Data Format

Temperature data is r epresented by a 10-b it two’s com -

plement word with a resolution of 0.25°C per bit. The

tempera ture data is stored in the Temp erature registe rs

in a two’s complement format. The ADC converter is

scaled from -128°C to +12 7°C, but th e operat ing rang e

of TC72 is specified from -55°C to +125°C.

EXAMPL E 4-1:

TABLE 4-1: TC72 TEMPERATURE

OUTPUT DATA

TABLE 4-2: TEMPERATURE REGISTER

4.2 Power-Up And Power-Down

TC72 is in low-power consumption Shutdown mode at

power-up. The Continuous Temperature Conversion

mode is selected by performing a Write operation to the

Control register, as described in Section 5.0 “Internal

A supply vo ltage lower than 1.6V (typic al) is considered

a power-down state for TC72. If the supply voltage

drops below the 1.6V threshold, the internal registers

are reset to the powe r-up def aul t st ate .

4.3 Serial Bus Interface

The serial interface consists of the Chip Enable (CE),

Serial Clock (SCK), Serial Data Input (SDI) and Serial

Data Output (SDO) signals. TC72 operates as a slave

and is co mpati ble with th e SPI bus spec ificatio ns. The

serial interface is designed to be compatible with the

Microchip PIC® family of microcontrollers.

The CE input is used to select TC72 when multiple

devices are connected to the serial clock and data

lines. The CE is active-high, and data is written to or

read from the device, when CE is equal to a logic high

volt age. The SC K input is di sabled when CE is low . The

rising edge of the CE line initiates a read or write

operation, while the falling edge of CE completes a

read or write operation.

The SCK input is provided by the external

microcontroller and is used to synchronize the data on

the SDI and SDO lines. The SDI input writes data into

TC72’s Control register, while the SDO outputs the

temperature data from the Temperature register and

the status of Shutdown bit of the Control register.

TC72 has the capability to function with either an

active -high o r low SCK input. The SC K inac tive st ate i s

detected when the CE signal goes high, while the

polarity of the clock input (CP) determines whether the

dat a is c locke d and shif te d on e ither t he ris ing or fallin g

edge of the system clock, as shown in Figure 4-2.

Table 4-3 gives the appropriate clock edge used to

transfer da ta into an d out of the regis ters. Each da ta bit

is transf erred at ea ch clock puls e, and the dat a bit s are

clock ed in groups of eigh t bits, as shown in Figure 4-3.

The address byte is transferred first, followed by the

data. A7, the MSb of the address, determines whether

a read or write operation will occur. If A7 = ‘0’, one or

more read cycles will occur; otherwise, if A7 = ‘1’, one

or more write cycles will occur.

Data can be transferred either in a single byte or a

multi-by te pac ket, as sh own in Figure 4-3. In the 3-byte

packet, the data sequence consists of the MSb

temperature data, LSb temperature data, followed by

the Co ntrol r egiste r dat a. Th e mul ti-byt e read feature is

initiated by writing the highest address of the desired

packet to registers. TC72 will automatically send the

registers , as l ong as the Chip Ena ble pi n is he ld act ive.

Temperature Binary

MSB / LSB Hex

+125°C 0111 1101/0000 0000 7D00

+25°C 0001 1001/0000 0000 1900

+0.5°C 0000 0000/1000 0000 0080

+0.25°C 0000 0000/0100 0000 0040

0°C 0000 0000/0000 0000 0000

-0.25°C 1111 1111/1100 0000 FFC0

-25°C 1110 0111/0000 0000 E700

-55°C 1100 1001/0000 0000 C900

D7 D6 D5 D4 D3 D2 D1 D0 Address/

Sign 2625242323212002H

Temp. MSB

2-1 2-2 000000 01H

Temp. LSB

Temperature = +41.5°C

MSB Temperature Register = 00101001b

5 + 23 + 20

= 32 + 8 + 1 = 41

LSB Temperature Register = 10000000b = 2-1 = 0.5

TC72

TABLE 4-3: OPERATIONAL MODES

4.4 Read Operation

The TC72 uses the CE, SCK and SDO lines to output

the Temperature and Control register data. Figure 4-3

shows a timing diagram of the read operation.

Communication is initiated by the chip enable (CE)

going high. The SDO line remains at the voltage level

of the LSb bit that is output and goes to the tri-state

level when the CE line goes to a logic low level.

4.5 Write Operation

Data is clocked into the Control register in order to

enable TC72’s power saving shutdown mode. The

write operation is shown in Figure 4-3 and is

accomplished using the CE, SCK and SDI lines.

FIGURE 4-2: Serial Clock Polarity (CP)

Operation.

Mode CE SCK (Note 1)SDISDO

Disable L Input Disabled Input Disabled High Z

Write (A7 = 1)HCP=1, Data Shifted on Falling Edge,

Data Clocked on Rising Edge Data Bit Latch High Z

CP=0, Data Shifted on Rising Edge,

Data Clocked on Falling Edge

Read (A7 = 0)HCP=1, Data Shifted on Falling Edge,

Data Clocked on Rising Edge X Next data bit shift,

Note 2

CP=0, Data Shifted on Rising Edge,

Data Clocked on Falling Edge

Note 1: CP is the Cloc k Po lari ty of the microcon trol ler s ys tem c loc k. I f the i nac ti ve s t at e of SC K is lo gic lev el hig h,

CP is equal to ‘1’; otherwise, if the inactive state of SCK is low, CP is equal to ‘0’.

2: During a Read ope ration, SDO re mains at a high imped ance (High Z ) level until the ei ght bits of data b egin

to be shifted out of the Temperature register.

SHIFT

EDGE CLOCK

EDGE

SHIFT

EDGE CLOCK

EDGE

SCK

CP = 0

CP = 1

TC72

FIGURE 4-3: Serial Interface Timing Diagrams (CP=0).

SCK

SDI

SDO High Z

A7=1

Single Byte Write Operation

(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1)

2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

A A A A A A A D D D D D D D D

7654321076543210

MSb LSb

Single Byte Read Operation

(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0)

SCK

SDI

A7=0

2345678910 11 12 13 14 15 16

AAAAAAA

D D

SDO High Z High Z

76543210

MSb LSb

SPI Multiple Byte Transfer

SCK

Write Operation

(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1)

SDI Address Byte = 80hex

High Z

SDO

Control Byte

A7 A0 D7 D0

Read Operation

(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0)

SDI

SDO High Z High Z

MSB Temp. Byte LSB Temp. Byte

Address Byte = 02hex

Control Byte

A7 A0

D7 D0 D7 D0 D7 D0

TC72

5.0 INTERNAL REGISTER

STRUCTURE

TC72 registers are listed below.

TABLE 5-1: REGISTERS FOR TC72

5.1 Control Register

The Control register is both a read and a write register

that is used to select either the Shutdown, Continuous

or One -Sho t Conv ersion opera ting mo de. Th e Temp er-

ature Conversion mode selection logic is shown in

Table 5-2. The Sh utdown (SHDN) bit is stored in bit 0

of the C ontrol registe r . If SHDN is equal to ‘1’, TC72 will

go into power-saving Shutdown mode. If SHDN is

equal to ‘0’, TC72 will perform a temperature

conversion appr oximat ely every 15 0 ms.

At power-up, the SHDN bit is set to ‘1’. Thus, TC72 is

in Shutdown operating mode at startup. Continuous

Temperature Conversion mode is selected by writing a

‘0’ to the SHDN bit of the Control register.

Shutdown mode can be used to minimize the power

consumption of TC72 when active temperature

monitoring is not required. The Shutdown mode

disables the temperature conversion circuitry;

however, the serial I/O communication port remains

active . A tempe ratur e convers ion wil l be in itiali zed by a

Write operation to the Control register to select either

the Continuous Temperature Conversion or the One-

Shot operating mode. The temperature data will be

available in the MSB and LSB Temperature registers

approximately 150 ms after the Control register Write

operation.

One-Shot mode is selected by writing a ‘1’ into bit 4 of

the Control register. The One-Shot mode performs a

single temperature measurement and returns to the

power-saving Shutdown mode. After completion of the

temperat ure conve rsion , the O ne-Shot bit (O S) is res et

to ‘0’ (i.e. “OFF”). The user must set the One-Shot bit

to ‘1’ to initiate another temperature conversion.

Bits 1 , 3, 5, 6 an d 7 of the Contro l regist er are not used

by TC72. Bit 2 is set to a logic ‘1’. Any write operation

to these bit locations will have no affect on the

operation of TC72.

5.2 Temperature Register

The Temperature register is a read-only register and

contains a 10-bit two’s complement representation of

the temperature measurement. Bit 0 through Bit 5 of

the LSB Temperature register are always set to a logic

‘0’.

At Power-On Reset (POR) or a Brown-Out Reset

(BOR) low voltage occurrence, the temperature regis-

ter is reset to all zeroes, which corresponds to a tem-

perature value of 0°C. A VDD power supply less than

1.6V is considered a reset event and will reset the

Temperature register to the power-up state.

5.3 Manufacturer ID Register

The Manufacturer Identification (ID) register is a read-

only register used to identify the temperature sensor as

a Microch ip com po nen t.

TABLE 5-2: CONTROL REGISTER TEMPERATURE CONVERSION MODE SELECTION

Address Write

Address Bit

7Bit

6 Bit

5Bit

4Bit

3Bit

2Bit

1Bit

0Value on

POR/BOR

Control 00hex 80hex 000One-Shot

(OS) 010Shutdown

(SHDN) 05hex

LSB Temperature 01hex N/A T1 T0 0 0 000 0 00hex

MSB Temperature 02hex N/A T9 T8 T7 T6 T5 T4 T3 T2 00hex

Manufacturer ID 03hex N/A 010 1 010 0 54hex

Operational Mode One-Shot (OS) Bit 4 Shutdown (SHDN) Bit 0

Contin uou s Tempe r atu re Co nv ersi on 00

Shutdown 01

Contin uou s Tempe r atu re Co nv ersi on

(One-Shot Command is ignored if SHDN = ‘0’) 10

One-Shot 11

TC72

NOTES:

TC72

6.0 APPLICATIONS INFORMATION

The TC7 2 do es not requ ire any additiona l c om pon ents

in order to measure temperature; however, it is

recommended that a decoupling capacitor of 0.1mF to

1mF be provided between the VDD and GND pins.

Although the current consumption of the TC72 is

modest (250 mA, typical), the TC72 contains an on

chip data acquisition with internal digital switching

circuitry. Thus, it is considered good design practice to

use an external decoupling capacitor with the sensor . A

high frequency ceramic capacitor should be used and

be located as close as possible to the IC power pins in

order to provide effect ive noise protectio n to the TC 7 2.

The TC72 measures temperature by monitoring the

volt age of a dio de l oca ted on the IC di e. Th e IC pins of

the TC72 provide a low impedance thermal path

between the die and the PCB, allowing the TC72 to

effectively monitor the temperature of the PCB board.

The thermal path between the ambient air is not as

efficient because the plastic IC housing package

functions as a thermal insulator. Thus, the ambient air

temperature (assuming that a large temperature

gradient exists between the air and PCB) has only a

small effect on the temperature measured by the TC72.

Note that the exposed metal center pad on the bottom

of the DFN package is connected to the silicon

substrate. The center pad should be connected to

either the PCB ground plane or treated as a “No

Connect” pin. The mechanical dimensions of the center

pad are given in Section 7.0 “Packaging

Information” of this data sheet.

A potential for self-heating errors can exist if the TC72

SPI communication lines are heavily loaded. Typically,

the self-heating error is negligible because of the

relatively small current consumption of the TC72. A

temperature accuracy error of approximately +0.5°C

will result from self-heating if the SPI communication

pins sin k/sou rce the m aximum current spec ified fo r the

TC72. Thus, to maximize temperature accuracy, the

output loading of the SPI signals should be minimized.

FIGURE 6-1: Typical Application.

I/O

SCK

SDI

SCK

SDO

TC72

0.1µF

VDD

GND

VDD

PICmicro®

MCU

SDOSDI

TC72

7.0 PACKAGING INFORMATION

7.1 Package Marking Information

8-Lead DFN Example:

XXXXXXXX

MYWW

NNN

7228

M109

256

8-Lead MSOP Example:

XXXXXX

YWWNNN TC722M

109256

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanu me ric trac ea bil ity code

Pb-free JEDEC designator for Matte Tin (Sn)

*This package is Pb-free. The Pb- free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the ev ent the fu ll Micr ochip part nu mber ca nnot be m arked o n one line, it w ill

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

TC72

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TC72

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

TC72

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

TC72

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TC72

APPENDIX A: REVISION HISTORY

Revision B (July 2011)

The following is the list of modifications:

1. Updated DFN pin draw ing.

2. Added new chapter Section 3.0 “PIN

Description”.

3. Moved Typical Application figure in Section 6.0

“Applications information” (see Figure 6-1).

4. Updated Section 7.0 “Packaging

Information”

Revision A (October 2002)

• Original data sheet for the TC72 device.

TC72

NOTES:

TC72

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X/XXXX

Voltage PackageTemperature

Range

Device

Device: TC72: Digital Temperature Sensor w/SPI Interface

Voltage Range: 2.8 = Accuracy Optimized for 2.8V

3.3 = Accuracy Optimized for 3.3V

5.0 = Accuracy Optimized for 5.0V

Temperature Range: M =-55°C to +1 25° C

Package: MF = Dual, Flat, No Lead (DFN) (3x3mm), 8-lead

MFTR = Dual, Flat, No Lead (DFN) (3x3mm), 8-lead

(Tape and Reel )

UA = Plastic Micro Small Outline (MSOP), 8-lead

UATR = Plastic Micro Small Outline (MSOP), 8-lead

(Tape an d Reel)

Examples:

a) TC72-2.8MU A : D igita l Temper atu re Sensor,

2.8V, 8LD MSOP package .

b) TC72-2.8MUATR: Digital Temperature Sensor,

2.8V, 8LD MSOP

(tape and reel ) packag e.

c) TC72-2.8MMF: Digital Temperature Sensor,

2.8V, 8LD DFN package.

d) TC72-3.3MU A : Dig ital Tem per atu re Se nso r,

3.3V, 8LD MSOP package.

e) TC72-3.3MMF: Digital Temperature Sensor,

3.3V, 8LD DFN package .

f) TC72-5.0MUA: Digital Temperature Sensor,

5.0V, 8LD MSOP package.

g) TC72-5.0MMF : Digital Temper atu re Senso r,

5.0V, 8LD DFN package .

h) TC72-5.0MMF T R : Digi tal Temper ature Sensor,

5.0V, 8LD DFN (tape and

reel) package.

Range

TC72

NOTES:

Information contained in this publication regarding device

applications and the lik e is p ro vided only for your conve nien ce

and may be superseded by updates. I t is your r es ponsibilit y to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

KEELOQ, KEELOQ logo , MPL AB, PIC , PI Cmi cro, PI CSTART,

PIC32 logo, rfPIC and UNI/O are registered tr ademark s of

Microchip Technology Incorporated in the U.S.A. and other

countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,

MXDEV, MXLAB, SEEVAL and The Embedded Control

Solutions Company are registered trademarks of Microchip

Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, chipKIT,

chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,

dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,

FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,

Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,

MPLINK, mTouch, Omniscient Code Generation, PICC,

PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,

rfLAB, Select Mode, Total Endurance , TSHARC,

UniWinDriver, WiperLock and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip T echnology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

ISBN: 978-1-61341-429-3

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that it s family of products is one of the most secure famili es of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal m ethods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our

products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such act s

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, microperiph erals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

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05/02/11