Datasheet Gate Driver Providing Galvanic isolation Series Isolation voltage 2500Vrms 1ch Gate Driver Providing Galvanic Isolation BM6104FV-C Key Specifications General Description The BM6104FV-C is a gate driver with isolation voltage 2500Vrms, I/O delay time of 150ns, and minimum input pulse width of 90ns, and incorporates the fault signal output functions, undervoltage lockout (UVLO) function, and short current protection (SCP, DESAT) function. Isolation Voltage: Maximum Gate Drive Voltage: I/O Delay Time: Minimum Input Pulse Width: Package Features W(Typ) x D(Typ) x H(Max) 6.50mm x 8.10mm x 2.01mm SSOP-B20W Providing Galvanic Isolation Active Miller Clamping Fault Signal Output Function (Adjustable Output Holding Time) Undervoltage Lockout Function Short Current Protection Function (Adjustable Reset Time) Soft Turn-Off Function For Short Current Protection (Adjustable Turn-Off Time) Supporting Negative VEE2 Output State Feedback Function UL1577 Recognized:File No. E356010 AEC-Q100 Qualified(Note 1) (Note 1:Grade1) 2500Vrms 24V 150ns(Max) 90ns(Max) Applications IGBT Gate Driver MOSFET Gate Driver Typical Application Circuits GND1 Latch OSFB INB FLTRLS S Q R ENA PROOUT + INA - FB VEE2 + OUT1L - Timer FLT OUT1H VCC1 VCC2 UVLO Regulator UVLO FLT LOGIC INA VREG OUT2 ENA LOGIC TEST S Q R GND2 + VEE2 - GND1 SCPIN 1pin Figure 1. For using 4-pin IGBT (for using SCP function) GND1 INA Latch OSFB INB FLTRLS ENA - VEE2 FB + OUT1L - Timer FLT PROOUT + S Q R OUT1H VCC1 VCC2 UVLO UVLO FLT Regulator LOGIC INA OUT2 ENA TEST GND1 VREG LOGIC S Q R GND2 + - Figure 2. For using 3-pin IGBT (for using DESAT function) VEE2 SCPIN 1pin Product structureSilicon integrated circuit This product is not designed protection against radioactive rays www.rohm.com TSZ02201-0717ABH00030-1-2 (c) 2012 ROHM Co., Ltd. All rights reserved. 1/35 25.Dec.2015 Rev.004 TSZ2211114001 BM6104FV-C Recommended Range Of External Constants Pin Name Recommended Value Symbol Typ CFLTRLS - 0.01 0.47 F RFLTRLS 50 200 1000 k VREG CVREG 1.0 3.3 10.0 F VCC1 CVCC1 0.1 1.0 - F VCC2 CVCC2 0.33 - - F FLTRLS Max Unit Min Pin Configurations (TOP VIEW) SCPIN 1 VEE2 2 GND2 3 OUT2 4 VREG 5 VCC2 6 OUT1H 7 OUT1L 8 820 19 8 18 8 17 8 16 8 15 8 14 8 13 8 12 8 11 8 VEE2 9 PROOUT 10 GND1 TEST ENA INA FLT VCC1 FLTRLS INB OSFB GND1 Pin Descriptions Pin No. Pin Name 1 SCPIN Short current detection pin Function 2 VEE2 Output-side negative power supply pin 3 GND2 Output-side ground pin 4 OUT2 MOSFET control pin for Miller Clamp 5 VREG Power supply pin for driving MOSFET for Miller Clamp 6 VCC2 Output-side positive power supply pin 7 OUT1H Source side output pin 8 OUT1L Sink side output pin 9 VEE2 10 PROOUT 11 GND1 Input-side ground pin 12 OSFB Output state feedback output pin Output-side negative power supply pin Soft turn-off pin 13 INB 14 FLTRLS Control input pin B 15 VCC1 16 FLT Fault output pin 17 INA Control input pin A 18 ENA Input enabling signal input pin 19 TEST Mode setting pin 20 GND1 Input-side ground pin Fault output holding time setting pin Input-side power supply pin www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C Description of pins and cautions on layout of board 1) VCC1 (Input-side power supply pin) The VCC1 pin is a power supply pin on the input side. To suppress voltage fluctuations due to the current to drive internal transformers, connect a bypass capacitor between the VCC1 and the GND1 pins. 2) GND1 (Input-side ground pin) The GND1 pin is a ground pin on the input side. 3) VCC2 (Output-side positive power supply pin) The VCC2 pin is a positive power supply pin on the output side. To reduce voltage fluctuations due to OUT1H/L pin output current and due to the current to drive internal transformers, connect a bypass capacitor between the VCC2 and the GND2 pins. 4) VEE2 (Output-side negative power supply pin) The VEE2 pin is a power supply pin on the output side. To suppress voltage fluctuations due to OUT1H/L pin output current and due to the current to drive internal transformers, connect a bypass capacitor between the VEE2 and the GND2 pins. To use no negative power supply, connect the VEE2 pin to the GND2 pin. 5) GND2 (Output-side ground pin) The GND2 pin is a ground pin on the output side. Connect the GND2 pin to the emitter / source of a power device. 6) IN (Control input terminal) The IN is a pin used to determine output logic. ENA INB H X L H L H L L L L INA X L H L H OUT1H Hi-Z Hi-Z Hi-Z Hi-Z H OUT1L L L L L Hi-Z 7) FLT (Fault output pin) The FLT pin is an open drain pin used to output a fault signal when a fault occurs (i.e., when the undervoltage lockout function (UVLO) or short current protection function (SCP) is activated). Pin FLT While in normal operation Hi-Z When an Fault occurs L (When UVLO or SCP is activated) 8) FLTRLS (Fault output holding time setting pin) The FLTRLS is a pin used to make setting of time to hold a Fault signal. Connect a capacitor between the FLTRLS pin and the GND1 pin, and a resistor between it and the VCC1 pin. The Fault signal is held until the FLTRLS pin voltage exceeds a voltage set with the V FLTRLS parameter. To set holding time to 0 ms, do not connect the capacitor. Short-circuiting the FLTRLS pin to the VCC1 pin will cause a high current to flow in the FLTRLS pin and, in an open state, may cause the IC to malfunction. To avoid such trouble, be sure to connect a resistor between the FLTRLS and the VCC1 pins. 9) OUT1H, OUT1L (Output pin) The OUT1H pin is a source side pin used to drive the gate of a power device, and the OUT1L pin is a sink side pin used to drive the gate of a power device. 10) OUT2 (MOSFET control pin for Miller Clamp) The OUT2 is a pin for controlling the external MOS switch to prevent the increase in gate voltage due to the miller current of the power device connected to OUT1H/L pin. 11) VREG (Power supply pin for driving the MOSFET for Miller Clamp) The VREG pin is a power supply pin for Miller Clamp (typ 10V). Be sure to connect a capacitor between VREG pin and VEE2 pin to prevent oscillation and to reduce voltage fluctuations due to OUT2 pin output current. 12) PROOUT (Soft turn-off pin) The PROOUT is a pin used to put the soft turn-off function of a power device in operation when the SCP function is activated. This pin combines with the gate voltage monitoring pin for Miller Clamp function and OSFB function which output the gate state. 13) SCPIN (Short current detection pin) The SCPIN is a pin used to detect current for short current protection. When the SCPIN pin voltage exceeds VSCDET (typ 0.7V), the SCP function will be activated. This may cause the IC to malfunction in an open state. To avoid such trouble, short-circuit the SCPIN pin to the GND2 pin if the short current protection is not used. In order to prevent the wrong detection due to noise, the noise mask time tSCPMSK (typ 0.8s) is set. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C 14) OSFB (Output state feedback output pin) The OSFB pin is an open drain pin used to output the gate state. If the IN and the OUT1H/L pin are at the same level, the OSFB pin output the "Hi-Z" level, otherwise the OSFB pin output the "L" level and hold "L" until ENA=H or UVLO on low voltage side is activated. 15) TEST(Mode setting pin) The TEST pin is an operation mode setting pin. This pin is usually connected to GND1 pin. If the TEST pin is connected to the VCC1 pin, Input-side UVLO function is disabled. Description of functions and examples of constant setting 1) Miller Clamp function When OUT1H/L=Hi-Z/L and PROOUT pin voltage < VOUT2ON (typ 2V), H is output from OUT2 pin and the external MOS switch is turned ON. When OUT1H/L=H/Hi-Z, L is output from OUT2 pin and the external MOS switch is turned OFF. While the short-circuit protection function is activated, L is output from OUT2 pin and the external MOS switch is turned OFF. Short current SCPIN IN PROOUT OUT2 Detected Not less than VSCDET X X L X L Not less than VOUT2ON L X L less than VOUT2ON H X H X L Not detected VCC2 PREDRIV ER OUT1H/L PREDRIV ER PROOUT PREDRIV ER LOGIC VREG REGULATOR PREDRIV ER OUT2 PREDRIV ER + V OUT2ON - GND2 VEE2 Figure 3. Block diagram of Miller Clamp function. tPON (typ 115ns) tPOFF (typ 115ns) IN OUT1H/L PROOUT (Monitor the gate voltage) VOUT2ON tOUT2ON (typ 25ns) OUT2 Figure 4. Timing chart of Miller Clamp function www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C 2) Fault status output This function is used to output a fault signal from the FLT pin when a fault occurs (i.e., when the undervoltage lockout function (UVLO) or short current protection function (SCP) is activated) and hold the Fault signal until the set Fault output holding time is completed. The Fault output holding time t FLTRLS is given as the following equation with the settings of capacitor CFLTRLS and resistor RFLTRLS connected to the FLTRLS pin. For example, when CFLTRLS is set to 0.01F and RFLTRLS is set to 200k, the holding time will be set to 2 ms. tFLTRLS [ms]= CFLTRLS [F]*RFLTRLS [k] To set the fault output holding time to "0" ms, only connect the resistor RFLTRLS. Status FLT pin Normal Hi-Z Fault occurs L Fault occurs (The UVLO or SCP function is activated.) Status UVLO FLT VFLTRLS S SCP FLTRLS R VCC1 CFLTRLS RFLTRLS Hi-Z FLT L + FLTRLS H OUT1H/L FLT L GND1 Fault output holding time (tFLTRLS) ECU Figure 5. Fault Status Output Timing Chart Figure 6. Fault Output Block Diagram 3) Undervoltage Lockout (UVLO) function The BM6104FV-C incorporates the undervoltage lockout (UVLO) function both on the low and the high voltage sides. When the power supply voltage drops to the UVLO ON voltage (low voltage side typ 3.4V, high voltage side typ 9.05V), the OUT1 and the FLT pin both will output the "L" signal. When the power supply voltage rises to the UVLO OFF voltage (low voltage side typ 3.5V, high voltage side typ 9.55V), these pins will be reset. However, during the fault output holding time set in "2) Fault status output" section, the OUT1 pin and the FLT pin will hold the "L" signal. In addition, to prevent malfunctions due to noises, mask time tUVLO1MSK (typ 10s) and tUVLO2MSK (typ 10s) are set on both low and high voltage sides. H L IN VUVLO1H VUVLO1L VCC1 FLT OUT1H/L Figure 7. Low voltage side UVLO Function Operation Timing Chart Hi-Z L H L H L IN VUVLO2H VUVLO2L VCC2 FLT OUT1H/L Figure 8. High voltage side UVLO Operation Timing Chart www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/35 Hi-Z L H Hi-Z L TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C 4) Short current protection function (SCP, DESAT) When the SCPIN pin voltage exceeds VSCDET (typ 0.7V), the SCP function will be activated. When the SCP function is activated, the OUT1H/L pin voltage will be set to the "Hi-Z/HiZ" level first, and then the PROOUT pin voltage to the "L" level (soft turn-off).Next, after tSTO (min 30s, max 110s) has passed after the short-circuit current falls below the threshold value, OUT1H/L pin becomes HiZ/L and PROOUT pin becomes L. Finally, when the fault output holding time set in "2) fault status output" section on page 5 is completed, the SCP function will be released. VCOLLECTOR/VDRAIN which Desaturation Protection starts operation (VDESAT) and the blanking time (tBLANK) can be calculated by the formula below; R3 R 2 V FD1 R3 R3 R 2 R1 VCC 2 MIN V VSCDET R3 R 2 R1 R3 R 2 R1 VSCDET t BLANKouternal s R3 (C BLANK 24 10 12 ) ln(1 ) 0.2 10 6 R3 R 2 R1 R3 VCC 2 VDESAT V VSCDET Reference Value VDESAT R1 R2 R3 4.0V 15 k 39 k 6.8 k 4.5V 15 k 43 k 6.8 k 5.0V 15 k 36 k 5.1 k 5.5V 15 k 39 k 5.1 k 6.0V 15 k 43 k 5.1 k 6.5V 15 k 62 k 6.8 k 7.0V 15 k 68 k 6.8 k 7.5V 15 k 82 k 7.5 k 8.0V 15 k 91 k 8.2 k 8.5V 15 k 82 k 6.8 k 9.0V 15 k 130 k 10 k 9.5V 15 k 91 k 6.8 k 10.0V 15 k 130 k 9.1 k VCC2 VCC1 R1 D1 OUT1H/L LOGIC S FLTRLS + - PROOUT Q R R2 FLT SCPIN VFLTRLS SCPMASK + - VSCDET CBLANK R3 GND2 GND2 VEE2 Figure 9. Block Diagram for DESAT www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C IN A OUT1H/L OUT2 PROOUT SCPIN FLT tSCPMSK+tcomp_delay VSCPTH (typ 0.95s) VSCPTH t BLANKouternal tBLANK BLAN t BLANKouternal tBLANK BLAN K tSCPMSK+tcomp_delay K Figure 10. DESAT Operation Timing Chart H L INA VSCDET SCPIN H Hi-Z L H Hi-Z L OUT1 OUT2 Hi-Z L Hi-Z L PROOUT FLT tSTO tSTO Fault output holding time (Note 2) Fault output holding time (Note 2) (Note 2): "2) Fault status output" section on page 5 Figure 11. SCP Operation Timing Chart www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C Start OUT1H/L=Hi-Z/LOUT2=H No VSCPIN>VSCDET VFLTRLS>VTFLTRLS No Yes Yes No Exceed mask time Yes FLT=Hi-Z OUT1H/L=Hi-Z/Hi-ZOUT2=L PROOUT=LFLT=L IN=H No No VSCPIN<VSCDET Yes OUT1H/L=H/Hi-ZOUT2=L PROOUT=Hi-Z Yes No Exceed tSTO Yes Figure 12. SCP Operation Status Transition Diagram VCC2 VCC1 OUT1H/L LOGIC FLTRLS S + - PROOUT Q R FLT SCPIN VFLTRLS SCPMASK + GND2 VSCDET GND2 VEE2 Figure 13. Block Diagram for SCP www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C 5I/O condition table Input No . Status 1 SCP 2 Output E N A I N B I N A P R O O U T O U T 1 H O U T 1 L O U T 2 P R O O U T F L T O S F B VCC1 VCC2 S C P I N H L L H X Hi-Z Hi-Z L L L Hi-Z UVLO X L X X X H Hi-Z L L Hi-Z L Hi-Z UVLO X L X X X L Hi-Z L H Hi-Z L Hi-Z X UVLO L X X X H Hi-Z L L Hi-Z L Hi-Z X UVLO L X X X L Hi-Z L H Hi-Z L Hi-Z L H X X H Hi-Z L L Hi-Z Hi-Z Hi-Z L H X X L Hi-Z L H Hi-Z Hi-Z Hi-Z L L H X H Hi-Z L L Hi-Z Hi-Z L L L H X L Hi-Z L H Hi-Z Hi-Z Hi-Z L L L L H Hi-Z L L Hi-Z Hi-Z L L L L L L Hi-Z L H Hi-Z Hi-Z Hi-Z L L L H H H Hi-Z L Hi-Z Hi-Z Hi-Z L L L H L H Hi-Z L Hi-Z Hi-Z L VCC1UVLO 3 4 VCC2UVLO 5 6 Disable 7 8 INB Active 9 10 Normal Operation L Input 11 12 Normal Operation H Input 13 : VCC1 or VCC2 > UVLO, X:Don't care www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C 6) Power supply startup / shutoff sequence H L IN VUVLO1L VCC1 VCC2 VUVLO2H VUVLO1L VUVLO2H VUVLO1L VUVLO2H 0V 0V VEE2 H Hi-Z L H Hi-Z L Hi-Z L Hi-Z L OUT1H/L OUT2 PROOUT FLT H L IN VCC1 VCC2 VUVLO1L VUVLO1H VUVLO2H VUVLO1H VUVLO2L 0V VUVLO2L VEE2 OUT2 PROOUT FLT H L IN VCC1 VUVLO1L VUVLO2H VUVLO1L VUVLO2H VUVLO1H 0V VUVLO2L VEE2 OUT2 PROOUT FLT H L IN VCC2 0V 0V H Hi-Z L H Hi-Z L Hi-Z L Hi-Z L OUT1H/L VCC1 0V 0V H Hi-Z L H Hi-Z L Hi-Z L Hi-Z L OUT1H/L VCC2 0V VUVLO1H VUVLO1H VUVLO2L VUVLO1H VUVLO2L 0V VUVLO2L VEE2 0V 0V H Hi-Z L H Hi-Z L Hi-Z L Hi-Z L OUT1H/L OUT2 PROOUT FLT : Since the VCC2 to VEE2 pin voltage is low and the output MOS does not turn ON, the output pins become Hi-Z conditions. : Since the VCC1 pin voltage is low and the FLT output MOS does not turn ON, the output pins become Hi-Z conditions. Figure 14. Power supply startup / shutoff sequence www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C Absolute Maximum Ratings Parameter Symbol Limits Unit VCC1 -0.3+7.0(Note 3) V VCC2 -0.3+30.0(Note 4) V Output-Side Negative Supply Voltage VEE2 -15.0+0.3(Note 4) V Maximum Difference Between Output-Side Positive and Negative Voltages VMAX2 36.0 V INA, INB, ENA Pin Input Voltage VIN -0.3+VCC1+0.3 or 7.0(Note 3) V OSFB, FLT Pin Input Voltage VFLT -0.3+VCC1+0.3 or 7.0(Note 3) V VFLTRLS -0.3+VCC1+0.3 or 7.0(Note 3) V SCPIN Pin Input Voltage VSCPIN -0.3~VCC2+0.3(Note 4) V VREG Pin Output Current IVREG 10 mA OUT1H, OUT1L, PROOUT Pin Output Current (Peak 10s) IOUT1PEAK 5.0(Note 5) A OUT2 Pin Output Current (Peak 10s) IOUT2PEAK 1.0(Note 5) A IOSFB 10 mA FLT Output Current IFLT 10 mA Power Dissipation Pd 1.19(Note 6) W Operating Temperature Range Topr -40+125 C Storage Temperature Range Tstg -55+150 C Junction Temperature Tjmax +150 C Input-Side Supply Voltage Output-Side Positive Supply Voltage FLTRLS Pin Input Voltage OSFB Output Current (Note 3) Relative to GND1. (Note 4) Relative to GND2. (Note 5) Should not exceed Pd and Tj=150C. (Note 6) Derate above Ta=25C at a rate of 9.5mW/C. Mounted on a glass epoxy of 70 mm 70 mm 1.6 mm. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Ratings Parameter Symbol Min Max Units VCC1 4.5 5.5 V Output-Side Positive Supply Voltage(Note 8) VCC2 10 24 V Output-Side Negative Supply Voltage(Note 8) VEE2 -12 0 V Maximum Difference Between Output-Side Positive and Negative Voltages VMAX2 10 32 V Input-Side Supply Voltage(Note 7) (Note 7) Relative to GND1. (Note 8) Relative to GND2. Insulation Related Characteristics Parameter Symbol Characteristic Units RS >109 Insulation Withstand Voltage / 1min VISO 2500 Vrms Insulation Test Voltage / 1sec VISO 3000 Vrms Insulation Resistance (VIO=500V) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 11/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C Electrical Characteristics Unless otherwise specified Ta=-40C~125C, VCC1=4.5V~5.5V, VCC2=10V~24V, VEE2=-12V~0V Parameter Symbol Min Typ Max Unit Conditions General Input Side Circuit Current 1 ICC11 0.38 0.51 0.64 mA OUT1=L Input Side Circuit Current 2 ICC12 0.38 0.51 0.64 mA OUT1=H Input Side Circuit Current 3 Input Side Circuit Current 4 ICC13 ICC14 0.47 0.54 0.62 0.72 0.77 0.90 mA mA INA=10kHz, Duty=50% INA=20kHz, Duty=50% Output Side Circuit Current 1 Output Side Circuit Current 2 ICC21 ICC22 1.5 1.3 2.0 1.8 2.5 2.3 mA mA VCC2=14V, OUT1=L VCC2=14V, OUT1=H Output Side Circuit Current 3 Output Side Circuit Current 4 Output Side Circuit Current 5 Output Side Circuit Current 6 Logic Block Logic High Level Input Voltage Logic Low Level Input Voltage ICC23 ICC24 ICC25 ICC26 1.6 1.3 1.8 1.5 2.2 1.9 2.5 2.1 2.8 2.5 3.2 2.7 mA mA mA mA VCC2=18V, OUT1=L VCC2=18V, OUT1=H VCC2=24V, OUT1=L VCC2=24V, OUT1=H VINH VINL 2.0 0 - VCC1 0.8 V V INA, INB, ENA INA, INB, ENA Logic Pull-Down Resistance Logic Pull-Up Resistance RIND RINU 25 25 50 50 100 100 k k INA, INB ENA Logic Input Mask Time ENA Mask Time tINMSK tENAMSK 4 10 90 20 ns s INA, INB ENA Output OUT1H ON Resistance RONH 0.7 1.8 4.0 IOUT1H=40mA OUT1L ON Resistance RONL 0.4 0.9 2.0 OUT1 Maximum Current IOUTMAX 3.0 4.5 - A PROOUT ON Resistance RONPRO 0.4 0.9 2.0 IOUT1L=40mA VCC2=18V Guaranteed by design IPROOUT=40mA tPONA 90 115 150 ns INA=PWM, INB=L tPONB 100 125 160 ns INA=H, INB=PWM tPOFFA 90 115 150 ns INA=PWM, INB=L Turn ON Time Turn OFF Time Propagation Distortion tPOFFB 80 105 140 ns INA=H, INB=PWM tPDISTA tPDISTB -25 -45 0 -20 20 0 ns ns tPOFFA - tPONA tPOFFB - tPONB tRISE tFALL - 50 50 - ns ns 10nF between OUT1-VEE2 RON2H RON2L 2.0 1.5 4.5 3.5 9.0 7.0 IOUT2=10mA IOUT2=10mA VOUT2ON tOUT2ON 1.8 - 2 25 2.2 50 V ns Relative to VEE2 VREG CM 9 100 10 - 11 - V kV/s Relative to VEE2 Design assurance Rise Time Fall Time OUT2 ON Resistance (Source) OUT2 ON Resistance (Sink) OUT2 ON Threshold Voltage OUT2 Output Delay Time VREG Output Voltage Common Mode Transient Immunity www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 12/35 10nF between OUT1-VEE2 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C Electrical Characteristics Unless otherwise specified Ta=-40C~125C, V CC1=4.5V~5.5V, VCC2=10V~24V, VEE2=-12V~0V Protection functions VCC1 UVLO OFF Voltage VUVLO1H 3.35 3.50 3.65 V VUVLO1L tUVLO1MSK 3.25 4 3.40 10 3.55 30 V s VCC2 UVLO OFF Voltage VCC2 UVLO ON Voltage VUVLO2H VUVLO2L 8.95 8.45 9.55 9.05 10.15 9.65 V V VCC2 UVLO Mask Time SCPIN Input Voltage tUVLO2MSK VSCPIN 4 - 10 0.1 30 0.22 s V SCP Threshold Voltage SCP Detection Mask Time VSCDET tSCPMSK 0.665 0.55 0.700 0.8 0.735 1.05 V s Soft Turn OFF Release Time OSFB Threshold Voltage H tSTO VOSFBH 30 4.5 5.0 110 5.5 s V Respective to GND2 OSFB Threshold Voltage L OSFB Output Low Voltage VOSFBL VOSFBOL 4.0 - 4.5 0.18 5.0 0.40 V V Respective to GND2 IOSFB=5mA OSFB Filter Time FLT Output Low Voltage tOSFBON VFLTL 1.5 - 2.0 0.18 2.6 0.40 s V IFLT=5mA VTFLTRLS 0.64xVCC1 -0.1 0.64xVCC1 0.64xVCC1 +0.1 V VCC1 UVLO ON Voltage VCC1 UVLO Mask Time FLTRLS Threshold INA 50% ISCPIN=1mA 50% tPON tPOFF OUT1H/L 90% 50% 90% 10% tFALL tRISE 50% 10% Figure 15. INA-OUT1 Timing Chart UL1577 Ratings Table Following values are described in UL Report. Parameter Values Units Side 1 (Input Side) Circuit Current 0.51 mA VCC1=5.0V, OUT1H/L=L Side 2 (Output Side) Circuit Current 2.2 mA VCC2=18V, VEE2=0V, UT1H/L=L Side 1 (Input Side) Consumption Power 2.55 mW VCC1=5.0V, OUT1H/L=L Side 2 (Output Side) Consumption Power 39.6 mW VCC2=18V, VEE2=0V, OUT1H/L=L Isolation Voltage 2500 Vrms Maximum Operating (Ambient) Temperature 125 Maximum Junction Temperature 150 Maximum Strage Temperature 150 Maximum Data Transmission Rate 2.5 MHz www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 13/35 Conditions TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C Typical Performance Curves 0.64 0.64 Input side circuit current [mA] Input side circuit current [mA] Ta=125C 0.51 Ta=25C 0.51 Vcc1=5.5V Vcc1=5.0V Vcc1=4.5V Ta=-40C 0.38 4.50 0.38 4.75 5.00 VCC1 [V] 5.25 -40 5.50 -20 0 20 40 60 Ta [C] 80 100 120 Figure 17. Input side circuit current vs. Temperature (OUT1=L) Figure 16. Input side circuit current vs. VCC1 (OUT1=L) 0.64 0.64 Input side circuit current [mA] Input side circuit current [mA] Ta=125C 0.51 Ta=25C 0.51 Vcc1=5.5V Vcc1=5.0V Vcc1=4.5V Ta=-40C 0.38 4.50 0.38 4.75 5.00 VCC1 [V] 5.25 5.50 Figure 18. Input side circuit current vs. VCC1 (OUT1=H) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 14/35 -40 -20 0 20 40 60 Ta [C] 80 100 120 Figure 19. Input side circuit current vs. Temperature (OUT1=H) TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 0.77 0.77 0.72 0.72 Ta=125C Input side circuit current [mA] Input side circuit current [mA] BM6104FV-C 0.67 0.62 Ta=25C 0.57 0.52 Vcc1=5.5V 0.67 0.62 Vcc1=5.0V 0.57 0.52 Vcc1=4.5V Ta=-40C 0.47 4.50 0.47 4.75 5.00 VCC1 [V] 5.25 5.50 -40 Figure 20. Input side circuit current vs. VCC1 (INA=10 kHz, Duty=50%) 0 20 40 60 Ta [C] 80 100 120 Figure 21. Input side circuit current vs. Temperature (INA=10 kHz, Duty=50%) 0.89 0.89 0.84 Input side circuit current [mA] 0.84 Input side circuit current [mA] -20 Ta=125C 0.79 0.74 0.69 Ta=25C 0.64 Vcc1=5.5V 0.79 0.74 Vcc1=5.0V 0.69 0.64 Vcc1=4.5V 0.59 0.59 Ta=-40C 0.54 4.50 0.54 4.75 5.00 VCC1 [V] 5.25 5.50 Figure 22. Input side circuit current vs. VCC1 (INA=20 kHz, Duty=50%) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 -40 -20 0 20 40 60 Ta [C] 80 100 120 Figure 23. Input side circuit current vs. Temperature (INA=20 kHz, Duty=50%) 15/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C 3.1 3.1 Output side circuit current [mA] Output side circuit current [mA] Ta=125C 2.9 2.7 2.5 2.3 Ta=25C 2.1 1.9 Ta=-40C 1.7 2.7 2.5 2.3 Vcc2=18V 2.1 Vcc2=14V 1.9 1.7 1.5 1.5 14 16 18 20 VCC2 [V] 22 -40 24 Figure 24. Output side circuit current vs. VCC2 (OUT1=L) -20 0 20 40 60 Ta [C] 80 100 120 Figure 25. Output side circuit current vs. Temperature (OUT1=L) 2.7 2.7 Ta=125C 2.5 Output side circuit current [mA] 2.5 Output side circuit current [mA] Vcc2=24V 2.9 2.3 2.1 Ta=25C 1.9 1.7 Ta=-40C 2.3 2.1 1.9 Vcc2=14V 1.5 1.3 1.3 16 18 20 VCC2 [V] 22 24 Figure 26. Output side circuit current vs. VCC2 (OUT1=H) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Vcc2=18V 1.7 1.5 14 Vcc2=24V -40 -20 0 20 40 60 Ta [C] 80 100 120 Figure 27. Output side circuit current vs. Temperature (OUT1=H) 16/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C 24 3.0 20 Ta=-40C Ta=25C Ta=125C 2.0 16 OUT1 [V] VINH / VINL [V] 2.5 H level 1.5 L level 1.0 12 8 Ta=-40C Ta=25C Ta=125C 0.5 0.0 4.50 4 0 4.75 5.00 VCC1 [V] 5.25 5.50 0 1 2 3 4 5 INA [V] Figure 28. Logic (INA/INB/ENA) High/Low level input voltage vs. VCC1 Figure 29. OUT1 vs. INA input voltage (VCC1=5V, VCC2=18V, Ta=25C) 100.0 75.0 75.0 RINU [k ] RIND [k ] 100.0 Ta=-40C 50.0 Ta=-40C 50.0 Ta=25C Ta=25C Ta=125C 25.0 4.50 4.75 5.00 VCC1 [V] Ta=125C 5.25 5.50 25.0 4.50 Figure 30. Logic pull-down resistance vs. VCC1 www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4.75 5.00 VCC1 [V] 5.25 5.50 Figure 31. Logic pull-up resistance vs. VCC1 17/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C 90 90 80 80 70 70 Ta=-40C Ta=-40C 60 tINMSK [ns] tINMSK [ns] 60 50 40 30 Ta=125C 20 50 40 30 Ta=25C Ta=25C Ta=125C 20 10 10 0 4.50 4.75 5.00 VCC1 [V] 5.25 5.50 0 4.50 4.75 5.00 VCC1 [V] 5.50 5.25 Figure 33. Logic (INA/INB) input mask time vs. VCC1 (Low pulse) Figure 32. Logic (INA/INB) input mask time vs. VCC1 (High pulse) 20 3.7 16 3.1 RONH [ ] tENAMSK [s] Ta=-40C 12 2.5 Ta=125C 1.9 8 Ta=25C 1.3 Ta=25C Ta=125C Ta=-40C 4 4.50 0.7 4.75 5.00 VCC1 [V] 5.25 5.50 16 18 20 VCC2 [V] 22 24 Figure 35. OUT1H ON resistance vs. VCC2 Figure 34. ENA mask time vs. VCC1 www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 14 18/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C 2.0 2.0 1.6 1.6 RONPRO [ ] RONL [ ] Ta=125C Ta=125C 1.2 Ta=25C 0.8 1.2 Ta=25C 0.8 Ta=-40C Ta=-40C 0.4 0.4 14 16 18 20 VCC2 [V] 22 24 14 Figure 36. OUT1L ON resistance vs. VCC2 18 20 VCC2 [V] 22 24 Figure 37. PROOUT ON resistance vs. VCC2 150 150 140 140 130 130 tPON [ns] Ta=-40C tPON [ns] 16 120 110 120 110 Ta=25C Ta=125C 100 100 90 90 14 16 18 20 VCC2 [V] 22 24 Figure 38. Turn ON time vs VCC2 (INA=PWM, INB=L) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 -40 -20 0 20 40 60 Ta [C] 80 100 120 Figure 39. Turn ON time vs Temperature (VCC2=24V, INA=PWM, INB=L) 19/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 150 150 140 140 130 130 Ta=125C tPOFF [ns] tPOFF [ns] BM6104FV-C 120 110 120 110 Ta=-40C Ta=25C 100 100 90 90 14 16 18 20 VCC2 [V] 22 24 -40 Figure 40. Turn OFF time vs. VCC2 (INA=PWM, INB=L) 100 90 90 20 40 60 Ta [C] 80 100 120 80 Ta=125C 70 70 60 60 tFALL [ns] tRISE [ns] 0 Figure 41. Turn OFF time vs. Temperature (VCC2=24V, INA=PWM, INB=L) 100 80 -20 50 Ta=125C 50 40 40 Ta=25C 30 Ta=25C 30 Ta=-40C Ta=-40C 20 20 10 10 0 0 14 16 18 20 VCC2 [V] 22 24 16 18 20 VCC2 [V] 22 24 Figure 43. Fall time vs. VCC2 (10nF between OUT1-VEE2) Figure 42. Rise time vs. VCC2 (10nF between OUT1-VEE2) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 14 20/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C 9.0 6.5 Ta=125C 8.0 Ta=125C 5.5 RON2L [ ] RON2H [ ] 7.0 6.0 Ta=25C 5.0 Ta=25C 4.5 3.5 4.0 2.5 3.0 Ta=-40C Ta=-40C 2.0 14 16 1.5 18 20 VCC2 [V] 22 14 24 16 18 20 VCC2 [V] 22 24 Figure 45. OUT2 ON resistance (Sink) vs. VCC2 Figure 44. OUT2 ON resistance (Source) vs. VCC2 2.2 50 Ta=125C 40 2.1 Ta=25C tOUT2ON [ns] VOUT2ON [V] Ta=125C 2.0 30 Ta=25C 20 Ta=-40C Ta=-40C 1.9 10 1.8 0 14 16 18 20 VCC2 [V] 22 24 16 18 20 VCC2 [V] 22 24 Figure 47. OUT2 output delay time vs. VCC2 Figure 46. OUT2 ON threshold voltage vs. VCC2 www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 14 21/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C 11.0 11.0 Vcc2=24V Vcc2=18V Vcc2=14V 10.5 10.5 VREG [V] VREG [V] Ta=-40C 10.0 10.0 Ta=25C Ta=125C 9.5 9.5 9.0 9.0 14 16 18 20 VCC2 [V] 22 -40 24 -20 0 20 40 60 Ta [C] 80 100 120 Figure 49. VREG output voltage vs. Temperature Figure 48. VREG output voltage vs. VCC2 5 28 4 Ta=-40C tUVLO1MSK [s] FLT [V] 3 24 Ta=-40C Ta=125C 2 Ta=125C 20 16 12 Ta=25C Ta=25C 1 0 3.25 8 4 3.35 3.45 VCC1 [V] 3.55 3.65 -20 0 20 40 60 Ta [C] 80 100 120 Figure 51. VCC1 UVLO mask time vs. Temperature Figure 50. FLT vs. VCC1 (VCC1 UVLO ON/OFF voltage) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 -40 22/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C 6 28 5 24 Ta=125C FLT [V] Ta=125C 3 Ta=25C Ta=25C Ta=-40C tUVLO2MSK [s] 4 2 20 16 12 Ta=-40C 1 8 0 4 8.6 9.1 -40 9.6 -20 0 VCC2 [V] 20 40 60 Ta [C] 80 100 120 Figure 53. VCC2 UVLO mask time vs. Temperature Figure 52. FLT vs. VCC2 (VCC2 UVLO ON/OFF voltage, VCC1=5V) 0.22 0.73 Ta=25C VSCDET [V] VSCPIN [V] Ta=125C 0.11 Ta=-40C Ta=25C 0.70 Ta=-40C Ta=125C 0.00 0.67 14 16 Figure 54. 18 20 VCC2 [V] 22 24 SCPIN Input voltage vs. VCC2 (ISCPIN=1mA) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 14 16 18 20 VCC2 [V] 22 24 Figure 55. SCP threshold voltage vs. VCC2 23/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C 110 1.05 0.95 90 0.85 tSTO [s] tSCPMSK [s] Ta=-40C 0.75 Ta=25C Vcc2=14V Vcc2=18V Vcc2=24V 70 Ta=125C Vcc2=14V Vcc2=18V Vcc2=24V Max. 50 0.65 Min. 30 0.55 14 16 18 20 VCC2 [V] 22 -40 24 -20 0 20 40 60 Ta [C] 80 100 120 Figure 57. Soft turn OFF release time vs. Temperature Figure 56. SCP detection mask time vs. VCC2 0.4 5.40 Ta=25C Ta=125C Ta=-40C 5.20 Ta=125C 0.3 OSFB_H VOSFBOL [V] VOSFB [V] 5.00 4.80 4.60 0.2 Ta=25C OSFB_L 4.40 0.1 Ta=125C Ta=-40C Ta=25C 4.20 Ta=-40C 4.00 14 16 18 20 VCC2 [V] 22 24 Figure 58. OSFB threshold voltage H/L vs. VCC2 www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 24/35 0.0 4.50 4.75 5.00 VCC2 [V] 5.25 5.50 Figure 59. OSFB output low voltage vs. VCC2 (IOSFB=5mA) TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C 0.4 2.50 Ta=125C 0.3 Ta=125C Ta=-40C Ta=25C VFLTL [V] tOSFBON [s] 2.30 2.10 0.2 Ta=25C 1.90 0.1 1.70 1.50 4.50 Ta=-40C 4.75 5.00 VCC1 [V] 5.25 5.50 0.0 4.50 4.75 5.00 VCC2 [V] 5.25 5.50 Figure 61. FLT output low voltage vs. VCC2 (IFLT=5mA) Figure 60. OSFB filter time vs. VCC1 3.62 Ta=-40C Ta=25C Ta=125C VTFLTRLS [V] 3.41 3.20 2.99 2.78 4.50 4.75 5.00 VCC1 [V] 5.25 5.50 Figure 62. FLTRLS threshold vs. VCC1 www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 25/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C Selection of Components Externally Connected Recommended ROHM RSR025N03 RSS065N03 Recommended ROHM MCR03EZP GND1 + INA Latch OSFB INB ENA FLTRLS PROOUT - S Q R FB VEE2 + OUT1L - Timer FLT OUT1H VCC1 VCC2 UVLO Regulator UVLO FLT VREG LOGIC INA OUT2 S Q R ENA LOGIC TEST GND2 + VEE2 - GND1 SCPIN 1pin Figure 63. For using 4-pin IGBT (for using SCP function) Recommended ROHM MCR03EZP Recommended ROHM MCR03EZP GND1 INA Latch OSFB INB ENA FLTRLS PROOUT + - S Q R VEE2 FB + OUT1L - Timer FLT OUT1H VCC1 VCC2 UVLO UVLO FLT Regulator VREG LOGIC INA OUT2 S Q R ENA LOGIC TEST GND2 + VEE2 - GND1 SCPIN Figure 64. For using 3-pin IGBT (for using DESAT function) 1pin Recommended ROHM RSR025N03 RSS065N03 www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 26/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C Power Dissipation Measurement machineTH156Kuwano Electric Measurement conditionROHM board Board size70x70x1.6mm3 1-layer boardja=105.3C/W Power Dissipation:Pd [W] 1.5 1.19W 1.0 0.5 0 0 25 50 75 100 125 150 Ambient Temperature: Ta [C] Figure 65. SSOP-B20W Derating Curve Thermal Design Please confirm that the IC's chip temperature Tj is not over 150C, while considering the IC's power consumption (W), package power (Pd) and ambient temperature (Ta). When Tj=150C is exceeded, the functions as a semiconductor do not operate and some problems (ex. Abnormal operation of various parasitic elements and increasing of leak current) occur. Constant use under these circumstances leads to deterioration and eventually IC may destruct. Tjmax=150C must be strictly followed under all circumstances. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 27/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C I/O Equivalence Circuits Name Pin No. I/O equivalence circuits Function VCC2 Internal power supply SCPIN SCPIN 1 Short current detection pin GND2 VEE2 VCC2 OUT2 Internalpower pow er suppl y Internal supply 4 MOSFET control pin for Miller Clamp VREG VREG OUT2 Power supply pin for driving MOSFET for Miller Clamp VEE2 5 OUT1H VCC2 7 Source side output pin OUT1H OUT1L OUT1L 8 VEE2 Sink side output pin VREG PROOUT VCC2 10 PROOUT Soft turn-off pin VEE2 www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 28/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C Name Pin No. I/O equivalence circuits Function OSFB OSFB 12 GND1 Output state feedback pin VCC1 FLTRLS FLTRLS 14 Fault output holding time setting pin GND1 FLT FLT 16 Fault output pin GND1 VCC1 INB 13 Control input pin B INAINB INA 17 GND1 Control input pin A www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 29/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C Name Pin No. I/O equivalence circuits Function VCC1 ENA 18 ENA Input enabling signal input pin GND1 VCC1 TEST TEST 19 Test mode setting pin GND1 www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 30/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 31/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C 11. Unused Input Terminals Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 12. Regarding Input Pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND Parasitic Elements Pin B B GND GND Parasitic Elements GND N Region close-by Figure 66. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 32/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C Ordering Information B M 6 1 0 4 F V - Package FV:SSOP-B20W Part Number CE 2 Rank C:Automotive Packaging and forming specification E2: Embossed tape and reel Marking Diagram SSOP-B20W (TOP VIEW) Part Number Marking B M 6 1 0 4 LOT Number 1PIN MARK www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 33/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C Physical Dimension, Tape and Reel Information Package Name www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 SSOP-B20W 34/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 BM6104FV-C Revision History Date Revision 06.Nov.2013 001 23.Jan.2014 002 20.May.2015 003 25.Dec.2015 004 Changes New Release Page 13 : Change Electrical Characteristics ' VCC2 UVLO OFF Voltage ' Page 13 : Change Electrical Characteristics ' VCC2 UVLO ON Voltage ' Page 26 : Change Selection of Components Externally Connected Page 1 : Features Adding item (UL1577 Recognized) Page 4 : Description of Pins Adding TEST pin Page 7 : Description of functions Correcting mistake of Figure 10 Page 13 : Adding UL1577 Rating Table www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 35/35 TSZ02201-0717ABH00030-1-2 25.Dec.2015 Rev.004 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001