OPTIONAL CHAMFER \ oo IF PRESENT, SEE NOTE 4.70 4.00 i SUPPLIER "B" PACKAGE SHAPE @4.00 10.67 3.50 SUPPLIER "A" PACKAGE 9.65 A SHAPE 30 .90 16.51 A 15.42 240 8.13, [2.46] .- "A1 " SEE NOTE "F" .04 10 2.06 FRONT VIEWS 1.62 1.42 mo Jum on NOTE "I" .30 50 BOTTOM VIEW NOTES: A) REFERENCE JEDEC, TO-220, VARIATION AB B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS COMMON TO ALL PACKAGE 85 SIDE VIEW = 0 ro) ! | ! | ! | q | T SUPPLIERS EXCEPT WHERE NOTED [ ]. | D) LOCATION OF MOLDED FEATURE MAY VARY ! (LOWER LEFT CORNER, LOWER CENTER | AND CENTER OF THE PACKAGE) | DOES NOT COMPLY JEDEC STANDARD VALUE. | F) "A1" DIMENSIONS AS BELOW: | SINGLE GAUGE = 0.51 - 0.61 1 DUAL GAUGE =1.10- 1.45 | A DRAWING FILE NAME: TO220B03REV8 ' PRESENCE IS SUPPLIER DEPENDENT | 1) SUPPLIER DEPENDENT MOLD LOCKING HOLES IN HEATSINK. J) FAIRCHILD SEMICONDUCTOR BACK VIEW