LEADLESS GLASS ZENER DIODES
SCOTTSDALE DIVISION
1N3016BUR-1 thru 1N3051BUR-1
(or MLL3016B thru MLL3051B)
WWW.Microsemi .COM 1N3016BUR-1 thru
1N3051BUR-1
DESCRIPTION APPEARANCE
This surface mountable zener diode series is similar to the 1N3016 thru
1N3051 JEDEC registration in the DO-13 package except that it meets the
surface mount DO-213AB outline. It is an ideal selection for applications of
high density and low parasitic requirements. Due to its glass hermetic seal
qualities and metallurgically enhanced internal construction, it is also well
suited for high-reliability applications. This can be acquired by a source
control drawing (SCD), or by ordering device types with MQ, MX, or MV
prefix to part number for equivalent screening to JAN, JANTX or JANTXV.
DO-213AB
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES APPLICATIONS / BENEFITS
• Leadless surface mount package equivalents to the
JEDEC registered 1N3016 thru 1N3051 except with
higher power rating of 1.5 Watts
• Ideal for high-density mounting
• Voltage range: 6.8 to 200 volts
• Hermetically sealed, double-slug glass construction
• Metallurgically enhanced contact construction.
• Options for screening in accordance with MIL-PRF-
19500/115 for JAN, JANTX, JANTXV, and JANS
with MQ, MX, MV, or MSP prefixes respectively for
part numbers, e.g. MX1N3016BUR-1,
MV1N3051BUR-1, etc.
• Axial lead “thru-hole” DO-13 packages per JEDEC
registration available as 1N3016B thru 1N3051B
(see separate data sheet with MIL-PRF-19500/115
qualification)
• Regulates voltage over a broad operating current
and temperature range
• Wide selection from 6.8 to 200 V
• Tight voltage tolerances available
• Low reverse (leakage) currents
• Leadless package for surface mounting
• Ideal for high-density mounting
• Metallurgically enhanced internal contact design for
greater reliability and lower thermal resistance
• Nonsensitive to ESD
• Hermetically sealed glass package
• Specified capacitance (see Figure 2)
MAXIMUM RATINGS MECHANICAL AND PACKAGING
• Power dissipation at 25ºC: 1.5 watts (also see
derating in Figure 1).
• Operating and Storage temperature: -65ºC to
+175ºC
• Thermal Resistance: 40 ºC/W junction to end cap,
or 120ºC/W junction to ambient when mounted on
FR4 PC board (1 oz Cu) with recommended
footprint (see last page)
• Steady-State Power: 1.50 watts at end-cap
temperature TEC < 115oC, or 1.25 watts at TA = 25ºC
when mounted on FR4 PC board and
recommended footprint as described for thermal
resistance (also see Figure 1)
• Forward voltage @200 mA: 1.2 volts (maximum)
• Solder Temperatures: 260 ºC for 10 s (max)
• CASE: Hermetically sealed glass MELF package
• TERMINALS: Leads, tin-lead plated solderable per
MIL-STD-750, method 2026
• POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
• MARKING: Cathode band only
• TAPE & REEL optional: Standard per EIA-481-1-A
with 12 mm tape, 1500 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
• WEIGHT: 0.05 grams
• See package dimensions on last page
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
Copyright 2002
9-18-2003 REV B
LEADLESS GLASS ZENER DIODES
SCOTTSDALE DIVISION
1N3016BUR-1 thru 1N3051BUR-1
(or MLL3016B thru MLL3051B)
WWW.Microsemi .COM 1N3016BUR-1 thru
1N3051BUR-1
*ELECTRICAL CHARACTERISTICS @ 25oC
MAXIMUM ZENER
IMPEDANCE
(Note 2)
NOMINAL
ZENER
VOLTAGE
VZ @ IZT
(NOTE 1)
ZENER
TEST
CURRENT
IZT ZZT @ IZT Z
ZK
@ IZK
MAXIMUM
ZENER
CURRENT
IZM
MAXIMUM
REVERSE
LEAKAGE
CURRENT †
IR @ VR
TYPICAL
TEMP.COEFF
OF ZENER
VOLTAGE
αVZ
INDUSTRY
PART
NUMBER
**
MICROSEMI
PART
NUMBER
VOLTS mA OHMS OHMS mA mA µA Volts %/oC
1N3016BUR-1
1N3017BUR-1
1N3018BUR-1
1N3019BUR-1
MLL3016B
MLL3017B
MLL3018B
MLL3019B
6.8
7.5
8.2
9.1
37
34
31
28
3.5
4.0
4.5
5
700
700
700
700
1.0
.5
.5
.5
210
187.5
172.5
157.5
5
5
5
5
5.2
5.7
6.2
6.9
.040
.045
.048
.050
1N3020BUR-1
1N3021BUR-1
1N3022BUR-1
1N3023BUR-1
MLL3020B
MLL3021B
MLL3022B
MLL3023B
10
11
12
13
25
23
21
19
7
8
9
10
700
700
700
700
.25
.25
.25
.25
142.5
127.5
120
111
5
1.0
1.0
0.5
7.6
8.4
9.1
9.9
.055
.060
.065
.065
1N3024BUR-1
1N3025BUR-1
1N3026BUR-1
1N3027BUR-1
MLL3024B
MLL3025B
MLL3026B
MLL3027B
15
16
18
20
17
15.5
14.0
12.5
14
16
20
22
700
700
750
750
.25
.25
.25
.25
94.5
90
78
70.5
0.5
0.5
0.5
0.5
11.4
12.2
13.7
15.2
.070
.070
.075
.075
1N3028BUR-1
1N3029BUR-1
1N3030BUR-1
1N3031BUR-1
MLL3028B
MLL3029B
MLL3030B
MLL3031B
22
24
27
30
11.5
10.5
9.5
8.5
23
25
35
40
750
750
1000
1000
.25
.25
.25
.25
64.5
60
51
46.5
0.5
0.5
0.5
0.5
16.7
18.2
20.6
22.8
.080
.080
.085
.085
1N3032BUR-1
1N3033BUR-1
1N3034BUR-1
1N3035BUR-1
MLL3032B
MLL3033B
MLL3034B
MLL3035B
33
36
39
40
7.5
7.0
6.5
6.0
45
50
60
70
1000
1000
1000
1500
.25
.25
.25
.25
42
39
34.5
31.5
0.5
0.5
0.5
0.5
25.1
27.4
29.7
32.7
.085
.085
.090
.090
1N3036BUR-1
1N3037BUR-1
1N3038BUR-1
1N3039BUR-1
MLL3036B
MLL3037B
MLL3038B
MLL3039B
47
51
56
62
5.5
5.0
4.5
4.0
80
95
110
125
1500
1500
2000
2000
.25
.25
.25
.25
28.5
27
25.5
22.5
0.5
0.5
0.5
0.5
35.8
38.8
42.6
47.1
.090
.090
.090
.090
1N3040BUR-1
1N3041BUR-1
1N3042BUR-1
1N3043BUR-1
MLL3040B
MLL3041B
MLL3042B
MLL3043B
68
75
82
91
3.7
3.3
3.0
2.8
150
175
200
250
2000
2000
3000
3000
.25
.25
.25
.25
21
18
16.5
15
0.5
0.5
0.5
0.5
51.7
56.0
62.2
69.2
.090
.090
.090
.090
1N3044BUR-1
1N3045BUR-1
1N3046BUR-1
1N3047BUR-1
MLL3044B
MLL3045B
MLL3046B
MLL3047B
100
110
120
130
2.5
2.3
2.0
1.9
350
450
550
700
3000
4000
4500
5000
.25
.25
.25
.25
13.5
12.45
12
10.35
0.5
0.5
0.5
0.5
76.0
83.6
91.2
98.8
.090
.095
.095
.095
1N3048BUR-1
1N3049BUR-1
1N3050BUR-1
1N3051BUR-1
MLL3048B
MLL3049B
MLL3050B
MLL3051B
150
160
180
200
1.7
1.6
1.4
1.2
1000
1100
1200
1500
6000
6500
7000
8000
.25
.25
.25
.25
8.55
8.1
7.35
6.9
0.5
0.5
0.5
0.5
114.0
121.6
136.8
152.0
.095
.095
.095
.100
* JEDEC registered data for 1N3016B thru 3051B equivalents except reverse (leakage) currents IR are lower and maximum Zener current IZM is higher.
** When applicable, add MQ, MX, MV, MSP prefix for 1N3016B to 1N3051B screening options in accordance with MIL-PRF-19500/115.
† Not JEDEC Data.
NOTE 1: Suffix “B” shown signifies a +/-5% tolerance on nominal zener voltage. No suffix designates a +/-20% and suffix “A” is +/-10%. If tighter
tolerance is required, suffix C is used to identify +/-2%; and suffix D is to identify +/-1% tolerance. VZ is measured with the diode in
thermal equilibrium in 25oC still air. The test currents (IZT) at nominal voltages provide a constant 0.25 watts for this device series.
NOTE 2: The zener impedance is derived when a 60 cycle ac current having an rms value equal to 10% of the dc zener current (IZT or IZK) is
superimposed on IZT or IZK. Zener impedance is measured at 2 points to ensure a sharp knee on the breakdown curve and to eliminate
unstable units. See MicroNote 202 for variation in dynamic impedance with different zener currents.
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 2
Copyright 2002
9-18-2003 REV B
LEADLESS GLASS ZENER DIODES
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 3
Copyright 2002
9-18-2003 REV B
WWW.Microsemi .COM
SCOTTSDALE DIVISION
1N3016BUR-1 thru 1N3051BUR-1
(or MLL3016B thru MLL3051B)
1N3016BUR-1 thru
1N3051BUR-1
GRAPHS
STEADY-STATE POWER DERATING
PD Power Dissipation (WATTS)
TA
TEC
Temperature (oC)
FIGURE 1 FIGURE 2
Power Derating Curve Where TEC is End Cap Temp Typical Capacitance vs. Reverse Voltage
and TA is Ambient Temperature on FR4 PC board.
PACKAGE DIMENSIONS
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.189 0.205 4.80 5.20
B 0.094 0.105 2.39 2.66
C 0.016 0.022 0.41 0.55
INCHES mm
A .276 7.00
B 0.070 1.8
C 0.110 2.8
PAD LAYOUT
FIGURE 3
Typical Zener Voltage
Temperature Coeff. vs. Zener Voltage
