MX7537SE/883B - Maxim Integrated Products, Inc.

SCOPE: CMOS, PARALLEL-LOADING, DUAL, MULTIPLYING 12-BIT D/A CONVERTER

Device Type Generic Number

01 MX7537U(x)/883B

02 MX7537T(x)/883B

03 MX7537S(x)/883B

04 MX7547U(x)/883B

05 MX7547T(x)/883B

06 MX7547S(x)/883B

Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:

Outline Letter Mil-Std-1835 Case Outline Package Code

MAXIM SMD

Q L GDIP1-T24 or CDIP2-T24 24 LEAD CERDIP J24

E 3 CQCC1-N28 28 LEADLESS CHIP L28

A bsol ute Maximum Rat ings :

VDD to DGND ........................................................................................………. -0.3V, + 17V

VRFBA, VRFBB to AGND .......................................................................................………. ±25V

VREFA, VREFB to AGND .......................................................................................………. ±25V

Digital Input Voltage to DGND .....................................................……… -0.3V, (VDD+0.3V)

IOUTA, IOUTB Voltage to DGND ...............................................…….... -0.3V, (VDD+0.3V)

AGND to DGND ............................................................................…….... -0.3V, (VDD+0.3V)

Lead Temperature (soldering, 10 seconds) ........................................................................ +300°C

Storage Temperature ........................................................................................... -65°C to +150°C

Continuous Power Dissipation ..........................................................................……... TA=+70°C

24 pin CERDIP(derate 12.5mW/°C above +70°C) ...............................................…….. 1000mW

28 pin LCC(derate 10.2mW/°C above +70°C) .......................................................…….. 816mW

Junct ion Temperatur e TJ .....................................................................................…….... +150°C

Thermal Resista nce, J unction to Case, ΘJC

24 pin CERDIP................................................................................................…….... 40°C/W

28 pin LCC .....................................................................................................……..... 15°C/W

Thermal Resistance, Junction to Ambient, ΘJA:

24 pin CERDIP................................................................................................…….... 80°C/W

28 pin LCC .....................................................................................................………. 98°C/W

Recommended Operating Co ndit ions

Ambient Operating Range (TA) ............................................................……... -55°C to +125°C

Logic Supply Voltage (VLOGIC) ................................................................……... +4.5V to +5.5V

Positive Supply Voltage (VDD)..............................................................……... +11.4V to +16.5V

Negative Supply Voltage (VEE)...............................................................……... -11.4V to -16.5V

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.

These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those indicated in the operational section s of the sp ecifica tions is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability.

---------------------- Electrical Characteristics of MX7537/47/883B for /883B 19-0057 Rev. C

and SMD 5962-87763 and SMD 5962-89657 Page 2 of 7

TABLE 1. ELECTRICAL TESTS:

TEST Symbol

CONDITIONS

-55 °C <=TA<= +125°C 1/

Unless otherwise specified Group A

Subgroup Device

type Limits

Min Limits

Max Units

ACCURACY

Resolution RES 1,2,3 All 12.0 Bits

Relative Accuracy RA VDD=+10.8V and VDD=+16.5V

VDD=10.8V (MX7547 only) 1,2,3 1,2,4,5

3,6 ±0.5

±1.0 LSB

Differential Nonlinearity DNL Guaranteed monotonic 1,2,3 All ±1.0 LSB

Gain Error AE Measured using RFBA, RFBB; DAC

registers loaded with all 1’s,

VDD=10.8V

1,2,3 1,4

2,5

3,6

±2.0

±3.0

±6.0

LSB

Gain Tempco

∆Gain/∆Temperature

NOTE 2

TCFS 4 All ±5.0 ppm/°C

Output Leakage Current

IOUTA, IOUTB ILKG VDD=+16.5V, DAC registers

loaded with all 0s 1,3

2All ±10

±250 nA

VREFA, VREFB Input

Leakage RREF VDD=+10.8V 1,2,3 All 920

kΩ

VREFA, VREFB Input

Resistance Match ∆RREF VDD=+10.8V 1,2,3 1,4

2,3,5,6 ±1.0

±3.0 %

Digital Input High

Voltage VIH VDD=+10.8V and VDD=+16.5V 1,2,3 All 2.4 V

Digital Input Low

Voltage VIL VDD=+10.8V and VDD=+16.5V 1,2,3 All 0.8 V

Digital Input Leakage

Current IIN VIN=+0V or 16.5V 1,3

2All ±1.0

±10 µA

Digital Input Capacitance CIN 4All 10 pF

Supply Voltage VDD Operating range, VDD=16.5V 1,2,3 All 10.8 16.5 V

Supply Current IDD 1,2,3 All 2.0 mA

Current Settling Time tSL To 0.5 LSB, IOUT load =100Ω,

CEXT=13pF, DAC output ___

measured from falling edge of WR

9,10,11 4,5,6 1.5 µs

Current Settling Time tSL To 0.5 LSB, IOUT load =100Ω,

CEXT=13pF, DAC output ___

measured from rising edge of WR

41,2,3 1.5 µs

VREFA

to IOUTA

Feedthrough

Error

VREFB

to IOUTB

NOTE 2

FTE

DAC VREFA=20Vp-p

registers 10kHz sine wave,

loaded VREFB=0V

with all 0s

VREFB=20Vp-p

10kHz sine wave,

VREFA=0V

4,5,6

(SMD)

4,5,6 -70 -65

(SMD) dB

VREFA

to IOUTA

Feedthrough

Error

VREFB

to IOUTB

NOTE 2

FTE

DAC VREFA=20Vp-p

registers 10kHz sine wave,

loaded VREFB=0V

with all 0s

VREFB=20Vp-p

10kHz sine wave,

VREFA=0V

(SMD)

1,2,3 -70 -65

(SMD) dB

---------------------- Electrical Characteristics of MX7537/47/883B for /883B 19-0057 Rev. C

and SMD 5962-87763 and SMD 5962-89657 Page 3 of 7

TEST Symbol

CONDITIONS

-55 °C <=TA<= +125°C 1/

Unless otherwise specified Group A

Subgroup Device

type Limits

Min Limits

Max Units

Power-Supply

Rejection Ratio PSRR VDD=10.8V, ∆VDD=12V±5%

VDD=10.8V, ∆VDD=VDD MAX -

VDD MIN

2,3

01,02,03

All

±0.01

±0.02

±0.01

±0.02

%/%

Output Capacitance

(IOUTA, IOUTB) COUT DAC A, DAC B loaded with 0s

DAC A, DAC B loaded with 1s 4All -70

140

Channel-to-Channel

Isolation

VREFA

to IOUTA

VREFB to

IOUTB

VREFA=20Vp-p, 10kHz sine

wa v e, VREFB =0V

VREFB=20Vp-p, 10kHz sine

wa v e, VREFA=0V

4All -84 dB

TIMING

Address Valid to

Write-setup Time t19

10,11 01,02,03 20

30 ns

Address Valid to

Write-hold Time t29

10,11 01,02,03 15

25 ns

Data-setup Time t39

10,11 All 60

80 ns

Data-hold Time t49,10,11 All 25 ns

Chip Select or Update

to Write-setup Ti me t5

9,10,11

10,11

01,02,03

04,05,06

100

Chip Select or Update

to Write Hold T ime t69,10,11 All 0ns

Write Pulse Wid th t79

10,11 All 80

100 ns

Clear Pulse Width t89

10,11 All 80

100 ns

NOTE 1: Conditions unless otherwise specified, 4.5V≤VDD≤5.5V. VDD=10.8V to 16.5V, AGND=DGND=0V,

use maximum possible reference voltage.

NOTE 2: Typical number, for design aid only.

MODE SELECTION TABLE: MX7537

___

CLR ___

UPD ___

CS ___

WR A1 A0 Function

1 1 1 X X X No data transfer

1 1 X 1 X X No data transfer

0 X X X X X All registers cleared

1 1 0 0 0 0 DAC A LS input register loaded with D7-D0

1 1 0 0 0 1 DAC A MS input register loaded with D3-D0

1 1 0 0 1 0 DAC B LS input register loaded with D7-D0

1 1 0 0 1 1 DAC B MS inp ut register lo aded with D3-D0

1 0 1 0 X X DAC A, DAC B registers updated simultaneously from input

1 0 0 0 X X DAC A, DAC B registers are transparent. Input registers loaded.

X = Don’t care

---------------------- Electrical Characteristics of MX7537/47/883B for /883B 19-0057 Rev. C

and SMD 5962-87763 and SMD 5962-89657 Page 4 of 7

MODE SELECTION TABLE: MX7547

___

CSA ___

CSB ___

WR Function

X X 1 No data transfer

1 1 X No data transfer

↑↑0 ___ ___

A rising edge on CSA or CSB transfer data to the respective DAC.

01↑DAC A register loaded from data bus.

10↑DAC B register loaded from data bus.

00↑DAC A and DAC B registers loaded from data bus.

X= don’t care WR input is edge-triggered.

ORDERING INFORMATION:

Package Pkg. Code Device ID SMD Number

01 24 pin CERDIP J24 MX7537UQ/883B 5962-8776303LA

02 24 pin CERDIP J24 MX7537TQ/883B 5962-8776302LA

03 24 pin CERDIP J24 MX7537SQ/883B 5962-8776301LA

01 28 pin LCC L28 MX7537UE/883B 5962-87763033C

02 28 pin LCC L28 MX7537TE/883B 5962-87763023C

03 28 pin LCC L28 MX7537SE/883B 5962-87763013C

04 24 pin CERDIP J24 MX7547UQ/883B 5962-8965703LA

05 24 pin CERDIP J24 MX7547TQ/883B 5962-8965702LA

06 24 pin CERDIP J24 MX7547SQ/883B 5962-8965701LA

04 28 pin LCC L28 MX7547UE/883B 5962-89657033C

05 28 pin LCC L28 MX7547TE/883B 5962-89657023C

06 28 pin LCC L28 MX7547SE/883B 5962-89657013C

TERMINAL CONNECTIONS:

MX7537 MX7537 MX7547 MX7547 MX7537 MX7537 MX7547 MX7547

J24 L28 J24 L28 J24 L28 J24 L28

1 AGNDA NC AGNDA NC 15 A0 NC D8 NC

OUTA AGNDA IOUTA AGNDA 16 A1 D6 D9 D6

3RFBA I

OUTA RFBA IOUTA 17 ____

CLR D7 D10 D7

4 VREFA RFBA VREFA RFBA 18 ___

WR A0 D11

(MSB) D8

5__

CS VREFA ___

CSA VREFA 19 ___

UPD A1 ___

WR D9

6D0 __

CS (LSB)D0 ___

CSA 20 VDD ____

CLR ____

CSB D10

7 D1 D0 D1 (LSB)D0 21 VREFB ___

WR VDD D11

8D2NCD2NC22RFBBNCVREFBNC

9D3D1D3D123I

OUTB ___

UPD RFBB ___

10 D4 D2 D4 D2 24 AGNDB VDD IOUTB ____

CSB

11 D5 D3 D5 D3 25 VREFB VDD

12 DGND D4 DGND D4 26 RFBB VREFB

13 D6 D5 D6 D5 27 IOUTB RFBB

14 D7 DGND D7 DGND 28 AGNDB IOUTB

----------------------- Electrical Characteristics of MX7537/47/883B for /883B 19-0057 Rev. C

and SMD 5962-87763 and SMD 5962-89657 Page 5 of 7

QUALITY ASSURAN CE

Sampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in Mil-Std-883.

Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015:

1. Test Condition, A, B, C, or D.

2. TA = +125°C minimum.

3. Interim and final electrical test requirements shall be specified in Table 2.

Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B, C, and D inspection.

Group A inspection:

1. Tests as specified in Table 2.

2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted.

Group C and D inspections:

a. End-point electrical parameters shall be specified in Table 1.

b. Steady-state life test, Method 1005 of Mil-Std-883:

1. Test condition A, B, C, D.

2. TA = +125°C, minimum.

3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883.

TABLE 2. ELECTRICAL TEST R EQUIREMENTS

Mil-Std-883 Test Requirements Subgroups

per Method 5005, Table 1

Interim Electric Parameters

Method 5004 1

Final Electrical Parameters

Method 5005 1*, 2, 3, 9, 10, 11

Group A Test Requirements

Method 5005 1, 2, 3, 4**, 5**, 6**, 9, 10**, 11**

Group C and D End-Point Electrical Parameters

Method 5005 1

* PDA applies to Subgroup 1 only.

** If not tested shall be guaranteed to the limits specified in Table 1.

----------------------- Electrical Characteristics of MX7537/47/883B for /883B 19-0057 Rev. C

and SMD 5962-87763 and SMD 5962-89657 Page 6 of 7