NV24C16MUW3VLTBG - ON SEMICONDUCTOR

March, 2019 − Rev. P3

1Publication Order Number:

NV24C02LV/D

NV24C02LV, NV24C04LV,

NV24C08LV, NV24C16LV

Product Preview

2-Kb, 4-Kb, 8-Kb and 16-Kb

Low Voltage Automotive

I2C Serial EEPROM

Description

The NV24C02/04/08/16LV are 2−Kb, 4−Kb, 8−Kb and 16−Kb

respectively CMOS Serial EEPROM devices that operate at a

minimum 1.7 V supply voltage. They are organized internally as

16/32/64 and 128 pages respectively of 16 bytes each. All devices

support the Standard (100 kHz), Fast (400 kHz) and Fast−Plus

(1 MHz) I2C protocol.

Data is written by providing a starting address, then loading 1 to 16

contiguous bytes into a Page Write Buffer, and then writing all data to

non−volatile memory in one internal write cycle. Data is read by

providing a starting address and then shifting out data serially while

automatically incrementing the internal address count.

External address pins make it possible to address up to eight

NV24C02, four NV24C04, two NV24C08 and one NV24C16 device

on the same bus.

Features

•Automotive AEC−Q100 Grade 1 (−40°C to +125°C) Qualified

•Supports Standard, Fast and Fast−Plus I2C Protocol

•1.7 V to 5.5 V Supply Voltage Range

•16−Byte Page Write Buffer

•Fast Write Time (4 ms max)

•Hardware Write Protection for Entire Memory

•Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs

(SCL and SDA)

•Low power CMOS Technology

•More than 1,000,000 Program/Erase Cycles

•100 Year Data Retention

•Automotive Grade 1 Temperature Range

•SOIC, TSSOP, US 8−Lead, TSOP−5 Lead and Wettable Flank UDFN

8−pad Packages

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

SDA

SCL

VCC

VSS

NV24C__

16 / 08 / 04 / 02

NC ///

NC NC

A1A1

A2A2

///

PIN CONFIGURATION (SOIC−8,US−8,UNFN−8 ,TSSOP−8) PIN CONFIGURATION (TSOP−5)

VCC

SCL

VSS

SDA

This document contains information on a product under development. ON Semiconductor

reserves the right to change or discontinue this product without notice.

www.onsemi.com

US8

U SUFFIX

CASE 493

See detailed ordering, marking and shipping information in the

package dimensions section on page 14 of this data sheet.

ORDERING INFORMATION

UDFN−8

MUW3 SUFFIX

CASE 517DH

SOIC8

DW SUFFIX

CASE 751BD

TSSOP−8

DT SUFFIX

CASE 948AL

TSOP−5

SN SUFFIX

CASE 483

NV24C02LV, NV24C04LV, NV24C08LV, NV24C16LV

www.onsemi.com

SCL

NV24Cxx

Figure 1. Functional Symbol

VSS

SDA

VCC

A2, A1, A0

Table 1. PIN FUNCTION

Pin Name Function

A0, A1, A2 Device Address Input

SDA Serial Data Input/Output

SCL Serial Clock Input

WP Write Protect Input

VCC Power Supply

VSS Ground

NC No Connect

Table 2. ABSOLUTE MAXIMUM RATINGS

Parameters Ratings Units

Storage Temperature −65 to +150 °C

Voltage on any pin with respect to Ground (Note 1) −0.5 to +6.5 V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. During input transitions, voltage undershoot on any pin should not exceed −1 V for more than 20 ns. Voltage overshoot on pins A0, A1, A2

and WP should not exceed VCC + 1 V for more than 20 ns, while voltage on the I2C bus pins, SCL and SDA, should not exceed the absolute

maximum ratings, irrespective of VCC.

Table 3. RELIABILITY CHARACTERISTICS

Symbol Parameter Min Units

NEND (Note 2) Endurance 1,000,000 Write Cycles (Note 3)

TDR (Note 2) Data Retention 100 Years

2. TA = 25°C

3. A Write Cycle refers to writing a Byte or a Page.

Table 4. D.C. OPERATING CHARACTERISTICS (VCC = 1.7 V to 5.5 V, TA = −40°C to +125°C, unless otherwise speciﬁed.*)

Symbol Parameter Test Conditions Min Max Units

ICCR Read Current Read, fSCL = 1 MHz 0.3 mA

ICCW Write Current Write 0.5 mA

ISB Standby Current All I/O Pins at GND or VCC TA = −40°C to +85°C 1 mA

TA = −40°C to +125°C 2

ILI/O Pin Leakage Pin at GND or VCC 2mA

VIL1 Input Low Voltage 2.2 V ≤ VCC ≤ 5.5 V −0.5 0.3 VCC V

VIL2 Input Low Voltage 1.7 V ≤ VCC < 2.2 V −0.5 0.2 VCC V

VIH1 Input High Voltage 2.2 V ≤ VCC ≤ 5.5 V 0.7 VCC VCC + 0.5 V

VIH2 Input High Voltage 1.7 V ≤ VCC < 2.2 V 0.8 VCC VCC + 0.5 V

VOL1 Output Low Voltage VCC ≥ 2.2 V, IOL = 6.0 mA 0.4 V

VOL2 Output Low Voltage VCC < 2.2 V, IOL = 2.0 mA 0.2 V

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

*VCC(min) = 1.6 V for Read operations, TA = −20°C to +85°C.

NV24C02LV, NV24C04LV, NV24C08LV, NV24C16LV

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Table 5. PIN IMPEDANCE CHARACTERISTICS VCC = 1.7 V to 5.5 V, TA = −40°C to +125°C, unless otherwise speciﬁed.*)

Symbol Parameter Conditions Max Units

CIN (Note 4) SDA I/O Pin Capacitance VIN = 0 V 8 pF

CIN (Note 4) Input Capacitance (other pins) VIN = 0 V 6 pF

IWP

, IA

(Note 5)

WP Input Current, Address Input

Current (A0, A1, A2)

VIN < VIH, VCC = 5.5 V 50 mA

VIN < VIH, VCC = 3.3 V 35

VIN < VIH, VCC = 1.7 V 25

VIN > VIH 2

4. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100

and JEDEC test methods.

5. When not driven, the WP, A0, A1 and A2 pins are pulled down to GND internally. For improved noise immunity, the internal pull−down is relatively

strong; therefore the external driver must be able to supply the pull−down current when attempting to drive the input HIGH. To conserve power,

as the input level exceeds the trip point of the CMOS input buffer (~ 0.5 x VCC), the strong pull−down reverts to a weak current source.

*VCC(min) = 1.6 V for Read operations, TA = −20°C to +85°C.

Table 6. A.C. CHARACTERISTICS VCC = 1.7 V to 5.5 V, TA = −40°C to +125°C, unless otherwise speciﬁed.*) (Note 6)

Symbol Parameter

Standard Fast Fast−Plus

Units

Min Max Min Max Min Max

FSCL Clock Frequency 100 400 1,000 kHz

tHD:STA START Condition Hold Time 4 0.6 0.26 ms

tLOW Low Period of SCL Clock 4.7 1.3 0.50 ms

tHIGH High Period of SCL Clock 4 0.6 0.26 ms

tSU:STA START Condition Setup Time 4.7 0.6 0.26 ms

tHD:DAT Data In Hold Time 0 0 0 ms

tSU:DAT Data In Setup Time 250 100 50 ns

tR (Note 7) SDA and SCL Rise Time 1,000 300 120 ns

tF (Note 7) SDA and SCL Fall Time 300 300 120 ns

tSU:STO STOP Condition Setup Time 4 0.6 0.26 ms

tBUF Bus Free Time Between

STOP and START

4.7 1.3 0.5 ms

tAA SCL Low to Data Out Valid 3.5 0.9 0.45 ms

tDH (Note 7) Data Out Hold Time 100 100 50 ns

Ti (Note 7) Noise Pulse Filtered at SCL

and SDA Inputs

50 50 50 ns

tSU:WP WP Setup Time 0 0 0 ms

tHD:WP WP Hold Time 2.5 2.5 1 ms

tWR Write Cycle Time 4 4 4 ms

tPU (Notes 7, 8) Power-up to Ready Mode 0.35 0.35 0.35 ms

6. Test conditions according to “A.C. Test Conditions” table.

7. Tested initially and after a design or process change that affects this parameter.

8. tPU is the delay between the time VCC is stable and the device is ready to accept commands.

*VCC(min) = 1.6 V for Read operations, TA = −20°C to +85°C.

Table 7. A.C. TEST CONDITIONS

Input Levels 0.2 x VCC to 0.8 x VCC for VCC ≥ 2.2 V

0.15 x VCC to 0.85 x VCC for VCC < 2.2 V

Input Rise and Fall Times ≤ 50 ns

Input Reference Levels 0.3 x VCC, 0.7 x VCC

Output Reference Levels 0.3 x VCC, 0.7 x VCC

Output Load Current Source: IOL = 6 mA (VCC ≥ 2.2 V); IOL = 2 mA (VCC < 2.2 V); CL = 100 pF

NV24C02LV, NV24C04LV, NV24C08LV, NV24C16LV

www.onsemi.com

Power−On Reset (POR)

Each NV24Cxx* incorporates Power−On Reset (POR)

circuitry which protects the internal logic against powering

up in the wrong state.

A NV24Cxx device will power up into Standby mode

after VCC exceeds the POR trigger level and will power

down into Reset mode when VCC drops below the POR

trigger level. This bi−directional POR feature protects the

device against ‘brown−out’ failure following a temporary

loss of power.

*For common features, the NV24C02/04/08/16 will be

referred to as NV24Cxx.

Pin Description

SCL: The Serial Clock input pin accepts the Serial Clock

generated by the Master.

SDA: The Serial Data I/O pin receives input data and

transmits data stored in EEPROM. In transmit mode, this pin

is open drain. Data is acquired on the positive edge, and is

delivered on the negative edge of SCL.

A0, A1 and A2: The Address inputs set the device address

when cascading multiple devices. When not driven, these

pins are pulled LOW internally.

WP: The Write Protect input pin inhibits all write

operations, when pulled HIGH. When not driven, this pin is

pulled LOW internally.

Functional Description

The NV24Cxx supports the Inter−Integrated Circuit (I2C)

Bus data transmission protocol, which defines a device that

sends data to the bus as a transmitter and a device receiving

data as a receiver. Data flow is controlled by a Master device,

which generates the serial clock and all START and STOP

conditions. The NV24Cxx acts as a Slave device. Master and

Slave alternate as either transmitter or receiver.

I2C Bus Protocol

The I2C bus consists of two ‘wires’, SCL and SDA. The

two wires are connected to the VCC supply via pull−up

resistors. Master and Slave devices connect to the 2−wire

bus via their respective SCL and SDA pins. The transmitting

device pulls down the SDA line to ‘transmit’ a ‘0’ and

releases it to ‘transmit’ a ‘1’.

Data transfer may be initiated only when the bus is not

busy (see AC Characteristics).

During data transfer, the SDA line must remain stable

while the SCL line is high. An SDA transition while SCL is

high will be interpreted as a START or STOP condition

(Figure 2). The START condition precedes all commands. It

consists of a HIGH to LOW transition on SDA while SCL

is HIGH. The START acts as a ‘wake−up’ call to all

receivers. Absent a START, a Slave will not respond to

commands. The STOP condition completes all commands.

It consists of a LOW to HIGH transition on SDA while SCL

is HIGH.

NOTE: The I/O pins of NV24Cxx do not obstruct the SCL

and SDA lines if the VCC supply is switched off. During

power−up, the SCL and SDA pins (connected with pull−up

resistors to VCC) will follow the VCC monotonically from

VSS (0 V) to nominal VCC value, regardless of pull−up

resistor value. The delta between the VCC and the

instantaneous voltage levels during power ramping will be

determined by the relation between bus time constant

(determined by pull−up resistance and bus capacitance) and

actual VCC ramp rate.

Device Addressing

The Master initiates data transfer by creating a START

condition on the bus. The Master then broadcasts an 8−bit

serial Slave address. For normal Read/Write operations, the

first 4 bits of the Slave address are fixed at 1010 (Ah). The

next 3 bits are used as programmable address bits when

cascading multiple devices and/or as internal address bits.

The last bit of the slave address, R/W, specifies whether a

Read (1) or Write (0) operation is to be performed. The 3

address space extension bits are assigned as illustrated in

Figure 3. A2, A1 and A0 must match the state of the external

address pins, and a10, a9 and a8 are internal address bits.

Acknowledge

After processing the Slave address, the Slave responds

with an acknowledge (ACK) by pulling down the SDA line

during the 9th clock cycle (Figure 4). The Slave will also

acknowledge the address byte and every data byte presented

in Write mode. In Read mode the Slave shifts out a data byte,

and then releases the SDA line during the 9th clock cycle. As

long as the Master acknowledges the data, the Slave will

continue transmitting. The Master terminates the session by

not acknowledging the last data byte (NoACK) and by

issuing a STOP condition. Bus timing is illustrated in

Figure 5.

NV24C02LV, NV24C04LV, NV24C08LV, NV24C16LV

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START

CONDITION

STOP

CONDITION

SDA

SCL

Figure 2. Start/Stop Timing

101 0a10 a9a8R/W N24C16

101 0A2a9a8R/W N24C08

101 0A2A1a8R/W N24C04

101 0A2A1A0R/W NV24C0

2LV

Figure 3. Slave Address Bits

189

START

SCL FROM

MASTER

BUS RELEASE DELAY (TRANSMITTER) BUS RELEASE DELAY

(RECEIVER)

DATA OUTPUT

FROM TRANSMITTER

DATA OUTPUT

FROM RECEIVER

ACK DELAY (v tAA)

ACK SETUP (w tSU:DAT)

Figure 4. Acknowledge Timing

Figure 5. Bus Timing

SCL

SDA IN

SDA OUT

tSU:STA

tHD:STA

tHD:DAT

tLOW

tAA

tHIGH

tLOW

tDH tBUF

tSU:DAT tSU:STO

NV24C02LV, NV24C04LV, NV24C08LV, NV24C16LV

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WRITE OPERATIONS

Byte Write

In Byte Write mode, the Master sends the START

condition and the Slave address with the R/W bit set to zero

to the Slave. After the Slave generates an acknowledge, the

Master sends the byte address that is to be written into the

address pointer of the NV24Cxx. After receiving another

acknowledge from the Slave, the Master transmits the data

byte to be written into the addressed memory location. The

NV24Cxx device will acknowledge the data byte and the

Master generates the STOP condition, at which time the

device begins its internal Write cycle to nonvolatile memory

(Figure 6). While this internal cycle is in progress (tWR), the

SDA output will be tri−stated and the NV24Cxx will not

respond to any request from the Master device (Figure 7).

Page Write

The NV24Cxx writes up to 16 bytes of data in a single

write cycle, using the Page Write operation (Figure 8). The

Page Write operation is initiated in the same manner as the

Byte Write operation, however instead of terminating after

the data byte is transmitted, the Master is allowed to send up

to fifteen additional bytes. After each byte has been

transmitted the NV24Cxx will respond with an

acknowledge and internally increments the four low order

address bits. The high order bits that define the page address

remain unchanged. If the Master transmits more than sixteen

bytes prior to sending the STOP condition, the address

counter ‘wraps around’ to the beginning of page and

previously transmitted data will be overwritten. Once all

sixteen bytes are received and the STOP condition has been

sent by the Master, the internal Write cycle begins. At this

point all received data is written to the NV24Cxx in a single

write cycle.

Acknowledge Polling

The acknowledge (ACK) polling routine can be used to

take advantage of the typical write cycle time. Once the stop

condition is issued to indicate the end of the host’s write

operation, the NV24Cxx initiates the internal write cycle.

The ACK polling can be initiated immediately. This

involves issuing the start condition followed by the slave

address for a write operation. If the NV24Cxx is still busy

with the write operation, NoACK will be returned. If the

NV24Cxx has completed the internal write operation, an

ACK will be returned and the host can then proceed with the

next read or write operation.

Hardware Write Protection

With the WP pin held HIGH, the entire memory is

protected against Write operations. If the WP pin is left

floating or is grounded, it has no impact on the operation of

the NV24Cxx. The state of the WP pin is strobed on the last

falling edge of SCL immediately preceding the first data

byte (Figure 9). If the WP pin is HIGH during the strobe

interval, the NV24Cxx will not acknowledge the data byte

and the Write request will be rejected.

Delivery State

The NV24Cxx is shipped erased, i.e., all bytes are FFh.

ADDRESS

BYTE

DATA

BYTE

SLAVE

ADDRESS

BUS ACTIVITY:

MASTER

SLAVE

a7− a0d7− d0

Figure 6. Byte Write Sequence

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tWR

STOP

CONDITION

START

CONDITION

ADDRESS

ACK8th Bit

Byte n

SCL

SDA

Figure 7. Write Cycle Timing

SLAVE

ADDRESS

n = 1

P v 15

ADDRESS

BYTE n n+1 n+P

BUS ACTIVITY:

MASTER

SLAVE

DATA

BYTE DATA

BYTE

Figure 8. Page Write Sequence

1891 8

a7a0d7d0

tSU:WP

tHD:WP

ADDRESS

BYTE

DATA

BYTE

SCL

SDA

Figure 9. WP Timing

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READ OPERATIONS

Immediate Read

Upon receiving a Slave address with the R/W bit set to ‘1’,

the NV24Cxx will interpret this as a request for data residing

at the current byte address in memory. The NV24Cxx will

acknowledge the Slave address, will immediately shift out

the data residing at the current address, and will then wait for

the Master to respond. If the Master does not acknowledge

the data (NoACK) and then follows up with a STOP

condition (Figure 10), the NV24Cxx returns to Standby

mode.

Selective Read

Selective Read operations allow the Master device to

select at random any memory location for a read operation.

The Master device first performs a ‘dummy’ write operation

by sending the START condition, slave address and byte

address of the location it wishes to read. After the NV24Cxx

acknowledges the byte address, the Master device resends

the START condition and the slave address, this time with

the R/W bit set to one. The NV24Cxx then responds with its

acknowledge and sends the requested data byte. The Master

device does not acknowledge the data (NoACK) but will

generate a STOP condition (Figure 11).

Sequential Read

If during a Read session, the Master acknowledges the 1st

data byte, then the NV24Cxx will continue transmitting data

residing at subsequent locations until the Master responds

with a NoACK, followed by a STOP (Figure 12). In contrast

to Page Write, during Sequential Read the address count will

automatically increment to and then wrap−around at end of

memory (rather than end of page).

SCL

SDA 8th Bit

STOPNO ACKDATA OUT

SLAVE

ADDRESS

D ATA

BYTE

BUS ACTIVITY:

MASTER

SLAVE

Figure 10. Immediate Read Sequence and Timing

SLAVE

ADDRESS

D ATA

BYTE

ADDRESS

BYTEADDRESS

BUS ACTIVITY:

MASTER

SLAVE

Figure 11. Selective Read Sequence

SLAVE

ADDRESS

D ATA

BYTE

D ATA

BYTE

n+1

D ATA

BYTE

n+2

D ATA

BYTE

n+x

BUS ACTIVITY:

MASTER

SLAVE

Figure 12. Sequential Read Sequence

NV24C02LV, NV24C04LV, NV24C08LV, NV24C16LV

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PACKAGE DIMENSIONS

TSSOP8, 4.4x3

CASE 948AL−01

ISSUE O

E1 E

TOP VIEW

SIDE VIEW END VIEW

L1 L

Notes:

(1) All dimensions are in millimeters. Angles in degrees.

(2) Complies with JEDEC MO-153.

SYMBOL

MIN NOM MAX

0º 8º

0.05

0.80

0.19

0.09

0.50

2.90

6.30

4.30

0.65 BSC

1.00 REF

1.20

0.15

1.05

0.30

0.20

0.75

3.10

6.50

4.50

0.90

0.60

3.00

6.40

4.40

NV24C02LV, NV24C04LV, NV24C08LV, NV24C16LV

www.onsemi.com

PACKAGE DIMENSIONS

SOIC 8, 150 mils

CASE 751BD−01

ISSUE O

E1 E

PIN # 1

IDENTIFICATION

TOP VIEW

SIDE VIEW END VIEW

Notes:

(1) All dimensions are in millimeters. Angles in degrees.

(2) Complies with JEDEC MS-012.

SYMBOL MIN NOM MAX

0º 8º

0.10

0.33

0.19

0.25

4.80

5.80

3.80

1.27 BSC

1.75

0.25

0.51

0.25

0.50

5.00

6.20

4.00

L0.40 1.27

1.35

NV24C02LV, NV24C04LV, NV24C08LV, NV24C16LV

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PACKAGE DIMENSIONS

UDFN8 2x3, 0.5P

CASE 517DH

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.25MM FROM THE TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

5. FOR DEVICE OPN CONTAINING W OPTION,

DETAIL B ALTERNATE CONSTRUCTION IS

NOT APPLICABLE.

C0.05

PIN ONE

INDICATOR

TOP VIEW

SIDE VIEW

BOTTOM VIEW

C0.10

C0.08 A1 SEATING

PLANE

NOTE 3

0.10 C

0.05 C

DIM MIN MAX

MILLIMETERS

A0.45 0.55

A1 0.00 0.05

b0.20 0.30

D2.00 BSC

D2 1.30 1.50

E3.00 BSC

E2 1.30 1.50

e0.50 BSC

L0.30 0.50

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.50

PITCH

1.55 3.40

DIMENSIONS: MILLIMETERS

NOTE 4

0.30

DETAIL A

A3 0.13 REF

DETAIL B

DETAIL A

ALTERNATE

CONSTRUCTIONS

L1 −−− 0.15

RECOMMENDED

1.56

0.68

C0.05

DETAIL B

MOLD CMPDEXPOSED Cu

ALTERNATE

CONSTRUCTIONS

NV24C02LV, NV24C04LV, NV24C08LV, NV24C16LV

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PACKAGE DIMENSIONS

US8

CASE 493

ISSUE D

DIM

MIN MAX MIN MAX

INCHES

1.90 2.10 0.075 0.083

MILLIMETERS

B2.20 2.40 0.087 0.094

C0.60 0.90 0.024 0.035

D0.17 0.25 0.007 0.010

F0.20 0.35 0.008 0.014

G0.50 BSC 0.020 BSC

H0.40 REF 0.016 REF

J0.10 0.18 0.004 0.007

K0.00 0.10 0.000 0.004

L3.00 3.20 0.118 0.128

M0 6 0 6

N0 10 0 10

P0.23 0.34 0.010 0.013

R0.23 0.33 0.009 0.013

S0.37 0.47 0.015 0.019

U0.60 0.80 0.024 0.031

V0.12 BSC 0.005 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH, PROTRUSION OR GATE BURR. MOLD

FLASH. PROTRUSION AND GATE BURR SHALL

NOT EXCEED 0.14MM (0.0055”) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH

AND PROTRUSION SHALL NOT EXCEED 0.14MM

(0.0055”) PER SIDE.

5. LEAD FINISH IS SOLDER PLATING WITH

THICKNESS OF 0.0076−0.0203MM (0.003−0.008”).

6. ALL TOLERANCE UNLESS OTHERWISE

SPECIFIED ±0.0508MM (0.0002”).

SEATING

DETAIL E

R 0.10 TYP

DETAIL E

0.10 (0.004) XY

T0.10 (0.004)

____

PLANE

X Y

0.30

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.50

RECOMMENDED

PITCH

3.40

0.68

NV24C02LV, NV24C04LV, NV24C08LV, NV24C16LV

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PACKAGE DIMENSIONS

TSOP−5

CASE 483

ISSUE M

0.7

0.028

1.0

0.039

ǒmm

inchesǓ

SCALE 10:1

0.95

0.037

2.4

0.094

1.9

0.074

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH

THICKNESS. MINIMUM LEAD THICKNESS IS THE

MINIMUM THICKNESS OF BASE MATERIAL.

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR GATE BURRS. MOLD

FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT

EXCEED 0.15 PER SIDE. DIMENSION A.

5. OPTIONAL CONSTRUCTION: AN ADDITIONAL

TRIMMED LEAD IS ALLOWED IN THIS LOCATION.

TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2

FROM BODY.

DIM MIN MAX

MILLIMETERS

C0.90 1.10

D0.25 0.50

G0.95 BSC

H0.01 0.10

J0.10 0.26

K0.20 0.60

M0 10

S2.50 3.00

123

54 S

0.20

CAB

T0.10

2X T0.20

NOTE 5

CSEATING

PLANE

0.05

DETAIL Z

TOP VIEW

SIDE VIEW

END VIEW

1.35 1.65

2.85 3.15

NV24C02LV, NV24C04LV, NV24C08LV, NV24C16LV

www.onsemi.com

Ordering Information

OPN Density (Kb) Package Type

Device

Specific

Marking Temperature Range Shipping

NV24C02UVLT2G 2 US−8 TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

2,000 Units / Reel

NV24C02MUW3VLTBG 2 UDFN−8

Wettable Flank

TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

3,000 Units / Reel

NV24C02DWVLT3G 2 SOIC−8 TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

3,000 Units / Reel

NV24C02DTVLT3G 2 TSSOP−8 TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

3,000 Units / Reel

NV24C02SNVLT3G 2 TSOP−5 TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

3,000 Units / Reel

NV24C04UVLT2G 4 US−8 TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

2,000 Units / Reel

NV24C04MUW3VLTBG 4 UDFN−8

Wettable Flank

TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

3,000 Units / Reel

NV24C04DWVLT3G 4 SOIC−8 TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

3,000 Units / Reel

NV24C04DTVLT3G 4 TSSOP−8 TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

3,000 Units / Reel

NV24C04SNVLT3G 4 TSOP−5 TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

3,000 Units / Reel

NV24C08UVLT2G 8 US−8 TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

2,000 Units / Reel

NV24C08MUW3VLTBG 8 UDFN−8

Wettable Flank

TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

3,000 Units / Reel

NV24C08DWVLT3G 8 SOIC−8 TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

3,000 Units / Reel

NV24C08DTVLT3G 8 TSSOP−8 TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

3,000 Units / Reel

NV24C08SNVLT3G 8 TSOP−5 TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

3,000 Units / Reel

NV24C16UVLT2G 16 US−8 TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

2,000 Units / Reel

NV24C16MUW3VLTBG 16 UDFN−8

Wettable Flank

TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

3,000 Units / Reel

NV24C16DWVLT3G 16 SOIC−8 TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

3,000 Units / Reel

NV24C16DTVLT3G 16 TSSOP−8 TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

3,000 Units / Reel

NV24C16SNVLT3G 16 TSOP−5 TBD V = Automotive Grade 1

(−40°C to +125°C)

Tape & Reel,

3,000 Units / Reel

9. All packages are RoHS−compliant (Lead−free, Halogen−free).

10.For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

NV24C02LV, NV24C04LV, NV24C08LV, NV24C16LV

www.onsemi.com

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PUBLICATION ORDERING INFORMATION

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Europe, Middle East and Africa Technical Support:

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NV24C02LV/D

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