Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
UCC2806Q ACTIVE PLCC FN 20 46 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
UCC2806QG3 ACTIVE PLCC FN 20 46 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
UCC3806DW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3806DWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3806DWTR ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3806DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3806J ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
UCC3806N ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC3806NG4 ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UCC3806PW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3806PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UCC3806PWTRG4 ACTIVE TSSOP PW 16 TBD Call TI Call TI
UCC3806Q ACTIVE PLCC FN 20 46 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
UCC3806QG3 ACTIVE PLCC FN 20 46 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
UCC3806QTR ACTIVE PLCC FN 20 1000 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
UCC3806QTRG3 ACTIVE PLCC FN 20 1000 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 7-Mar-2008
Addendum-Page 2