H11L1VM - APTINA IMAGING - Datasheet.Directory

June, 2020 − Rev. 3

1Publication Order Number:

H11L3M/D

6-Pin DIP Schmitt Trigger

Output Optocoupler

H11L1M, H11L2M, H11L3M

Description

The H11LXM series has a high−speed integrated circuit detector

optically coupled to a gallium−arsenide infrared emitting diode. The

output incorporates a Schmitt trigger, which provides hysteresis for

noise immunity and pulse shaping. The detector circuit is optimized

for simplicity of operation and utilizes an open−collector output for

maximum application flexibility.

Features

•High Data Rate, 1 MHz Typical (NRZ)

•Free from Latch−up and Oscillation Throughout Voltage and

Temperature Ranges

•Microprocessor Compatible Drive

•Logic Compatible Output Sinks 16 mA at 0.4 V Maximum

•Guaranteed On/Off Threshold Hysteresis

•Wide Supply Voltage Capability, Compatible with All Popular Logic

Systems

•Safety and Regulatory Approvals:

♦UL1577, 4,170 VACRMS for 1 Minute

♦DIN−EN/IEC60747−5−5, 850 V Peak Working Insulation Voltage

Applications

•Logic−to−Logic Isolator

•Programmable Current Level Sensor

•Line Receiver − Eliminate Noise and Transient Problems

•AC to TTL Conversion − Square Wave Shaping

•Digital Programming of Power Supplies

•Interfaces Computers with Peripherals

PDIP6

CASE 646BX

See detailed ordering and shipping information on page 5

of this data sheet.

ORDERING INFORMATION

www.onsemi.com

MARKING DIAGRAM

H11L1 = Specific Device Code

V = DIN EN/IEC40747−5−5 Option

Y = Year Code

WW = Work Week

Q = Assembly Package Code

H11L1

VYWWQ

SCHEMATIC

ANODE

CATHODE

VCC

GND

Input Output

Truth Table

PDIP6

CASE 646BY

PDIP6

CASE 646BZ

H11L1M, H11L2M, H11L3M

www.onsemi.com

SAFETY AND INSULATION RATINGS

As per DIN EN/IEC 60747−5−5, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data. Compliance with

the safety ratings shall be ensured by means of protective circuits.

Parameter Characteristics

Installation Classifications per DIN VDE

0110/1.89 Table 1, For For Rated Mains Voltage

< 150 VRMS I−IV

< 300 VRMS I−IV

Climatic Classification 55/100/21

Pollution Degree (DIN VDE 0110/1.89) 2

Comparative Tracking Index 175

Symbol Parameter Value Units

VPR Input−to−Output Test Voltage, Method A, VIORM × 1.6 = VPR,

Type and Sample Test with tm = 10 s, Partial Discharge < 5 pC

1360 Vpeak

Input−to−Output Test Voltage, Method B, VIORM × 1.875 = VPR,

100% Production Test with tm = 1 s, Partial Discharge < 5 pC

1594 Vpeak

VIORM Maximum Working Insulation Voltage 850 Vpeak

VIOTM Highest Allowable Over−Voltage 6000 Vpeak

External Creepage ≥7 mm

External Clearance ≥7 mm

External Clearance (for Option TV, 0.4” Lead Spacing) ≥10 mm

DTI Distance Through Insulation (Insulation Thickness) ≥0.5 mm

TSCase Temperature (Note 1) 175 °C

IS,INPUT Input Current (Note 1) 350 mA

PS,OUTPUT Output Power (Note 1) 800 mW

RIO Insulation Resistance at TS, VIO = 500 V (Note 1) >10

1. Safety limit values − maximum values allowed in the event of a failure.

ABSOLUTE MAXIMUM RATINGS

Symbol Parameters Value Units

TOTAL DEVICE

TSTG Storage Temperature −40 to +125 °C

TOPR Operating Temperature −40 to +85 °C

TJJunction Temperature −40 to +125 °C

TSOL Lead Solder Temperature 260 for 10 seconds °C

PDTotal Device Power Dissipation at 25°C

Derate Above 25°C

250 mW

2.94 mW/°C

EMITTER

IFContinuous Forward Current 30 mA

VRReverse Voltage 6 V

IF(pk) Forward Current − Peak (1 ms pulse, 300 pps) 100 mA

PDLED Power Dissipation 60 mW

DETECTOR

PDDetector Power Dissipation 150 mW

VOV45 Allowed Range 0 to 16 V

VCC V65 Allowed Range 3 to 16 V

IOI4 Output Current 50 mA

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

H11L1M, H11L2M, H11L3M

www.onsemi.com

ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)

Symbol Parameter Test Conditions Device Min Typ Max Units

INDIVIDUAL COMPONENT CHARACTERISTICS

Emitter

VFInput Forward Voltage IF = 10 mA All 1.2 1.5 V

IF = 0.3 mA 0.75 1.0

IRReverse Current VR = 3 V All 10 mA

CJCapacitance V = 0, f = 1.0 MHz All 100 pF

Detector

VCC Operating Voltage Range All 3 15 V

ICC(off) Supply Current IF = 0, VCC = 5 V All 1.6 5.0 mA

IOH Output Current, High IF = 0, VCC = VO = 15 V All 100 mA

TRANSFER CHARACTERISTICS

DC Characteristics

ICC(on) Supply Current IF = 10 mA, VCC = 5 V All 1.6 5.0 mA

VOL Output Voltage, Low RL = 270 W, VCC = 5 V,

IF = IF(on) max.

All 0.2 0.4 V

IF(on) Turn−On Threshold Current

(Note 2)

RL = 270 W, VCC = 5 V H11L1M 1.6 mA

H11L2M 10.0

H11L3M 5.0

IF(off) Turn−Off Threshold Current RL = 270 W, VCC = 5 V All 0.3 1.0 mA

IF(off)/IF(on) Hysteresis Ratio RL = 270 W, VCC = 5 V All 0.50 0.75 0.90

AC Characteristics, Switching Speed

ton Turn−On Time RL = 270 W, VCC = 5 V,

IF = IF(on), TA = 25°C

All 1.0 4.0 ms

tfFall Time All 0.1

toff Turn−Off Time All 1.2 4.0

trRise Time All 0.1

Data Rate All 1.0 MHz

ISOLATION CHARACTERISTICS

VISO Input−Output Isolation Voltage t = 1 Minute 4170 VACRMS

CISO Isolation Capacitance VI−O = 0 V, f = 1 MHz 0.4 0.6 pF

RISO Isolation Resistance VI−O = ±500 VDC, TA =

25°C

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

2. Maximum IF(ON) is the maximum current required to trigger the output. For example, a 1.6 mA maximum trigger current would require the

LED to be driven at a current greater than 1.6 mA to guarantee the device turns on. A 10% guard band is recommended to account for

degradation of the LED over its lifetime. The maximum allowable LED drive current is 30 mA.

H11L1M, H11L2M, H11L3M

www.onsemi.com

TYPICAL PERFORMANCE CURVES

, INPUT CURRENT (mA)

VO, OUTPUT VOLTAGE (V)

Figure 1. Transfer Characteristics Figure 2. Threshold Current vs. Supply Voltage

Figure 3. Threshold Current vs. Supply Temperature Figure 4. Output Voltage, Low vs. Load Current

Figure 5. Supply Current vs. Supply Voltage Figure 6. LED Forward Voltage

vs. Forward Current

VOH

IF(OFF) IF(ON)

VOL

VCC = 5 V

RL = 270 W

TA = 25°C

VCC, SUPPLY VOLTAGE (V)

,THRESHOLD CURRENT

(NORMALIZED)

1.6

1.4

1.2

1.0

0.8

0.6

0.4

106 8 12 14 16

IF NORMALIZED TO:

IF(ON) at VCC = 5 V

TA = 25°C

TURN ON THRESHOLD

TURN OFF THRESHOLD

IF(On), IF(Off), THRESHOLD CURRENT

(NORMALIZED)

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

TA, TEMPERATURE (5C)

−50 −25 0 5025 10075

NORMALIZED TO:

VCC = 5 V

TA = 25°C

IF = IF(ON)

VCC = 5 V

RL = 270 W

IO, LOAD CURRENT (mA)

100110

0.3

0.2

0.1

0.5

0.4

0.6

0.8

VOL, OUTPUT VOLTAGE, LOW (V)

TA = 0°C

TA = 25°C

TA = 70°C

IF = 5 mA

TA = 0°C TA = 25°C TA = 70°C

IF = 0 mA

VCC, SUPPLY VOLTAGE (V)

IC, SUPPLY CURRENT (mA)

02 4 6 8 10 12 14 16

TA = 55°C

TA = 25°CTA = 100°C

1.6

1.4

1.2

1.0

1.7

1.5

1.3

1.1

, LED FORWARD CURRENT (mA)

100110

, FORWARD VOLTAGE (V)

H11L1M, H11L2M, H11L3M

www.onsemi.com

TYPICAL PERFORMANCE CURVES (continued)

Figure 7. Switching Test Circuit and Waveforms

H11L1

tr = tf ≤ 0.01 mS

Z = 50 W

VIN

I65 V

270 W

0.1 mF

VIN

50%

ton toff

tftr

10%

90%

Figure 8. Reflow Profile

300

280

260

240

220

200

180

160

140

120

100

0 60 120 180 270 360

33 Sec

1.822°C/Sec Ramp up

rate

260°C

>245°C = 42

Sec

Time above

183°C = 90 Sec

TEMPERATURE (5C)

TIME (s)

REFLOW PROFILE

PACKAGE MARKING AND ORDERING INFORMATION

Part Number Package Shipping

†

H11L1M DIP 6−Pin 50 Units/Tube

H11L1SM SMT 6−Pin (Lead Bend) 50 Units/Tube

H11L1SR2M SMT 6−Pin (Lead Bend) 1000 Units/Tape & Reel

H11L1VM DIP 6−Pin, DIN EN/IEC60747−5−5 Option 50 Units/Tube

H11L1SVM SMT 6−Pin (Lead Bend), DIN EN/IEC60747−5−5 Option 50 Units/Tube

H11L1SR2VM SMT 6−Pin (Lead Bend), DIN EN/IEC60747−5−5 Option 1000 Units/Tape & Reel

H11L1TVM DIP 6−Pin, 0.4” Lead Spacing, DIN EN/IEC60747−5−5 Option 50 Units/Tube

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

3. The product orderable part number system listed in this table also applies to the H11L2M and H11L3M product families.

PDIP6 8.51x6.35, 2.54P

CASE 646BX

ISSUE O

DATE 31 JUL 2016

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

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DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

PDIP6 8.51X6.35, 2.54P

PDIP6 8.51x6.35, 2.54P

CASE 646BY

ISSUE A

DATE 15 JUL 2019

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

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PDIP6 8.51x6.35, 2.54P

CASE 646BZ

ISSUE O

DATE 31 JUL 2016

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

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DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

PDIP6 8.51X6.35, 2.54P

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