Prepared Ref No. Product Specifications Checked AN17880A Approved A-1 Total Page 7 Page No. 1 Structure Silicon Monolithic Bipolar IC Appearance SSONF-16D DIL-16Pin Plastic Package (SO type) Application Low Frequency Amplifier Function Headphone amplifier IC with Center Amplifier Absolute Maximum Ratings A No. Item Symbol Ratings Unit Note 1 Storage Temperature Tstg -55 ~ +150 C 1 2 Operating Ambient Temperature Topr -25 ~ +75 C 1 3 Operating Ambient Pressure Popr 1.013x10 0.61x10 (1.0 0.6) 4 Operating Constant Gravity Gopr 9,810 (1,000) m/s 5 Operating Shock Sopr 4,900 (500) m/s 6 Power Supply Voltage Vcc 4.6 V 7 Power Supply Current Icc 200 mA 8 Power Dissipation PD 437 mW 5 Operating Supply Voltage Range Vcc 5 Pa (atm) 2 (G) 2 (G) 2 3 1.8 V ~ 4.5 V Note : 1) Ta = 25C except storage temperature and operating ambient temperature. Note : 2) At no - signal Note : 3) At Ta = 70C on PCB of the standard, 50mmX 50mmX 0.8tmm glass - epoxy. Eff. Date Eff. Date Eff. Date Eff. Date 9 Nov 2000 FMSC-PSDA-002-01 Matsushita Electronics Corporation Prepared Ref No. Product Specifications Checked AN17880A Approved B-1 Total Page 7 Page No. 2 Electrical Characteristics (Ambient temperature is 25C2C unless otherwise specified) B No. Symbol Test Cct. Item Condition Limit Unit Note Min Typ Max 1 Stand-by current Istb 1 Vin = 0mV STB: ON - 0.1 5.0 uA 2 Quiescent Current 1 Icq 1 1 Vin = 0mV C-Amp: OFF - 1.3 2.6 mA 3 Quiescent Current 2 Icq 2 1 Vin = 0mV C-Amp: ON - 1.6 3.2 mA 4 Voltage Gain 1 Gv 1 1 Vout = -22dBv 5.5 8.3 10.5 dB 5 Channel Balance CB 1 Vout = -22dBv -1.0 0 1.0 dB 6 Maximum Power Output Po 1 THD = 10% Vcc = 2V 5.0 9.0 - mW 7 Total Harmonic Distortion THD 1 Vout = -12.2dBv - 0.1 0.5 % 8 Output Noise Voltage Vno 1 Rg = 600 - -94.5 -88 dBv 1 9 Channel Crosstalk CT 1 Vout = -12.2dBv 30 50 - dB 2 10 Ripple Rejection Ratio RR 1 Vcc = 1.8V, fr = 100Hz Vr = -20dBv 64 72 - dB 1 11 Muting Effect MT 1 Vout = -12.2dBv 68 78 - dB 2 Vbeep 1 Vbeep - in = 0dBv -56 -51 -46 dBv 12 Beep Output Voltage Vcc = 2.4V, RL = 16, Frequency = 1KHz, Rg = 10K, Vbeep = 0V (GND), STB: OFF, MUTE: OFF, unless otherwise specified. Note : 1) For this measurement, use the filter [ A-Curve ]. 2) For this measurement, use the filter [ 30KHz LPF ]. Eff. Date Eff. Date Eff. Date Eff. Date 9 Nov 2000 FMSC-PSDA-002-01 Matsushita Electronics Corporation Prepared Ref No. Product Specifications Checked AN17880A Approved C-1 Total Page 7 Page No. 3 Description of Test Circuits 1 Test Circuit : ON 22F + + 16 15 ON 14 12 13 Standby SW BIAS 1F 0.22F OFF OFF IN2 BEEP + 10F Mute 10k + Standby 11 7 8 - + - + - 9 BEEP Mute SW + 10 C - Amp SW 2 1 ON + 10F 3 5 4 10k + 16 1 OFF 6 OUT2 16 OUT1 + 1F C-Amp IN1 VCC Note: The above circuit is used for Latchup testing. Eff. Date Eff. Date Eff. Date Eff. Date 9 Nov 2000 FMSC-PSDA-002-01 Matsushita Electronics Corporation Prepared Ref No. Product Specifications Checked AN17880A Approved D-1 Total Page 7 Page No. 4 Circuit Function Block Diagram ON 22F + + 16 15 ON 14 12 13 Standby SW BIAS 1F 0.22F OFF OFF IN2 BEEP + 10F Mute 10k + Standby 11 7 8 - + - + - 9 BEEP Mute SW + 10 C - Amp SW 2 1 3 ON + 10F 5 4 10k + 16 1 OFF 6 OUT2 16 OUT1 + 1F C-Amp IN1 VCC Pin Descriptions Pin No. 1 2 3 4 5 6 7 8 Eff. Date Pin Descriptions Ripple Filter Centre Amplifier Control Supply Voltage Ch.2 Output Centre Amplifier Output Ch.1 Output Output Gnd Ch.1 Input Eff. Date Eff. Date Pin No. 9 10 11 12 13 14 15 16 Pin Descriptions Ch.2 Input Input Gnd Beep Input Mute time Control Mute Control Standby Control Bias Output Bias input Eff. Date 9 Nov 2000 FMSC-PSDA-002-01 Matsushita Electronics Corporation Prepared Product Specifications Checked AN17880A Approved Ref No. E Total Page 7 Page No. 5 Package Name Unit : mm SSONF-16D 5.00 0.20 16 9 +0.10 -0.05 6.400.30 0.15 4.400.20 (1.0) 0~10 0.500.20 8 +0.10 (0.225) 0.22 -0.05 0.65 0.100.10 1.200.20 1 SEATING PLANE SEATING PLANE Name of item Date Code ( ) : Reference Value Eff. Date Eff. Date Eff. Date Eff. Date 9 Nov 2000 FMSC-PSDA-002-01 Matsushita Electronics Corporation Prepared Product Specifications Checked AN17880A Approved Ref No. F-1 Total Page 7 Page No. 6 (Structure Description) Chip surface passivation SiN, PSG, Others ( ) 1 Lead frame material Fe group, Cu group, Others ( ) 2 , 6 Inner lead surface process Ag plating, Au plating, Others ( ) 2 Outer lead surface process Solder plating, Solder dip, Others ( ) 6 Chip mounting method Ag paste, Au-Si alloy, Solder, Others ( ) 3 Wire bonding method Thermalsonic bonding, Others ( ) 4 Wire material Au, Others ( ) 4 Mold material Epoxy Others ( ) 5 Molding method Transfer mold, Others ( ) 5 Diameter : 24 m Multiplunger mold, Package SSONF-16D 1 4 5 2 3 Eff. Date Eff. Date Eff. Date 6 Eff. Date 9 Nov 2000 FMSC-PSDA-002-01 Matsushita Electronics Corporation Prepared Ref No. Product Specifications (Technical Data) Checked AN17880A Approved G-1 Total Page 7 Page No. 7 SSONF-16D Package Power Dissipation PD - Ta 0.800 0.727 0.700 With a glass-epoxy PCB Mounted on standard board (Glass epoxy : 50mm x 50mm x 0.8tmm3) Rth(j-a)=171.8C/W Power Dissipation, PD (W) 0.600 0.500 0.422 0.400 0.300 Single unit package Rth(j-a)=295.6C/W 0.200 0.100 0.000 0 25 50 75 100 125 150 Ambient Temperature, Ta (C) Eff. Date Eff. Date Eff. Date Eff. Date 9 Nov 2000 FMSC-PSDA-002-01 Matsushita Electronics Corporation