Intel® NUC Kit NUC7i7BNH
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Specifications
Essentials
Supplemental Information
Memory Specifications
Graphics Specifications
Expansion Options
I/O Specifications
Package Specifications
Advanced Technologies
Security & Reliability
Ordering and
Compliance
Downloads and
Software
Export specifications
Essentials
Product Collection Intel® NUC Kits
Code Name Products formerly Baby Canyon
Status Launched
Launch Date Q1'17
Expected Discontinuance See Roadmap
Board Form Factor UCFF (4" x 4")
Socket Soldered-down BGA
Internal Drive Form Factor M.2 and 2.5" Drive
# of Internal Drives Supported 2
Lithography 14 nm
TDP 28 W
DC Input Voltage Supported 12-19 VDC
Recommended Customer Price
Processor Included Intel® Core™ i7-7567U Processor (4M Cache, up to 4.00 GHz)
Warranty Period 3 yrs
Supplemental Information
Embedded Options Available No
Description
Other features: Includes Thunderbolt 3 (40Gbps) USB 3.1 Gen 2 (10Gbps) and DP 1.2 via
USB-C; also includes SDXC card slot, dual microphones
Product Brief View now
Additional Information URL View now
Memory Specifications
Max Memory Size (dependent on memory type) 32 GB
Memory Types DDR4-2133 1.2V SO-DIMM
Max # of Memory Channels 2
Max Memory Bandwidth 34.1 GB/s
Max # of DIMMs 2
ECC Memory Supported ‡No
Graphics Specifications
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Integrated Graphics ‡Yes
Graphics Output HDMI 2.0a; USB-C (DP1.2)
# of Displays Supported ‡3
Expansion Options
PCI Express Revision Gen3
PCI Express Configurations ‡M.2 slot with PCIe x4 lanes
Removable Memory Card Slot SDXC with UHS-I support
M.2 Card Slot (storage) 22x42/80
I/O Specifications
USB Configuration 2x front and 2x rear USB 3.0; 2x USB 2.0 via internal headers
USB Revision 2.0, 3.0
# of USB Ports 6
USB 2.0 Configuration (External + Internal) 0 + 2
USB 3.0 Configuration (External + Internal) 2B 2F + 0
Total # of SATA Ports 2
Max # of SATA 6.0 Gb/s Ports 2
RAID Configuration 2.5" HDD/SSD + M.2 SATA/PCIe SSD (RAID-0 RAID-1)
Audio (back channel + front channel) 7.1 digital (HDMI mDP); L+R+mic (F)
Integrated LAN 10/100/1000
Integrated Wifi Intel® Wireless-AC 8265 + BT 4.2
Integrated Bluetooth Yes
Consumer Infrared Rx Sensor Yes
Additional Headers CEC, 2x USB2.0, FRONT_PANEL
# of Thunderbolt™ 3 Ports 1
Package Specifications
Low Halogen Options Available See MDDS
Advanced Technologies
Intel® Optane™ Memory Supported ‡Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡Yes
Intel® vPro™ Technology ‡No
TPM No
Intel® HD Audio Technology Yes
Intel® Rapid Storage Technology Yes
Intel® Virtualization Technology (VT-x) ‡Yes
Intel® Platform Trust Technology (Intel® PTT) Yes
Security & Reliability
Intel® AES New Instructions Yes
More support options for Intel® NUC Kit NUC7i7BNH
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and
product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties
whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please
contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule
(HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding
the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-
2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or
reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine
monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may
vary depending on system configuration.
“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products
that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic
Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains,
smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before
January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed
Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit
purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and
shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP does not
constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as
purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The
replacement of halogenated flame retardants and/or PVC may not be better for the environment.
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