TAITIEN
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Specifications subject to change without notice.
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ELECTRICAL SPECIFICATION
Parameter 3.3V 2.5V 1.8V unit
Min. Max. Min. Max. Min. Max.
Supply Voltage Variation(VDD) 10% 2.97 3.63 2.25 2.75 1.62 1.98
Frequency Range 156.25 133 125 0.012 0.012
Supply Current _ _ _
_ _ _
_ _ _
_ _ _ mA
_ _
_
_
_
_
_ _
_
Output Level (CMOS)
Output High (Logic “1”)
90%VDD
_
90%VDD
_
90%VDD
_
_
V
V
Output Low (Logic “0”) _
10%V
DD
_
10%V
DD
_
10%V
DD
TransitionTime:Rise/FallTime
_
_200
6
5
4
3
5
15
_
_
_
_
_ _ _
_ _ _
nSec
_ _ _
Start Time
Output Drive Capability (CL)
_
_
_
_
_
_ mSec
pF
Tri-State Enable
0.7
VDD
0.3 VDD
_ _
0.7 VDD
_
V
Disable
_
_
_
0.7 VDD
_
_
_
_
_
_
_ _
pSec
pSec
ppm
_ _ _
µA
±3
-55 125 -55 125 -55 125 °C
Standard frequencies are frequencies which the crystal has been designed and does not imply a stock position.
+Transition times are measured between 10% and 90% of VDD, with an output load of 15pF.
F0 = 0.032768MHz
0.3125MHz F0 < 35.328MHz (A1)
30MHz F0 < 50MHz (A3)
50MHz F0 < 75MHz
75MHz F0 < 100MHz
100MHz F0 < 125MHz
133MHz F0 < 156.25MHz
0.048
3
7
15
20
25
35
45
2
6
13
18
20
30
40
2
5
10
15
18
20
MHz
F0 = 0.032768MHz
0.3125MHz F0 < 50MHz
50MHz F0 < 100MHz
100MHz F0 < 125MHz
125MHz F0 < 156.25MHz
Absolute Clock Period Jitter
RMS Phase Jitter (Integrated 12KHz~20MHz)
Standby Current
Aging
Storage Temp. Range
200
5
4
3
2
5
15
200
4
3
2
-
5
15
40
1
10
0.3 VDD
±3
40
1
10
0.3 VDD
±3
40
1
10
● Output waveform CMOS only.
FREQ. STABILITY vs. TEMP. RANGE
ppm
Temp.
(°C)
±20 ±25 ±50
-10 ~ +60
-20 ~ +70
-40 ~ +85
Inclusive of calibration @ 25 °C, operating temperature range, input
voltage variation, load variation, aging (1st year), shock, and vibration
*
*
○: Available △:Conditional X: Not available
7.0 x 5.0 mm SMD Crystal Oscillator – OC Type
FEATURE
- Typical 7.0 x 5.0 x 1.3 mm ceramic SMD package.
- Tight symmetry (45 to 55%) available.
- Packing: Tape & Reel, 1000/3000pcs per Reel.
- Realize the standby function with Tri-State
TYPICAL APPLICATION
- xDSL, WLAN, Fiber/10G-Bit Ethernet
- Notebook, PDA
- PC main board, VGA card
RoHS Compliant Standard
DIMENSION (mm) SOLDER PAD LAYOUT (mm)
Actual Size
OC
2.0
1.8
5.08
4.0
0.1µF
[ SIDE VIEW ]
1.4max
5.0±0.2
#4 #3
#2
#1
7.0±0.2
[ TOP VIEW ] [ BOTTOM VIEW ]
#3
#2 #1
#4
5.08
3.7
1.1
1.4
Pad Function
#1 Tri-State / NC
#2 GND
#3 Output
#4 VDD
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