Features
• Well dened and smooth spatial radiation patterns
• Wide viewing angle
• Tinted diused lamp
• High luminous output
• Colors:
590/592 nm Amber
617 nm Reddish-Orange
626/630 nm Red
• High operating temperature: TJLED = +130°C
• Superior resistance to moisture
Applications
• Trac management:
Variable message signs
Trac management signs
• Commercial indoor/outdoor advertising:
Signs
Marquees
Passenger information
• Automotive:
Exterior and interior lights
Description
These Precision Optical Performance AlInGaP LEDs pro-
vide superior light output for excellent readability in sun-
light and are extremely reliable. AlInGaP LED technology
provides extremely stable light output over long periods
of time. Precision Optical Performance lamps utilize the
aluminum indium gallium phosphide (AlInGaP) technol-
ogy.
These LED lamps are tinted, diused, T-13/4 packages
incorporating second generation optics producing well
dened radiation patterns at specic viewing cone an-
gles.
There are two families of amber, red, and red-orange
lamps; AlInGaP and the higher performance AlInGaP II.
The high maximum LED junction temperature limit of
+130°C enables high temperature operation in bright
sunlight conditions.
These lamps are available in two package options to give
the designer exibility with device mounting.
Benets
• Viewing angles match trac management sign
requirements
• Colors meet automotive specications
• Superior performance in outdoor environments
• Suitable for autoinsertion onto PC boards
HLMP-EL55/EG55/EL57/EH57/ED57
T-13/4 (5 mm) Precision Optical Performance AlInGaP
LED Lamps
Data Sheet
2
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk Packaging
DD: Ammo Pack
Color Bin Selections
0: No color bin limitation
K: Amber color bins 2 and 4 only
L: Amber Color Bins 4 and 6 only
Maximum Intensity Bin
Minimum Intensity Bin
Viewing Angle & Lead Stand Os
55: 55 deg without lead stand os; AlInGaP
57: 55 deg without lead stand os; AlInGaP II
Color
D: 630 nm Red
G: 626 nm Red
H: 617 nm Red-Orange
L: 590/592 Amber
Package
E: 5 mm Round
Device Selection Guide for AlInGaP
Part Number
Color and Dominant Wavelength
ld (nm) Typ. [3]
Luminous Intensity Iv
(mcd) at 20 mA Min. [1,2]
Luminous Intensity Iv
(mcd) at 20 mA Max. [1,2]
HLMP-EL55-GK0DD Amber 590 140 400
HLMP-EL55-GHKDD Amber 590 140 240
HLMP-EL55-HJKxx Amber 590 180 310
HLMP-EL55-JKLDD Amber 590 240 400
HLMP-EL55-LP000 Amber 590 400 1150
HLMP-EG55-GK0DD Red 626 140 400
HLMP-EG55-HJ0xx Red 626 180 310
HLMP-EG55-JK0xx Red 626 240 400
Device Selection Guide for AlInGaPII
Part Number
Color and Dominant Wavelength
ld (nm) Typ. [3]
Luminous Intensity Iv
(mcd) at 20 mA Min. [1,2]
Luminous Intensity Iv
(mcd) at 20 mA Max. [1,2]
HLMP-EL57-LP0xx Amber 592 400 1150
HLMP-EH57-LP000 Red-Orange 617 400 1150
HLMP-ED57-LP0xx Red 630 400 1150
HLMP-ED57-LPT00 Red 630 400 1150
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
3
Package Dimensions
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN
EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.
3. RECOMMENDED PC BOARD HOLE DIAMETERS:
LAMP PACKAGE WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF
LAMP PACKAGE = 1.143/1.067 (0.044/0.042).
2.35 (0.093)
MAX.
5.80 ± 0.20
(0.228 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
31.60
(1.244) MIN. 0.70 (0.028)
MAX.
1.00
(0.039) MIN.
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
CATHODE
FLAT
8.71 ± 0.20
(0.343 ± 0.008
1.14 ± 0.20
(0.045 ± 0.008)
4
Electrical/Optical Characteristics at T
A = 25°C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Forward Voltage VF V IF = 20 mA
Amber (ld = 590 nm) 2.02 2.4
Amber (ld = 592 nm) 2.15 2.4
Red-Orange (ld = 617 nm) 2.08 2.4
Red (ld = 626 nm) 1.90 2.4
Red (ld = 630 nm) 2.00 2.4
Reverse Voltage VR 5 20 V IR = 100 µA
Peak Wavelength lPEAK nm Peak of Wavelength of Spectral
Amber (ld = 590 nm) 592 Distribution at IF = 20 mA
Amber (ld = 592 nm) 594
Red-Orange (ld = 617 nm) 623
Red (ld = 626 nm) 635
Red (ld = 630 nm) 639
Spectral Halfwidth ∆l1/2 17 nm Wavelength Width at Spectral
Distribution 1/2 Power Point at
IF = 20 mA
Speed of Response τs 20 ns Exponential Time
Constant, e-t/τs
Capacitance C 40 pF VF = 0, f = 1 MHz
Thermal Resistance RθJ-PIN 240 °C/W LED Junction-to-Cathode Lead
Luminous Ecacy[1] ηv lm/W Emitted Luminous Power/Emitted
Amber (ld = 590 nm) 480 Radiant Power
Amber (ld = 592 nm) 500
Red-Orange (ld = 617 nm) 235
Red (ld = 626 nm) 150
Red (ld = 630 nm) 155
Note:
1. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv
is the luminous ecacy in lumens/watt.
Absolute Maximum Ratings at T
A = 25°C
DC Forward Current[1,2,3] ....................................................................................................... 50 mA
Peak Pulsed Forward Current[2,3] .........................................................................................100 mA
Average Forward Current[3] .................................................................................................... 30 mA
Reverse Voltage (IR = 100 µA) .......................................................................................................... 5 V
LED Junction Temperature ......................................................................................................... 130°C
Operating Temperature ..........................................................................................–40°C to +100°C
Storage Temperature ...............................................................................................–40°C to +100°C
Notes:
1. Derate linearly as shown in Figure 4.
2. For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended.
For more information on recommended drive conditions, please refer to Application Brief I-024 (5966-3087E).
3. Please contact your Avago Technologies sales representative about operating currents below 10 mA.
5
Figure 2. Forward current vs. forward voltage. Figure 3. Relative luminous intensity vs.
forward current.
Figure 4. Maximum forward current vs. ambient
temperature. Derating based on TJMAX = 130°C.
Figure 1. Relative intensity vs. peak wavelength.
Figure 5. Representative spatial radiation pattern for 55° viewing angle lamps.
WAVELENGTH – nm
RELATIVE INTENSITY
500 600 650 700
1.0
0.5
0
AMBER RED-ORANGE
RED
550
CURRENT – mA
1.0
0
V
F
– FORWARD VOLTAGE – V
2.5
100
40
30
1.5 2.0
60
3.0
10
20
50
RED
AMBER
70
80
90
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0
0
I
F
– DC FORWARD CURRENT – mA
40
3.0
2.0
1.5
1.0
0.5
20 60
2.5
IF – FORWARD CURRENT – mA
0
0
TA – AMBIENT TEMPERATURE – °C
40 80
50
40
30
20
10
20 60 100
RθJA = 585° C/W
RθJA = 780° C/W
RELATIVE INTENSITY – %
100
0
θ – ANGULAR DISPLACEMENT – DEGREES
80
60
50
70
20
-80 -60
10
30
40
-40 0 20 40 60 80 100
90
-100 -20
6
Bin Name Min. Max.
G 140 180
H 180 240
J 240 310
K 310 400
L 400 520
M 520 680
N 680 880
P 880 1150
Intensity Bin Limits
(mcd at 20 mA)
Tolerance for each bin limit is ± 15%.
Bin Name Min. Max.
1 584.5 587.0
2 587.0 589.5
4 589.5 592.0
6 592.0 594.5
Amber Color Bin Limits
(nm at 20 mA)
Tolerance for each bin limit is ± 0.5 nm.
Note:
1. Bin categories are established for classi-
cation of products. Products may not be
available in all bin categories.
7
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder opera-
tion, as the excess lead length also acts as small heat
sink.
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be eectively hand soldered
to PCB. However, it is only recommended under un-
avoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat
source (soldering iron’s tip) to the body is 1.59mm.
Note:
1. PCB with dierent size and design (component density) will have
dierent heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
prole again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high eciency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
Avago Technologies LED conguration
1.59mm
Soldering the LED using soldering iron tip closer than
1.59mm might damage the LED.
• ESD precaution must be properly applied on the sol-
dering station and personnel to prevent ESD damage
to the LED component that is ESD sensitive. Do refer
to Avago application note AN 1142 for details. The sol-
dering iron used should have grounded tip to ensure
electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature 105 °C Max. -
Preheat time 60 sec Max -
Peak temperature 250 °C Max. 260 °C Max.
Dwell time 3 sec Max. 5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and main-
tained according to the recommended tempera-
ture and dwell time. Customer is advised to perform
daily check on the soldering prole to ensure that
it is always conforming to recommended soldering
conditions.
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment xture that is being applied during
wave soldering should be loosely tted and should
not apply weight or force on LED. Non metal mate-
rial is recommended as it will absorb less heat during
wave soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to
cool down to room temperature prior to handling,
which includes removal of alignment xture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommend-
ed that surface mount components be soldered on
the top side of the PCB. If surface mount need to be
on the bottom side, these components should be sol-
dered using reow soldering prior to insertion the TH
LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH
can cause diculty inserting the TH LED.
AllnGaP Device
CATHODE
8
Ammo Pack Drawing
Example of Wave Soldering Temperature Prole for TH LED
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
0 10 20 30 40 50 60 70 80 90 100
250
200
150
100
50
TIME (MINUTES)
PREHEAT
TURBULENT WAVE LAMINAR WAVE
HOT AIR KNIFE
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
9
Packaging Box for Ammo Packs
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
AVAGO
TECHNOLOGIES
ANODE
MOTHERLABEL
CATHODE
C
A
+
–
ANODE LEAD LEAVES
THE BOX FIRST.
NOTE: THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF.
LABEL ON
THIS SIDE
OF BOX.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 250C
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
250C
Lam
p
s Bab
y
Label
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. Obsoletes 5989-4364EN
AV02-1541EN - January 20, 2009
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE
AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLE-
AR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO
MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 250C
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
250C
Lam
p
s Bab
y
Label
(ii) Avago Baby Label (Only available on bulk packaging)
Acronyms and Denition:
BIN:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and
no color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color
bin and VF bin)
Example:
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only