Technical Data 4149 Effective November 2015 Supersedes March 2007 SD53 Low profile shielded power inductors Applications * Desktop computers * Notebook and laptop regulators * LED and White LED drivers * Digital cameras, media devices * Battery power systems Environmental Data Product description * Octagonal shape utilizes board space * Shielded drum core * Inductance range from 1.1 uH to 100 uH * Current range from 0.44 A to 4.8 A * 5.7 mm x 5.2 mm footprint surface mount package in a 3.0 mm height * Ferrite core material * Halogen free, lead free, RoHS compliant * Storage temperature range (component): -40 C to +125 C * Operating temperature range: -40 C to +125 C (Ambient plus self temperature rise) * Solder reflow temperature: J-STD-020D compliant HALOGEN Pb HF FREE SD53 Low profile shielded power inductors Technical Data 4149 Effective November 2015 Product Specifications Part Number5 OCL1 (H) 20% Part marking Irms2 (A) Isat3 (A) DCR () typical @ 20 C DCR () maximum @ 20 C K-factor4 0.017 0.020 48 SD53-1R1-R 1.10 A 3.25 4.80 SD53-2R0-R 2.00 B 2.64 3.30 0.023 0.027 35 SD53-3R3-R 3.30 C 2.26 2.60 0.029 0.034 28 SD53-4R7-R 4.70 D 2.01 2.10 0.039 0.045 21 SD53-6R8-R 6.80 E 1.65 1.85 0.059 0.068 20 SD53-100-R 10.0 F 1.41 1.40 0.077 0.090 15 SD53-150-R 15.0 G 1.10 1.10 0.122 0.142 12 SD53-220-R 22.0 H 0.81 0.94 0.179 0.208 10 SD53-330-R 33.0 I 0.75 0.76 0.221 0.257 8 SD53-470-R 47.0 J 0.64 0.64 0.303 0.352 7 SD53-680-R 68.0 K 0.52 0.58 0.452 0.525 6 SD53-101-R 100 L 0.44 0.45 0.689 0.801 5 1. 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc. 2. Irms: DC current for an approximate T of 40 C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125 C under worst case operating conditions verified in the end application 3. lsat: Peak current for approximately 30% rolloff @ 25 C. 4. K-factor: Used to determine B p-p for core loss (see graph). B p-p = K*L*I, B p-p(mT), K: (K factor from table), L: (Inductance in uH), I (Peak to peak ripple current in Amps). 5. Part Number Definition: SD53-xxx-R SD53 = Product code and size; -xxx = Inductance value in uH; R = decimal point; If no R is present then third character equals the number of zeros. -R suffix = RoHS compliant. 53 Dimensions (mm) Part Marking: Line 1: (1st digit= inductance value per Part Marking Designator); (2nd digit= Bi-weekly production date code); (3rd digit= Last digit of the year produced), (4th digit= Internal manufacturing code). Line 2: 53=product size code) Do not route traces or vias underneath the inductor Packaging information (mm) Parts packaged on 13" diameter reel, 2,600 parts per reel. 2 www.eaton.com/elx SD53 Low profile shielded power inductors Technical Data 4149 Effective November 2015 Core loss vs. Bp-p 10 1 1MH z Core Loss (W) 0.1 500kH z 300kH z 200kH z 100kH z 0.01 0.001 0.0001 0.00001 0.000001 1 10 Bp-p (mT) 100 1000 Temperature rise vs. total loss Inductance characteristics www.eaton.com/elx 3 SD53 Low profile shielded power inductors Technical Data 4149 Effective November 2015 Solder reflow profile TP TC -5C tP Max. Ramp Up Rate = 3C/s Max. Ramp Down Rate = 6C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 <2.5mm) 235C 220C 2.5mm 220C 220C Table 2 - Lead (Pb) Free Solder (Tc) Tsmin 25C ts Time 25C to Peak Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260C 260C 260C 1.6 - 2.5mm 260C 250C 245C >2.5mm 250C 245C 245C Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder * Temperature min. (Tsmin) 100C 150C * Temperature max. (Tsmax) 150C 200C * Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3C/ Second Max. 3C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183C 60-150 Seconds 217C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6C/ Second Max. 6C/ Second Max. Time 25C to Peak Temperature 6 Minutes Max. 8 Minutes Max. Preheat and Soak * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx (c) 2015 Eaton All Rights Reserved Printed in USA Publication No. 4149 November 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners.