LM4899
LM4899 1 Watt Fully Differential Audio Power Amplifier With Shutdown
Select and Fixed 6dB Gain
Literature Number: SNAS206E
LM4899 OBSOLETE
October 5, 2011
1 Watt Fully Differential Audio Power Amplifier With
Shutdown Select and Fixed 6dB Gain
General Description
The LM4899 is a fully differential audio power amplifier pri-
marily designed for demanding applications in mobile phones
and other portable communication device applications. It is
capable of delivering 1 watt of continuous average power to
an 8Ω load with less than 1% distortion (THD+N) from a
5VDC power supply.
Boomer audio power amplifiers were designed specifically to
provide high quality output power with a minimal amount of
external components. The LM4899 does not require output
coupling capacitors or bootstrap capacitors, and therefore is
ideally suited for mobile phone and other low voltage appli-
cations where minimal power consumption is a primary re-
quirement.
The LM4899 features a low-power consumption shutdown
mode. To facilitate this, Shutdown may be enabled by either
logic high or low depending on mode selection. Driving the
shutdown mode pin either high or low enables the shutdown
select pin to be driven in a likewise manner to enable Shut-
down. Additionally, the LM4899 features an internal thermal
shutdown protection mechanism.
The LM4899 contains advanced pop & click circuitry which
virtually eliminates noises which would otherwise occur dur-
ing turn-on and turn-off transitions.
The LM4899 has an internally fixed gain of 6dB.
Key Specifications
■ Improved PSRR at 217Hz 83dB
■ Power Output at 5.0V & 1% THD 1.0W(typ.)
■ Power Output at 3.3V & 1% THD 400mW(typ.)
■ Shutdown Current 0.1µA(typ.)
Features
■Fully differential amplification
■Internal-gain-setting resistors
■Available in space-saving packages micro SMD, MSOP
and LLP
■Ultra low current shutdown mode
■Can drive capacitive loads up to 500pF
■Improved pop & click circuitry which virtually eliminates
noises during turn-on and turn-off transitions
■2.4 - 5.5V operation
■No output coupling capacitors, snubber networks or
bootstrap capacitors required
■Shutdown high or low selectivity
Applications
■Mobile phones
■PDAs
■Portable electronic devices
Connection Diagrams
9 Bump micro SMD Package
200645a0
Top View
Order Number LM4899ITL, LM4899ITLX
See NS Package Number TLA09AAA
9 Bump micro SMD Marking
200645c7
X - Date Code
T - Die Run Traceability
G - Boomer Family
C1 - LM4899ITL
Boomer® is a registered trademark of National Semiconductor Corporation.
© 2011 National Semiconductor Corporation 200645 www.national.com
200645 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:26:48
LM4899 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select and Fixed 6dB
Gain
Mini Small Outline (MSOP) Package
20064523
Top View
Order Number LM4899MM
See NS Package Number MUB10A
MSOP Marking
200645c9
Z - Assembly Code
X - Date Code
TT - Die Run Traceability
G - Boomer Family
B1 - LM4899MM
LD Package
20064535
Top View
Order Number LM4899LD
See NS Package Number LDA10B
LD Marking
200645c8
Z - Assembly Code
XY - Date Code
TT - Die Run Traceability
L4899 - LM4899LD
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LM4899
Typical Application
200645d0
FIGURE 1. Typical Audio Amplifier Application Circuit
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LM4899
Absolute Maximum Ratings (Note 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage 6.0V
Storage Temperature −65°C to +150°C
Input Voltage −0.3V to VDD +0.3V
Power Dissipation (Note 3) Internally Limited
ESD Susceptibility (Note 4) 2000V
ESD Susceptibility (Note 5) 200V
Junction Temperature 150°C
Thermal Resistance
θJC (LD) 12°C/W
θJA (LD) 63°C/W
θJA (micro SMD) 220°C/W
θJC (MSOP) 56°C/W
θJA (MSOP) 190°C/W
Soldering Information
See AN-1112 "microSMD Wafers Level Chip Scale
Package".
Operating Ratings
Temperature Range
TMIN ≤ TA ≤ TMAX −40°C ≤ TA ≤ +85°C
Supply Voltage 2.4V ≤ VDD ≤ 5.5V
Electrical Characteristics VDD = 5V (Note 1, Note 2, Note 8)
The following specifications apply for VDD = 5V and 8Ω load unless otherwise specified. Limits apply for TA = 25°C.
Symbol Parameter Conditions
LM4899 Units
(Limits)
Typical Limit
(Note 6) (Note 7)
IDD Quiescent Power Supply Current VIN = 0V, no Load
VIN = 0V, RL = 8Ω
3
5
6
10
mA (max)
ISD Standby Current VSDMODE = VSHUTDOWN = GND 0.1 1 µA (max)
PoOutput Power
THD = 1% (max); f = 1 kHz
LM4899LD, RL = 4Ω (Note 11) 1.4
W (min)
LM4899, RL = 8Ω 1 0.9
THD+N Total Harmonic Distortion+Noise Po = 0.4 Wrms; f = 1kHz 0.05 %
PSRR Power Supply Rejection Ratio
Vripple = 200mV sine p-p
f = 217Hz (Note 9) 83
dB (min)
f = 1kHz (Note 9) 90
f = 217Hz (Note 10) 83 71
f = 1kHz (Note 10) 83 71
CMRR Common-Mode Rejection Ratio f = 217Hz, VCM = 200mVpp 50 dB
VOS Output Offset VIN = 0V 2 mV
VSDIH Shutdown Voltage Input High SD Mode = GND 0.9 V
VSDIL Shutdown Voltage Input Low SD Mode = GND 0.7 V
VSDIH Shutdown Voltage Input High SD Mode = VDD 0.9 V
VSDIL Shutdown Voltage Input Low SD Mode = VDD 0.7 V
Electrical Characteristics VDD = 3V (Note 1, Note 2, Note 8)
The following specifications apply for VDD = 3V and 8Ω load unless otherwise specified. Limits apply for TA = 25°C.
Symbol Parameter Conditions
LM4899 Units
(Limits)
Typical Limit
(Note 6) (Note 7)
IDD Quiescent Power Supply Current VIN = 0V, no Load
VIN = 0V, RL = 8Ω
2.5
4
5.5
9mA (max)
ISD Standby Current VSDMODE = VSHUTDOWN = GND 0.1 1 µA (max)
PoOutput Power THD = 1% (max); f = 1kHz
LM4899, RL = 8Ω 0.35 W
THD+N Total Harmonic Distortion+Noise Po = 0.25Wrms; f = 1kHz 0.3 %
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LM4899
Symbol Parameter Conditions
LM4899 Units
(Limits)
Typical Limit
(Note 6) (Note 7)
PSRR Power Supply Rejection Ratio
Vripple = 200mV sine p-p
f = 217Hz (Note 9) 83
dB
f = 1kHz (Note 9) 84
f = 217Hz (Note 10) 83
f = 1kHz (Note 10) 83
CMRR Common-Mode Rejection Ratio f = 217Hz, VCM = 200mVpp 50 dB
VOS Offset Voltage VIN = 0V 2 mV
VSDIH Shutdown Voltage Input High SD Mode = GND 0.8 V
VSDIL Shutdown Voltage Input Low SD Mode = GND 0.6 V
VSDIH Shutdown Voltage Input High SD Mode = VDD 0.8 V
VSDIL Shutdown Voltage Input Low SD Mode = VDD 0.6 V
Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions
which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters
where no limit is given, however, the typical value is a good indication of device performance.
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature TA. The maximum
allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever is lower. For the LM4899, see power derating
currents for additional information.
Note 4: Human body model, 100pF discharged through a 1.5kΩ resistor.
Note 5: Machine Model, 220pF–240pF discharged through all pins.
Note 6: Typicals are measured at 25°C and represent the parametric norm.
Note 7: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.
Note 8: For micro SMD only, shutdown current is measured in a Normal Room Environment. Exposure to direct sunlight will increase ISD by a maximum of 2µA.
Note 9: Unterminated input.
Note 10: 10Ω terminated input.
Note 11: : When driving 4Ω loads from a 5V power supply, the LM4899LD must be mounted to a circuit board with the exposed-DAP area soldered down to a
1sq. in plane of 1oz. copper.
External Components Description
(Figure 1)
Components Functional Description
1. CSSupply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing section for
information concerning proper placement and selection of the supply bypass capacitor.
2. CBBypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of External
Components, for information concerning proper placement and selection of CB.
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LM4899
Typical Performance Characteristics
LD Specific Characteristics
THD+N vs Output Power
VDD = 5V, RL = 4Ω
200645c1
THD+N vs Frequency
VDD = 5V, RL = 4Ω, PO = 1W
200645b5
LM4899LD
Power Dissipation vs Output Power
20064511
LM4899LD
Power Derating Curve
20064512
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LM4899
Typical Performance Characteristics
Non-LD Specific Characteristics
THD+N vs Frequency
VDD = 5V, RL = 8Ω, PO = 400mW
200645b6
THD+N vs Frequency
VDD = 3V, RL = 8Ω, PO = 275mW
200645b4
THD+N vs Frequency
VDD = 3V, RL = 4Ω, PO = 225mW
200645b3
THD+N vs Frequency
VDD = 2.6V, RL = 8Ω, PO = 150mW
200645b2
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LM4899
THD+N vs Frequency
VDD = 2.6V, RL = 4Ω, PO = 150mW
200645b1
THD+N vs Output Power
VDD = 5V, RL = 8Ω
200645c2
THD+N vs Output Power
VDD = 3V, RL = 8Ω
200645c0
THD+N vs Output Power
VDD = 3V, RL = 4Ω
200645b9
THD+N vs Output Power
VDD = 2.6V, RL = 8Ω
200645b8
THD+N vs Output Power
VDD = 2.6V, RL = 4Ω
200645b7
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LM4899
PSRR vs Frequency
VDD = 5V, RL = 8Ω, Input 10Ω Terminated
200645b0
PSRR vs Frequency
VDD = 3V, RL = 8Ω, Input 10Ω Terminated
200645a9
Output Power vs Supply Voltage
RL = 8Ω
200645a6
Output Power vs Supply Voltage
RL = 4Ω
200645a5
Power Dissipation vs
Output Power
20064581
Power Dissipation vs
Output Power
20064582
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LM4899
Power Dissipation vs
Output Power
20064583
Output Power vs
Load Resistance
20064584
Supply Current vs Shutdown Voltage
Shutdown Low
20064585
Supply Current vs Shutdown Voltage
Shutdown High
20064586
Clipping (Dropout) Voltage vs
Supply Voltage
20064587
Open Loop Frequency Response
20064588
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LM4899
Power Derating Curve
20064589
Noise Floor
200645a4
CMRR vs Frequency
VDD = 5V, RL = 8Ω, 200mVpp
200645a3
CMRR vs Frequency
VDD = 3V, RL = 8Ω, 200mVpp
200645a2
PSRR vs Common Mode Voltage
VDD = 5V
200645a8
PSRR vs Common Mode Voltage
VDD = 3V, RL = 8Ω, 217Hz, 200mVpp
200645a7
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200645 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:26:48
LM4899
Application Information
DIFFERENTIAL AMPLIFIER EXPLANATION
The LM4899 is a fully differential audio amplifier that features
differential input and output stages. Internally this is accom-
plished by two circuits: a differential amplifier and a common
mode feedback amplifier that adjusts the output voltages so
that the average value remains VDD/2. The LM4899 features
precisely matched internal gain-setting resistors, thus elimi-
nating the need for external resistors and fixing the differential
gain at AVD = 6dB.
A differential amplifier works in a manner where the difference
between the two input signals is amplified. In most applica-
tions, this would require input signals that are 180° out of
phase with each other.
The LM4899 provides what is known as a "bridged mode"
output (bridge-tied-load, BTL). This results in output signals
at Vo1 and Vo2 that are 180° out of phase with respect to each
other. Bridged mode operation is different from the single-
ended amplifier configuration that connects the load between
the amplifier output and ground. A bridged amplifier design
has distinct advantages over the single-ended configuration:
it provides differential drive to the load, thus doubling maxi-
mum possible output swing for a specific supply voltage. Four
times the output power is possible compared with a single-
ended amplifier under the same conditions. This increase in
attainable output power assumes that the amplifier is not cur-
rent limited or clipped.
A bridged configuration, such as the one used in the LM4899,
also creates a second advantage over single-ended ampli-
fiers. Since the differential outputs, Vo1 and Vo2, are biased at
half-supply, no net DC voltage exists across the load. BTL
configuration eliminates the output coupling capacitor re-
quired in single-supply, single-ended amplifier configurations.
If an output coupling capacitor is not used in a single-ended
output configuration, the half-supply bias across the load
would result in both increased internal IC power dissipation
as well as permanent loudspeaker damage. Further advan-
tages of bridged mode operation specific to fully differential
amplifiers like the LM4899 include increased power supply
rejection ratio, common-mode noise reduction, and click and
pop reduction.
EXPOSED-DAP PACKAGE PCB MOUNTING
CONSIDERATIONS
The LM4899's exposed-DAP (die attach paddle) package
(LD) provide a low thermal resistance between the die and
the PCB to which the part is mounted and soldered. This al-
lows rapid heat transfer from the die to the surrounding PCB
copper traces, ground plane and, finally, surrounding air. The
result is a low voltage audio power amplifier that produces
1.4W at ≤ 1% THD with a 4Ω load. This high power is
achieved through careful consideration of necessary thermal
design. Failing to optimize thermal design may compromise
the LM4899's high power performance and activate unwant-
ed, though necessary, thermal shutdown protection. The LD
package must have its DAP soldered to a copper pad on the
PCB. The DAP's PCB copper pad is connected to a large
plane of continuous unbroken copper. This plane forms a
thermal mass and heat sink and radiation area. Place the heat
sink area on either outside plane in the case of a two-sided
PCB, or on an inner layer of a board with more than two layers.
Connect the DAP copper pad to the inner layer or backside
copper heat sink area with 4 (2x2) vias. The via diameter
should be 0.012in - 0.013in with a 0.050in pitch. Ensure effi-
cient thermal conductivity by plating-through and solder-filling
the vias.
Best thermal performance is achieved with the largest prac-
tical copper heat sink area. If the heatsink and amplifier share
the same PCB layer, a nominal 2.5in2 (min) area is necessary
for 5V operation with a 4Ω load. Heatsink areas not placed on
the same PCB layer as the LM4899 should be 5in2 (min) for
the same supply voltage and load resistance. The last two
area recommendations apply for 25°C ambient temperature.
In all circumstances and conditions, the junction temperature
must be held below 150°C to prevent activating the LM4899's
thermal shutdown protection. The LM4899's power de-rating
curve in the Typical Performance Characteristics shows the
maximum power dissipation versus temperature. Example
PCB layouts for the exposed-DAP TSSOP and LLP packages
are shown in the Demonstration Board Layout section. Fur-
ther detailed and specific information concerning PCB layout,
fabrication, and mounting an LLP package is available from
National Semiconductor's package Engineering Group under
application note AN-1187.
PCB LAYOUT AND SUPPLY REGULATION
CONSIDERATIONS FOR DRIVING 3Ω AND 4Ω LOADS
Power dissipated by a load is a function of the voltage swing
across the load and the load's impedance. As load impedance
decreases, load dissipation becomes increasingly dependent
on the interconnect (PCB trace and wire) resistance between
the amplifier output pins and the load's connections. Residual
trace resistance causes a voltage drop, which results in power
dissipated in the trace and not in the load as desired. For ex-
ample, 0.1Ω trace resistance reduces the output power dis-
sipated by a 4Ω load from 1.4W to 1.37W. This problem of
decreased load dissipation is exacerbated as load impedance
decreases. Therefore, to maintain the highest load dissipation
and widest output voltage swing, PCB traces that connect the
output pins to a load must be as wide as possible.
Poor power supply regulation adversely affects maximum
output power. A poorly regulated supply's output voltage de-
creases with increasing load current. Reduced supply voltage
causes decreased headroom, output signal clipping, and re-
duced output power. Even with tightly regulated supplies,
trace resistance creates the same effects as poor supply reg-
ulation. Therefore, making the power supply traces as wide
as possible helps maintain full output voltage swing.
POWER DISSIPATION
Power dissipation is a major concern when designing a suc-
cessful amplifer, whether the amplifier is bridged or single-
ended. Equation 2 states the maximum power dissipation
point for a single-ended amplifier operating at a given supply
voltage and driving a specified output load.
PDMAX = (VDD)2 / (2π2RL) Single-Ended (1)
However, a direct consequence of the increased power de-
livered to the load by a bridge amplifier is an increase in
internal power dissipation versus a single-ended amplifier op-
erating at the same conditions.
PDMAX = 4*(VDD)2 / (2π2RL) Bridge Mode (2)
Since the LM4899 has bridged outputs, the maximum internal
power dissipation is 4 times that of a single-ended amplifier.
Even with this substantial increase in power dissipation, the
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LM4899
LM4899 does not require additional heatsinking under most
operating conditions and output loading. From Equation 3,
assuming a 5V power supply and an 8Ω load, the maximum
power dissipation point is 625mW. The maximum power dis-
sipation point obtained from Equation 3 must not be greater
than the power dissipation results from Equation 4:
PDMAX = (TJMAX - TA) / θJA (3)
The LM4899's θJA in an MUA10A package is 190°C/W. De-
pending on the ambient temperature, TA, of the system sur-
roundings, Equation 4 can be used to find the maximum
internal power dissipation supported by the IC packaging. If
the result of Equation 3 is greater than that of Equation 4, then
either the supply voltage must be decreased, the load
impedance increased, the ambient temperature reduced, or
the θJA reduced with heatsinking. In many cases, larger traces
near the output, VDD, and GND pins can be used to lower the
θJA. The larger areas of copper provide a form of heatsinking
allowing higher power dissipation. For the typical application
of a 5V power supply, with an 8Ω load, the maximum ambient
temperature possible without violating the maximum junction
temperature is approximately 30°C provided that device op-
eration is around the maximum power dissipation point. Re-
call that internal power dissipation is a function of output
power. If typical operation is not around the maximum power
dissipation point, the LM4899 can operate at higher ambient
temperatures. Refer to the Typical Performance Charac-
teristics curves for power dissipation information.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is crit-
ical for low noise performance and high power supply rejec-
tion ratio (PSRR). The capacitor location on both the bypass
and power supply pins should be as close to the device as
possible. A larger half-supply bypass capacitor improves
PSRR because it increases half-supply stability. Typical ap-
plications employ a 5V regulator with 10µF and 0.1µF bypass
capacitors that increase supply stability. This, however, does
not eliminate the need for bypassing the supply nodes of the
LM4899. Although the LM4899 will operate without the by-
pass capacitor CB, although the PSRR may decrease. A 1µF
capacitor is recommended for CB. This value maximizes
PSRR performance. Lesser values may be used, but PSRR
decreases at frequencies below 1kHz. The issue of CB se-
lection is thus dependant upon desired PSRR and click and
pop performance.
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the
LM4899 contains shutdown circuitry that is used to turn off the
amplifier's bias circuitry. In addition, the LM4899 contains a
Shutdown Mode pin, allowing the designer to designate
whether the part will be driven into shutdown with a high level
logic signal or a low level logic signal. This allows the designer
maximum flexibility in device use, as the Shutdown Mode pin
may simply be tied permanently to either VDD or GND to set
the LM4899 as either a "shutdown-high" device or a "shut-
down-low" device, respectively. The device may then be
placed into shutdown mode by toggling the Shutdown Select
pin to the same state as the Shutdown Mode pin. For
simplicity's sake, this is called "shutdown same", as the
LM4899 enters shutdown mode whenever the two pins are in
the same logic state. The trigger point for either shutdown
high or shutdown low is shown as a typical value in the Supply
Current vs Shutdown Voltage graphs in the Typical Perfor-
mance Characteristics section. It is best to switch between
ground and supply for maximum performance. While the de-
vice may be disabled with shutdown voltages in between
ground and supply, the idle current may be greater than the
typical value of 0.1µA. In either case, the shutdown pin should
be tied to a definite voltage to avoid unwanted state changes.
In many applications, a microcontroller or microprocessor
output is used to control the shutdown circuitry, which pro-
vides a quick, smooth transition to shutdown. Another solution
is to use a single-throw switch in conjunction with an external
pull-up resistor (or pull-down, depending on shutdown high or
low application). This scheme guarantees that the shutdown
pin will not float, thus preventing unwanted state changes.
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LM4899
Physical Dimensions inches (millimeters) unless otherwise noted
9-Bump micro SMD
Order Number LM4899ITL
NS Package Number TLA09AAA
X1 = 1.514±0.03 X2 = 1.514±0.03 X3 = 0.600±0.075
LLP
Order Number LM4899LD
NSPackage Number LDA10B
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LM4899
Mini Small Outline (MSOP)
Order Number LM4899MM
NSPackage Number MUB10A
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LM4899
Notes
LM4899 1 Watt Fully Differential Audio Power Amplifier With Shutdown Select and Fixed 6dB
Gain
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200645 Version 6 Revision 2 Print Date/Time: 2011/10/05 08:26:48
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