NCP500 150 mA CMOS Low Noise Low-Dropout Voltage Regulator The NCP500 series of fixed output low dropout linear regulators are designed for portable battery powered applications which require low noise operation, fast enable response time, and low dropout. The device achieves its low noise performance without the need of an external noise bypass capacitor. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, and resistors for setting output voltage, and current limit and temperature limit protection circuits. The NCP500 has been designed to be used with low cost ceramic capacitors and requires a minimum output capacitor of 1.0 mF. Ultra-Low Dropout Voltage of 170 mV at 150 mA Fast Enable Turn-On Time of 20 msec Wide Operating Voltage Range of 1.8 V to 6.0 V Excellent Line and Load Regulation High Accuracy Output Voltage of 2.5% Enable Can Be Driven Directly by 1.0 V Logic Typical RMS Noise Voltage 50 mV with No Bypass Capacitor (BW = 10 Hz to 100 kHz) Very Small DFN 2x2.2 Package Pb-Free Packages are Available 6 DFN 2x2.2 MM SQL SUFFIX CASE 506BA PIN CONNECTIONS AND MARKING DIAGRAMS TSOP-5 Vin 1 GND 2 Enable 3 5 Vout 4 N/C (Top View) xxx = Specific Device Code A = Assembly Location Y = Year W = Work Week G = Pb-Free Package (Note: Microdot may be in either location) Typical Applications * * * * 1 xxxAYWG G * * TSOP-5 SN SUFFIX CASE 483 5 1 Features * * * * * * * http://onsemi.com Noise Sensitive Circuits - VCO's, RF Stages, etc. SMPS Post-Regulation Hand-Held Instrumentation Camcorders and Cameras DFN 2x2.2 mm Vin 1 (3) Vout 5 (4) Thermal Shutdown Driver w/ Current Limit Enable 1 GND 2 Vin 3 xxM 6 N/C 5 GND 4 Vout (Top View) xx M Enable ON 3 (1) = Specific Device Code = Date Code ORDERING INFORMATION OFF GND See detailed ordering and shipping information in the package dimensions section on page 17 of this data sheet. 2 (2, 5) NOTE: Pin numbers in parenthesis indicate DFN package. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Figure 1. Simplified Block Diagram (c) Semiconductor Components Industries, LLC, 2012 March, 2012 - Rev. 20 1 Publication Order Number: NCP500/D NCP500 AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA PIN FUNCTION DESCRIPTION TSOP-5 Pin No. DFN 2x2 Pin No. Pin Name 1 3 Vin 2 2, 5 GND 3 1 Enable 4 6 N/C No internal connection. 5 4 Vout Regulated output voltage. Description Positive power supply input voltage. Power supply ground. This input is used to place the device into low-power standby. When this input is pulled to a logic low, the device is disabled. If this function is not used, Enable should be connected to Vin. MAXIMUM RATINGS AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAA AAAAAAAAAAAA AAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA Rating Symbol Value Unit Vin 0 to 6.0 V Enable Voltage Von/off -0.3 to Vin +0.3 V Output Voltage Vout -0.3 to Vin +0.3 V - Infinite - Input Voltage Output Short Circuit Duration Thermal Resistance, Junction-to-Ambient TSOP-5 DFN (Note 3) RqJA C/W 250 225 Operating Junction Temperature TJ +125 C Storage Temperature Tstg -65 to +150 C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL-STD-883, Method 3015 Machine Model Method 200 V Latch up capability (85C) "100 mA. 2. Device is internally limited to 160C by thermal shutdown. 3. For more information, refer to application note, AND8080/D. ELECTRICAL CHARACTERISTICS (Vin = 2.35 V, Cin = 1.0 mF, Cout = 1.0 mF, for typical value TA = 25C, for min and max values TA = -40C to 85C, Tjmax = 125C, unless otherwise noted) Symbol Min Typ Max Unit Vout 1.755 1.8 1.845 V Line Regulation (Vin = 2.3 V to 6.0 V, Iout = 1.0 mA) Regline - 1.0 10 mV Load Regulation (Iout = 1.0 mA to 150 mA) Regload - 15 45 mV Dropout Voltage (Measured at Vout -2.0%, TA = -40C to 85C) (Iout = 1.0 mA) (Iout = 75 mA) (Iout = 150 mA) Vin-Vout - - - 2.0 140 270 10 200 350 Output Short Circuit Current Iout(max) 200 540 700 mA RR - 62 - dB - - - 0.01 175 175 1.0 300 300 0.9 - - - - 0.15 - 3.0 100 Characteristic -1.8 V Output Voltage (TA = -40C to 85C, Iout = 1.0 mA to 150 mA) Ripple Rejection (Vin = Vout (nom.) + 1.0 V + 0.5 Vpp, f = 1.0 kHz, Io = 60 mA) Quiescent Current (Enable Input = 0 V) (Enable Input = 0.9 V, Iout = 1.0 mA) (Enable Input = 0.9 V, Iout = 150 mA) IQ Enable Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Vth(EN) Enable Input Bias Current IIB(EN) http://onsemi.com 2 mV mA V nA NCP500 ELECTRICAL CHARACTERISTICS (continued) (Vin = 2.35 V, Cin = 1.0 mF, Cout = 1.0 mF, for typical value TA = 25C, for min and max values TA = -40C to 85C, Tjmax = 125C, unless otherwise noted) Output Turn On Time (Enable Input = 0 V to Vin) - - 20 100 ms Symbol Min Typ Max Unit Vout 1.804 1.85 1.896 V Line Regulation (Vin = 2.3 V to 6.0 V, Iout = 1.0 mA) Regline - 1.0 10 mV Load Regulation (Iout = 1.0 mA to 150 mA) Regload - 15 45 mV Dropout Voltage (Measured at Vout -2.0%, TA = -40C to 85C) (Iout = 1.0 mA) (Iout = 75 mA) (Iout = 150 mA) Vin-Vout - - - 2.0 - - 10 - - Output Short Circuit Current Iout(max) 200 540 700 mA RR - 62 - dB - - - 0.01 175 175 1.0 300 300 0.9 - - - - 0.15 Characteristic -1.85 V Output Voltage (TA = -40C to 85C, Iout = 1.0 mA to 150 mA) Ripple Rejection (Vin = Vout (nom.) + 1.0 V + 0.5 Vpp, f = 1.0 kHz, Io = 60 mA) Quiescent Current (Enable Input = 0 V) (Enable Input = 0.9 V, Iout = 1.0 mA) (Enable Input = 0.9 V, Iout = 150 mA) IQ mV mA Enable Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Vth(EN) Enable Input Bias Current IIB(EN) - 3.0 100 nA - - 20 100 ms Output Turn On Time (Enable Input = 0 V to Vin) V ELECTRICAL CHARACTERISTICS (continued) (Vin = 3.0 V, Cin = 1.0 mF, Cout = 1.0 mF, for typical value TA = 25C, for min and max values TA = -40C to 85C, Tjmax = 125C, unless otherwise noted) Symbol Characteristic Min Typ Max 2.438 2.5 2.563 Unit -2.5 V Vout Output Voltage (TA =-40C to 85C, Iout = 1.0 mA to 150 mA) V Line Regulation (Vin = 3.0 V to 6.0 V, Iout = 1.0 mA) Regline - 1.0 10 mV Load Regulation (Iout = 1.0 mA to 150 mA) Regload - 15 45 mV Dropout Voltage (Measured at Vout -2.0%, TA = -40C to 85C) (Iout = 1.0 mA) (Iout = 75 mA) (Iout = 150 mA) Vin-Vout - - - 2.0 100 190 10 170 270 Output Short Circuit Current Iout(max) 200 540 700 mA RR - 62 - dB - - - 0.01 180 180 1.0 300 300 0.9 - - - - 0.15 Ripple Rejection (Vin = Vout (nom.) + 1.0 V + 0.5 Vpp, f = 1.0 kHz, Io = 60 mA) Quiescent Current (Enable Input = 0 V) (Enable Input = 0.9 V, Iout = 1.0 mA) (Enable Input = 0.9 V, Iout = 150 mA) IQ mV mA Enable Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Vth(EN) Enable Input Bias Current IIB(EN) - 3.0 100 nA - - 20 100 ms Output Turn On Time (Enable Input = 0 V to Vin) http://onsemi.com 3 V NCP500 ELECTRICAL CHARACTERISTICS (Vin = 3.1 V, Cin = 1.0 mF, Cout = 1.0 mF, for typical value TA = 25C, for min and max values TA = -40C to 85C, Tjmax = 125C, unless otherwise noted) Symbol Characteristic Min Typ Max 2.535 2.6 2.665 Unit -2.6 V Vout Output Voltage (TA =-40C to 85C, Iout = 1.0 mA to 150 mA) V Line Regulation (Vin = 3.0 V to 6.0 V, Iout = 1.0 mA) Regline - 1.0 10 mV Load Regulation (Iout = 1.0 mA to 150 mA) Regload - 15 45 mV Dropout Voltage (Measured at Vout -2.0%, TA = -40C to 85C) (Iout = 1.0 mA) (Iout = 75 mA) (Iout = 150 mA) Vin-Vout - - - 2.0 - - 10 - - Output Short Circuit Current Iout(max) 200 540 700 mA RR - 62 - dB - - - 0.01 180 180 1.0 300 300 0.9 - - - - 0.15 Ripple Rejection (Vin = Vout (nom.) + 1.0 V + 0.5 Vpp, f = 1.0 kHz, Io = 60 mA) Quiescent Current (Enable Input = 0 V) (Enable Input = 0.9 V, Iout = 1.0 mA) (Enable Input = 0.9 V, Iout = 150 mA) IQ mV mA Enable Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Vth(EN) Enable Input Bias Current IIB(EN) - 3.0 100 nA - - 20 100 ms Output Turn On Time (Enable Input = 0 V to Vin) V ELECTRICAL CHARACTERISTICS (Vin = 3.2 V, Cin = 1.0 mF, Cout = 1.0 mF, for typical value TA = 25C, for min and max values TA = -40C to 85C, Tjmax = 125C, unless otherwise noted) Symbol Characteristic Min Typ Max 2.633 2.7 2.768 Unit -2.7 V Vout Output Voltage (TA =-40C to 85C, Iout = 1.0 mA to 150 mA) V Line Regulation (Vin = 3.2 V to 6.0 V, Iout = 1.0 mA) Regline - 1.0 10 mV Load Regulation (Iout = 1.0 mA to 150 mA) Regload - 15 45 mV Dropout Voltage (Measured at Vout -2.0%, TA = -40C to 85C) (Iout = 1.0 mA) (Iout = 75 mA) (Iout = 150 mA) Vin-Vout - - - 2.0 90 180 10 160 260 Output Short Circuit Current Iout(max) 200 540 700 mA RR - 62 - dB - - - 0.01 185 185 1.0 300 300 0.9 - - - - 0.15 Ripple Rejection (Vin = Vout (nom.) + 1.0 V + 0.5 Vpp, f = 1.0 kHz, Io = 60 mA) Quiescent Current (Enable Input = 0 V) (Enable Input = 0.9 V, Iout = 1.0 mA) (Enable Input = 0.9 V, Iout = 150 mA) IQ mV mA Enable Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Vth(EN) Enable Input Bias Current IIB(EN) - 3.0 100 nA - - 20 100 ms Output Turn On Time (Enable Input = 0 V to Vin) http://onsemi.com 4 V NCP500 ELECTRICAL CHARACTERISTICS (Vin = 3.3 V, Cin = 1.0 mF, Cout = 1.0 mF, for typical value TA = 25C, for min and max values TA = -40C to 85C, Tjmax = 125C, unless otherwise noted) Symbol Characteristic Min Typ Max 2.730 2.8 2.870 Unit -2.8 V Vout Output Voltage (TA =-40C to 85C, Iout = 1.0 mA to 150 mA) V Line Regulation (Vin = 3.3 V to 6.0 V, Iout = 1.0 mA) Regline - 1.0 10 mV Load Regulation (Iout = 1.0 mA to 150 mA) Regload - 15 45 mV Dropout Voltage (Measured at Vout -2.0%, TA = -40C to 85C) (Iout = 1.0 mA) (Iout = 75 mA) (Iout = 150 mA) Vin-Vout - - - 2.0 90 170 10 150 250 Output Short Circuit Current Iout(max) 200 540 700 mA RR - 62 - dB - - - 0.01 185 185 1.0 300 300 0.9 - - - - 0.15 Ripple Rejection (Vin = Vout (nom.) + 1.0 V + 0.5 Vpp, f = 1.0 kHz, Io = 60 mA) Quiescent Current (Enable Input = 0 V) (Enable Input = 0.9 V, Iout = 1.0 mA) (Enable Input = 0.9 V, Iout = 150 mA) IQ mV mA Enable Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Vth(EN) Enable Input Bias Current IIB(EN) - 3.0 100 nA - - 20 100 ms Output Turn On Time (Enable Input = 0 V to Vin) V ELECTRICAL CHARACTERISTICS (Vin = 3.5 V, Cin = 1.0 mF, Cout = 1.0 mF, for typical value TA = 25C, for min and max values TA = -40C to 85C, Tjmax = 125C, unless otherwise noted) Symbol Characteristic Min Typ Max 2.925 3.0 3.075 Unit -3.0 V Vout Output Voltage (TA =-40C to 85C, Iout = 1.0 mA to 150 mA) V Line Regulation (Vin = 3.5 V to 6.0 V, Iout = 1.0 mA) Regline - 1.0 10 mV Load Regulation (Iout = 1.0 mA to 150 mA) Regload - 15 45 mV Dropout Voltage (Measured at Vout -2.0%, TA = -40C to 85C) (Iout = 1.0 mA) (Iout = 75 mA) (Iout = 150 mA) Vin-Vout - - - 2.0 85 165 10 130 240 Output Short Circuit Current Iout(max) 200 540 700 mA RR - 62 - dB - - - 0.01 190 190 1.0 300 300 0.9 - - - - 0.15 Ripple Rejection (Vin = Vout (nom.) + 1.0 V + 0.5 Vpp, f = 1.0 kHz, Io = 60 mA) Quiescent Current (Enable Input = 0 V) (Enable Input = 0.9 V, Iout = 1.0 mA) (Enable Input = 0.9 V, Iout = 150 mA) IQ mV mA Enable Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Vth(EN) Enable Input Bias Current IIB(EN) - 3.0 100 nA - - 20 100 ms Output Turn On Time (Enable Input = 0 V to Vin) http://onsemi.com 5 V NCP500 ELECTRICAL CHARACTERISTICS (Vin = 3.8 V, Cin = 1.0 mF, Cout = 1.0 mF, for typical value TA = 25C, for min and max values TA = -40C to 85C, Tjmax = 125C, unless otherwise noted) Symbol Characteristic Min Typ Max 3.218 3.3 3.383 Unit -3.3 V Vout Output Voltage (TA =-40C to 85C, Iout = 1.0 mA to 150 mA) V Line Regulation (Vin = 3.8 V to 6.0 V, Iout = 1.0 mA) Regline - 1.0 10 mV Load Regulation (Iout = 1.0 mA to 150 mA) Regload - 15 45 mV Dropout Voltage (Measured at Vout -2.0%, TA = -40C to 85C) (Iout = 1.0 mA) (Iout = 75 mA) (Iout = 150 mA) Vin-Vout - - - 2.0 80 150 10 110 230 Output Short Circuit Current Iout(max) 200 540 700 mA RR - 62 - dB - - - 0.01 195 195 1.0 300 300 0.9 - - - - 0.15 Ripple Rejection (Vin = Vout (nom.) + 1.0 V + 0.5 Vpp, f = 1.0 kHz, Io = 60 mA) Quiescent Current (Enable Input = 0 V) (Enable Input = 0.9 V, Iout = 1.0 mA) (Enable Input = 0.9 V, Iout = 150 mA) IQ mV mA Enable Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Vth(EN) Enable Input Bias Current IIB(EN) - 3.0 100 nA - - 20 100 ms Output Turn On Time (Enable Input = 0 V to Vin) http://onsemi.com 6 V NCP500 ELECTRICAL CHARACTERISTICS (Vin = 5.5 V, Cin = 1.0 mF, Cout = 1.0 mF, for typical value TA = 25C, for min and max values TA = -40C to 85C, Tjmax = 125C, unless otherwise noted) Symbol Characteristic Min Typ Max 4.875 5.0 5.125 Unit -5.0 V Vout Output Voltage (TA =-40C to 85C, Iout = 1.0 mA to 150 mA) V Line Regulation (Vin = 5.5 V to 6.0 V, Iout = 1.0 mA) Regline - 1.0 10 mV Load Regulation (Iout = 1.0 mA to 150 mA) Regload - 15 45 mV Dropout Voltage (Measured at Vout -2.0%, TA = -40C to 85C) (Iout = 1.0 mA) (Iout = 75 mA) (Iout = 150 mA) Vin-Vout - - - 2.0 60 120 10 100 180 Output Short Circuit Current Iout(max) 200 540 700 mA RR - 62 - dB - - - 0.01 210 210 1.0 300 300 0.9 - - - - 0.15 Ripple Rejection (Vin = Vout (nom.) + 1.0 V + 0.5 Vpp, f = 1.0 kHz, Io = 60 mA) Quiescent Current (Enable Input = 0 V) (Enable Input = 0.9 V, Iout = 1.0 mA) (Enable Input = 0.9 V, Iout = 150 mA) IQ mV mA Enable Input Threshold Voltage (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Vth(EN) Enable Input Bias Current IIB(EN) - 3.0 100 nA - - 20 100 ms Output Turn On Time (Enable Input = 0 V to Vin) V 4. Maximum package power dissipation limits must be observed. T *TA PD + J(max) RqJA 5. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. http://onsemi.com 7 NCP500 200 50 50 mA Load 40 30 20 10 mA Load 10 0 -50 80 Vin - Vout, Dropout Voltage (mV) Vin - Vout, Dropout Voltage (mV) 60 Vout(nom.) = 3.3 V 70 1.0 mA Load -25 0 25 50 75 100 120 mA Load 120 100 mA Load 100 -25 0 25 50 75 100 Figure 3. Dropout Voltage vs. Temperature 50 mA Load 30 20 10 mA Load 10 1.0 mA Load -25 25 0 125 220 Vout(nom.) = 2.8 V 50 75 100 200 Vout(nom.) = 2.8 V 180 150 mA Load 160 140 120 mA Load 120 100 mA Load 100 80 -50 125 -25 0 25 50 75 100 Temperature (C) Temperature (C) Figure 4. Dropout Voltage vs. Temperature Figure 5. Dropout Voltage vs. Temperature 125 350 120 Vout(nom.) = 1.8 V Vin - Vout, Dropout Voltage (mV) Vin - Vout, Dropout Voltage (mV) 150 mA Load 140 Figure 2. Dropout Voltage vs. Temperature 40 50 mA Load 80 60 40 10 mA Load 20 1.0 mA Load 0 -50 160 Temperature (C) 50 100 180 Temperature (C) 60 0 -50 Vout(nom.) = 3.3 V 80 -50 125 Vin - Vout, Dropout Voltage (mV) Vin - Vout, Dropout Voltage (mV) 70 -25 0 25 50 75 100 330 290 150 mA Load 270 250 230 120 mA Load 210 190 170 150 -50 125 Vout(nom.) = 1.8 V 310 100 mA Load -25 0 25 50 75 100 Temperature (C) Temperature (C) Figure 6. Dropout Voltage vs. Temperature Figure 7. Dropout Voltage vs. Temperature http://onsemi.com 8 125 NCP500 2.804 3.308 Vin = Vout(nom.) +0.5 V Vout(nom.) = 3.3 V IO = 1.0 mA 3.304 3.302 3.300 3.298 3.296 2.8 2.798 2.796 2.794 2.792 3.294 3.292 -50 -25 0 25 50 75 100 2.790 -50 125 25 50 75 100 Figure 8. Output Voltage vs. Temperature Figure 9. Output Voltage vs. Temperature 125 210 IQ, Quiescent Current (mA) 1.803 1.8025 1.802 Vin = Vout(nom.) + 0.5 V Vout(nom.) = 1.8 V IO = 1.0 mA 1.8015 1.801 1.8005 -50 -25 0 25 50 75 100 125 Vout(nom.) = 3.3 V 190 180 Vout(nom.) = 1.8 V 170 160 150 -50 -25 0 25 50 75 100 125 Temperature (C) Figure 10. Output Voltage vs. Temperature Figure 11. Quiescent Current vs. Temperature 225 225 200 200 175 150 125 100 75 50 Vout(nom.) = 1.8 V Iout = 0 mA TA = 25C 25 0 Vin = Vout(nom.) = + 0.5 V IO = 0 mA 200 Temperature (C) IQ, Quiescent Current (mA) Vout, Output Voltage (V) 0 Temperature (C) 1.8035 IQ, Quiescent Current (mA) -25 Temperature (C) 1.804 0 Vin = Vout(nom.) + 0.5 V Vout(nom.) = 2.8 V IO = 1.0 mA 2.802 Vout, Output Voltage (V) Vout, Output Voltage (V) 3.306 1.0 2.0 3.0 4.0 5.0 175 150 125 100 75 Vout(nom.) = 3.3 V Iout = 0 mA TA = 25C 50 25 6.0 0 0 1.0 2.0 3.0 4.0 5.0 6.0 Input Voltage (V) Input Voltage (V) Figure 12. Quiescent Current vs. Input Voltage Figure 13. Quiescent Current vs. Input Voltage http://onsemi.com 9 225 225 200 200 175 175 Ground Pin Current (mA) Ground Pin Current (mA) NCP500 150 125 100 75 50 Vout(nom.) = 1.8 V Iout = 50 mA TA = 25C 25 1.0 2.0 3.0 4.0 5.0 100 75 50 Vout(nom.) = 3.3 V Iout = 50 mA TA = 25C 0 0 6.0 1.0 2.0 3.0 4.0 5.0 6.0 Input Voltage (V) Input Voltage (V) Figure 14. Ground Pin Current vs. Input Voltage Figure 15. Ground Pin Current vs. Input Voltage 600 100 500 80 400 300 200 100 Vout(nom.) = 3.3 V 1.0 2.0 3.0 4.0 5.0 10 mA 60 mA 60 10 mA 40 Vout = 1.8 V Vin = 2.8 VDC + 0.5 Vp-p Cout = 1 mF 20 0 0.1 6.0 1.0 10 f, Frequency (kHz) Figure 16. Current Limit vs. Input Voltage Figure 17. Ripple Rejection vs. Frequency 1000 Vout = 1.8 V Vin = 2.8 V Iout = 1 mA Cout = 1 mF 800 600 5.0 4.0 3.0 200 Vin = 3.8 V to 4.8 V Vout = 3.3 V Cout = 1.0 mF Iout = 1.0 mA 150 Output Voltage Deviation (mV) 400 200 0 0.01 100 Input Voltage (V) Vin, Input Voltage (V) 0 0 Vout, Output Voltage Noise (nV/HZ) 125 25 RR, Ripple Rejection (dB) Current Limit (mA) 0 0 150 0.1 1.0 10 100 1000 100 50 0 -50 0 20 40 60 80 100 120 140 f, Frequency (kHz) Time (ms) Figure 18. Output Noise Density Figure 19. Line Transient Response http://onsemi.com 10 160 Iout, Output Current (mA) 5.0 3.0 Output Voltage Deviation (mV) 200 Vin = 3.8 V to 4.8 V Vout = 3.3 V Cout = 1.0 mF Iout = 10 mA 150 100 50 0 -50 0 20 40 60 80 100 120 140 Iout, Output Current (mA) 75 0 100 0 -100 -200 0 10 20 30 40 50 Time (ms) Time (ms) Figure 20. Line Transient Response Figure 21. Load Transient Response Vin = 3.8 V Vout = 3.3 V Cout = 10 mF Cin = 1 mF 150 75 0 50 3.0 60 Vin = 3.8 V Vout = 3.3 V TA = 25C RL = 3.3 kW Cin = 1 mF 2.0 1.0 0 4.0 Output Voltage (V) Output Voltage Deviation (mV) Vin = 3.8 V Vout = 3.3 V Cout = 1.0 mF Cin = 1 mF 150 -300 160 225 25 0 -25 -50 225 200 Output Voltage Deviation (mV) 4.0 Enable Voltage (V) Vin, Input Voltage (V) NCP500 0 10 20 30 40 50 60 70 80 90 3.0 2.0 Cout = 10 mF 1.0 0 Cout = 1.0 mF 0 20 40 60 80 100 Time (ms) Time (ms) Figure 22. Load Transient Response Figure 23. Turn-off Response http://onsemi.com 11 120 NCP500 2 3 2.5 Vout, Output Voltage (V) 1.6 1.4 1.2 1 0.8 Cin = 1 mF Cout = 1 mF TA = 25C VEnable = Vin 0.6 0.4 0.2 0 0 1 2 3 1.5 1 Cin = 1 mF Cout = 1 mF TA = 25C VEnable = Vin 0.5 5 4 2 0 6 0 1 2 3 4 5 Vin, Input Voltage (V) Vin, Input Voltage (V) Figure 24. Output Voltage vs. Input Voltage Figure 25. Output Voltage vs. Input Voltage 3.5 3 Vout, Output Voltage (V) Vout, Output Voltage (V) 1.8 2.5 2 1.5 Cin = 1 mF Cout = 1 mF TA = 25C VEnable = Vin 1 0.5 0 0 1 2 3 4 5 6 Vin, Input Voltage (V) Figure 26. Output Voltage vs. Input Voltage http://onsemi.com 12 7 6 NCP500 DEFINITIONS Load Regulation Line Regulation The change in output voltage for a change in output load current at a constant temperature. The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Line Transient Response Typical over and undershoot response when input voltage is excited with a given slope. Thermal Protection are expressed in mVRMS or nV Hz. Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 160C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Quiescent Current Maximum Package Power Dissipation Output Noise Voltage This is the integrated value of the output noise over a specified frequency range. Input voltage and output load current are kept constant during the measurement. Results The power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125C. The current which flows through the ground pin when the regulator operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current. http://onsemi.com 13 NCP500 APPLICATIONS INFORMATION The NCP500 series regulators are protected with internal thermal shutdown and internal current limit. A typical application circuit is shown in Figure 27. If TJ is not recommended to exceed 125C, then the NCP500 can dissipate up to 400 mW @ 25C. The power dissipated by the NCP500 can be calculated from the following equation: Input Decoupling (C1) Ptot + Vin * Ignd (Iout) ) [Vin * Vout] * Iout A 1.0 mF capacitor either ceramic or tantalum is recommended and should be connected close to the NCP500 package. Higher values and lower ESR will improve the overall line transient response. or P ) Vout * Iout VinMAX + tot Ignd ) Iout Output Decoupling (C2) If a 150 mA output current is needed the ground current is extracted from the data sheet curves: 200 mA @ 150 mA. For a NCP500SN18T1 (1.8 V), the maximum input voltage will then be 4.4 V, good for a 1 Cell Li-ion battery. The NCP500 is a stable component and does not require a minimum Equivalent Series Resistance (ESR) or a minimum output current. The minimum decoupling value is 1.0 mF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load regulation transient response. Figure 29 shows the stability region for a range of operating conditions and ESR values. Hints Please be sure the Vin and GND lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction. Set external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible. Noise Decoupling The NCP500 is a low noise regulator without the need of an external bypass capacitor. It typically reaches a noise level of 50 mVRMS overall noise between 10 Hz and 100 kHz. The classical bypass capacitor impacts the start up phase of standard LDOs. However, thanks to its low noise architecture, the NCP500 operates without a bypass element and thus offers a typical 20 ms start up phase. Package Placement DFN packages can be placed using standard pick and place equipment with an accuracy of "0.05 mm. Component pick and place systems are composed of a vision system that recognizes and positions the component and a mechanical system which physically performs the pick and place operation. Two commonly used types of vision systems are: (1) a vision system that locates a package silhouette and (2) a vision system that locates individual bumps on the interconnect pattern. The latter type renders more accurate place but tends to be more expensive and time consuming. Both methods are acceptable since the parts align due to a self-centering feature of the DFN solder joint during solder re-flow. Enable Operation The enable pin will turn on or off the regulator. These limits of threshold are covered in the electrical specification section of this data sheet. The turn-on/turn-off transient voltage being supplied to the enable pin should exceed a slew rate of 10 mV/ms to ensure correct operation. If the enable is not to be used then the pin should be connected to Vin. Solder Paste Thermal Type 3 or Type 4 solder paste is acceptable. As power across the NCP500 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature effect the rate of junction temperature rise for the part. This is stating that when the NCP500 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The maximum dissipation the package can handle is given by: Re-flow and Cleaning The DFN may be assembled using standard IR/IR convection SMT re-flow processes without any special considerations. As with other packages, the thermal profile for specific board locations must be determined. Nitrogen purge is recommended during solder for no-clean fluxes. The DFN is qualified for up to three re-flow cycles at 235C peak (J-STD-020). The actual temperature of the DFN is a function of: * Component density * Component location on the board * Size of surrounding components T *TA PD + J(max) RqJA http://onsemi.com 14 NCP500 ON OFF Battery or Unregulated Voltage C1 5 1 + Vout + 2 ON 3 Battery or Unregulated Voltage C2 4 1 6 2 5 3 4 Vout + C1 + C2 OFF Figure 27. Typical Application Circuit Figure 28. Typical Application Circuit 10 Cout = 1 mF to 10 mF TA = 40C to 125C Vin = up to 6.0 V Output Capacitor ESR (W) UNSTABLE 1 STABLE 0.1 0.01 0 25 50 75 100 125 150 IO, Output Current (mA) Figure 29. Stability Input Input Q1 R Output 1 1.0 mF R2 Q1 R3 5 Output 1 1.0 mF 2 3 Q2 R1 1.0 mF 4 5 1.0 mF 2 3 4 Figure 30. Current Boost Regulator Figure 31. Current Boost Regulator with Short Circuit Limit The NCP500 series can be current boosted with a PNP transistor. Resistor R in conjunction with VBE of the PNP determines when the pass transistor begins conducting; this circuit is not short circuit proof. Input/Output differential voltage minimum is increased by VBE of the pass resistor. Short circuit current limit is essentially set by the VBE of Q2 and R1. ISC = ((VBEQ2 - ib * R2) / R1) + IO(max) Regulator http://onsemi.com 15 Output 5 1 1.0 mF 1.0 mF 2 Enable 3 4 1 5 Output 1.0 mF 1.0 mF 2 R 3 4 C Vout, Output Voltage (V) Input Enable Voltage (V) NCP500 4 3 TA = 25C Vin = 3.4 V Vout = 2.8 V 2 1 0 3 2.5 No Delay 2 1.5 R = 1.0 MW C = 1.0 mF R = 1.0 MW C = 0.1 mF 1 0.5 0 10 0 20 30 40 50 60 70 80 90 100 110 Time (ms) Figure 32. Delayed Turn-on Figure 33. Delayed Turn-on If a delayed turn-on is needed during power up of several voltages then the above schematic can be used. Resistor R, and capacitor C, will delay the turn-on of the bottom regulator. A few values were chosen and the resulting delay can be seen in Figure 33. The graph shows the delay between the enable signal and output turn-on for various resistor and capacitor values. Input Output Q1 R 1 5 1.0 mF 2 1.0 mF 3 5.6 V 4 Figure 34. Input Voltages Greater than 6.0 V A regulated output can be achieved with input voltages that exceed the 6.0 V maximum rating of the NCP500 series with the addition of a simple pre-regulator circuit. Care must be taken to prevent Q1 from overheating when the regulated output (Vout) is shorted to Gnd. http://onsemi.com 16 NCP500 ORDERING INFORMATION Nominal Output Voltage Marking Package NCP500SN18T1 NCP500SN18T1G NCP500SN185T1 NCP500SN185T1G NCP500SN25T1 NCP500SN25T1G NCP500SN26T1 NCP500SN26T1G NCP500SN27T1 NCP500SN27T1G NCP500SN28T1 NCP500SN28T1G NCP500SN30T1 NCP500SN30T1G NCP500SN33T1 NCP500SN33T1G NCP500SN50T1 NCP500SN50T1G 1.8 1.8 1.85 1.85 2.5 2.5 2.6 2.6 2.7 2.7 2.8 2.8 3.0 3.0 3.3 3.3 5.0 5.0 LCS LCS LFL LFL LCT LCT LFM LFM LCU LCU LCV LCV LCW LCW LCX LCX LCY LCY TSOP-5 NCP500SQL18T1 NCP500SQL18T1G NCP500SQL25T1 NCP500SQL25T1G NCP500SQL27T1 NCP500SQL27T1G NCP500SQL28T1 NCP500SQL28T1G NCP500SQL30T1 NCP500SQL30T1G NCP500SQL33T1 NCP500SQL33T1G NCP500SQL50T1 NCP500SQL50T1G 1.8 1.8 2.5 2.5 2.7 2.7 2.8 2.8 3.0 3.0 3.3 3.3 5.0 5.0 LD LD LE LE LF LF LG LG LH LH LJ LJ LK LK DFN6 2x2.2 Device* Shipping 3000 Units/ 7 Tape & Reel For availability of other output voltages, please contact your local ON Semiconductor Sales Representative. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *The "G'' suffix indicates Pb-Free package available. http://onsemi.com 17 NCP500 PACKAGE DIMENSIONS TSOP-5 SN SUFFIX CASE 483-02 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. D S 5 4 1 2 L A 3 B J C 0.05 (0.002) MILLIMETERS INCHES DIM MIN MAX MIN MAX A 2.90 3.10 0.1142 0.1220 B 1.30 1.70 0.0512 0.0669 C 0.90 1.10 0.0354 0.0433 D 0.25 0.50 0.0098 0.0197 G 0.85 1.05 0.0335 0.0413 H 0.013 0.100 0.0005 0.0040 J 0.10 0.26 0.0040 0.0102 K 0.20 0.60 0.0079 0.0236 L 1.25 1.55 0.0493 0.0610 M 0_ 10 _ 0_ 10 _ S 2.50 3.00 0.0985 0.1181 G H M K SOLDERING FOOTPRINT* 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 18 NCP500 PACKAGE DIMENSIONS DFN6, 2x2.2, 0.65P CASE 506BA-01 ISSUE A A B D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L L1 EEE EEE PIN ONE REFERENCE 2X 0.10 C DETAIL A E ALTERNATE TERMINAL CONSTRUCTIONS TOP VIEW EE EE EXPOSED Cu 2X 0.10 C A 0.10 C EE CC CC A3 MOLD CMPD A1 DETAIL B DETAIL B DIM A A1 b D D2 E E2 e K L L1 ALTERNATE CONSTRUCTIONS MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 0.30 2.00 BSC 1.10 1.30 2.20 BSC 0.70 0.90 0.65 BSC 0.20 --- 0.25 0.35 0.00 0.10 7X 0.08 C SIDE VIEW C A1 L SOLDERING FOOTPRINT* D2 DETAIL A 6X SEATING PLANE e 6X 3 1 6 4 2.50 0.96 6X b BOTTOM VIEW 6X 0.58 L1 E2 K 1.36 PACKAGE OUTLINE 1 0.10 C A B 0.05 C 6X NOTE 3 0.35 0.65 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5817-1050 http://onsemi.com 19 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NCP500/D