○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
1/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.co.jp
TSZ22111・14・001
1ch Ultra Small High Side Load Switch
BUS1DJC0GWZ BUS1DJC3GWZ
General Description
BUS1DJC0GWZ and BUS1DJC3GWZ are low
ON-Resistance high-side power switch P-channel
MOSFETs. It comes in ultra-small package for portable
digital applications. This switch IC operates on low input
voltages ranging from 1.1V to 5.0V and exhibits a typical
ON-resistance of 63 m at 3.3V. The turn ON time of the
device can be controlled to avoid inrush current.
Features
P-MOSFET high-side load switch
Low input voltage
Ultra low bias current
Ultra low standby current
Built-in discharge circuit
Built-in soft start circuit
Built-in short circuit protection
Input logic : Active-High
Ultra small package
ESD protection
Applications
Digital cameras
Mobile phones
Smart phones
Portable devices
Digital video cameras
Key Specifications
Input Voltage Range: 1.1V to 5.0V
R
ON (at VIN=1.2V): 140m (Typ)
R
ON (at VIN=3.3V): 63m (Typ)
Bias Current: 0.35µA(Typ)
Standby Current: 0.01A (Typ)
Operating Temperature Range: -30°C to +85°C
Package W(Typ) x D(Typ) x H(Max)
UCSP30L1 0.8mm x 0.8mm x 0.35mm
Typical Application Circuits
Figure 1. Typical Application Circuits
VOUT
VIN
GND
CL
CIN
EN
ON/OFF
Datashee
t
Datasheet
Datasheet
2/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Pin Configurations
Pin Descriptions
Pin No. Pin Name Pin Function
A1 VOUT Switch output
A2 VIN Switch input
B1 GND Ground
B2 EN Enable input
Block Diagram
B EN GND
A VIN V
OUT
2 1
Top View
Figure 2. Pin Configuration
Figure 3. Block Diagram
B
A
Top View Bottom View
2 1 1 2
Short
Circuit
Protection
VIN VOUT
EN
Gate Driver
with Soft Start
GND
Datasheet
Datasheet
3/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Absolute Maximum Ratings (Ta = 25°C)
Parameter Symbol Rating Unit
Switch Input Voltage VIN -0.3 to +5.5 V
Switch Output Voltage VOUT -0.3 to VIN+0.3 V
Enable Input Voltage VEN -0.3 to +5.5 V
Power Dissipation Pd 0.41 (Note 1) W
Operating Temperature Range Topr -30 to +85 °C
Storage Temperature Range Tstg -55 to +125 °C
Junction Temperature Tjmax 125 °C
(Note 1) Derate by 4.1mW/°C when operating above 25°C. (When mounted on a 9 layer glass-epoxy board with 63mm x 55mm x 1.6mm dimension.)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Conditions (Ta= -30°C to +85°C)
Parameter Symbol Min Typ Max Unit
Switch Input Voltage VIN 1.1 - 5.0 V
Output Current IOUT - - 2
(Note 2) A
(Note 2) Not to exceed Pd and ASO.
Electrical Characteristics (Unless otherwise specified, VIN=3.3V, VEN=3.3V, Ta=25°C)
Parameter Symbol Min Typ Max Unit Conditions
Operating Current IIN - 0.35 1 µA VEN=3.3V, IOUT=0A
OFF Supply Current IIN_OFF - 0.01 1 µA VEN=0V, VOUT=OPEN
Leakage Current IIN_Leak - 0.01 1 µA VEN=0V, VOUT=0V
ON-Resistance 1 RON1 - 140 245 m V
IN=1.2V
ON-Resistance 2 RON2 - 80 125 m V
IN=1.8V
ON-Resistance 3 RON3 - 63 85 m V
IN=3.3V
ON-Resistance 4 RON4 - 58 80 m V
IN=5.0V
EN High Voltage VEN_High 0.85 - 5.0 V
EN Low Voltage VEN_Low -0.3 - 0.4 V
EN Bias Current IEN - 0.7 1.5 A VEN=3.3V
Discharge ON-Resistance RON_DIS 50 80 110 V
EN=0V
BUS1DJC0GWZ
Parameter Symbol Min Typ Max Unit Conditions
Turn-ON Time 1 tON1 - 32 - µsec VIN=1.2V, RL=510, CL=0.1F
Turn-ON Time 2 tON2 - 12 - µsec VIN=3.3V, RL=510, CL=0.1F
Turn-OFF Time tOFF - 25 - µsec VIN=3.3V, RL=510, CL=0.1F
BUS1DJC3GWZ
Parameter Symbol Min Typ Max Unit Conditions
Turn-ON Time 1 tON1 - 510 - µsec VIN=1.2V, RL=510, CL=0.1F
Turn-ON Time 2 tON2 - 190 - µsec VIN=3.3V, RL=510, CL=0.1F
Turn-OFF Time tOFF - 25 - µsec VIN=3.3V, RL=510, CL=0.1F
Datasheet
Datasheet
4/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Measurement Circuit
Figure 4. Measurement Circuit
Figure 5. Timing Diagram
VOUT
VIN
GND
EN
ON/OFF
CLRL
CIN
50%
10%
90%
10%
tON tOFF
tr tf
EN
VOUT
90%
50%
Datasheet
Datasheet
5/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Typical Performance Curves
(Unless otherwise specified, Ta=25°C, VEN=3.3V, VIN=3.3V)
0
20
40
60
80
100
120
140
160
-30 -10 10 30 50 70
Ta [℃]
R
ON
[m]
Figure 7. ON-Resistance vs Temperature
VIN=1.2V
VIN=1.8V
VIN=3.3V
VIN=5.0V
Temperature : Ta [°C]
ON-Resistance : RON [m]
Figure 6. ON-Resistance vs Switch Input Voltage
0
20
40
60
80
100
120
140
160
12345
VIN [V]
RON
[m]
Ta=85°C
Ta=25°C
Ta=-30°C
ON-Resistance : RON [m]
Switch Input Voltage : VIN [V]
0
0.2
0.4
0.6
0.8
1
25 45 65 85 105 125
IIN [A]
Ta [℃]
Figure 9. Operating Current vs Temperature
VIN=5.0V
VIN=3.3V
VIN=1.8V
VIN=1.2V
Temperature : Ta [°C]
Operating Current : IIN [µA]
0
0.2
0.4
0.6
0.8
1
012345
IIN [µA]
V
IN
[V]
Figure 8. Operating Current vs Switch Input Voltage
Operating Current : IIN [µA]
Switch Input Voltage : VIN [V]
Datasheet
Datasheet
6/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Typical Performance Curves - continued
0
0.5
1
1.5
2
2.5
3
25 45 65 85 105 125
Ta [℃]
I
IN_OFF
[µA]
Figure 11. OFF Supply Current vs Temperature
(VEN=0V)
VIN=5.0V
VIN=3.3V
VIN=1.8V
VIN=1.2V
Temperature : Ta [°C]
OFF Supply Current : IIN
_
OFF [µA]
0
0.2
0.4
0.6
0.8
1
012345
I
IN_Leak
[A]
V
IN
[V]
Figure 12. Leakage Current vs Switch Input Voltage
(VEN=0V, VOUT=0V)
Leakage Current : IIN
_
Leak [µA]
Switch Input Voltage : VIN [V]
0
0.5
1
1.5
2
2.5
3
25 45 65 85 105 125
Ta [℃]
I
IN_Leak
[µA]
Figure 13. Leakage Current vs Temperature
(VEN=0V, VOUT=0V)
VIN=5.0V
VIN=3.3V
VIN=1.8V
VIN=1.2V
Leakage Current : IIN
_
Leak [µA]
Temperature : Ta [°C]
0
0.2
0.4
0.6
0.8
1
012345
IIN_OFF [A]
VIN [V]
Figure 10. OFF Supply Current vs Switch Input Voltage
(VEN=0V)
OFF Supply Current : IIN
_
OFF [µA]
Switch Input Voltage : VIN [V]
Datasheet
Datasheet
7/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Typical Performance Curves – continued
Figure 17. Switch Output Voltage vs Enable Input Voltage
(VIN=5.0V)
0
1
2
3
4
5
0 0.2 0.4 0.6 0.8 1
VEN [V]
VOUT
[V]
Switch Output Voltage : VOUT [V]
Enable Input Voltage : VEN [V]
Figure 16. Switch Output Voltage vs Enable Input Voltage
(VIN=3.3V)
0
1
2
3
4
5
0 0.2 0.4 0.6 0.8 1
VEN [V]
VOUT
[V]
Switch Output Voltage : VOUT [V]
Enable Input Voltage : VEN [V]
Figure 15. Switch Output Voltage vs Enable Input Voltage
(VIN=1.8V)
0
1
2
3
4
5
0 0.2 0.4 0.6 0.8 1
VEN [V]
VOUT
[V]
Switch Output Voltage : VOUT [V]
Enable Input Voltage : VEN [V]
Figure 14. Switch Output Voltage vs Enable Input Voltage
(VIN=1.2V)
0
1
2
3
4
5
0 0.2 0.4 0.6 0.8 1
VEN [V]
VOUT
[V]
Switch Output Voltage : VOUT [V]
Enable Input Voltage : VEN [V]
Datasheet
Datasheet
8/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Typical Performance Curves – continued
Figure 21. Switch Output Voltage vs Switch Input Voltage
(VEN=0V)
0
1
2
3
4
5
012345
VIN [V]
VOUT
[V]
Switch Input Voltage : VIN [V]
Figure 18. EN Bias Current vs Enable Input Voltage
0
0.4
0.8
1.2
1.6
2
012345
VEN [V]
IEN
[µA]
Enable Input Voltage : VEN [V]
EN Bias Current : IEN [µA]
Figure 19. Discharge ON-Resistance vs Switch Input Voltage
60
70
80
90
100
110
120
12345
VIN [V]
RON_DIS
[Ω]
Switch Input Voltage : VIN [V]
Discharge ON-Resistance : RON_DIS []
Figure 20. Switch Output Voltage vs Switch Input Voltage
(VEN=3.3V)
0
1
2
3
4
5
012345
VIN [V]
VOUT
[V]
Switch Input Voltage : VIN [V]
Switch Output Voltage : VOUT [V]
Switch Output Voltage : VOUT [V]
Datasheet
Datasheet
9/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Typical Performance Curves – continued
Figure 22. Switch Output Voltage vs Output Current
(VIN=1.2V)
0
0.3
0.6
0.9
1.2
1.5
0 0.3 0.6 0.9 1.2 1.5 1.8
IOUT [A]
VOUT
[V]
Switch Output Voltage : VOUT [V]
Output Current : IOUT [A]
Figure 23. Switch Output Voltage vs Output Current
(VIN=1.5V)
0
0.3
0.6
0.9
1.2
1.5
1.8
0 0.5 1 1.5 2 2.5 3 3.5
IOUT [A]
VOUT
[V]
Switch Output Voltage : VOUT [V]
Output Current : IOUT [A]
Figure 25. Switch Output Voltage vs Output Current
(VIN=2.5V)
0
0.4
0.8
1.2
1.6
2
2.4
2.8
0123456
IOUT [A]
VOUT
[V]
Switch Output Voltage : VOUT [V]
Figure 24. Switch Output Voltage vs Output Current
(VIN=1.8V)
0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
0 0.8 1.6 2.4 3.2 4 4.8
IOUT [A]
VOUT
[V]
Switch Output Voltage : VOUT [V]
Output Current : IOUT [A] Output Current : IOUT [A]
Datasheet
Datasheet
10/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Typical Performance Curves – continued
Figure 26. Switch Output Voltage vs Output Current
(VIN=3.3V)
0
0.5
1
1.5
2
2.5
3
3.5
01234567
IOUT [A]
VOUT
[V]
Switch Output Voltage : VOUT [V]
Output Current : IOUT [A]
Figure 27. Switch Output Voltage vs Output Current
(VIN=5.0V)
0
1
2
3
4
5
6
01234567
IOUT [A]
VOUT
[V]
Switch Output Voltage : VOUT [V]
Output Current : IOUT [A]
Figure 28. Turn-ON Time vs Switch Input Voltage
(BUS1DJC0GWZ)
0
10
20
30
40
12345
V
IN
[V]
t
ON
[µsec]
Turn-ON Time : tON [µsec]
Switch Input Voltage : VIN [V]
Figure 29. Rise Time vs Switch Input Voltage
(BUS1DJC0GWZ)
0
5
10
15
20
25
30
12345
V
IN
[V]
t
r
[µsec]
Switch Input Voltage : VIN [V]
Rise Time : tr [µsec]
Datasheet
Datasheet
11/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Typical Performance Curves – continued
t:10[µsec/div]
EN:2[V/div]
VOUT:500[mV/div]
Figure 32. Turn ON Response 1
(BUS1DJC0GWZ VIN=1.2V)
EN:2[V/div]
VOUT:500[mV/div]
t:10[µsec/div]
Figure 33. Turn OFF Response 1
(BUS1DJC0GWZ VIN=1.2V)
Figure 30. Turn-OFF Time vs Switch Input Voltage
(BUS1DJC0GWZ)
0
10
20
30
40
12345
V
IN
[V]
t
OFF
[µsec]
Turn-OFF Time : tOFF [µsec]
Switch Input Voltage : VIN [V]
Figure 31. Fall Time vs Switch Input Voltage
(BUS1DJC0GWZ)
0
5
10
15
20
25
30
12345
V
IN
[V]
t
f
[µsec]
Switch Input Voltage : VIN [V]
Fall Time : tf [µsec]
Datasheet
Datasheet
12/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Typical Performance Curves – continued
t:10[µsec/div]
EN:2[V/div]
VOUT:500[mV/div]
Figure 34. Turn ON Response 2
(BUS1DJC0GWZ VIN=1.5V)
EN:2[V/div]
VOUT:500[mV/div]
t:10[µsec/div]
Figure 35. Turn OFF Response 2
(BUS1DJC0GWZ VIN=1.5V)
t:10[µsec/div]
EN:2[V/div]
VOUT:500[mV/div]
Figure 36. Turn ON Response 3
(BUS1DJC0GWZ VIN=1.8V)
EN:2[V/div]
VOUT:500[mV/div]
t:10[µsec/div]
Figure 37. Turn OFF Response 3
(BUS1DJC0GWZ VIN=1.8V)
Datasheet
Datasheet
13/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Typical Performance Curves – continued
t:4[µsec/div]
EN:2[V/div]
VOUT:1 [V/div]
Figure 38. Turn ON Response 4
(BUS1DJC0GWZ VIN=2.5V)
EN:2[V/div]
VOUT:1[V/div]
t:10[µsec/div]
Figure 39. Turn OFF Response 4
(BUS1DJC0GWZ VIN=2.5V)
t:4 [µsec/div]
EN:2[V/div]
VOUT:1[V/div]
Figure 40. Turn ON Response 5
(BUS1DJC0GWZ VIN=3.3V)
EN:2[V/div]
VOUT:1[V/div]
t:10[µsec/div]
Figure 41. Turn OFF Response 5
(BUS1DJC0GWZ VIN=3.3V)
Datasheet
Datasheet
14/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Typical Performance Curves – continued
t:4[µsec/div]
EN:2[V/div]
VOUT:2 [V/div]
EN:2[V/div]
VOUT:2[V/div]
t:10[µsec/div]
Figure.42 Turn on response 6
(BUS1DJC0GWZ VIN=5.0V)
Figure.43 Turn off response 6
(BUS1DJC0GWZ VIN=5.0V)
Figure 45. Rise Time vs Switch Input Voltage
(BUS1DJC3GWZ)
0
100
200
300
400
500
12345
V
IN
[V]
t
r
[µsec]
Switch Input Voltage : VIN [V]
Rise Time : tr [µsec]
Figure 44. Turn-ON Time vs Switch Input Voltage
(BUS1DJC3GWZ)
0
100
200
300
400
500
600
12345
V
IN
[V]
t
ON
[µsec]
Turn-ON Time : tON [µsec]
Switch Input Voltage : VIN [V]
Datasheet
Datasheet
15/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Typical Performance Curves – continued
Figure.48 Turn on response 7
(BUS1DJC3GWZ VIN=1.2V)
Figure.49 Turn off response 7
(BUS1DJC3GWZ VIN=1.2V)
t:100[µsec/div]
EN:2[V/div]
VOUT:500 [mV/div]
EN:2[V/div]
VOUT:500[mV/div]
t:10[µsec/div]
Figure 46. Turn-OFF Time vs Switch Input Voltage
(BUS1DJC3GWZ)
0
10
20
30
40
12345
V
IN
[V]
t
OFF
[µsec]
Turn-OFF Time : tOFF [µsec]
Switch Input Voltage : VIN [V]
Figure 47. Fall Time vs Switch Input Voltage
(BUS1DJC3GWZ)
0
5
10
15
20
25
30
12345
V
IN
[V]
t
f
[µsec]
Switch Input Voltage : VIN [V]
Fall Time : tf [µsec]
Datasheet
Datasheet
16/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Typical Performance Curves – continued
t:100[µsec/div]
EN:2[V/div]
VOUT:500[mV/div]
EN:2[V/div]
VOUT:500[mV/div]
t:10[µsec/div]
Figure.50 Turn on response 8
(BUS1DJC3GWZ VIN=1.5V)
Figure.51 Turn off response 8
(BUS1DJC3GWZ VIN=1.5V)
t:100[µsec/div]
EN:2[V/div]
VOUT:500[mV/div]
EN:2[V/div]
VOUT:500[mV/div]
t:10[µsec/div]
Figure.52 Turn on response 9
(BUS1DJC3GWZ VIN=1.8V)
Figure.53 Turn off response 9
(BUS1DJC3GWZ VIN=1.8V)
Datasheet
Datasheet
17/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Typical Performance Curves – continued
t:40[µsec/div]
EN:2[V/div]
VOUT:1 [V/div]
EN:2[V/div]
VOUT:1[V/div]
t:10[µsec/div]
Figure.54 Turn on response 10
(BUS1DJC3GWZ VIN=2.5V)
Figure.55 Turn off response 10
(BUS1DJC3GWZ VIN=2.5V)
t:40 [µsec/div]
EN:2[V/div]
VOUT:1[V/div]
EN:2[V/div]
VOUT:1[V/div]
t:10[µsec/div]
Figure.56 Turn on response 11
(BUS1DJC3GWZ VIN=3.3V)
Figure.57 Turn off response 11
(BUS1DJC3GWZ VIN=3.3V)
Datasheet
Datasheet
18/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Typical Performance Curves – continued
t:40[µsec/div]
EN:2[V/div]
VOUT:2 [V/div]
EN:2[V/div]
VOUT:2[V/div]
t:10[µsec/div]
Figure.58 Turn on response 12
(BUS1DJC3GWZ VIN=5V)
Figure.59 Turn off response 12
(BUS1DJC3GWZ VIN=5V)
Datasheet
Datasheet
19/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Application Information
It is recommended that an input bypass/decoupling capacitor (over 0.1F) is placed near the IC between the VIN and GND
pins. The capacitor between VIN and GND pins is necessary when there is high impedance on the power supply or if the
power trace is long. Larger capacitance value (0.1F to 100F) would result to better line regulation and will improve power
characteristics during load change. However, IC operation must be confirmed by mounting the device on an actual
application board.
Power Dissipation
An estimation of heat reduction characteristics and internal power consumption of the IC are shown below. Use these for
reference. It is recommended to measure Pd on a set board since power dissipation changes substantially according to the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.).
Exceeding the power dissipation of IC may lead to degradation of the original IC performance, such as reduction in current
capability of the device. It is recommended to provide sufficient margin within the power dissipation rating for usage.
Calculation of the internal power consumption of IC (P)
OUTOUTON IIRP ××=
Where:
RON is the ON-state resistance
IOUT is the Average output current
○Measurement Conditions
Evaluation Board
Layout of Board for
Measurement
Top Layer (Top View) Bottom Layer (Top View)
Measurement State With board implemented (Wind speed 0 m/s)
Board Material Glass epoxy resin (9 layers)
Board Size 63 mm x 55 mm x 1.6 mm
Wiring
Rate
Top layer Metal (GND) wiring rate: Approx. 0%
Bottom layer Metal (GND) wiring rate: Approx. 50%
Through Hole Diameter 0.5mm x 6 holes
Power Dissipation 0.41W
Thermal
Resistance ja=243.9°C/W
Datasheet
Datasheet
20/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
I/O Equivalence Circuits
A2(VIN) / A1(VOUT) B1(GND) B2(EN)
B2(EN)
Depression
NMOS
A2(VIN)
A
1(VOUT)
B1(GND)
Figure 60. UCSP30L1(BUS1DJC0GWZ/ BUS1DJC3GWZ)
Power Dissipation Heat Reduction Characteristics (Reference)
* Please design the margin so that P is
less than Pd (P < Pd) within the usage
temperature range
0 25 50 75 100 12585
0
0.2
0.3
0.4
0.1
0.41W
Ambient Temperature :Ta [°C]
0.5
Power Dissipation :Pd [W]
Datasheet
Datasheet
21/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital
and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.
Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the
capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the
IC is mounted on a glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and
copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of
connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned OFF completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Datasheet
Datasheet
22/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Operational Notes – continued
11. Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power
supply or ground line.
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of
these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower
than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply
voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages
within the values specified in the electrical characteristics of this IC.
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
Datasheet
Datasheet
23/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Ordering Information
B U S 1 D J C 0 G W Z – E2
Part number
Switch Number Discharge Voltage Output Slew rate Package Packaging and
of channel FET resistance current forming specification
1:1ch D:Built in J:5.5V GWZ:UCSP30L1 E2:Embossed tape and reel
N:None I:7.0V
H:10V
Marking Diagram
Physical Dimension, Tape and Reel Information
5:500mA
A:1A
C:2A
0:None
1:Fast
3:Middle
5:Slo
w
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
E2
()
Direction of feed
Reel 1pin
(Unit : mm)
UCSP50L1(BUXXSA4WGWL)
S
0.06 S
0.55MAX
0.1±0.05
A
B
BA
0.05
0.2±0.05
4-φ0.25±0.05
21
0.2±0.05
B
A
0.4
0.4
1PIN MARK
0.8±0.05
0.8±0.05
UCSP30L1(BUS1DJC0GWZ / BUS1DJC3GWZ)
0.08±0.05
0.35MAX
4-φ0.20±0.05
xx
Marking
Lot No.
1Pin Mark
Part No. Marking
BUS1DJC0GWZ GV
BUS1DJC3GWZ GX
Datasheet
Datasheet
24/24
TSZ02201-0R5R0GZ00010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
8.Apr.2014 Rev.002
www.rohm.com
TSZ22111・15・001
BUS1DJC0GWZ BUS1DJC3GWZ
Revision History
Date Revision Changes
11.Mar.2014 001 New Release
8.Apr.2014 002 Added BUS1DJC3GWZ
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for applicatio n in ordinar y elec tronic eq uipm ents (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliabili ty, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radi ation-proof design.
5. Please verify and confirm ch aracteristics of the final or mounted products in using the Pro ducts.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending o n Ambient temper ature (Ta). When us ed in se aled area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specifi ed range described in the product specification.
9. ROHM shall not be in any way responsible or lia ble for failure induced under deviant conditio n from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogen ous (chlori ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information
contained in this document. ROHM shall not be i n an y way responsible or liable for any damages, expenses or loss es
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommende d b y ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage c ondition, solderabil ity of products out of recommended storage time perio d
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive s t ress applied when dropping of a carton.
4. Use Products within the spec ified time after opening a humidity barrier bag. Baking is required b efore using Products of
which storage time is exceeding the recommended storage time perio d.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly us ing an authorized industr y waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under an y intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained i n this document. Provide d, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated compani es or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
