Sample & Buy Product Folder Support & Community Tools & Software Technical Documents DS90LV032A SNLS011D - JULY 1999 - REVISED AUGUST 2016 DS90LV032A 3-V LVDS Quad CMOS Differential Line Receiver 1 Features 3 Description * * * * * * * * * * The DS90LV032A is a quad CMOS differential line receiver designed for applications requiring ultra-low power dissipation and high data rates. The device is designed to support data rates in excess of 400 Mbps (200 MHz) using Low Voltage Differential Signaling (LVDS) technology. 1 * * * >400 Mbps (200 MHz) Switching Rates 0.1-ns Channel-to-Channel Skew (Typical) 0.1-ns Differential Skew (Typical) 3.3-ns Maximum Propagation Delay 3.3-V Power Supply Design Power Down High Impedance on LVDS Inputs Low Power Design (40 mW at 3.3 V Static) Interoperable With Existing 5-V LVDS Networks Accepts Small Swing (350 mV Typical) VID Supports Open, Short, and Terminated Input FailSafe Compatible With ANSI/TIA/EIA-644 Industrial Temperature Operating Range (-40C to 85C) Available in SOIC and TSSOP Packaging The DS90LV032A accepts low voltage (350 mV typical) differential input signals and translates them to 3-V CMOS output levels. The receiver supports a TRI-STATE function that may be used to multiplex outputs. The receiver also supports open, shorted, and terminated (100 ) input Fail-safe. The receiver output is HIGH for all fail-safe conditions. The DS90LV032A and companion LVDS line driver (for example, DS90LV031A) provide a new alternative to high power PECL or ECL devices for high speed point-to-point interface applications. Device Information(1) 2 Applications * * PART NUMBER Building And Factory Automation Grid Infrastructure DS90LV032A PACKAGE BODY SIZE (NOM) SOIC (16) 9.90 mm x 3.91 mm TSSOP (16) 5.00 mm x 4.40 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Block Diagram RIN1+ + RIN1- RIN2+ + RIN2- RIN3+ + RIN3- RIN4+ + RIN4- R1 ROUT1 R2 ROUT2 R3 ROUT3 R4 ROUT4 EN EN* Copyright (c) 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DS90LV032A SNLS011D - JULY 1999 - REVISED AUGUST 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 3 4 4 4 5 6 6 7 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics .......................................... Switching Characteristics .......................................... Dissipation Ratings ................................................... Typical Characteristics .............................................. Parameter Measurement Information .................. 8 Detailed Description ............................................ 10 8.1 Overview ................................................................. 10 8.2 Functional Block Diagram ....................................... 10 8.3 Feature Description................................................. 10 8.4 Device Functional Modes........................................ 11 9 Application and Implementation ........................ 12 9.1 Application Information............................................ 12 9.2 Typical Application .................................................. 12 10 Power Supply Recommendations ..................... 14 11 Layout................................................................... 14 11.1 Layout Guidelines ................................................. 14 11.2 Layout Example .................................................... 15 12 Device and Documentation Support ................. 16 12.1 12.2 12.3 12.4 12.5 12.6 Documentation Support ....................................... Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 16 16 16 16 16 16 13 Mechanical, Packaging, and Orderable Information ........................................................... 16 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (April 2013) to Revision D Page * Added ESD Ratings table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1 * Added Thermal Information table. .......................................................................................................................................... 4 Changes from Revision B (April 2013) to Revision C * 2 Page Changed layout of National Semiconductor Data Sheet to TI format .................................................................................... 7 Submit Documentation Feedback Copyright (c) 1999-2016, Texas Instruments Incorporated Product Folder Links: DS90LV032A DS90LV032A www.ti.com SNLS011D - JULY 1999 - REVISED AUGUST 2016 5 Pin Configuration and Functions D or PW Package 16-Pin SOIC or TSSOP Top View Pin Functions PIN NAME NO. I/O DESCRIPTION EN 4 I Active high enable pin, OR-ed with EN EN 12 I Active low enable pin, OR-ed with EN GND 8 -- RIN- 1, 7, 9, 15 I Inverting receiver input pin RIN+ 2, 6, 10, 14 I Noninverting receiver input pin ROUT 3, 5, 11, 13 O Receiver output pin VCC 16 -- Power supply pin, 3.3 V 0.3 V Ground pin 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage VCC -0.3 4 V Input voltage RIN+, RIN- -0.3 3.9 V Enable input voltage EN, EN* -0.3 VCC + 0.3 V Output voltage ROUT -0.3 VCC + 0.3 V Lead temperature, soldering (4 s) 260 C Maximum junction temperature, TJ 150 C 150 C Storage temperature, Tstg (1) -65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Submit Documentation Feedback Copyright (c) 1999-2016, Texas Instruments Incorporated Product Folder Links: DS90LV032A 3 DS90LV032A SNLS011D - JULY 1999 - REVISED AUGUST 2016 www.ti.com 6.2 ESD Ratings VALUE Electrostatic discharge (1) V(ESD) (1) Human-body model (HBM) (1) 4500 Machine model (MM), EIAJ 250 UNIT V ESD Ratings: HBM (1.5 k, 100 pF) 4.5 kV and EIAJ (0 , 200 pF) 250 V 6.3 Recommended Operating Conditions VCC MIN NOM MAX 3 3.3 3.6 Supply voltage Receiver input voltage TA GND Operating free-air temperature -40 25 UNIT V 3 V 85 C 6.4 Thermal Information DS90LV032A THERMAL METRIC (1) PW (TSSOP) D (SOIC) 16 PINS 16 PINS UNIT RJA Junction-to-ambient thermal resistance 110 75 C/W RJC(top) Junction-to-case (top) thermal resistance 47 36 C/W RJB Junction-to-board thermal resistance 55 32 C/W JT Junction-to-top characterization parameter 6 6 C/W JB Junction-to-board characterization parameter 54 31.7 C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright (c) 1999-2016, Texas Instruments Incorporated Product Folder Links: DS90LV032A DS90LV032A www.ti.com SNLS011D - JULY 1999 - REVISED AUGUST 2016 6.5 Electrical Characteristics over supply voltage and operating temperature ranges (unless otherwise noted) (1) PARAMETER VTH Differential input high threshold VTL Differential input low threshold VCMR Common mode voltage range IIN VOH VOL Input current Output high voltage Output low voltage TEST CONDITIONS VCM = 1.2 V, RIN+, RIN- pin (2) VID = 200 mV peak to peak, RIN+, RIN- pin (3) VCC = 3.6 V or 0 V, RIN+, RIN- pin MIN TYP MAX UNIT 20 100 mV -100 -20 0.1 mV 2.3 V VIN = 2.8 V -10 1 10 A 1 10 A 20 A VIN = 0 V -10 VCC = 0 V, VIN = 3.6 V, RIN+, RIN- pin -20 IOH = -0.4 mA, VID = 200 mV, ROUT pin 2.7 3 V IOH = -0.4 mA, input terminated, ROUT pin 2.7 3 V IOH = -0.4 mA, input shorted, ROUT pin 2.7 3 IOL = 2 mA, VID = -200 mV, ROUT pin (4) V 0.1 0.25 V -15 -48 -120 mA -10 1 10 A IOS Output short-circuit current Enabled, VOUT = 0 V, ROUT pin IOZ Output TRI-STATE current Disabled, VOUT = 0 V or VCC VIH Input high voltage EN, EN* pins 2 VCC V VIL Input low voltage EN, EN* pins GND 0.8 V II Input current VIN = 0 V or VCC, other input = VCC or GND, EN, EN* pins -10 1 10 A VCL Input clamp voltage ICL = -18 mA, EN, EN* pins -1.5 -0.8 No load supply current EN, EN* = VCC or GND, inputs open, VCC pin 10 15 mA Receivers enabled EN, EN* = 2.4 V or 0.5 V, inputs open, VCC pin 10 15 mA No load supply current Receivers disabled, EN = GND, EN* = VCC, inputs open, VCC pin 3 5 mA ICC ICCZ (1) (2) (3) (4) V Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise specified. VCC is always higher than RIN+ and RIN- voltage. RIN- and RIN+ are allowed to have a voltage range -0.2 V to VCC - VID / 2. However, to be compliant with AC specifications, the common voltage range is 0.1 V to 2.3 V The VCMR range is reduced for larger VID. Example: if VID = 400 mV, the VCMR is 0.2 V to 2.2 V. The fail-safe condition with inputs shorted is valid over a common mode range of 0 V to 2.3 V. A VID up to VCC - 0 V may be applied to the RIN+/ RIN- inputs with the common mode voltage set to VCC / 2. Propagation delay and differential pulse skew decrease when VID is increased from 200 mV to 400 mV. Skew specifications apply for 200 mV VID 800 mV over the common mode range. Output short-circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. Only one output must be shorted at a time, do not exceed maximum junction temperature specification. Submit Documentation Feedback Copyright (c) 1999-2016, Texas Instruments Incorporated Product Folder Links: DS90LV032A 5 DS90LV032A SNLS011D - JULY 1999 - REVISED AUGUST 2016 www.ti.com 6.6 Switching Characteristics over supply voltage and operating temperature ranges (unless otherwise noted) (1) (2) PARAMETER TEST CONDITIONS MIN NOM MAX UNIT tPHLD Differential propagation delay, high to low CL = 10 pF 1.8 3.3 ns tPLHD Differential propagation delay, low to high VID = 200 mV 1.8 3.3 ns tSKD1 Differential pulse skew (3) |tPHLD - tPLHD| (4) See Figure 4 and Figure 5 0 0.1 0.35 ns Same device 0 0.1 0.5 ns 1 ns tSKD2 Differential channel-to-channel skew tSKD3 Differential part-to-part skew (5) tSKD4 Differential part-to-part skew (6) 1.5 ns tTLH Rise time 0.35 1.2 ns tTHL Fall time 0.35 1.2 ns tPHZ Disable time high to Z RL = 2 k 8 12 ns tPLZ Disable time low to Z CL = 10 pF 6 12 ns tPZH Enable time Z to high See Figure 6 and Figure 7 11 17 ns tPZL Enable time Z to low 11 17 fMAX Maximum operating frequency (7) (1) (2) (3) (4) (5) (6) (7) All channels switching 200 250 ns MHz All typicals are given for: VCC = 3.3 V, TA = 25C. Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50 , tr and tf (0% to 100%) 3 ns for RIN. tSKD1 is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of the same channel tSKD2, channel-to-channel skew, is defined as the difference between the propagation delay of one channel and that of the others on the same chip with any event on the inputs. tSKD3, part-to-part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices at the same VCC, and within 5C of each other within the operating temperature range. tSKD4, part-to-part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices over recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Maximum - Minimum| differential propagation delay. fMAX generator input conditions: tr = tf < 1 ns (0% to 100%), 50% duty cycle, differential (1.05-V to 1.35-V peak-to-peak). Output criteria: 60% / 40% duty cycle, VOL (maximum: 0.4 V), VOH (minimum: 2.7 V), load = 10 pF (stray plus probes). 6.7 Dissipation Ratings MAXIMUM PACKAGE POWER DISSIPATION AT 25C D package 1025 mW PW package 866 mW Derate D package 8.2 mW/C above 25C Derate PW package 6.9 mW/C above 25C 6 Submit Documentation Feedback Copyright (c) 1999-2016, Texas Instruments Incorporated Product Folder Links: DS90LV032A DS90LV032A www.ti.com SNLS011D - JULY 1999 - REVISED AUGUST 2016 6.8 Typical Characteristics Figure 1. Typical Pulse Skew Variation vs Common Mode Voltage Figure 2. Variation in High-to-Low Propagation Delay vs VCM Figure 3. Variation in Low-to-High Propagation Delay vs VCM Submit Documentation Feedback Copyright (c) 1999-2016, Texas Instruments Incorporated Product Folder Links: DS90LV032A 7 DS90LV032A SNLS011D - JULY 1999 - REVISED AUGUST 2016 www.ti.com 7 Parameter Measurement Information Figure 4. Receiver Propagation Delay and Transition Time Test Circuit Figure 5. Receiver Propagation Delay and Transition Time Waveforms CL includes load and test jig capacitance. S1 = VCC for tPZL, and tPLZ measurements. S1 = GND for tPZH and tPHZ measurements. Figure 6. Receiver TRI-STATE Delay Test Circuit 8 Submit Documentation Feedback Copyright (c) 1999-2016, Texas Instruments Incorporated Product Folder Links: DS90LV032A DS90LV032A www.ti.com SNLS011D - JULY 1999 - REVISED AUGUST 2016 Parameter Measurement Information (continued) Figure 7. Receiver TRI-STATE Delay Waveforms Submit Documentation Feedback Copyright (c) 1999-2016, Texas Instruments Incorporated Product Folder Links: DS90LV032A 9 DS90LV032A SNLS011D - JULY 1999 - REVISED AUGUST 2016 www.ti.com 8 Detailed Description 8.1 Overview LVDS drivers and receivers are intended to be primarily used in an uncomplicated point-to-point configuration as is shown in Figure 8. This configuration provides a clean signaling environment for the fast edge rates of the drivers. The receiver is connected to the driver through a balanced media which may be a standard twisted pair cable, a parallel pair cable, or simply PCB traces. Typically, the characteristic impedance of the media is in the range of 100 . A termination resistor of 100 (selected to match the media) is located as close to the receiver input pins as possible. Other configurations are possible such as a multi-receiver configuration, but the effects of a mid-stream connector(s), cable stub(s), and other impedance discontinuities as well as ground shifting, noise margin limits, and total termination loading must be considered. The DS90LV032A differential line receiver is capable of detecting signals as low as 100 mV, over a 1-V common-mode range centered around 1.2 V. This is related to the driver offset voltage which is typically 1.2 V. The driven signal is centered around this voltage and may shift 1 V around this center point. The 1-V shifting may be the result of a ground potential difference between the ground reference of the driver and the ground reference of the receiver, the common-mode effects of coupled noise, or a combination of the two. The AC parameters of both receiver input pins are optimized for a recommended operating input voltage range of 0 V to 2.4 V (measured from each pin to ground). The device operates for receiver input voltages up to VCC, but exceeding VCC turns on the ESD protection circuitry which clamps the bus voltages. 8.2 Functional Block Diagram RIN1+ + RIN1- RIN2+ + RIN2- RIN3+ + RIN3- RIN4+ + RIN4- R1 ROUT1 R2 ROUT2 R3 ROUT3 R4 ROUT4 EN EN* Copyright (c) 2016, Texas Instruments Incorporated 8.3 Feature Description 8.3.1 Fail-Safe Feature The LVDS receiver is a high-gain, high-speed device that amplifies a small differential signal (20 mV) to CMOS logic levels. Due to the high gain and tight threshold of the receiver, take care to prevent noise from appearing as a valid signal. The internal fail-safe circuitry of the receiver is designed to source or sink a small amount of current, providing fail-safe protection (a stable known state of HIGH output voltage) for floating, terminated, or shorted receiver inputs. 10 Submit Documentation Feedback Copyright (c) 1999-2016, Texas Instruments Incorporated Product Folder Links: DS90LV032A DS90LV032A www.ti.com SNLS011D - JULY 1999 - REVISED AUGUST 2016 Feature Description (continued) 1. Open input pins: The DS90LV032A is a quad receiver device, and if an application requires only 1, 2, or 3 receivers, the unused channel(s) inputs must be left OPEN. Do not tie unused receiver inputs to ground or any other voltages. The input is biased by internal high value pullup and pulldown resistors to set the output to a HIGH state. This internal circuitry ensures a HIGH, stable output state for open inputs. 2. Terminated input: If the driver is disconnected (cable unplugged), or if the driver is in a TRI-STATE or poweroff condition, the receiver output is in a HIGH state, even with the end of cable 100- termination resistor across the input pins. The unplugged cable can become a floating antenna which can pick up noise. If the cable picks up more than 10 mV of differential noise, the receiver may see the noise as a valid signal and switch. To insure that any noise is seen as common-mode and not differential, a balanced interconnect must be used. Twisted pair cable offers better balance than flat ribbon cable. 3. Shorted inputs: If a fault condition occurs that shorts the receiver inputs together, thus resulting in a 0-V differential input voltage, the receiver output remains in a HIGH state. Shorted input fail-safe is not supported across the common-mode range of the device (GND to 2.4 V). It is only supported with inputs shorted and no external common-mode voltage applied. External lower value pullup and pulldown resistors (for a stronger bias) may be used to boost fail-safe in the presence of higher noise levels. The pullup and pulldown resistors must be in the 5-k to 15-k range to minimize loading and waveform distortion to the driver. The common-mode bias point must be set to approximately 1.2 V (less than 1.75 V) to be compatible with the internal circuitry. The footprint of the DS90LV032A is the same as the industry standard 26LS32 Quad Differential (RS-422) Receiver. 8.4 Device Functional Modes Table 1 lists the functional modes of the DS90LV032A. Table 1. Truth Table ENABLES EN EN* L H All other combinations of ENABLE inputs INPUTS OUTPUT RIN+ - RIN- ROUT X Z VID 0.1 V H VID -0.1 V L Full Fail-safe OPEN/SHORT or Terminated H Submit Documentation Feedback Copyright (c) 1999-2016, Texas Instruments Incorporated Product Folder Links: DS90LV032A 11 DS90LV032A SNLS011D - JULY 1999 - REVISED AUGUST 2016 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The DS90LV032A LVDS receiver and DS90LV031A driver are intended to be primarily used in an uncomplicated point-to-point configuration as shown in Figure 8. This configuration provides a clean signaling environment for the fast edge rates of the drivers. The receiver is connected to the driver through a balanced media which may be a standard twisted pair cable, a parallel pair cable, or simply PCB traces. Typically the characteristic impedance of the media is in the range of 100 . 9.1.1 Probing LVDS Transmission Lines Always use high impedance (>100 k), low capacitance (<2 pF) scope probes with a wide bandwidth (1 GHz) scope. Improper probing gives deceiving results. 9.1.2 Cables and Connectors, General Comments When choosing cable and connectors for LVDS it is important to remember: * Use controlled impedance media. The cables and connectors you use must have a matched differential impedance of about 100 . They must not introduce major impedance discontinuities. * Balanced cables (that is, twisted pair) are usually better than unbalanced cables (such as ribbon cable or simple coax) for noise reduction and signal quality. Balanced cables tend to generate less EMI due to field canceling effects and also tend to pick up electromagnetic radiation as common-mode (not differential mode) noise which is rejected by the receiver. For cable distances <0.5 m, most cables can be made to work effectively. For distances 0.5 m d 10 m, Category 3 (CAT 3) twisted pair cable works well, is readily available, and relatively inexpensive. 9.2 Typical Application ENABLE 1/4 DS90LV032 DATA INPUT RT 100Y + DATA OUTPUT 1/4 DS90LV031 Copyright (c) 2016, Texas Instruments Incorporated Figure 8. Balanced System Point-to-Point Application 9.2.1 Design Requirements When using LVDS devices, it is important to remember to specify controlled impedance PCB traces, cable assemblies, and connectors. All components of the transmission media must have a matched differential impedance of about 100 . They must not introduce major impedance discontinuities. Balanced cables (for example, twisted pair) are usually better than unbalanced cables (ribbon cable) for noise reduction and signal quality. Balanced cables tend to generate less EMI due to field canceling effects and also tend to pick up electromagnetic radiation as common-mode (not differential mode) noise which is rejected by the LVDS receiver. For cable distances < 0.5 m, most cables work effectively. For distances 0.5 m d 10 m, Category 5 (CAT5) twisted pair cable works well, is readily available, and relatively inexpensive. 12 Submit Documentation Feedback Copyright (c) 1999-2016, Texas Instruments Incorporated Product Folder Links: DS90LV032A DS90LV032A www.ti.com SNLS011D - JULY 1999 - REVISED AUGUST 2016 Typical Application (continued) 9.2.2 Detailed Design Procedure 9.2.2.1 Probing LVDS Transmission Lines Always use high impedance (>100 k), low capacitance (<2 pF) scope probes with a wide bandwidth (1 GHz) scope. Improper probing gives deceiving results. 9.2.3 Application Curves Figure 9. ICC vs Frequency, Four Channels Switching Figure 10. Typical Common Mode Range Variation With Respect to Amplitude of Differential Input Submit Documentation Feedback Copyright (c) 1999-2016, Texas Instruments Incorporated Product Folder Links: DS90LV032A 13 DS90LV032A SNLS011D - JULY 1999 - REVISED AUGUST 2016 www.ti.com 10 Power Supply Recommendations Although the DS90LV032A draws very little power, there is a dynamic current component which increases the overall power consumption at higher switching frequencies. The DS90LV032A power supply connection must take this additional current consumption into consideration for maximum power requirements. 11 Layout 11.1 Layout Guidelines * * * Use at least 4 PCB layers (top to bottom): LVDS signals, ground, power, and TTL signals. Isolate TTL signals from LVDS signals, otherwise the TTL may couple onto the LVDS lines. It is best to put TTL and LVDS signals on different layers which are isolated by power or ground plane(s). Keep drivers and receivers as close to the (LVDS port side) connectors as possible. 11.1.1 Power Decoupling Recommendations Bypass capacitors must be used on power pins. High-frequency ceramic (surface-mount recommended) 0.1-F in parallel with 0.01-F, in parallel with 0.001-F at the power supply pin as well as scattered capacitors over the printed-circuit board. Multiple vias must be used to connect the decoupling capacitors to the power planes. A 10F, 35-V (or greater) solid tantalum capacitor must be connected at the power entry point on the printed-circuit board. 11.1.2 Differential Traces Use controlled impedance traces which match the differential impedance of your transmission medium (that is, cable) and termination resistor. Run the differential pair trace lines as close together as possible as soon as they leave the IC (stubs must be <10 mm long). This helps eliminate reflections and ensure noise is coupled as common-mode. Lab experiments show that differential signals which are 1 mm apart radiate far less noise than traces 3 mm apart because magnetic field cancellation is much better with the closer traces. Plus, noise induced on the differential lines is much more likely to appear as common-mode which is rejected by the receiver. Match electrical lengths between traces to reduce skew. Skew between the signals of a pair means a phase difference between signals which destroys the magnetic field cancellation benefits of differential signals and results in EMI. Note the velocity of propagation, v = c/Er where c (the speed of light) = 0.2997 mm/ps or 0.0118 in/ps. Do not rely solely on the auto-route function for differential traces. Carefully review dimensions to match differential impedance and provide isolation for the differential lines. Minimize the number of vias and other discontinuities on the line. Avoid 90 turns (these cause impedance discontinuities). Use arcs or 45 bevels. Within a pair of traces, the distance between the two traces must be minimized to maintain common-mode rejection of the receivers. On the printed-circuit board, this distance must remain constant to avoid discontinuities in differential impedance. Minor violations at connection points are allowable. 11.1.3 Termination Use a resistor which best matches the differential impedance of your transmission line. The resistor must be between 90 and 130 . Remember that the current mode outputs need the termination resistor to generate the differential voltage. LVDS does not work without resistor termination. Typically, connect a single resistor across the pair at the receiver end. Surface-mount 1% to 2% resistors are best. PCB stubs, component lead, and the distance from the termination to the receiver inputs must be minimized. The distance between the termination resistor and the receiver must be <10 mm (12 mm maximum). 14 Submit Documentation Feedback Copyright (c) 1999-2016, Texas Instruments Incorporated Product Folder Links: DS90LV032A DS90LV032A www.ti.com SNLS011D - JULY 1999 - REVISED AUGUST 2016 11.2 Layout Example Decoupling Cap DS90LV032A Input Termination (Required) 1 RIN1- VCC 16 2 RIN1+ RIN4- 15 3 ROUT1 RIN4+ 14 4 EN ROUT4 13 5 ROUT2 EN* 12 6 RIN2+ ROUT3 11 7 RIN2- RIN3+ 10 8 GND RIN3- 9 Input Termination (Required) Series Termination (optional) Series Termination (optional) LVCMOS Outputs Input Termination (Required) LVCMOS Outputs Input Termination (Required) Control Signals Figure 11. DS90LV032A Layout Example Submit Documentation Feedback Copyright (c) 1999-2016, Texas Instruments Incorporated Product Folder Links: DS90LV032A 15 DS90LV032A SNLS011D - JULY 1999 - REVISED AUGUST 2016 www.ti.com 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation General application guidelines and hints for LVDS drivers and receivers may be found in the following application notes: * LVDS Owner's Manual * AN-808 Long Transmission Lines and Data Signal Quality (SNLA028) * AN-977 LVDS Signal Quality: Jitter Measurements Using Eye Patterns Test Report #1 (SNLA166) * AN-971 An Overview of LVDS Technology (SNLA165) * AN-916 A Practical Guide to Cable Selection (SNLA219) * AN-805 Calculating Power Dissipation for Differential Line Drivers (SNOA233) * AN-903 A Comparison of Differential Termination Techniques (SNLA034) * AN-1035 PCB Design Guidelines for LVDS Technology (SNOA355) 12.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.6 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 16 Submit Documentation Feedback Copyright (c) 1999-2016, Texas Instruments Incorporated Product Folder Links: DS90LV032A PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) DS90LV032ATM NRND SOIC D 16 48 Non-RoHS & Non-Green Call TI Call TI -40 to 85 DS90LV032A TM DS90LV032ATM/NOPB ACTIVE SOIC D 16 48 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DS90LV032A TM DS90LV032ATMTC NRND TSSOP PW 16 92 Non-RoHS & Non-Green Call TI Call TI -40 to 85 DS90LV 032AT DS90LV032ATMTC/NOPB ACTIVE TSSOP PW 16 92 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DS90LV 032AT DS90LV032ATMTCX/NOPB ACTIVE TSSOP PW 16 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DS90LV 032AT DS90LV032ATMX NRND SOIC D 16 2500 Non-RoHS & Non-Green Call TI Call TI -40 to 85 DS90LV032A TM DS90LV032ATMX/NOPB ACTIVE SOIC D 16 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DS90LV032A TM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device DS90LV032ATMTCX/NO PB Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TSSOP PW 16 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1 DS90LV032ATMX SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1 DS90LV032ATMX/NOPB SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TSSOP PW 16 2500 367.0 367.0 35.0 DS90LV032ATMX SOIC D 16 2500 367.0 367.0 35.0 DS90LV032ATMX/NOPB SOIC D 16 2500 367.0 367.0 35.0 DS90LV032ATMTCX/NOP B Pack Materials-Page 2 PACKAGE OUTLINE PW0016A TSSOP - 1.2 mm max height SCALE 2.500 SMALL OUTLINE PACKAGE SEATING PLANE C 6.6 TYP 6.2 A 0.1 C PIN 1 INDEX AREA 14X 0.65 16 1 2X 5.1 4.9 NOTE 3 4.55 8 9 B 0.30 0.19 0.1 C A B 16X 4.5 4.3 NOTE 4 1.2 MAX (0.15) TYP SEE DETAIL A 0.25 GAGE PLANE 0.15 0.05 0 -8 0.75 0.50 DETAIL A A 20 TYPICAL 4220204/A 02/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. www.ti.com EXAMPLE BOARD LAYOUT PW0016A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE SYMM 16X (1.5) (R0.05) TYP 1 16 16X (0.45) SYMM 14X (0.65) 8 9 (5.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK OPENING METAL UNDER SOLDER MASK METAL SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.05 MAX ALL AROUND NON-SOLDER MASK DEFINED (PREFERRED) 0.05 MIN ALL AROUND SOLDER MASK DEFINED SOLDER MASK DETAILS 15.000 4220204/A 02/2017 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN PW0016A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 16X (1.5) SYMM (R0.05) TYP 1 16X (0.45) 16 SYMM 14X (0.65) 8 9 (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4220204/A 02/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. 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