TMP122 TMP124 SBOS272B - JUNE 2003 - REVISED DECEMBER 2003 1.5C Accurate Programmable Digital Temperature Sensors with SPITM Interface FEATURES DESCRIPTION DIGITAL OUTPUT: SPI-Compatible Interface PROGRAMMABLE RESOLUTION: 9- to 12-Bits + Sign ACCURACY: 1.5C from -25C to +85C (max) 2.0C from -40C to +125C (max) LOW QUIESCENT CURRENT: 50A WIDE SUPPLY RANGE: 2.7V to 5.5V TINY SOT23-6 AND SO-8 PACKAGES OPERATION TO 150C PROGRAMMABLE HIGH/LOW SETPOINTS The TMP122 and TMP124 are SPI-compatible temperature sensors available in SOT23-6 and SO-8 packages. Requiring only a pull-up resistor for complete function, the TMP122 and TMP124 temperature sensors are capable of measuring temperatures within 2C of accuracy over a temperature range of -40C to +125C, with operation up to 150C. Programmable resolution, programmable set points and shut down function provide versatility for any application. Low supply current and a supply range from 2.7V to 5.5V make the TMP122 and TMP124 excellent candidates for lowpower applications. APPLICATIONS POWER-SUPPLY TEMPERATURE MONITORING COMPUTER PERIPHERAL THERMAL PROTECTION NOTEBOOK COMPUTERS CELL PHONES BATTERY MANAGEMENT OFFICE MACHINES THERMOSTAT CONTROLS ENVIRONMENTAL MONITORING and HVAC ELECTROMECHANICAL DEVICE TEMPERATURE The TMP122 and TMP124 are ideal for extended thermal measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications. Temperature Temperature SO/I ALERT 1 Diode Temp. Sensor Control Logic 6 GND V+ 2 3 Serial Interface 5 Config and Temp Register 4 Control Logic 8 A/D Converter Serial Interface 7 OSC Config and Temp Register V+ 2 CS CS NC OSC Diode Temp. Sensor SO/I SCK A/D Converter 1 SCK GND 3 6 4 5 NC ALERT TMP124 TMP122 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SPI is a registered trademark of Motorola. All other trademarks are the property of their respective owners. Copyright (c) 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com ELECTROSTATIC DISCHARGE SENSITIVITY ABSOLUTE MAXIMUM RATINGS(1) Power Supply, V+ .................................................................................. 7V Input Voltage(2) ....................................................................... -0.3V to 7V Input Current ..................................................................................... 10mA Operating Temperature Range ...................................... -55C to +150C Storage Temperature Range ......................................... -60C to +150C Junction Temperature (TJ Max) .................................................... +150C Lead Temperature (soldering) ....................................................... +300C This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. NOTES: (1) Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. (2) Input voltage rating applies to all TMP122 and TMP124 input voltages. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR(1) SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY SOT23-6 DBV -40C to +125C T122 " " " " SO-8 D -40C to +125C T124 " " " " TMP122AIDBVT TMP122AIDBVR TMP124AID TMP124AIDR Tape and Reel, 250 Tape and Reel, 3000 Rails, 100 Tape and Reel, 2500 TMP122 " TMP124 " NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com. PIN CONFIGURATIONS Top View SOT23-6 GND 2 V+ 3 6 SO/I 5 CS 4 SCK SO-8 SI/O 1 SC 2 NC 3 GND 4 T124 1 T122 ALERT Top View 8 V+ 7 CS 6 NC 5 ALERT TMP122 TMP124 NC = No Connection 2 TMP122, TMP124 www.ti.com SBOS272B ELECTRICAL CHARACTERISTICS At TA = -40C to +125C, and V+ = 2.7V to 5.5V, unless otherwise noted. TMP122, TMP124 PARAMETER CONDITION TEMPERATURE INPUT Range Accuracy (Temperature Error) -0.3 Selectable DIGITAL INPUT/OUTPUT Input Logic Levels: VIH VIL Input Current, SO/I, SCK, CS Output Logic Levels: VOL SO/I VOH SO/I VOL ALERT Leakage Current ALERT Input Capacitance, SO/I, SCK, CS, ALERT Resolution Conversion Time TEMPERATURE RANGE Specified Range Operating Range Storage Range Thermal Resistance, JA TYP -40 -25C to +85C -40C to +125C -55C to +150C vs Supply Resolution(1) POWER SUPPLY Operating Range Quiescent Current Shutdown Current MIN 0.5 1.0 1.5 0.1 0.0625 MAX UNITS +125 1.5 2.0 C C C C C/V C +0.3 0.7(V+) 0.3(V+) 1 0V VIN V+ ISINK = 3mA ISOURCE = 2mA ISINK = 4mA 0V VIN 6V 0.4 2.5 9 to 12 + Sign 30 60 120 240 40 80 160 320 V V V A pF Bits ms ms ms ms 50 0.1 5.5 75 1 V A A +125 +150 +150 C C C C/W C/W (V+)-0.4 0.4 1 Selectable 9-Bit + Sign 10-Bit + Sign 11-Bit + Sign 12-Bit + Sign 2.7 IQ ISD Serial Bus Inactive Serial Bus Inactive -40 -55 -60 SOT23-6 Surface-Mount SO-8 Surface-Mount V V A 200 150 NOTE: (1) Specified for 12-bit resolution. TMP122, TMP124 SBOS272B www.ti.com 3 TYPICAL CHARACTERISTICS At TA = +25C, and V+ = 5.0V, unless otherwise noted. QUIESCENT CURRENT vs TEMPERATURE SHUTDOWN CURRENT vs TEMPERATURE 70 1.0 0.9 0.8 60 0.7 0.6 ISD (A) IQ (A) V+ = 5V 50 0.5 0.4 0.3 V+ = 2.7V 0.2 40 0.1 0.0 Serial Bus Inactive -0.1 30 -60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 Temperature (C) 20 40 60 80 100 120 140 Temperature (C) TEMPERATURE ACCURACY vs TEMPERATURE CONVERSION TIME vs TEMPERATURE 2.0 400 300 Temperature Error (C) Conversion Time (ms) 1.5 V+ = 5V 200 V+ = 2.7V 1.0 0.5 0.0 -0.5 -1.0 -1.5 3 typical units 12-bit resolution. 12-bit resolution. -2.0 100 -60 -40 -20 0 20 40 60 80 100 -60 -40 -20 120 140 4 0 20 40 60 80 100 120 140 160 Temperature (C) Temperature (C) TMP122, TMP124 www.ti.com SBOS272B APPLICATIONS INFORMATION COMMUNICATING WITH THE TMP122 The TMP122/TMP124 converts continuously. If CS is brought low during a conversion the conversion process continues, but the last completed conversion is available at the output register. Communication with the TMP122/TMP124 is initiated by pulling CS low. The first 16 clocks of data transfer will return temperature data from the temperature sensors. The 16-bit data word is clocked out sign bit first, followed by the MSB. Any portion of the 16-bit word may be read before raising CS . If the user wishes to continue with CS low, the following 16 clocks transfer in a READ or WRITE command. READ and WRITE commands are described in Tables I and II. The TMP122 and TMP124 digital temperature sensors are optimal for thermal management and thermal protection applications. The TMP122/TMP124 are SPI interface-compatible and specified for a temperature range of -40C to +125C. The TMP122/TMP124 require minimal external components for operation, needing only a pull-up resistor on the ALERT pin and a bypass capacitor on the supply. Bypass capacitors of 0.1F is recommended. Figure 1 shows typical connections for the TMP122 and TMP124. V+ V+ 0.1F 0.1F 3 SCK SO/I 8 1 4 ALERT (Output) SO/I SCK TMP122 6 5 CS 1 7 2 6 TMP124 CS NC 5 3 NC 2 GND The READ command contains an embedded address in bits D4 and D3 to identify which register to read. Bits D4 and D3 are internally registered and will hold their value following a READ command until a entire 16-bit read is completed by the user. The completion of the 16-bit READ acknowledges that the READ command has been completed. If the user issues a READ command and then raises CS with less than 16 subsequent clocks, the data from that register will be available at the next fall of CS . The registered READ address will remain in effect until a full 16 clocks have been received. After the completion of a 16-bit READ from the part, the READ address is reset to return data from the Temperature Register. A WRITE command to a register will not change the READ address registered. For further discussion on the READ address register, see the Read Address Register section. ALERT (Output) 4 NOTE: Alert requires pull-up resistor (open drain). NC indicates pin should be left open or floating. GND FIGURE 1. Typical Connections of the TMP122 and TMP124. Multiple commands may be strung together as illustrated in Figure 2. The TMP122/TMP124 accepts commands alternating with 16-bit response data. On lowering CS , the part always responds with a READ from the address location indicated by the READ address register. If the next command is a READ command then data is returned from the address specified by the READ command with the 16th clock resetting the READ address register to the default temperature register. The TMP122/TMP124 then expect a 16-bit command. If the command is a WRITE command, then the 16 clocks following the command will again return temperature data. To maintain accuracy in applications requiring air or surface temperature measurement, care should be taken to isolate the package and leads from ambient air temperature. CS 16-Bit READ SO/I 16-Bit READ COMMAND 16-Bit WRITE/ Embedded Address 16-Bit Response 16-Bit READ Figures 3, 4, 5, and 6 detail the communication sequences. FIGURE 2.Multiple Command Sequence. Read Command D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 Temperature Configuration Register 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 Low Temp Threshold 1 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 High Temp Threshold 1 0 0 0 0 0 0 0 0 0 0 1 1 0 0 0 TABLE I. Read Command. Write Command D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 Configuration Register 0 0 0 0 D1 D0 R1 R0 F1 F0 POL TM1 TM0 0 1 0 Low Temp Threshold T12 T11 T10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 1 0 0 High Temp Threshold T12 T11 T10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 1 1 0 Shutdown Command x x x x x x x x 1 1 1 1 1 1 1 1 TABLE II. Write Command. TMP122, TMP124 SBOS272B www.ti.com 5 CS CS 16-Bit READ SO/I 16-Bit WRITE/ Embedded Address ... SCK SO/I (Continued) D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 1 Z Z T12 T11 T10 T9 T8 T7 T6 T5 T4 T3 T2 T1 T0 1 0/1(1) 0 CS ... SCK SO/I NOTE: (1) 0 indicates TLOW register, 1 indicates THIGH register. FIGURE 3. READ followed by WRITE COMMAND to TLOW/THIGH Register. CS CS 16-Bit READ SO/I SCK 16-Bit WRITE/ Embedded Address ... SO/I (Continued) ... D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 1 Z Z 0 0 0 0 D1 D0 R1 R0 F1 F0 POL TM1 TM0 0 1 0 CS SCK SO/I FIGURE 4. READ followed by WRITE COMMAND to Configuration Register. CS CS 16-Bit READ SO/I 16-Bit READ COMMAND 16-Bit Response ... SCK SO/I (Continued) ... D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 1 Z Z CS ... SCK SO/I (Continued) ... 1 0 0 0 0 0 0 0 0 0 0 P1 P0 0 0 0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 1 Z Z D3 1 CS SCK SO/I FIGURE 5. READ followed by READ COMMAND and Response. CS CS SO/I 16-Bit READ SCK SO/I D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 Z Z FIGURE 6. Data READ. 6 TMP122, TMP124 www.ti.com SBOS272B READ ADDRESS REGISTER Figure 7 shows the internal register structure of the TMP122/TMP124. Table III describes the addresses of the registers available. The READ address register uses the two bits to identify which of the data registers should respond to a read command. Following a complete 16-bit read, the READ address register is reset to the default power-up state of P1/P0 equal 0/0. D15 D14 D13 D12 D11 D10 D9 D8 T12 T11 T10 T9 T8 T7 T6 T5 D7 D6 D5 D4 D3 D2 D1 D0 T4 T3 T2 T1 T0 1 Z Z TABLE IV. Temperature Register. 150 125 25 0.0625 0 -0.0625 -25 -55 READ Address Register Temperature Register CS 0100 0011 0000 0000 0000 1111 1111 1110 1011 1110 1100 0000 0000 1111 0011 0100 0000 1000 1000 0000 0000 1111 1000 1000 HEX 0111 0111 0111 1111 0111 1111 0111 0111 4B07 3E87 0C87 000F 0007 FFFF F387 E487 NOTE: (1) The last 2 bits are high impedance and are shown as 11 in the table. SCK Configuration Register DIGITAL OUTPUT(1) (BINARY) TEMPERATURE (C) TABLE V. Temperature Data Format. I/O Control Interface TLOW Register The user can obtain 9, 10, 11, or 12 bits of resolution by addressing the Configuration Register and setting the resolution bits accordingly. For 9-, 10-, or 11-bit resolution, the most significant bits in the Temperature Register are used with the unused LSBs set to zero. SO/I THIGH Register CONFIGURATION REGISTER FIGURE 7. Internal Register Structure of the TMP122 and TMP124. P1 P0 0 0 1 1 0 1 0 1 REGISTER Temperature Register (READ Only) Configuration Register (READ/WRITE) TLOW Register (READ/WRITE) THIGH Register (READ/WRITE) TABLE III. Pointer Addresses of the TMP122 and TMP124 Registers. The Configuration Register is a 16-bit read/write register used to store bits that control the operational modes of the temperature sensor. Read/write operations are performed MSB first. The format of the Configuration Register for the TMP122/TMP124 is shown in Table VI, followed by a breakdown of the register bits. The power-up/reset value of the Configuration Register bits R1/R0 equal 1/1, all other bits equal zero. D15 D14 D13 D12 D11 D10 D9 D8 0 0 0 0 D1 D0 R1 R0 D7 D6 D5 D4 D3 D2 D1 D0 F1 F0 POL TM1 TM0 0 1 0 TEMPERATURE REGISTER The Temperature Register of the TMP122/TMP124 is a 16bit, signed read-only register that stores the output of the most recent conversion. The TMP122/TMP124 are specified for the temperature range of -40C to +125C with operation from -55C to +150C. Up to 16 bits can be read to obtain data and are described in Table IV. The first 13 bits are used to indicate temperature where bit D2 is 1, and D1, D0 are in a high impedance state. Data format for temperature is summarized in Table V. Following power-up or reset, the Temperature Register will read 0C until the first conversion is complete. TABLE VI. Configuration Register. SHUTDOWN MODE (SD) The Shutdown Mode of the TMP122/TMP124 can be used to shut down all device circuitry except the serial interface. Shutdown mode occurs when the last 8 bits of the WRITE command are equal to 1, and will occur once the current conversion is completed, reducing current consumption to less than 1A. To take the part out of shutdown, send any command or pattern after the 16-bit read with the last 8 bits not equal to one. Power on default is in active mode. TMP122, TMP124 SBOS272B www.ti.com 7 THERMOSTAT MODE (TM1/TM0) HIGH AND LOW LIMIT REGISTERS The Thermostat Mode bits of the TMP122/TMP124 indicate to the device whether to operate in Comparator Mode, Interrupt Mode or Interrupt Comparator Mode. For more information on Comparator and Interrupt Mode, see text HIGH and LOW limit registers. The bit assignments for thermostat mode are described in Table VII. Power on default is comparator mode. In Comparator Mode (TM1/TM0 = 0/0), the ALERT Pin of the TMP122/TMP124 becomes active when the temperature equals or exceeds the value in THIGH and generates a consecutive number of faults according to fault bits F1 and F0. The ALERT pin will remain active until the temperature falls below the indicated TLOW value for the same number of faults. TM1 TM0 MODE OF OPERATION 0 0 1 1 0 1 0 1 Comparator Mode Interrupt Mode Interrupt Comparator Mode -- TABLE VII. Mode Settings of the TMP122. POLARITY (POL) The Polarity Bit of the TMP122/TMP124 adjusts the polarity of the ALERT pin output. By default, POL = 0 and the ALERT pin will be active LOW, as shown in Figure 8. For POL = 1 the ALERT Pin will be active HIGH, and the state of the ALERT Pin is inverted. THIGH Measured Temperature TLOW In Interrupt Mode (TM1/TM0 = 0/1) the ALERT pin becomes active when the temperature equals or exceeds THIGH for a consecutive number of fault conditions. The ALERT pin remains active until a read operation of any register occurs. The ALERT pin will also be cleared if the device is placed in Shutdown Mode. Once the ALERT pin is cleared, it will only become active again by the temperature falling below TLOW. When the temperature falls below TLOW, the ALERT pin becomes active and remains active until cleared by a read operation of any register. Once the ALERT pin is cleared, the above cycle will repeat with the ALERT pin becoming active when the temperature equals or exceeds THIGH. In Interrupt/Comparator Mode (TM1/TM0 = 1/0), the ALERT Pin of the TMP122/TMP124 becomes active when the temperature equals or exceeds the value in THIGH and generates a consecutive number of faults according to fault bits F1 and F0. The ALERT pin will remain active until the temperature falls below the indicated TLOW value for the same number of faults and a communication with the device has occurred after that point. Operational modes are represented in Figure 8. Tables IX and X describe the format for the THIGH and TLOW registers. Power-up reset values for THIGH and TLOW are: THIGH = 80C and TLOW = 75C. The format of the data for THIGH and TLOW is the same as for the Temperature Register. TMP122/124 ALERT PIN (Comparator Mode) POL = 0 TMP122/124 ALERT PIN (Interrupt Mode) POL = 0 All 13 bits for the Temperature, THIGH, and TLOW registers are used in the comparisons for the ALERT function for all converter resolutions. The three LSBs in T HIGH and TLOW can affect the ALERT output even if the converter is configured for 9-bit resolution. TMP122/124 ALERT PIN (Interrupt/Comparator Mode) POL = 0 Read Read Read Time FIGURE 8. ALERT Output Transfer Function Diagrams. D15 D14 D13 D12 D11 D10 D9 D8 H12 H11 H10 H9 H8 H7 H6 H5 D7 D6 D5 D4 D3 D2 D1 D0 H4 H3 H2 H1 H0 1 1 0 FAULT QUEUE (F1/F0) A fault condition occurs when the measured temperature exceeds the limits set in the THIGH and TLOW registers. The Fault Queue is provided to prevent a false alert due to environmental noise and requires consecutive fault measurements to trigger the alert function of the TMP122/TMP124. Table VIII defines the number of consecutive faults required to trigger a consecutive alert condition. Power-on default for F1/F0 is 0/0. F1 F0 CONSECUTIVE FAULTS 0 0 1 1 0 1 0 1 1 2 4 6 TABLE IX. THIGH Register. D15 D14 D13 D12 D11 D10 D9 D8 L12 L11 L10 L9 L8 L7 L6 L5 D7 D6 D5 D4 D3 D2 D1 D0 L4 L3 L2 L1 L0 1 0 0 TABLE X. TLOW Register. TABLE VIII. Fault Settings of the TMP122 and TMP124. 8 TMP122, TMP124 www.ti.com SBOS272B CONVERTER RESOLUTION (R1/R0) The Converter Resolution Bits control the resolution of the internal Analog-to-Digital (A/D) converter. This allows the user to maximize efficiency by programming for higher resolution or faster conversion time. Table XI identifies the Resolution Bits and the relationship between resolution and conversion time. The TMP122/TMP124 have a default resolution of 12 bits. R1 R0 RESOLUTION CONVERSION TIME (typical) 0 0 1 1 0 1 0 1 9 Bits (0.5C) plus sign 10 Bits (0.25C) plus sign 11 Bits (0.125C) plus sign 12 Bits (0.0625C) plus sign 30ms 60ms 120ms 240ms D1 D0 CONVERSION TIME CONVERSION PERIOD 0 0 1 1 0 1 0 1 0.25s 0.25s 0.25s 0.25s 0.25s 0.5s 1s 8s TABLE XII. Conversion Delay for 12-Bit Resolution. 0.5s 0.25s 50A (active) D1/D0 = 0/1 20A (idle) 1s 0.25s D1/D0 = 1/0 TABLE XI. Resolution of the TMP122 and TMP124. 0.25s 8s D1/D0 = 1/1 DELAY TIME The Delay Bits control the amount of time delay between each conversion. This feature allows the user to maximize power savings by eliminating unnecessary conversions, and minimizing current consumption. During active conversion the TMP122/ TMP124 typically requires 50A of current for approximately 0.25s conversion time, and approximately 20A for idle times between conversions. Delay settings are identified in Table XII as conversion time and period, and are shown in Figure 9. Default power up is D1/D0 equal 0/0. Conversion time and conversion periods scale with resolution. Conversion period denotes time between conversion starts. 12-Bit Resolution FIGURE 9. Conversion Time and Period Description. Timing Diagrams The TMP122/TMP124 are SPI compatible. Figures 10 to 12 describe the various timing parameters of the TMP122/ TMP124 with timing definitions in Table XIII. PARAMETER MIN MAX UNITS SCK Period t1 100 ns Data In to Rising Edge SCK Setup Time t2 20 ns SCK Falling Edge to Output Data Delay t3 SCK Rising Edge to Input Data Hold Time t4 20 CS to Rising Edge SCK Set-Up Time t5 40 CS to Output Data Delay t6 30 ns CS Rising Edge to Output High Impedance t7 30 ns 30 ns ns ns TABLE XIII. Timing Description. TMP122, TMP124 SBOS272B www.ti.com 9 SCK t5 t1 t3 CS t6 SO/I FIGURE 10. Output Data Timing Diagram. SCK SCK CS CS SO/I SO/I t7 t7 FIGURE 11. High Impedance Output Timing Diagram. SCK SCK t2 t2 t4 t4 CS CS SO/I SO/I FIGURE 12. Input Data Timing Diagram. 10 TMP122, TMP124 www.ti.com SBOS272B PACKAGE OPTION ADDENDUM www.ti.com 25-Oct-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TMP122AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples TMP122AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Purchase Samples TMP122AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples TMP122AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples TMP124AID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TMP124AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TMP124AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples TMP124AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 25-Oct-2010 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TMP122 : * Enhanced Product: TMP122-EP NOTE: Qualified Version Definitions: * Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 8-Jul-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TMP122AIDBVR SOT-23 DBV 6 3000 178.0 9.0 TMP122AIDBVT SOT-23 DBV 6 250 178.0 9.0 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 3.23 3.17 1.37 4.0 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 8-Jul-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP122AIDBVR SOT-23 DBV 6 3000 180.0 180.0 18.0 TMP122AIDBVT SOT-23 DBV 6 250 180.0 180.0 18.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated