Data brief
For further information contact your local STMicroelectronics sales office.
November 2009 Doc ID 16217 Rev 2 1/9
9
ST7590
Narrow-band OFDM power line networking
PRIME compliant system-on-chip
Features
■Fully integrated narrow-band power line
networking system on chip
■High performing DSP engine with embedded
turnkey firmware featuring:
– OFDM modulation:
– 97 sub-carriers in CENELEC A band
– BPSK, QPSK, 8PSK differential
programmable modulation
– Programmable baud up to 128 kbps
– Convolutional coding and Viterbi decoding
– Signal to noise ratio and channel quality
estimation
– Full PRIME compliant PHY
■Programmable 8051 protocol engine with
embedded PRIME compliant MAC and IEC
61334-4-32 data link layer
■On chip peripherals:
– Host controller UART/SPI interface
– I2C/SPI external data memory interface
– High speed SRAM controller for optional
external SRAM program code execution
– Watchdog timer
– 3 programmable 16 bit timers
– Up to 10 lines GPIO
– JTAG debugging
■On chip 128-bit AES encryption HW block
■Fully integrated analog front end:
– ADC and DAC
– High sensitivity receiver
– High linearity transmitter with intelligent
gain control
■Fully integrated single-ended power amplifier
for line driving
– Up to 1 A rms, 14 Vpp single ended
– Configurable active filtering topology
– Very high linearity
– Embedded temperature sensor
– Current control feature
■3.3 V or 5V I/O digital I/O supply
■8 V to 18 V power amplifier supply
■Integrated 5 V and 1.8 V linear regulators for
AFE and digital core supply
■Suitable for applications compliant with
EN50065 and FCC part 15 specifications
■-40 °C to +80 °C temperature range
■QFN48 7x7 and TQFP 100 14x14 exposed pad
package options
Applications
PRIME compliant smart metering and smart grids
applications
Description
Made using a multi-power technology with state-
of-the-art VLSI CMOS lithography, the ST7590 is
based on dual core architecture to guarantee
outstanding communication performance with a
very high level of flexibility and programmability
for either open standard or fully customized
implementations.
QFN-48
(7 x 7 mm)
41&0
www.st.com
Device description ST7590
2/9 Doc ID 16217 Rev 2
1 Device description
The ST7590 comes with FW implementing PRIME(a) compliant PHY and MAC layers and
IEC 61334-4-32 data link layer, mainly developed for smart metering and smart grid
applications.
An HW 128-bit AES encryption block with turnkey management is available on chip when
secure communication is requested.
The on chip analog front end featuring AD and DA conversion, automatic gain control and
embedding a power line driver delivering up to 1 A rms output current, make the ST7590 a
unique single chip SoC for power line communication. Line coupling network design is also
extremely simplified leading to a very low cost BOM.
Safe and performing operations are guaranteed while keeping power consumption and
distortion levels very low.
a. Power-line intelligent metering evolution (open protocol specification)
ST7590 Block diagram and pin connection
Doc ID 16217 Rev 2 3/9
2 Block diagram and pin connection
Figure 1. ST7590 block diagram
Figure 2. ST7590 pin connection
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Package mechanical data ST7590
4/9 Doc ID 16217 Rev 2
3 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Table 1. TQFP 100 package mechanical data
Dim.
(mm)
Min. Typ. Max.
A 1.6
A1 0.05 0.15
A2 1.35 1.4 1.45
B 0.17 0.22 0.27
C 0.09 0.2
D 16
D1 14
D3 12
e 0.5
E 16
E1 14
E3 12
H 9.85
L 0.45 0.6 0.75
L1 1
S 8.8
S1 8.8
K 0° (min.), 3.5° (typ.), 7°(max.)
ccc 0.08
ST7590 Package mechanical data
Doc ID 16217 Rev 2 5/9
Figure 3. TQFP 100 package outline
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Package mechanical data ST7590
6/9 Doc ID 16217 Rev 2
Table 2. QFN-48 (7 x 7 mm) package mechanical data
Dim.
(mm)
Min. Typ. Max.
A 0.80 0.90 1.00
A1 0.02 0.05
A2 0.65 1.00
A3 0.25
b 0.18 0.23 0.30
D 6.85 7.00 7.15
D2 2.25 4.70 5.25
E 6.85 7.00 7.15
E2 2.25 4.70 5.25
e 0.45 0.50 0.55
L 0.30 0.40 0.50
ddd 0.08
ST7590 Package mechanical data
Doc ID 16217 Rev 2 7/9
Figure 4. QFN-48 (7 x 7 mm) package outline
Revision history ST7590
8/9 Doc ID 16217 Rev 2
4 Revision history
Table 3. Document revision history
Date Revision Changes
29-Sep-2009 1 Initial release.
16-Nov-2009 2 Added TQFP 100 mechanical data
ST7590
Doc ID 16217 Rev 2 9/9
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