1
FEATURES
Seemechanicaldrawingsfordimensions.
DBVPACKAGE
(TOP VIEW)
DCKPACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOMVIEW)
2
GND VCC
5
34
2A 2Y
6
1
1A 1Y
34
2A
2
GND
2Y
5
1
1A
VCC
61Y
2
GND VCC
1
5
1A
2A 4
32Y
61Y
DESCRIPTION/ORDERING INFORMATION
SN74LVC2G07
www.ti.com
....................................................................................................................................................... SCES308H AUGUST 2001 REVISED JUNE 2008
DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
2
Available in the Texas Instruments NanoFree™ Typical V
OHV
(Output V
OH
Undershoot)Package >2 V at V
CC
= 3.3 V, T
A
= 25 ° CSupports 5-V V
CC
Operation I
off
Supports Partial-Power-Down ModeOperationInputs and Open-Drain Outputs AcceptVoltages up to 5.5 V Latch-Up Performance Exceeds 100 mA PerJESD 78, Class IIMax t
pd
of 3.7 ns at 3.3 V
ESD Protection Exceeds JESD 22Low Power Consumption, 10- µA Max I
CC
2000-V Human-Body Model (A114-A)± 24-mA Output Drive at 3.3 V
200-V Machine Model (A115-A)Typical V
OLP
(Output Ground Bounce)< 0.8 V at V
CC
= 3.3 V, T
A
= 25 ° C 1000-V Charged-Device Model (C101)
This dual buffer/driver is designed for 1.65-V to 5.5-V V
CC
operation. The output of the SN74LVC2G07 is opendrain and can be connected to other open-drain outputs to implement active-low wired-OR or active-highwired-AND functions. The maximum sink current is 32 mA.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as thepackage.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
LOGIC DIAGRAM (POSITIVE LOGIC)
1A 1Y
1 6
2A 2Y
3 4
ABSOLUTE MAXIMUM RATINGS
(1)
SN74LVC2G07
SCES308H AUGUST 2001 REVISED JUNE 2008 .......................................................................................................................................................
www.ti.com
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoFree™ WCSP (DSBGA)
Reel of 3000 SN74LVC2G07YZPR _ _ _CV_0.23-mm Large Bump YZP (Pb-free)SOT (SOT-23) DBV Reel of 3000 SN74LVC2G07DBVR C07_ 40 ° C to 85 ° C
Reel of 3000 SN74LVC2G07DCKRSOT (SC-70) DCK CV_Reel of 250 SN74LVC2G07DCKT
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com .(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .(3) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one followingcharacter to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
FUNCTION TABLE(EACH BUFFER/DRIVER)
INPUT OUTPUTA Y
L LH Z
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range 0.5 6.5 VV
I
Input voltage range
(2)
0.5 6.5 VV
O
Voltage range applied to any output in the high-impedance or power-off state
(2)
0.5 6.5 VV
O
Voltage range applied to any output in the high or low state
(2) (3)
0.5 6.5 VI
IK
Input clamp current V
I
< 0 50 mAI
OK
Output clamp current V
O
< 0 50 mAI
O
Continuous output current ± 50 mAContinuous current through V
CC
or GND ± 100 mADBV package 165θ
JA
Package thermal impedance
(4)
DCK package 259 ° C/WYZP package 123T
stg
Storage temperature range 65 150 ° C
(1) Stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operatingconditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.(3) The value of V
CC
is provided in the recommended operating conditions table.(4) The package thermal impedance is calculated in accordance with JESD 51-7.
2Submit Documentation Feedback Copyright © 2001 2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC2G07
RECOMMENDED OPERATING CONDITIONS
(1)
ELECTRICAL CHARACTERISTICS
SN74LVC2G07
www.ti.com
....................................................................................................................................................... SCES308H AUGUST 2001 REVISED JUNE 2008
MIN MAX UNIT
Operating 1.65 5.5V
CC
Supply voltage VData retention only 1.5V
CC
= 1.65 V to 1.95 V 0.65 × V
CC
V
CC
= 2.3 V to 2.7 V 1.7V
IH
High-level input voltage VV
CC
= 3 V to 3.6 V 2V
CC
= 4.5 V to 5.5 V 0.7 × V
CC
V
CC
= 1.65 V to 1.95 V 0.35 × V
CC
V
CC
= 2.3 V to 2.7 V 0.7V
IL
Low-level input voltage VV
CC
= 3 V to 3.6 V 0.8V
CC
= 4.5 V to 5.5 V 0.3 × V
CC
V
I
Input voltage 0 5.5 VV
O
Output voltage 0 5.5 VV
CC
= 1.65 V 4V
CC
= 2.3 V 8I
OL
Low-level output current 16 mAV
CC
= 3 V
24V
CC
= 4.5 V 32V
CC
= 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20
Δt/ Δv Input transition rise or fall rate V
CC
= 3.3 V ± 0.3 V 10 ns/VV
CC
= 5 V ± 0.5 V 5T
A
Operating free-air temperature 40 85 ° C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS V
CC
MIN TYP
(1)
MAX UNIT
I
OL
= 100 µA 1.65 V to 5.5 V 0.1I
OL
= 4 mA 1.65 V 0.45I
OL
= 8 mA 2.3 V 0.3V
OL
VI
OL
= 16 mA 0.43 VI
OL
= 24 mA 0.55I
OL
= 32 mA 4.5 V 0.55I
I
A inputs V
I
= 5.5 V or GND 0 to 5.5 V ± 5 µAI
off
V
I
or V
O
= 5.5 V 0 ± 10 µAI
CC
V
I
= 5.5 V or GND, I
O
= 0 1.65 V to 5.5 V 10 µA
ΔI
CC
One input at V
CC
0.6 V, Other inputs at V
CC
or GND 3 V to 5.5 V 500 µAC
I
V
I
= V
CC
or GND 3.3 V 3.5 pF
(1) All typical values are at V
CC
= 3.3 V, T
A
= 25 ° C.
Copyright © 2001 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): SN74LVC2G07
SWITCHING CHARACTERISTICS
OPERATING CHARACTERISTICS
SN74LVC2G07
SCES308H AUGUST 2001 REVISED JUNE 2008 .......................................................................................................................................................
www.ti.com
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 )
V
CC
= 1.8 V V
CC
= 2.5 V V
CC
= 3.3 V V
CC
= 5 VFROM TO
± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 VPARAMETER UNIT(INPUT) (OUTPUT)
MIN MAX MIN MAX MIN MAX MIN MAX
t
pd
A Y 1.5 8.6 1 4.4 1 3.7 1 2.9 ns
T
A
= 25 ° C
V
CC
= 1.8 V V
CC
= 2.5 V V
CC
= 3.3 V V
CC
= 5 VPARAMETER TEST CONDITIONS UNITTYP TYP TYP TYP
C
pd
Power dissipation capacitance f = 10 MHz 3 3 4 4 pF
4Submit Documentation Feedback Copyright © 2001 2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC2G07
PARAMETER MEASUREMENT INFORMATION
th
tsu
From Output
UnderTestC
(see Note A)
L
LOAD CIRCUIT
S1 VLOAD
Open
GND
RL
Data Input
Timing Input 0V
0V
0V
tW
Input
0V
Input
Output
Waveform 1
S1 atV
(see Note B)
LOAD
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
0V
0V
Output
Output
TEST S1
Output
Control
VM
VMVM
VM
VM
1.8V 0.15 V±
2.5V 0.2 V±
3.3V 0.3 V±
5V 0.5 V±
1 k
500
500
500
VCC RL
2 ×VCC
2 ×VCC
6V
2 ×VCC
VLOAD CL
30 pF
30 pF
50 pF
50 pF
0.15V
0.15V
0.3V
0.3V
V
3V
VI
VCC/2
VCC/2
1.5V
VCC/2
VM
2 ns
2 ns
2.5 ns
2.5 ns
INPUTS
RL
t/t
r f
VCC
VCC
VCC
t (see Notes E and F)
PZL VLOAD
VOLTAGE WAVEFORMS
ENABLE AND DISABLETIMES
LOW- AND HIGH-LEVEL ENABLING
VOLTAGE WAVEFORMS
PROPAGATION DELAYTIMES
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. C includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators have the following characteristics: PRR 10 MHz, Z = 50 .
D. The outputs are measured one at a time, with one transition per measurement.
L
O
E. Because this device has open-drain outputs, t and t are the same as t .
F. t is measured at V .
G. t is measured at V + V .
H. All parameters and waveforms are not applicable to all devices.
PLZ PZL PD
PZL M
PLZ OL
VOLTAGE WAVEFORMS
PULSE DURATION VOLTAGE WAVEFORMS
SETUP AND HOLDTIMES
VI
VI
VI
VM
VM
V /2
LOAD
tPZL tPLZ
tPHZ
tPZH
V V
OH
V +V
OL
VM
VMVM
VM
VOL
VOH
VI
VI
VOH
VOL
VM
VM
VM
VM
tPLH tPHL
tPLH
tPHL
t (see Notes E and G)
PLZ VLOAD
t /t
PHZ PZH VLOAD
SN74LVC2G07
www.ti.com
....................................................................................................................................................... SCES308H AUGUST 2001 REVISED JUNE 2008
(OPEN DRAIN)
Figure 1. Load Circuit and Voltage Waveforms
Copyright © 2001 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): SN74LVC2G07
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74LVC2G07DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DBVRE4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DCKRE4 ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DCKT ACTIVE SC70 DCK 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DCKTE4 ACTIVE SC70 DCK 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07YEPR OBSOLETE WCSP YEP 6 TBD Call TI Call TI
SN74LVC2G07YZPR ACTIVE DSBGA YZP 6 3000 Green (RoHS &
no Sb/Br) SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 2-Mar-2009
Addendum-Page 1
OTHER QUALIFIED VERSIONS OF SN74LVC2G07 :
Enhanced Product: SN74LVC2G07-EP
NOTE: Qualified Version Definitions:
Enhanced Product - Supports Defense, Aerospace and Medical Applications
PACKAGE OPTION ADDENDUM
www.ti.com 2-Mar-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LVC2G07DBVR SOT-23 DBV 6 3000 180.0 9.2 3.23 3.17 1.37 4.0 8.0 Q3
SN74LVC2G07DBVR SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
SN74LVC2G07DCKR SC70 DCK 6 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
SN74LVC2G07DCKR SC70 DCK 6 3000 180.0 9.2 2.24 2.34 1.22 4.0 8.0 Q3
SN74LVC2G07DCKT SC70 DCK 6 250 180.0 9.2 2.24 2.34 1.22 4.0 8.0 Q3
SN74LVC2G07DCKT SC70 DCK 6 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
SN74LVC2G07YZPR DSBGA YZP 6 3000 180.0 8.4 1.02 1.52 0.63 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Sep-2009
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVC2G07DBVR SOT-23 DBV 6 3000 205.0 200.0 33.0
SN74LVC2G07DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0
SN74LVC2G07DCKR SC70 DCK 6 3000 180.0 180.0 18.0
SN74LVC2G07DCKR SC70 DCK 6 3000 205.0 200.0 33.0
SN74LVC2G07DCKT SC70 DCK 6 250 205.0 200.0 33.0
SN74LVC2G07DCKT SC70 DCK 6 250 180.0 180.0 18.0
SN74LVC2G07YZPR DSBGA YZP 6 3000 220.0 220.0 34.0
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Sep-2009
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDLP® Products www.dlp.com Broadband www.ti.com/broadbandDSP dsp.ti.com Digital Control www.ti.com/digitalcontrolClocks and Timers www.ti.com/clocks Medical www.ti.com/medicalInterface interface.ti.com Military www.ti.com/militaryLogic logic.ti.com Optical Networking www.ti.com/opticalnetworkPower Mgmt power.ti.com Security www.ti.com/securityMicrocontrollers microcontroller.ti.com Telephony www.ti.com/telephonyRFID www.ti-rfid.com Video & Imaging www.ti.com/videoRF/IF and ZigBee® Solutions www.ti.com/lprf Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2009, Texas Instruments Incorporated