SL04 www.vishay.com Vishay Semiconductors Schottky Rectifier Surface Mount FEATURES eSMP(R) Series * For surface mounted applications Available * Low-profile package * Ideal for automated placement 2 1 23020 * Low power loss, high efficiency * Meets MSL level 1, per LF maximum peak of 260 C J-STD-020, * Meets JESD 201 class 2 whisker test * Wave and reflow solderable 23019 SMF (DO-219AB) * AEC-Q101 qualified available LINKS TO ADDITIONAL RESOURCES 3D 3D * Base P/N-E3 - RoHS-compliant, and commercial grade * Base P/N-HE3 - RoHS-compliant, and AEC-Q101 qualified * Compatible to SOD-123W package case outline or SOD-123F and SOD-123FL 3D Models * Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 MECHANICAL DATA Case: SMF (DO-219AB) Polarity: color band denotes cathode end Weight: approx. 15 mg Packaging codes / options: 18/10K per 13" reel (8 mm tape), MOQ = 50K 08/3K per 7" reel (8 mm tape), MOQ = 30K TYPICAL APPLICATIONS For use in high frequency inverters, freewheeling, DC/DC converters, and polarity protection in commercial, industrial, and automotive applications. Circuit configuration: single PARTS TABLE PART ORDERING CODE MARKING REMARKS SL04 SL04-E3-18 or SL04-E3-08 SL04-HE3-18 or SL04-HE3-08 S4 Tape and reel ABSOLUTE MAXIMUM RATINGS (Tamb = 25 C, unless otherwise specified) PARAMETER SYMBOL VALUE Maximum repetitive peak reverse voltage TEST CONDITION VRRM 40 UNIT V Maximum average forward rectified current (fig. 4) IF(AV) 1.1 A Peak forward surge current 8.3 ms single half sine-wave TJ(init) = 25 C IFSM 40 A THERMAL CHARACTERISTICS (Tamb = 25 C, unless otherwise specified) PARAMETER SYMBOL VALUE UNIT Thermal resistance junction to lead TEST CONDITION RthJL 22 K/W Thermal resistance junction to ambient air (1) RthJA 180 K/W Junction temperature in DC forward current without reverse bias Storage temperature range Tj 175 C Tstg -55 to +175 C Note (1) Mounted on epoxy substrate with 3 mm x 3 mm Cu pads ( 40 m thick) Rev. 1.6, 27-Apr-2020 Document Number: 85942 1 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SL04 www.vishay.com Vishay Semiconductors ELECTRICAL CHARACTERISTICS (Tamb = 25 C, unless otherwise specified) PARAMETER TEST CONDITIONS IF = 0.5 A IF = 1.1 A IF = 0.5 A Instantaneous forward voltage IF = 1.1 A IF = 0.5 A IF = 1.1 A SYMBOL TYP. MAX. 0.41 0.47 TJ = 25 C VF (1) TJ = 100 C TJ = 125 C TJ = 25 C Reverse current VR = 40 V TJ = 100 C IR TJ = 125 C Typical junction capacitance VR = 4.0 V, 1 MHz CD 0.48 0.54 0.34 - 0.43 - 0.31 - UNIT V 0.42 - 10 20 A 1.2 2.6 mA 4.5 13 mA 65 - pF Note (1) Pulse test: 300 s pulse width, 1 % duty cycle RATINGS AND CHARACTERISTICS CURVES (Tamb = 25 C, unless otherwise specified) 1.0E+0 10 TJ at 25 C TJ at 100 C TJ at 150 C 100.0E-3 10.0E-3 IR [A] IF [A] 1 TJ at 75 C TJ at 125 C TJ at 175 C 0.1 1.0E-3 100.0E-6 typical at 25 C typical at 100 C typical at 125 C typical at 150 C 0.01 0.001 10.0E-6 1.0E-6 100.0E-9 0.00 0.20 0.40 0.60 0.80 1.00 1.20 0 10 20 30 40 VF [V] VR [V] Fig. 1 - Typical Forward Characteristics Fig. 3 - Typical Reverse Characteristics 1.2 200 180 Average Forward Current [A] f = 1 MHz 160 140 CD [pF] 120 100 80 60 40 20 1.0 0.8 0.6 0.4 RthJL = 22K/W 0.2 RthJA = 180K/W 0.0 0 0.1 1 10 100 0 25 50 75 100 125 150 VR [V] Lead Temperature (C) Fig. 2 - Typical Diode Capacitance vs. Reverse Voltage Fig. 4 - Forward Current Derating Curve 175 Rev. 1.6, 27-Apr-2020 Document Number: 85942 2 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SL04 www.vishay.com Vishay Semiconductors 1000 Transient Thermal Impedance [K/W] RthJL RthJA (Pad 3 mm x 3 mm) 100 10 1 0.001 0.01 0.1 1 10 100 1000 t - Pulse Duration [s] Fig. 5 - Typical Transient Thermal Impedance PACKAGE DIMENSIONS in millimeters (inches): SMF (DO-219AB) 0.85 (0.033) 0 (0.000) 0.1 (0.004) 5 5 0.05 (0.002) 1.7 (0.067) Detail Z enlarged 1.2 (0.047) 0.8 (0.031) 0.25 (0.010) 1.9 (0.075) 0.35 (0.014) 1.08 (0.043) 2.9 (0.114) 0.88 (0.035) 2.7 (0.106) 3.9 (0.154) 3.5 (0.138) Foot print recommendation: Created - Date: 15. February 2005 Rev. 3 - Date: 13. March 2007 Document no.:S8-V-3915.01-001 (4) 1.3 (0.051) 1.4 (0.055) 1.3 (0.051) 2.9 (0.114) 17247 Rev. 1.6, 27-Apr-2020 Document Number: 85942 3 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SL04 www.vishay.com Vishay Semiconductors ORIENTATION IN CARRIER TAPE - SMF Unreeling direction SMF cathode Top view Document no.: S8-V-3717.02-003 (4) Created - Date: 09. Feb. 2010 22670 Rev. 1.6, 27-Apr-2020 Document Number: 85942 4 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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