AP08N60I-HF Halogen-Free Product Advanced Power Electronics Corp. N-CHANNEL ENHANCEMENT MODE POWER MOSFET 100% Avalanche Test D Fast Switching Characteristic Simple Drive Requirement BVDSS 600V RDS(ON) 0.85 ID RoHS Compliant & Halogen-Free 8A G S Description AP08N60 series are specially designed as main switching devices for universal 90~265VAC off-line AC/DC converter applications. TO-220CFM type provide high blocking voltage to overcome voltage surge and sag in the toughest power system with the best combination of fast switching,ruggedized design and cost-effectiveness. G D S TO-220CFM(I) Absolute Maximum Ratings Symbol Parameter Rating Units VDS Drain-Source Voltage 600 V VGS Gate-Source Voltage +30 V ID@TC=25 Continuous Drain Current, V GS @ 10V 8 A ID@TC=100 Continuous Drain Current, V GS @ 10V 4.3 A 32 A 37 W 1 IDM Pulsed Drain Current PD@TC=25 Total Power Dissipation TSTG Storage Temperature Range -55 to 150 TJ Operating Junction Temperature Range -55 to 150 Thermal Data Symbol Parameter Value Units Rthj-c Maximum Thermal Resistance, Junction-case 3.4 /W Rthj-a Maximum Thermal Resistance, Junction-ambient 65 /W Data & specifications subject to change without notice 1 201001281 AP08N60I-HF o Electrical Characteristics@Tj=25 C(unless otherwise specified) Symbol BVDSS Parameter Test Conditions Drain-Source Breakdown Voltage Min. Typ. 600 - - V VGS=10V, ID=4A - - 0.85 VGS=0V, ID=250uA 2 Max. Units RDS(ON) Static Drain-Source On-Resistance VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 2 - 4 V gfs Forward Transconductance VDS=10V, ID=4A - 9.4 - S IDSS Drain-Source Leakage Current VDS=480V, VGS=0V - - 25 uA IGSS Gate-Source Leakage VGS=+30V, VDS=0V - - +100 nA ID=4A - 67 107.2 nC 2 Qg Total Gate Charge Qgs Gate-Source Charge VDS=480V - 9 - nC Qgd Gate-Drain ("Miller") Charge VGS=10V - 26 - nC 2 td(on) Turn-on Delay Time VDD=300V - 13 - ns tr Rise Time ID=4A - 8 - ns td(off) Turn-off Delay Time RG=3.3 - 62 - ns tf Fall Time VGS=10V - 14 - ns Ciss Input Capacitance VGS=0V - 2420 3870 pF Coss Output Capacitance VDS=30V - 150 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 12 - pF Rg Gate Resistance f=1.0MHz - 2.3 - Min. Typ. IS=4A, VGS=0V - - 1.5 V Source-Drain Diode Symbol VSD Parameter Forward On Voltage 2 2 Test Conditions Max. Units trr Reverse Recovery Time IS=4A, VGS=0V, - 430 - ns Qrr Reverse Recovery Charge dI/dt=100A/s - 6.1 - C Notes: 1.Pulse width limited by max. junction temperature. 2.Pulse test THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP08N60I-HF 8 14 o T C =25 C ID , Drain Current (A) ID , Drain Current (A) T C =150 o C 10V 6.0V 12 10 8 6 5.0V 10V 5.0V 6 4.5V 4 4 V G =4.0V 2 V G =4.0V 2 0 0 0 5 10 15 20 0 25 V DS , Drain-to-Source Voltage (V) 5 10 15 20 25 V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 3 1.2 Normalized RDS(ON) Normalized BVDSS (V) I D =4A V G =10V 1.1 1 2 1 4.3 0.9 0.8 0 -50 0 50 100 150 -50 o 0 50 100 150 o T j , Junction Temperature ( C) T j , Junction Temperature ( C ) Fig 3. Normalized BVDSS v.s. Junction Fig 4. Normalized On-Resistance Temperature v.s. Junction Temperature 100 1.4 Normalized VGS(th) (V) 1.2 IS (A) 10 T j = 150 o C T j = 25 o C 1 1 0.8 0.1 0.6 0.01 0.4 0 0.2 0.4 0.6 0.8 1 1.2 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.4 -50 0 50 100 150 T j , Junction Temperature ( o C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP08N60I-HF 12 f=1.0MHz 4000 3000 8 C (pF) VGS , Gate to Source Voltage (V) I D =4A 10 V DS =480V 6 C iss 2000 4 1000 2 C oss C rss 0 0 0 20 40 60 1 80 5 9 Q G , Total Gate Charge (nC) 13 17 21 25 29 33 37 V DS , Drain-to-Source Voltage (V) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 1 100 Normalized Thermal Response (Rthjc) Duty factor=0.5 Operation in this area limited by RDS(ON) 10 ID (A) 100us 1ms 1 10ms 100ms 1s DC 0.1 T c =25 o C Single Pulse 0.2 0.1 0.1 0.05 0.02 0.01 PDM 0.01 Single Pulse t 4.3 T Duty factor = t/T Peak Tj = PDM x Rthjc + TC 0.001 0.01 0.1 1 10 100 1000 10000 0.00001 0.0001 0.001 0.01 0.1 1 10 V DS , Drain-to-Source Voltage (V) t , Pulse Width (s) Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance VG VDS 90% QG 10V QGS QGD 10% VGS td(on) tr td(off) tf Fig 11. Switching Time Waveform Charge Q Fig 12. Gate Charge Waveform 4