ECP203 The Communications Edge TM Product Information 2 Watt, High Linearity InGaP HBT Amplifier x 10 dB Gain @ 2450 MHz x 9.5 dB Gain @ 2650 MHz x Single Positive Supply (+5V) x Available in 16pin 4mm QFN and Lead-free/green/RoHScompliant SOIC-8 packages Applications x W-LAN / Wi-Bro x RFID x DMB x Fixed Wireless The ECP203 is targeted for use as a driver amplifier in wireless infrastructure where high linearity and medium power is required. An internal active bias allows the ECP203 to maintain high linearity over temperature and operate directly off a single +5V supply. This combination makes the device an excellent candidate for driver amplifier stages in wireless-LAN, digital multimedia broadcast, or fixed wireless applications. The device can also be used in next generation RFID readers. Gnd Gnd 16 15 14 13 Vref 1 12 Gnd Gnd 2 11 RF OUT RF IN 3 10 RF OUT 9 Gnd Gnd 4 5 6 7 8 Gnd x +46 dBm Output IP3 Gnd x +32 dBm P1dB The ECP203 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve high performance for various narrowband-tuned application circuits with up to +46 dBm OIP3 and +32 dBm of compressed 1dB power. It is housed in a 16-pin 4x4mm QFN and Lead-free/ green/RoHS-compliant SOIC-8 SMT packages. All devices are 100% RF and DC tested. Gnd C Gnd x 2300 - 2700 MHz Functional Diagram Gnd DC Product Description Vbias Product Features ECP203D Vref 1 8 Vbias GND 2 7 RF OUT RF IN 3 6 RF OUT GND 4 5 GND ECP203G / ECP203G-G Specifications (1) Parameter Typical Performance (4) Units Min Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Test Frequency Gain Output P1dB Output IP3 (2) Operating Current Range, Icc (3) Device Voltage, Vcc MHz MHz dB dB dB dBm dBm dB MHz dB dBm dBm mA V Typ 2300 9 31 700 2450 10 8.5 8.5 +32 +46 6.3 2650 9.5 +32 +46 800 +5 Max Parameter Units Typical 2700 Frequency S21 - Gain S11 S22 Output P1dB Output IP3 Noise Figure Supply Bias (3) MHz dB dB dB dBm dBm dB 2350 2450 2650 10 10 9.5 -8 -8.5 -19.5 -15.5 -8.5 -11.5 32 32 32 47 46 46 6.3 6.3 6.3 +5 V @ 800 mA 4. Typical parameters reflect performance in a tuned application circuit at +25 C. 900 1. Test conditions unless otherwise noted: 25C, Vsupply = +5 V in tuned application circuit. 2. 3OIP measured with two tones at an output power of +17 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. This corresponds to the quiescent current or operating current under small-signal conditions into the Vbias and RF out pins. It is expected that the current can increase by an additional 200 mA at P1dB. Pin 1 is used as a reference voltage for the internal biasing circuitry. It is expected that Pin 1 will pull 22mA of current when used with a series bias resistor of R1=15 . (ie. total device current typically will be 822 mA.) Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature RF Input Power (continuous) Device Voltage Device Current Device Power Junction Temperature Ordering Information Part No. Rating -40 to +85 qC -65 to +125 qC +28 dBm +8 V 1400 mA 8W +250 qC Operation of this device above any of these parameters may cause permanent damage. Description 2 Watt InGaP HBT Amplifier ECP203D (lead-tin 16p 4x4mm Pkg) 2 Watt InGaP HBT Amplifier ECP203G* (lead-tin SOIC-8 Pkg) 2 Watt InGaP HBT Amplifier ECP203G-G * ECP203D-PCB2450 ECP203D-PCB2650 ECP203G-PCB2450 ECP203G-PCB2650 (lead-free/green/RoHS-compliant SOIC-8 Pkg) 2450 MHz Evaluation Board 2650 MHz Evaluation Board 2450 MHz Evaluation Board 2650 MHz Evaluation Board This package is being phased out in favor of the green package type which is backwards compatible for existing designs. Refer to Product Change Notification WJPCN06MAY05TC1 on the WJ website. Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 1 of 10 June 2005 ECP203 The Communications Edge TM Product Information 2 Watt, High Linearity InGaP HBT Amplifier Typical Device Data (QFN 4 X 4) S-Parameters (VCC = +5 V, ICC = 800 mA, T = 25 C, unmatched 50 ohm system) S22 DB(GMax()) 0. 8 0 6 0. 2. 0. 4 DB(|S(2,1)|) 0. 4 Gain / Maximum Stable Gain 20 Swp Max 3GHz 2. 0 6 0. 0. 8 1.0 Swp Max 3GHz 1.0 S11 0 3. 3. 0 0 4. 4. 5.0 0 5.0 0.2 15 10.0 0.2 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.4 0.2 0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.4 0.2 0 10.0 -5. -3 .0 4 Swp Min 2GHz -1.0 -0.8 Swp Min 2GHz -2 .0 . -0 .0 -2 3 -0 .6 Frequency (GHz) 2.8 -1.0 2.6 -0 .8 2.4 -0 .6 2.2 - 0 -4 .0 2 3. 0 .4 -0 0 - -10.0 2 -0. 2 4. 0 -0. 0 5 -5. 10 -1 0. 0 Gain (dB) 10.0 Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The impedance plots are shown from 2 - 3 GHz, with markers placed at 2.0 - 3.0 GHz in 0.1 GHz increments. S-Parameters (VCC = +5 V, ICC = 800 mA, T = 25 C, unmatched 50 ohm system, calibrated to device leads) Freq (GHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) 2 -3.47 119.00 1.66 16.07 -40.39 -44.75 -0.90 2.1 -4.38 113.65 1.77 8.68 -39.83 -56.07 -0.73 2.2 -5.64 109.11 2.08 -0.45 -39.08 -62.38 -0.77 2.3 -7.46 105.86 2.29 -10.35 -37.86 -88.93 -0.81 2.4 -10.26 107.44 2.21 -22.19 -37.62 -82.33 -0.92 2.5 -13.43 125.78 2.04 -33.19 -37.98 -95.60 -0.74 2.6 -13.11 162.69 1.80 -47.53 -37.98 -119.59 -0.80 2.7 -9.53 177.72 1.22 -60.84 -38.05 -150.04 -0.70 2.8 -6.50 178.14 0.07 -74.55 -39.73 -156.73 -0.70 2.9 -4.64 171.86 -1.09 -85.18 -37.86 -161.71 -0.75 3 -3.34 164.77 -2.28 -96.66 -38.71 -166.97 -0.78 S22 (ang) 167.78 166.99 164.76 164.27 162.74 161.75 159.67 158.22 155.86 153.95 153.25 Application Circuit PC Board Layout Circuit Board Material: .014" Getek, single layer, 1 oz copper, Microstrip line details: width = .026", spacing = .026" The silk screen markers `A', `B', `C', etc. and `1', `2', `3', etc. are used as placemarkers for the input and output tuning shunt capacitors - C8 and C9. The markers and vias are spaced in .050" increments. Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 2 of 10 June 2005 ECP203 The Communications Edge TM Product Information 2 Watt, High Linearity InGaP HBT Amplifier 2350 MHz Reference Design Typical RF Performance at 25qC Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output P1dB Output IP3 (+17 dBm / tone, 1 MHz spacing) Noise Figure Device / Supply Voltage Quiescent Current (1) +5 V RES ID=R1 R=15 Ohm 2350 MHz 9.8 dB -8.5 dB -12 dB +32 dBm +5.6 V zener CAP ID=C5 C=1000 pF CAP ID=C4 C=10000000 pF RES ID=R2 R=22 Ohm PORT P=1 Z=50 Ohm CAP ID=C1 C=56 pF RES ID=R3 R=51 Ohm RES ID=C11 R=0 Ohm TLINP ID=FR1 Z0=50 Ohm L=25 mil Eeff=3.16 Loss=0 F0=0 MHz +47 dBm 16 13 14 15 15 14 CAP ID=C7 C=1000 pF CAP ID=C6 C=10 pF 13 16 112 121 211 112 SUBCKT ID=ECP203D NET=" QFN" 3 10 94 9 6.3 dB +5 V 800 mA size 1008 103 4 CAP ID=C2 C=56 pF *The transmission line length are from the edge of the ECP203D pins to the center of the component. All passive components are of size 0603 unless otherwise noted. CAP ID=C8 C=.5 pF 8 5 76 7 6 TLINP ID= FR2 Z0=50 Ohm L=425 mil Eeff=3.16 Loss=0 F0=0 MHz IND ID=L1 L=18 nH TLINP ID=FR4 Z0=50 Ohm L=75 mil Eeff=3.16 Loss=0 F0=0 MHz 85 This component should be placed at silk scr een marker "A" on the WJ evaluation board as shown. CAP ID=C3 C=56 pF PORT P=2 Z=50 Ohm CAP ID=C9 C= 2.7 pF This component should be placed at silk screen marker "2" on the WJ evaluation board as shown. 1. This corresponds to the quiescent current or operating current under small-signal conditions into pins 10, 11, and 16. 12 48 34 -5 11 47 33 -10 10 -15 9 -20 -25 2.25 S11 S22 Gain (dB) 0 46 44 2.25 7 2.30 2.35 2.40 32 P1dB 45 8 S21 OIP3 2.45 P1dB (dBm) ECP203D 2.3 - 2.4GHz OIP3 (dBm) S11 & S22 (dB) ECP203D 2.3 - 2.4GHz 31 2.3 Frequency (GHz) 2.35 30 2.45 2.4 Frequency (GHz) 2450 MHz Application Circuit (ECP203D-PCB2450) Typical RF Performance at 25qC 2450 MHz 10.4 dB -12.5 dB -12.5 dB +32 dBm Noise Figure Device / Supply Voltage Quiescent Current (1) 6.3 dB +5 V 800 mA (+17 dBm / tone, 1 MHz spacing) +5 V RES ID=R1 R=15 Ohm +5.6 V zener CAP ID=C5 C=1000 pF CAP ID=C4 C=10000000 pF RES ID=R2 R=22 Ohm PORT P=1 Z=50 Ohm +46 dBm RES ID=R3 R=51 Ohm CAP ID=C1 C=56 pF RES ID=C11 R=0 Ohm TLINP ID=FR1 Z0=50 Ohm L=25 mil Eeff=3.16 Loss=0 F0=0 MHz 13 16 115 4 15 14 16 13 11 2 2 11 CAP ID=C8 C=.5 pF 94 58 7 6 6 7 85 This component should be placed at silk screen marker "A" on the WJ evaluation board as shown. 11 -10 10 -15 9 Gain (dB) -5 8 -20 -25 2.35 2.40 TLINP ID=FR4 Z0=50 Ohm L=125 mil Eeff=3.16 Loss=0 F0=0 MHz CAP ID=C3 C=56 pF PORT P=2 Z=50 Ohm CAP ID=C9 C= 2.2 pF ECP203D 2.4 - 2.5GHz 12 OIP3 (dBm) S11 & S22 (dB) ECP203D 2.4 - 2.5GHz 0 S22 size 1008 This component should be placed at silk screen marker "3" on the WJ evaluation boar d as shown. 1. This corresponds to the quiescent current or operating current under small-signal conditions into pins 10, 11, and 16. S11 TLINP ID=FR2 Z0=50 Ohm L=425 mil Eeff=3.16 Loss=0 F0=0 MHz IND ID=L1 L=18 nH 103 49 CAP ID=C2 C=56 pF *The transmission line length are from the edge of the ECP203D pins to the center of the component. All passive components are of size 0603 unless otherwise noted. 121 112 SUBCKT ID=ECP203D NET="QFN" 30 1 CAP ID=C7 C=1000 pF CAP ID= C6 C=10 pF 47 34 46 33 32 45 OIP3 P1dB 31 44 P1dB (dBm) Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output P1dB Output IP3 S21 2.45 7 2.55 2.50 43 2.35 Frequency (GHz) 2.4 2.45 2.5 30 2.55 Frequency (GHz) Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 3 of 10 June 2005 ECP203 The Communications Edge TM Product Information 2 Watt, High Linearity InGaP HBT Amplifier 2650 MHz Application Circuit (ECP203D-PCB2650) Typical RF Performance at 25qC (+17 dBm / tone, 1 MHz spacing) Noise Figure Device / Supply Voltage Quiescent Current (1) 2650 MHz 9.4 dB -29.5 dB -9.5 dB +32 dBm +5 V RES ID=R1 R=15 Ohm +5.6 V zener CAP ID=C5 C=1000 pF CAP ID=C4 C=10000000 pF RES ID=R2 R=22 Ohm +47 dBm PORT P=1 Z=50 Ohm 6.3 dB +5 V 800 mA RES ID=R3 R=51 Ohm CAP ID=C1 C=56 pF RES ID=C11 R=0 Ohm TLINP ID=FR1 Z0=50 Ohm L=75 mil Eeff=3.16 Loss=0 F0=0 MHz 16 13 115 4 15 14 CAP ID=C7 C=1000 pF CAP ID=C6 C=10 pF 13 16 12 1 121 2 11 112 SUBCKT ID=ECP203D "QFN" 30 1 9 4 CAP ID=C8 C=.5 pF 58 7 6 6 7 85 This component should be placed at silk scr een mar ker "B" on the WJ evaluation board as shown. 1. This corresponds to the quiescent current or operating current under small-signal conditions into pins 10, 11, and 16. TLINP ID=FR4 Z0=50 Ohm L=25 mil Eeff=3.16 Loss=0 F0=0 MHz ECP203D 2.6 - 2.7GHz 48 -5 11 47 33 -10 10 46 32 -15 9 S22 S21 -20 -25 2.55 Gain (dB) 12 OIP3 (dBm) 0 S11 8 2.60 2.65 CAP ID=C3 C=56 pF PORT P=2 Z=50 Ohm CAP ID=C9 C= 2.2 pF This component should be placed at silk screen marker "1" on the WJ evaluation boar d as shown. ECP203 2.6 - 2.7GHz S11 & S22 (dB) size 1008 10 3 49 CAP ID=C2 C=56 pF *The transmission line length are from the edge of the ECP203D pins to the center of the component. All passive components are of size 0603 unless otherwise noted. TLINP ID= FR2 Z0=50 Ohm L=425 mil Eeff=3.16 Loss=0 F0=0 MHz IND ID=L1 L=18 nH Frequency (GHz) 7 2.75 2.70 45 OIP3 34 31 P1dB 44 30 43 2.55 2.6 2.65 2.7 P1dB (dBm) Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output P1dB Output IP3 29 2.75 Frequency (GHz) Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 4 of 10 June 2005 ECP203 The Communications Edge TM Product Information 2 Watt, High Linearity InGaP HBT Amplifier Typical Device Data (SOIC-8) S-Parameters (VCC = +5 V, ICC = 800 mA, T = 25 C, unmatched 50 ohm system) S11 DB(GMax()) 1.0 0.8 2. 0 2. 0 6 0. 1.0 6 0. 0. 8 DB(|S(2,1)|) 0. 4 20 Swp Max 3GHz 0. 4 Gain / Maximum Stable Gain S22 Swp Max 3GHz 0 3. 0 3. 0 4. 15 0 4. 5.0 5.0 0.2 0. 2 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.4 0.2 10.0 0 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.4 0.2 10 0 Gain (dB) 10 .0 -1 0.0 2 -4 .0 -5. 0 -3 .0 -0.8 Swp Min 2GHz .0 -2 .4 -0 Swp Min 2GHz -1.0 3 -0 .6 Frequency (GHz) 2.8 .0 -2 2.6 -0 .8 2.4 -1.0 2.2 -0 .6 2 -3 .0 .4 -0 0 2 -0 . -4 .0 -5. 0 -0. -10. 0 5 Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The impedance plots are shown from 2 - 3 GHz, with markers placed at 2.0 - 3.0 GHz in 0.1 GHz increments. S-Parameters (VCC = +5 V, ICC = 800 mA, T = 25 C, unmatched 50 ohm system, calibrated to device leads) Freq (GHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) 2 -2.47 93.29 1.52 5.56 -39.87 -21.45 -0.85 2.1 -3.14 86.48 1.61 -0.62 -40.28 -38.37 -0.84 2.2 -3.99 79.50 2.06 -9.93 -38.75 -44.73 -0.77 2.3 -5.24 72.21 2.49 -19.19 -39.46 -56.18 -0.91 2.4 -7.30 64.82 2.73 -30.97 -38.17 -73.68 -0.92 2.5 -10.80 62.44 3.08 -43.75 -38.91 -95.46 -0.82 2.6 -16.44 84.08 3.15 -59.32 -40.42 -128.44 -0.74 2.7 -14.08 141.09 2.59 -75.76 -42.11 -144.07 -0.81 2.8 -8.78 147.95 1.74 -91.84 -43.40 165.97 -0.60 2.9 -5.67 140.30 0.69 -105.74 -41.99 148.86 -0.71 3 -3.92 130.41 -0.73 -118.98 -46.07 116.99 -0.71 S22 (ang) 157.53 155.92 153.69 152.59 151.15 149.97 147.33 144.78 141.53 139.50 136.89 Application Circuit PC Board Layout Circuit Board Material: .014" Getek, single layer, 1 oz copper, Microstrip line details: width = .026" , spacing = .026" The silk screen markers `A' , `B' , `C' , etc. and `1' , `2' , `3' , etc. are used as placemarkers for the input and output tuning shunt capacitors - C8 and C9. The markers and vias are spaced in .050" increments. Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 5 of 10 June 2005 ECP203 The Communications Edge TM Product Information 2 Watt, High Linearity InGaP HBT Amplifier 2350 MHz Reference Design Typical RF Performance at 25qC Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output P1dB Output IP3 2350 MHz 10 dB -7.5 dB -15.5 dB +32 dBm Noise Figure Device / Supply Voltage Quiescent Current (1) 6.3 dB +5 V 800 mA +5.6 V zener CAP ID= C4 C=10000000 pF CAP ID=C 5 C=1000 pF CAP ID=C 7 C=10 00 pF R ES ID =R2 R =22 Ohm PORT P=1 Z=50 Ohm R ES ID=R3 R =51 Ohm CAP ID=C1 C=56 pF RES ID= C16 R=0 Ohm +47 dBm CAP ID=C 6 C=10 pF SUBCKT NET= "ECP203G" TLINP ID=FR 1 Z0=50 Ohm L= 25 mil Eeff= 3.16 Loss=0 F0=0 MHz size 1008 TLINP ID= FR4 Z0=50 Ohm L=25 mil Eeff= 3.16 Loss=0 F0=0 MHz CAP ID=C8 C= 1 pF CAP ID=C 2 C=56 pF *The transmission line length ar e from t he edge of the ECP203G pins to the center of the component. This component should be place d at silk scre en marker "A" on the WJ evaluation boar d as show n. CAP ID= C9 C=2 .7 pF This component should be placed at silk screen marker "1" on the WJ evaluation board as shown. ECP203G 2.3 - 2.4GHz ECP203G 2.3 - 2.4GHz 48 34 -5 11 47 33 -10 10 46 32 -15 9 -20 -25 2.25 Gain (dB) 12 OIP3 (dBm) 0 2.30 S22 2.35 S21 OIP3 P1dB 30 44 43 2.25 7 2.45 2.40 31 45 8 S11 PORT P=2 Z=50 Ohm CAP ID=C3 C= 56 pF All passive components are of size 0603 unless other wise n oted. 1. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. S11 & S22 (dB) TLIN P ID=FR2 Z0= 50 Ohm L=425 m il Eeff=3. 16 Loss= 0 F0= 0 MHz IND ID= L1 L=18 nH 85 76 67 58 11 22 33 44 P1dB (dBm) (+17 dBm / tone, 1 MHz spacing) +5 V RES ID=R1 R=15 Ohm 2.3 Frequency (GHz) 2.35 29 2.45 2.4 Frequency (GHz) 2450 MHz Application Circuit (ECP203G-PCB2450) Typical RF Performance at 25qC 2450 MHz 10 dB -8.5 dB -8.5 dB +32 dBm Noise Figure Device / Supply Voltage Quiescent Current (1) 6.3 dB +5 V 800 mA (+17 dBm / tone, 1 MHz spacing) +5.6 V zener CAP ID= C4 C=10000000 pF CAP ID=C 5 C=1000 pF CAP ID=C 7 C=10 00 pF RES ID =R2 R=22 Ohm PORT P=1 Z=50 Ohm +46 dBm R ES ID =R3 R =51 Ohm CAP ID=C1 C=56 pF RES ID=C16 R=0 Ohm CAP ID=C2 C=56 pF *The transmission line len gth are f rom the edge of the ECP203G pins t o the center of the co mponent. All passive compo nents a re of size 060 3 unless otherwise noted. SUBCKT NET= "ECP203G" T LINP ID =FR 1 Z 0=50 Ohm L= 25 mil Eeff=3.16 Loss=0 F 0=0 MHz 11 22 3 3 4 4 85 76 67 58 CAP ID= C8 C=.5 pF This component should be placed at silk screen marker "A" on the WJ evaluation board as shown. 11 -5 10 -10 9 -15 8 S21 -20 7 2.40 2.45 Gain (dB) 0 -25 2.35 size 1008 T LINP ID= FR4 Z 0=50 Ohm L=75 mil Eeff=3.16 Loss=0 F 0=0 MHz CAP ID=C3 C= 56 pF PORT P=2 Z =50 Ohm CAP ID= C9 C=2 .2 pF ECP203G 2.4 - 2.5GHz OIP3 (dBm) S11 & S22 (dB) ECP203G 2.4 - 2.5GHz S22 TLINP ID=FR2 Z0= 50 Ohm L=425 m il Eeff=3. 16 Loss= 0 F0= 0 MHz IND ID= L1 L=18 nH This component should be placed between silk screen marker "1" & "2" on the WJ evaluation board as shown. 1. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. S11 CAP ID=C 6 C=10 pF 33 46 32 45 OIP3 31 P1dB 44 6 2.55 2.50 47 Frequency (GHz) 43 2.35 30 2.4 2.45 2.5 P1dB (dBm) Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output P1dB Output IP3 +5 V RES ID=R 1 R=15 Ohm 29 2.55 Frequency (GHz) Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 6 of 10 June 2005 ECP203 The Communications Edge TM Product Information 2 Watt, High Linearity InGaP HBT Amplifier 2650 MHz Application Circuit (ECP203G-PCB2650) Typical RF Performance at 25qC 2650 MHz 9.5 dB -19.5 dB -11.5 dB +32 dBm Noise Figure Device / Supply Voltage Quiescent Current (1) 6.3 dB +5 V 800 mA (+17 dBm / tone, 1 MHz spacing) +5.6 V zener CAP ID= C4 C= 10000000 pF CAP ID=C 5 C=1000 pF CAP ID=C7 C=10 00 pF RES ID =R2 R=22 Ohm PORT P=1 Z=50 Ohm +46 dBm R ES ID=R3 R =51 Ohm CAP ID=C1 C=56 pF RES ID= C16 R=0 Ohm CAP ID=C 2 C=56 pF *The transmission line length a re from the edge of the ECP203G pins to the cente r of the compon ent. All passive components are of size 0603 unless otherwise noted. CAP ID=C 6 C=10 pF SUBCKT NET= "ECP203G" T LINP ID=FR 1 Z 0=50 Ohm L= 25 mil Eeff= 3.16 Loss=0 F 0=0 MHz 11 2 2 33 44 8 5 6 7 67 58 CAP ID= C8 C= .5 pF size 1008 TLINP ID= FR4 Z0=50 Ohm L=13 mil Eeff= 3.16 Loss=0 F0=0 MHz This component should be placed between device a nd silk screen marker "1" on the WJ evaluation board as shown. ECP203G 2.6 - 2.7GHz ECP203G 2.6 - 2.7GHz 34 -5 10 47 33 -10 9 46 32 -15 8 -20 -25 2.55 OIP3 (dBm) 48 Gain (dB) 11 7 2.60 S22 PORT P=2 Z=50 Ohm CAP ID= C9 C=2 .2 pF 0 S11 CAP ID= C3 C= 56 pF This component should be place d at silk scre en marker "A" on the WJ evaluation board as shown. 1. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. S11 & S22 (dB) TLIN P ID= FR2 Z0= 50 Ohm L=425 m il Eeff=3. 16 Loss= 0 F0= 0 MHz IND ID= L1 L=18 nH S21 2.65 6 2.75 2.70 31 45 OIP3 P1dB P1dB (dBm) Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output P1dB Output IP3 +5 V RES ID=R 1 R=15 Ohm 30 44 43 2.55 2.6 2.65 2.7 29 2.75 Frequency (GHz) Frequency (GHz) Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 7 of 10 June 2005 ECP203 The Communications Edge TM Product Information 2 Watt, High Linearity InGaP HBT Amplifier ECP203G (SOIC-8 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Outline Drawing Product Marking The component will be marked with an "ECP203G" designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the "Application Notes" section. ESD / MSL Information ESD Rating: Value: Test: Standard: Class 1B Passes between 500 and 1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. 2. Land Pattern 3. 4. 5. 6. 7. 8. Parameter Rating Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) -40 to +85q C 17.5q C / W 155q C Notes: 1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85 C. Tjc is a function of the voltage at pins 6 and 7 and the current applied to pins 6, 7, and 8 and can be calculated by: Tjc = Tcase + Rth * Vcc * Icc 2. This corresponds to the typical biasing condition of +5V, 800 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 C. MTTF vs. GND Tab Temperature 100000 MTTF (million hrs) Thermal Specifications A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135" ) diameter drill and have a final plated thru diameter of .25 mm (.010" ). Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. RF trace width depends upon the PC board material and construction. Use 1 oz. Copper minimum. All dimensions are in millimeters (inches). Angles are in degrees. 10000 1000 100 60 70 80 90 100 110 Tab Temperature (C) 120 Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 8 of 10 June 2005 ECP203 The Communications Edge TM Product Information 2 Watt, High Linearity InGaP HBT Amplifier ECP203G-G (Lead-Free Package) Mechanical Information This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260qC reflow temperature) and lead (maximum 245qC reflow temperature) soldering processes. Outline Drawing Product Marking The component will be marked with an " ECP203G-G" designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the " Application Notes" section. ESD / MSL Information ESD Rating: Value: Test: Standard: Class 1B Passes 500 V to <1000 V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Standard: Level 2 at +260 C convection reflow JEDEC Standard J-STD-020 Mounting Config. Notes 1. 2. Mounting Configuration / Land Pattern 3. 4. 5. 6. 7. 8 Thermal Specifications Rating Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) -40 to +85q C 17.5q C / W 155q C Notes: 1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85 C. Tjc is a function of the voltage at pins 6 and 7 and the current applied to pins 6, 7, and 8 and can be calculated by: Tjc = Tcase + Rth * Vcc * Icc 2. This corresponds to the typical biasing condition of +5V, 800 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 C. MTTF vs. GND Tab Temperature 100000 MTTF (million hrs) Parameter A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135" ) diameter drill and have a final plated thru diameter of .25 mm (.010" ). Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. RF trace width depends upon the PC board material and construction. Use 1 oz. Copper minimum. All dimensions are in millimeters (inches). Angles are in degrees. 10000 1000 100 60 70 80 90 100 110 Tab Temperature (C) 120 Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 9 of 10 June 2005 ECP203 The Communications Edge TM Product Information 2 Watt, High Linearity InGaP HBT Amplifier ECP203D (16-pin 4x4mm Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Product Marking Outline Drawing The component will be marked with an " E203" designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the " Application Notes" section. E2 0 3 ESD / MSL Information Land Pattern ESD Rating: Value: Test: Standard: Class 1B Passes between 500 and 1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. 2. 3. Parameter Rating Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) -40 to +85q C 17.5q C / W 155q C Notes: 1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85 C. Tjc is a function of the voltage at pins 10 and 11 and the current applied to pins 10, 11, and 16 and can be calculated by: Tjc = Tcase + Rth * Vcc * Icc 2. This corresponds to the typical biasing condition of +5V, 800 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 C. MTTF vs. GND Tab Temperature 100000 MTTF (million hrs) Thermal Specifications 4. 5. 6. 10000 7. 8 A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135" ) diameter drill and have a final plated thru diameter of .25 mm (.010" ). Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. RF trace width depends upon the PC board material and construction. Use 1 oz. Copper minimum. All dimensions are in millimeters. Angles are in degrees. 1000 100 60 70 80 90 100 110 Tab Temperature (C) 120 Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 10 of 10 June 2005