LCB111 Single Pole, Normally Closed OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Load Voltage Load Current Input Control Current On-Resistance (max) Rating 350 120 2 35 Units VP mArms / mADC mA Features * * * * * * * * * * * Description LCB111 is a 350V, 120mA, 35, normally closed (1-Form-B) solid state relay featuring high sensitivity. It uses optically coupled relay technology to provide a 3750Vrms isolation barrier between the input and the output of the relay. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. Low Input Control Current: 2mA 3750Vrms Input/Output Isolation Low Drive Power Requirements High Reliability Arc-Free With No Snubbing Circuits FCC Compatible VDE Compatible No EMI/RFI Generation Small 6-Pin Package Flammability Rating UL 94 V-0 Tape & Reel, Surface Mount Version Available The LCB111 can be used to replace mechanical relays, and offers the superior reliability associated with semiconductor devices. Because it has no moving parts, it can offer faster, bounce-free switching in a more compact surface mount or thru-hole package. Approvals Applications * Telecommunications * Telecom Switching * Tip/Ring Circuits * Modem Switching (Laptop, Notebook, Pocket Size) * Hook Switch * Dial Pulsing * Ground Start * Ringing Injection * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment--Patient/Equipment Isolation * Security * Aerospace * Industrial Controls * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1175739 * EN/IEC 60950-1 Certified Component: Certificate available on our website Ordering Information Part # LCB111 LCB111S LCB111STR Description 6-Pin DIP (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount (1000/Reel) Pin Configuration AC/DC Configuration + Control - Control Do Not Use 1 6 2 5 3 4 Load Do Not Use Load DC Only Configuration + Control - Control Do Not Use 1 6 2 5 3 4 + Load - Load Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 10% toff DS-LCB111-R10 www.ixysic.com 90% ton 1 INTEGRATED CIRCUITS DIVISION LCB111 Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / C 2 Derate linearly 6.67 mW / C Ratings 350 5 50 1 Units VP V mA A 150 800 3750 -40 to +85 -40 to +125 mW mW Vrms C C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25C Parameter Output Characteristics Load Current AC/DC Configuration, Continuous DC Configuration, Continuous Peak On-Resistance AC/DC Configuration DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 2 Conditions Min Typ Max Units - - 120 mArms / mADC - - 200 350 mADC mAP 23 7 - 35 10 1 ILEAK - ton - 2 5 IF=2mA, VL=50V, f=1MHz toff COUT - 2 25 5 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 1 0.7 1.2 - 2 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 3 - pF - Symbol IL 10ms ILPK IL=120mA IL=200mA VL=350VP IF=2mA, VL=10V RON www.ixysic.com A ms pF R10 INTEGRATED CIRCUITS DIVISION LCB111 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LCB111 / LCB111S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles LCB111 LCB111S 250C 250C 30 seconds 30 seconds 1 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R10 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LCB111 MECHANICAL DIMENSIONS LCB111 8.382 0.381 (0.330 0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54 0.127 (0.100 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144 0.508 (0.360 0.020) 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) Pin 1 7.620 0.254 (0.300 0.010) 1.651 0.254 (0.065 0.010) 3.302 0.051 (0.130 0.002) 0.254 0.0127 (0.010 0.0005) 6.350 0.127 (0.250 0.005) 5.080 0.127 (0.200 0.005) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457 0.076 (0.018 0.003) LCB111S 8.382 0.381 (0.330 0.015) 9.524 0.508 (0.375 0.020) Pin 1 0.635 0.127 (0.025 0.005) PCB Land Pattern 2.54 0.127 (0.100 0.005) 2.54 (0.10) 6.350 0.127 (0.250 0.005) 0.457 0.076 (0.018 0.003) 1.651 0.254 (0.065 0.010) 7.620 0.254 (0.300 0.010) 0.254 0.0127 (0.010 0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 0.051 (0.130 0.002) 4.445 0.254 (0.175 0.010) Dimensions mm (inches) 1.651 0.254 (0.065 0.010) 4 www.ixysic.com R10 INTEGRATED CIRCUITS DIVISION LCB111 LCB111STR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) A0 = 10.10 (0.398) P1 = 12.00 (0.472) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all "Notes" for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 5 Specification: DS-LCB111-R10 (c)Copyright 2018, IXYS Integrated Circuits OptoMOS(R) is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/26/2018