INTEGRATED CIRCUITS DATA SHEET TJA1054A Fault-tolerant CAN transceiver Product specification Supersedes data of 2002 Feb 11 2004 Mar 23 Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A FEATURES GENERAL DESCRIPTION Optimized for in-car low-speed communication The TJA1054A is the interface between the protocol controller and the physical bus wires in a Controller Area Network (CAN). It is primarily intended for low-speed applications up to 125 kBaud in passenger cars. The device provides differential receive and transmit capability but will switch to single-wire transmitter and/or receiver in error conditions. * Baud rate up to 125 kBaud * Up to 32 nodes can be connected * Supports unshielded bus wires * Very low ElectroMagnetic Emission (EME) due to built-in slope control function and a very good matching of the CANL and CANH bus outputs The TJA1054A is the ESD improved version of the TJA1054. For an overview of the differences between the TJA1054 and the TJA1054A, please refer to "Appendix A". * Good ElectroMagnetic Immunity (EMI) in normal operating mode and in low power modes * Fully integrated receiver filters The TJA1054AT is, as the TJA1054T, pin and downwards compatible with the PCA82C252T and the TJA1053T. This means that these two devices can be replaced by the TJA1054AT or the TJA1054T with retention of all functions. * Transmit Data (TxD) dominant time-out function. Bus failure management * Supports single-wire transmission modes with ground offset voltages up to 1.5 V The most important improvements of the TJA1054 and the TJA1054A with respect to the PCA82C252 and the TJA1053 are: * Automatic switching to single-wire mode in the event of bus failures, even when the CANH bus wire is short-circuited to VCC * Very low EME due to a very good matching of the CANL and CANH output signals * Automatic reset to differential mode if bus failure is removed * Good EMI, especially in low power modes * Full wake-up capability during bus failures * Full wake-up capability during failure modes. Protections * Extended bus failure management including short-circuit of the CANH bus line to VCC * Bus pins short-circuit safe to battery and to ground * Support for easy system fault diagnosis * Thermally protected * Two-edge sensitive wake-up input signal via pin WAKE. * Bus lines protected against transients in an automotive environment * An unpowered node does not disturb the bus lines. Support for low power modes * Low current sleep and standby mode with wake-up via the bus lines * Power-on reset flag on the output. ORDERING INFORMATION TYPE NUMBER PACKAGE NAME TJA1054AT SO14 TJA1054AU - 2004 Mar 23 DESCRIPTION plastic small outline package; 14 leads; body width 3.9 mm bare die; 1990 x 2730 x 375 m 2 VERSION SOT108-1 - Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A QUICK REFERENCE DATA SYMBOL PARAMETER VCC supply voltage on pin VCC VBAT battery voltage on pin BAT CONDITIONS MIN. TYP. MAX. UNIT 4.75 - 5.25 V no time limit -0.3 - +40 V operating mode; note 1 5.0 - 27 V load dump - - 40 V IBAT battery current on pin BAT sleep mode; VCC = 0 V; VBAT = 12 V - 30 50 A VCANH CANH bus line voltage VCC = 0 to 5.0 V; VBAT 0 V; no time limit -27 - +40 V VCANL CANL bus line voltage VCC = 0 to 5.0 V; VBAT 0 V; no time limit -27 - +40 V VCANH CANH bus line transmitter voltage drop ICANH = -40 mA - - 1.4 V VCANL CANL bus line transmitter voltage drop ICANL = 40 mA - - 1.4 V tPD(L) propagation delay TXD (LOW) to RXD (LOW) - 1 - s tr bus line output rise time between 10% and 90%; C1 = 10 nF; see Fig.5 - 0.6 - s tf bus line output fall time between 10% and 90%; C1 = 1 nF; see Fig.5 - 0.3 - s Tvj virtual junction temperature -40 - +150 C Note 1. A local or remote wake-up event will be signalled at the transceiver pins RXD and NERR if VBAT = 5.3 V to 27 V (see Table 2). 2004 Mar 23 3 Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A BLOCK DIAGRAM BAT handbook, full pagewidth 14 INH WAKE STB EN VCC 10 1 7 TEMPERATURE PROTECTION WAKE-UP STANDBY CONTROL 5 6 9 11 VCC 12 2 TXD DRIVER RTH FAILURE DETECTOR PLUS WAKE-UP PLUS TIME-OUT 4 FILTER RECEIVER 3 FILTER 13 MGU383 GND Fig.1 Block diagram. 2004 Mar 23 CANL TJA1054A VCC RXD CANH TIMER VCC ERR 8 RTL 4 Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A PINNING SYMBOL PIN DESCRIPTION INH 1 inhibit output for switching an external voltage regulator if a wake-up signal occurs TXD 2 transmit data input for activating the driver to the bus lines RXD 3 receive data output for reading out the data from the bus lines ERR 4 error, wake-up and power-on indication output; active LOW in normal operating mode when the bus has a failure, and in low power modes (wake-up signal or in power-on standby) STB 5 standby digital control signal input (active LOW); together with the input signal on pin EN this input determines the state of the transceiver (in normal and low power modes); see Table 2 and Fig.3 EN 6 enable digital control signal input; together with the input signal on pin STB this input determines the state of the transceiver (in normal and low power modes); see Table 2 and Fig.3 WAKE 7 local wake-up signal input (active LOW); both falling and rising edges are detected RTH 8 termination resistor connection; in case of a CANH bus wire error the line is terminated with a predefined impedance RTL 9 termination resistor connection; in case of a CANL bus wire the line is terminated with a predefined impedance VCC 10 supply voltage CANH 11 HIGH-level CAN bus line CANL 12 LOW-level CAN bus line GND 13 ground BAT 14 battery supply voltage handbook, halfpage INH 1 14 BAT TXD 2 13 GND RXD 3 12 CANL ERR 4 TJA1054AT 11 CANH STB 5 10 VCC EN 6 9 RTL WAKE 7 8 RTH MGU379 Fig.2 Pin configuration. 2004 Mar 23 5 Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A FUNCTIONAL DESCRIPTION If the duration of the LOW level on pin TXD exceeds a certain time, the transmitter will be disabled. The timer will be reset by a HIGH level on pin TXD. The TJA1054A is the interface between the CAN protocol controller and the physical wires of the CAN bus (see Fig.7). It is primarily intended for low-speed applications, up to 125 kBaud, in passenger cars. The device provides differential transmit capability to the CAN bus and differential receive capability to the CAN controller. Failure detector The failure detector is fully active in the normal operating mode. After the detection of a single bus failure the detector switches to the appropriate mode (see Table 1). The differential receiver threshold voltage is set at -3.2 V typical (VCC = 5 V). This ensures correct reception with a noise margin as high as possible in the normal operating mode and in the event of failures 1, 2, 5 and 6a. These failures, or recovery from them, do not destroy ongoing transmissions. The output drivers remain active, the termination does not change and the receiver remains in differential mode (see Table 1). To reduce EME, the rise and fall slopes are limited. This allows the use of an unshielded twisted pair or a parallel pair of wires for the bus lines. Moreover, the device supports transmission capability on either bus line if one of the wires is corrupted. The failure detection logic automatically selects a suitable transmission mode. In normal operating mode (no wiring failures) the differential receiver is output on pin RXD (see Fig.1). The differential receiver inputs are connected to pins CANH and CANL through integrated filters. The filtered input signals are also used for the single-wire receivers. The receivers connected to pins CANH and CANL have threshold voltages that ensure a maximum noise margin in single-wire mode. Failures 3, 3a and 6 are detected by comparators connected to the CANH and CANL bus lines. Failures 3 and 3a are detected in a two-step approach. If the CANH bus line exceeds a certain voltage level, the differential comparator signals a continuous dominant condition. Because of inter operability reasons with the predecessor products PCA82C252 and TJA1053, after a first time-out the transceiver switches to single-wire operation through CANH. If the CANH bus line is still exceeding the CANH detection voltage for a second time-out, the TJA1054A switches to CANL operation; the CANH driver is switched off and the RTH bias changes to the pull-down current source. The time-outs (delays) are needed to avoid false triggering by external RF fields. A timer function (TxD dominant time-out function) has been integrated to prevent the bus lines from being driven into a permanent dominant state (thus blocking the entire network communication) due to a situation in which pin TXD is permanently forced to a LOW level, caused by a hardware and/or software application failure. Table 1 Bus failures FAILURE DESCRIPTION 1 CANH wire interrupted 2 CANL wire interrupted 3 CANH short-circuited to battery 3a CANH short-circuited to VCC 4 5 TERMINATION TERMINATION CANH CANL CANH (RTH) CANL (RTL) DRIVER DRIVER RECEIVER MODE on on on on differential on on on on differential weak; note 1 on off on CANL weak; note 1 on off on CANL CANL short-circuited to ground on weak; note 2 on off CANH CANH short-circuited to ground on on on on differential 6 CANL short-circuited to battery on weak; note 2 on off CANH 6a CANL short-circuited to VCC on on on on differential 7 CANL and CANH mutually short-circuited on weak; note 2 on off CANH Notes 1. A weak termination implies a pull-down current source behaviour of 75 A typical. 2. A weak termination implies a pull-up current source behaviour of 75 A typical. 2004 Mar 23 6 Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A During all single-wire transmissions, EMC performance (both immunity and emission) is worse than in the differential mode. The integrated receiver filters suppress any HF noise induced into the bus wires. The cut-off frequency of these filters is a compromise between propagation delay and HF suppression. In single-wire mode, LF noise cannot be distinguished from the required signal. Failure 6 is detected if the CANL bus line exceeds its comparator threshold for a certain period of time. This delay is needed to avoid false triggering by external RF fields. After detection of failure 6, the reception is switched to the single-wire mode through CANH; the CANL driver is switched off and the RTL bias changes to the pull-up current source. Recovery from failures 3, 3a and 6 is detected automatically after reading a consecutive recessive level by corresponding comparators for a certain period of time. Low power modes The transceiver provides three low power modes which can be entered and exited via STB and EN (see Table 2 and Fig.3). Failures 4 and 7 initially result in a permanent dominant level on pin RXD. After a time-out the CANL driver is switched off and the RTL bias changes to the pull-up current source. Reception continues by switching to the single-wire mode via pins CANH or CANL. When failures 4 or 7 are removed, the recessive bus levels are restored. If the differential voltage remains below the recessive threshold level for a certain period of time, reception and transmission switch back to the differential mode. The sleep mode is the mode with the lowest power consumption. Pin INH is switched to HIGH-impedance for deactivation of the external voltage regulator. Pin CANL is biased to the battery voltage via pin RTL. If the supply voltage is provided, pins RXD and ERR will signal the wake-up interrupt. The standby mode operates in the same way as the sleep mode but with a HIGH level on pin INH. If any of the wiring failure occurs, the output signal on pin ERR will be set to LOW. On error recovery, the output signal on pin ERR will be set to HIGH again. In case of an interrupted open bus wire, this failure will be detected and signalled only if there is an open wire between the transmitting and receiving node(s). Thus, during open wire failures, pin ERR typically toggles. Table 2 The power-on standby mode is the same as the standby mode, however, in this mode the battery power-on flag is shown on pin ERR instead of the wake-up interrupt signal. The output on pin RXD will show the wake-up interrupt. This mode is only for reading out the power-on flag. Normal operating and low power modes MODE Goto-sleep command Sleep Standby Power-on standby Normal operating PIN STB PIN ERR PIN EN LOW LOW HIGH LOW LOW HIGH LOW(4) LOW LOW VBAT power-on flag; notes 1 and 5 HIGH error flag HIGH PIN RXD HIGH wake-up interrupt signal; notes 1 2 and 3 no error flag LOW wake-up interrupt signal; notes 1 2 and 3 VBAT wake-up interrupt signal; notes 1 2 and 3 dominant recessive received data received data VBAT Notes 1. If the supply voltage VCC is present. 2. Wake-up interrupts are released when entering normal operating mode. 2004 Mar 23 7 HIGH PIN RTL SWITCHED TO VCC Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A 3. A local or remote wake-up event will be signalled at the transceiver pins RXD and NERR if VBAT = 5.3 V to 27 V. 4. In case the goto-sleep command was used before. When VCC drops, pin EN will become LOW, but due to the fail-safe functionality this does not effect the internal functions. 5. VBAT power-on flag will be reset when entering normal operating mode. Wake-up requests are recognized by the transceiver through two possible channels: Pin INH will be set to a HIGH level again by the following events only: * The bus lines for remote wake-up * VBAT power-on (cold start) * Pin WAKE for local wake-up. * Rising or falling edge on pin WAKE * A message frame with a dominant phase of at least the maximum specified tCANH or tCANL, while pin EN or pin STB is at a LOW level In order to wake-up the transceiver remotely through the bus lines, a filter mechanism is integrated. This mechanism makes sure that noise and any present bus failure conditions do not result into an erroneous wake-up. Because of this mechanism it is not sufficient to simply pull the CANH or CANL bus lines to a dominant level for a certain time. To guarantee a successful remote wake-up under all conditions, a message frame with a dominant phase of at least the maximum specified tCANH or tCANL in it is required. * Pin STB goes to a HIGH level with VCC active. To provide fail-safe functionality, the signals on pins STB and EN will internally be set to LOW when VCC is below a certain threshold voltage (VCC(stb)). Power-on After power-on (VBAT switched on) the signal on pin INH will become HIGH and an internal power-on flag will be set. This flag can be read in the power-on standby mode through pin ERR (STB = 1; EN = 0) and will be reset by entering the normal operating mode. A local wake-up through pin WAKE is detected by a rising or falling edge with a consecutive level with the maximum specified tWAKE. On a wake-up request the transceiver will set the output on pin INH to HIGH which can be used to activate the external supply voltage regulator. Protections A current limiting circuit protects the transmitter output stages against short-circuit to positive and negative battery voltage. If VCC is provided the wake-up request can be read on the ERR or RXD outputs, so the external microcontroller can activate the transceiver (switch to normal operating mode) via pins STB and EN. If the junction temperature exceeds the typical value of 165 C, the transmitter output stages are disabled. Because the transmitter is responsible for the major part of the power dissipation, this will result in a reduced power dissipation and hence a lower chip temperature. All other parts of the device will continue to operate. To prevent a false remote wake-up due to transients or RF fields, the wake-up voltage levels have to be maintained for a certain period of time. In the low power modes the failure detection circuit remains partly active to prevent an increased power consumption in the event of failures 3, 3a, 4 and 7. The pins CANH and CANL are protected against electrical transients which may occur in an automotive environment. To prevent a false local wake-up during an open wire at pin WAKE, this pin has a weak pull-up current source towards VBAT. However, in order to prevent EMC issues, it is recommended to connect a not used pin WAKE to pin BAT. Pin INH is set to floating only if the goto-sleep command is entered successfully. To enter a successful goto-sleep command under all conditions, this command must be kept stable for the maximum specified th(sleep). 2004 Mar 23 8 Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A handbook, full pagewidth POWER-ON STANDBY 10 GOTO SLEEP (5) 01 NORMAL (4) 11 (1) (2) STANDBY 00 SLEEP 00 MBK949 (3) Mode 10 stands for: Pin STB = HIGH and pin EN = LOW. (1) Mode change via input pins STB and EN. (2) Mode change via input pins STB and EN; it should be noted that in the sleep mode pin INH is inactive and possibly there is no VCC. Mode control is only possible if VCC of the transceiver is active. (3) Pin INH is activated after wake-up via bus or input pin WAKE. (4) Transitions to normal mode clear the internal wake-up: interrupt and battery fail flag are cleared. (5) Transitions to sleep mode: pin INH is deactivated. Fig.3 Mode control. 2004 Mar 23 9 Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); note 1. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage on pin VCC -0.3 +6 V VBAT battery voltage on pin BAT -0.3 +40 V Vn DC voltage on pins TXD, RXD, ERR, STB and EN -0.3 VCC + 0.3 V VCANH CANH bus line voltage -27 +40 V VCANL CANL bus line voltage -27 +40 V Vtrt(n) transient voltage on pins CANH and CANL -150 +100 V VWAKE DC input voltage on pin WAKE - VBAT + 0.3 V IWAKE DC input current on pin WAKE -15 - mA see Fig.6 note 2 VINH DC output voltage on pin INH -0.3 VBAT + 0.3 V VRTH DC voltage on pin RTH -0.3 VBAT + 1.2 V VRTL DC voltage on pin RTL -0.3 VBAT + 1.2 V RRTH termination resistance on pin RTH 500 16000 RRTL termination resistance on pin RTL Tvj virtual junction temperature Tstg storage temperature Vesd electrostatic discharge voltage 500 16000 -40 +150 C -55 +150 C pins RTH, RTL, CANH and CANL -4 +4 kV all other pins -2 +2 kV -300 +300 V note 3 human body model; note 4 machine model; note 5 any pin Notes 1. All voltages are defined with respect to pin GND. Positive current flows into the device. 2. Only relevant if VWAKE < VGND - 0.3 V; current will flow into pin GND. 3. Junction temperature in accordance with "IEC 60747-1". An alternative definition is: Tvj = Tamb + P x Rth(vj-a) where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and operating ambient temperature (Tamb). 4. Equivalent to discharging a 100 pF capacitor through a 1.5 k resistor. 5. Equivalent to discharging a 200 pF capacitor through a 10 resistor and a 0.75 H coil. THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-a) thermal resistance from junction to ambient in free air 120 K/W Rth(j-s) thermal resistance from junction to substrate bare die in free air 40 K/W QUALITY SPECIFICATION Quality specification in accordance with "AEC-Q100". 2004 Mar 23 10 Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A DC CHARACTERISTICS VCC = 4.75 to 5.25 V; VBAT = 5.0 to 27 V; VSTB = VCC; Tvj = -40 to +150 C; all voltages are defined with respect to ground; positive currents flow into the device; unless otherwise specified; notes 1 2 and 3 SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies (pins VCC and BAT) VCC supply voltage on pin VCC 4.75 - 5.25 V VCC(stb) supply voltage for forced standby mode (fail-safe) 2.75 - 4.5 V ICC supply current normal operating mode; VTXD = VCC (recessive) 4 7 11 mA normal operating mode; VTXD = 0 V (dominant); no load 10 17 27 mA low power modes; VTXD = VCC 0 0 10 A no time limit -0.3 - +40 V operating mode 5.0 - 27 V load dump - - 40 V 10 30 50 A VBAT IBAT battery voltage on pin BAT battery current on pin BAT all modes and in low power modes at VRTL = VWAKE = VINH = VBAT VBAT = 12 V VBAT(Pwon) Itot power-on flag voltage on pin BAT VBAT = 5.0 to 27 V 5 30 125 A VBAT = 3.5 V 5 20 30 A VBAT = 1 V 0 0 10 A low power modes power-on flag set - - 1 V power-on flag not set 3.5 - - V - 30 60 A 0.7VCC - VCC + 0.3 V -0.3 - 0.3VCC V - 9 20 A -200 -80 -25 A pins STB and EN 4 8 - A pin TXD -800 -320 -100 A supply current plus battery current low power modes; VCC = 5 V; VBAT = VWAKE = VINH = 12 V Pins STB, EN and TXD VIH HIGH-level input voltage VIL LOW-level input voltage IIH HIGH-level input current VI = 4 V pins STB and EN pin TXD IIL 2004 Mar 23 LOW-level input current VI = 1 V 11 Philips Semiconductors Product specification Fault-tolerant CAN transceiver SYMBOL PARAMETER TJA1054A CONDITIONS MIN. TYP. MAX. UNIT Pins RXD and ERR VOH HIGH-level output voltage on pin ERR lO = -100 A VCC - 0.9 - VCC V on pin RXD IO = -1 mA VCC - 0.9 - VCC V LOW-level output voltage on pins ERR and RXD IO = 1.6 mA 0 - 0.4 V IO = 7.5 mA 0 - 1.5 V IIL LOW-level input current VWAKE = 0 V; VBAT = 27 V -10 -4 -1 A Vth(wake) wake-up threshold voltage VSTB = 0 V 2.5 3.2 3.9 V VH HIGH-level voltage drop IINH = -0.18 mA - - 0.8 V IL leakage current sleep mode; VINH = 0 V - - 5 A VCC = 5 V -3.5 -3.2 -2.9 V VCC = 4.75 to 5.25 V -0.70VCC -0.64VCC -0.58VCC V VOL Pin WAKE Pin INH Pins CANH and CANL Vth(dif) VO(reces) differential receiver threshold voltage recessive output voltage on pin CANH on pin CANL VO(dom) dominant output voltage on pin CANH IO(CANL) Vd(CANH)(sc) Vd(CANL)(sc) Vth(wake) 2004 Mar 23 VTXD = VCC RRTH < 4 k - RRTL < 4 k - 0.2 V VCC - 0.2 - - V ICANH = -40 mA VCC - 1.4 - - V ICANL = 40 mA VTXD = 0 V; VEN = VCC - - 1.4 V normal operating mode; VCANH = 0 V; VTXD = 0 V -110 -80 -45 mA low power modes; VCANH = 0 V; VCC = 5 V - -0.25 - A normal operating mode; VCANL = 14 V; VTXD = 0 V 45 70 100 mA low power modes; VCANL = 12 V; VBAT = 12 V - 0 - A detection voltage for short-circuit to battery voltage on pin CANH normal operating mode 1.5 1.7 1.85 V low power modes 1.1 1.8 2.5 V detection voltage for short-circuit to battery voltage on pin CANL normal operating mode VCC = 5 V 6.6 7.2 7.8 V VCC = 4.75 to 5.25 V 1.32VCC 1.44VCC 1.56VCC V on pin CANL IO(CANH) no failures and bus failures 1, 2, 5 and 6a; see Fig.4 output current on pin CANH output current on pin CANL wake-up threshold voltage on pin CANL low power modes 2.5 3.2 3.9 V on pin CANH low power modes 1.1 1.8 2.5 V 12 Philips Semiconductors Product specification Fault-tolerant CAN transceiver SYMBOL Vth(wake) PARAMETER difference of wake-up threshold voltages Vth(CANH)(se) single-ended receiver threshold voltage on pin CANH TJA1054A CONDITIONS MIN. TYP. MAX. UNIT 0.8 1.4 - V VCC = 5 V 1.5 1.7 1.85 V VCC = 4.75 to 5.25 V 0.30VCC 0.34VCC 0.37VCC V VCC = 5 V 3.15 3.3 3.45 V VCC = 4.75 to 5.25 V 0.63VCC 0.66VCC 0.69VCC V low power modes normal operating mode and failures 4, 6 and 7 normal operating mode and Vth(CANL)(se) single-ended receiver threshold voltage on pin CANL failures 3 and 3a Ri(CANH)(se) single-ended input resistance on pin CANH normal operating mode 110 165 270 k Ri(CANL)(se) single-ended input resistance on pin CANL normal operating mode 110 165 270 k Ri(dif) differential input resistance normal operating mode 220 330 540 k Pins RTH and RTL Rsw(RTL) switch-on resistance between pin RTL and VCC normal operating mode; IO < 10 mA - 50 100 Rsw(RTH) switch-on resistance between pin RTH and ground normal operating mode; IO < 10 mA - 50 100 VO(RTH) output voltage on pin RTH low power modes; IO = 1 mA - 0.7 1.0 V IO(RTL) output current on pin RTL low power modes; VRTL = 0 V -1.25 -0.65 -0.3 mA Ipu(RTL) pull-up current on pin RTL normal operating mode and failures 4, 6 and 7 - 75 - A Ipd(RTH) pull-down current on pin RTH normal operating mode and failures 3 and 3a - 75 - A 155 165 180 C Thermal shutdown Tj(sd) junction temperature for shutdown Notes 1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at Tamb = 125 C for dies on wafer level, and above this for cased products 100% tested at Tamb = 25 C, unless otherwise specified. 2. For bare die, all parameters are only guaranteed if the back side of the die is connected to ground. 3. A local or remote wake-up event will be signalled at the transceiver pins RXD and NERR if VBAT = 5.3 V to 27 V (see Table 2). 2004 Mar 23 13 Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A TIMING CHARACTERISTICS VCC = 4.75 to 5.25 V; VBAT = 5.0 to 27 V; VSTB = VCC; Tvj = -40 to +150 C; all voltages are defined with respect to ground; unless otherwise specified; notes 1 2 and 3 SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT tt(r-d) CANL and CANH output transition between 10% and 90%; time for recessive to dominant R1 = 100 ; C1 = 10 nF; C2 = not present; see Fig.5 0.35 0.60 - s tt(d-r) CANL and CANH output transition between 10% and 90%; time for dominant to recessive R1 = 100 ; C1 = 1 nF; C2 = not present; see Fig.5 0.2 0.3 - s tPD(L) propagation delay TXD (LOW) to RXD (LOW) C1 = 1 nF; C2 = not present - 0.75 1.5 s C1 = C2 = 3.3 nF - 1 1.75 s C1 = 1 nF; C2 = not present - 0.85 1.4 s C1 = C2 = 3.3 nF - 1.1 1.7 s C1 = 1 nF; C2 = not present - 1.2 1.9 s C1 = C2 = 3.3 nF - 2.5 3.3 s C1 = 1 nF; C2 = not present - 1.1 1.7 s C1 = C2 = 3.3 nF - 1.5 2.2 s no failures and failures 1, 2, 5 and 6a; R1 = 100 ; see Figs 4 and 5 failures 3, 3a, 4, 6 and 7; R1 = 100 ; see Figs 4 and 5 tPD(H) propagation delay TXD (HIGH) to RXD (HIGH) no failures and failures 1, 2, 5 and 6a; R1 = 100 ; see Figs 4 and 5 failures 3, 3a, 4, 6 and 7; R1 = 100 ; see Figs 4 and 5 treact(sleep) reaction time of goto-sleep command note 4 5 - 50 s tdis(TxD) disable time of TxD permanent dominant timer normal operating mode; VTXD = 0 V 0.75 - 4 ms tCANH dominant time for remote wake-up low power modes; VBAT = 12 V; on pin CANH note 4 7 - 38 s tCANL dominant time for remote wake-up low power modes; VBAT = 12 V; on pin CANL note 4 7 - 38 s tWAKE required time on pin WAKE for local wake-up low power modes; VBAT = 12 V; for wake-up after receiving a falling or rising edge; note 4 7 - 38 s tdet failure detection time normal operating mode failures 3 and 3a 1.6 - 8.0 ms failures 4, 6 and 7 0.3 - 1.6 ms failures 3 and 3a 1.6 - 8.0 ms failures 4 and 7 0.1 - 1.6 ms low power modes; VBAT = 12 V 2004 Mar 23 14 Philips Semiconductors Product specification Fault-tolerant CAN transceiver SYMBOL trec PARAMETER failure recovery time TJA1054A CONDITIONS MIN. TYP. MAX. UNIT normal operating mode failures 3 and 3a 0.3 - 1.6 ms failures 4 and 7 7 - 38 s failure 6 125 - 750 s 0.3 - 1.6 ms low power modes; VBAT = 12 V failures 3, 3a, 4 and 7 Ndet pulse-count difference between CANH and CANL for failure detection normal operating mode and failures 1, 2, 5 and 6a; pin ERR becomes LOW - 4 - Nrec number of consecutive pulses on CANH and CANL simultaneously for failure recovery failures 1, 2, 5 and 6a - 4 - Notes 1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at Tamb = 125 C for dies on wafer level, and above this for cased products 100% tested at Tamb = 25 C, unless otherwise specified. 2. For bare die, all parameters are only guaranteed if the back side of the die is connected to ground. 3. A local or remote wake-up event will be signalled at the transceiver pins RXD and NERR if VBAT = 5.3 V to 27 V (see Table 2). 4. To guarantee a successful mode transition under all conditions, the maximum specified time must be applied. handbook, full pagewidth VCC VTXD 0V VCANL 5V 3.6 V 1.4 V VCANH 0V 2.2 V -3.2 V -5 V Vdiff VRXD 0.7VCC 0.3VCC tPD(H) tPD(L) Vdiff = VCANH - VCANL. Fig.4 Timing diagram for dynamic characteristics. 2004 Mar 23 15 MGL424 Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A TEST AND APPLICATION INFORMATION +5 V handbook, full pagewidth INH WAKE VCC BAT 1 14 10 7 TXD 8 2 STB 12 11 9 3 13 20 pF C1 CANL C2 6 RXD R1 TJA1054A 5 EN RTH CANH RTL R1 4 GND C1 ERR MGU381 Termination resistors R1 (100 ) are not connected to pin RTH or pin RTL for testing purposes because the minimum load allowed on the CAN bus lines is 500 per transceiver. The capacitive bus load of 10 nF is split into 3 equal capacitors (3.3 nF) to simulate the bus cable. Fig.5 Test circuit for dynamic characteristics. +12 V handbook, full pagewidth +5 V 10 F INH WAKE TXD STB EN RXD 1 14 10 7 8 5 125 RTH 1 nF 511 2 12 CANL 1 nF TJA1054A 11 6 9 3 GND 4 GENERATOR CANH 511 13 20 pF VCC BAT 1 nF RTL 125 1 nF ERR MGU382 The waveforms of the applied transients on pins CANH and CANL will be in accordance with "ISO 7637 part 1": test pulses 1, 2, 3a and 3b. Fig.6 Test circuit for automotive transients. 2004 Mar 23 16 Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A VBAT handbook, full pagewidth BATTERY VDD P8xC592/P8xCE598 +5 V CAN CONTROLLER +5 V CTX0 CRXO TXD WAKE 2 7 Px.x RXD Px.x STB 3 Px.x ERR 5 4 EN INH 6 1 14 TJA1054A 10 CAN TRANSCEIVER 13 8 11 RTH 12 CANH CANL BAT VCC GND 100 nF 9 RTL CAN BUS LINE MGU380 For more information: please refer to the separate FTCAN information available from our web site. Fig.7 Application diagram. 2004 Mar 23 17 Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A BONDING PAD LOCATIONS COORDINATES(1) SYMBOL PAD x y INH 1 106 317 TXD 2 111 168 RXD 3 750 111 ERR 4 1347 111 STB 5 2248 103 EN 6 2551 240 WAKE 7 2559 381 RTH 8 2463 1443 RTL 9 2389 1840 VCC 10 1886 1809 CANH 11 900 1698 CANL 12 401 1698 GND 13a 80 1356 GND 13b 80 1241 BAT 14 105 772 Note 1. All coordinates (m) represent the position of the centre of each pad with respect to the bottom left-hand corner of the top aluminium layer (see Fig.8). handbook, full pagewidth 9 10 12 11 8 13a 13b 1990 m TJA1054AU 14 7 1 2 x 0 6 3 4 5 0 y 2730 m MGU384 Fig.8 Bonding pad locations. 2004 Mar 23 18 Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A APPENDIX A Overview of differences between the TJA1054 and the TJA1054A Limiting values TJA1054 SYMBOL PARAMETER TJA1054A CONDITIONS UNIT MIN. MAX. MIN. MAX. VCANH CANH bus line voltage -40 +40 -27 +40 V VCANL CANL bus line voltage -40 +40 -27 +40 V Vesd electrostatic discharge voltage pins RTH, RTL, CANH, and CANL -2 +2 -4 +4 kV all other pins -2 +2 -2 +2 kV -175 +175 -300 +300 V human body model machine model any pin Bare die PARAMETER TJA1054 TJA1054A Dimensions 1990 x 2700 1990 x 2730 Bonding pad coordinates note 1 note 1 Note 1. The bonding pad coordinates partly differ between the TJA1054 and the TJA1054A. 2004 Mar 23 19 UNIT m Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A PACKAGE OUTLINE SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index Lp 1 L 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.010 0.057 inches 0.069 0.004 0.049 0.05 0.244 0.039 0.041 0.228 0.016 0.028 0.024 0.01 0.01 0.028 0.004 0.012 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06 MS-012 2004 Mar 23 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 20 o 8 o 0 Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A If wave soldering is used the following conditions must be observed for optimal results: SOLDERING Introduction to soldering surface mount packages * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. * below 225 C (SnPb process) or below 245 C (Pb-free process) Manual soldering - for all BGA, HTSSON-T and SSOP-T packages Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. * below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. 2004 Mar 23 21 Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE(1) WAVE REFLOW(2) BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA, USON, VFBGA not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable(4) suitable PLCC(5), SO, SOJ suitable suitable not recommended(5)(6) suitable SSOP, TSSOP, VSO, VSSOP not recommended(7) suitable CWQCCN..L(8), PMFP(9), WQCCN..L(8) not suitable LQFP, QFP, TQFP not suitable Notes 1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. 9. Hot bar or manual soldering is suitable for PMFP packages. 2004 Mar 23 22 Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A REVISION HISTORY REV 3 DATE 20040323 CPCN 200310013C DESCRIPTION Product specification (9397 750 11722) Modification: * Add VBAT = 5.3 V to 27 V condition for correct signalling of local or remote wake-up event at transceiver pins RXD and ERR. * Mode control diagram, Fig.3, completed. * Recommendation added, to connect a not used pin WAKE to pin BAT. * Reference of bond pad coordinates changed from the bottom left-hand corner of the die, to the bottom left-hand corner of the top aluminium layer. * Change of bare die dimension. * Add Chapter REVISION HISTORY. 2 20011120 - Product specification (9397 750 08321) DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) DEFINITION I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 2004 Mar 23 23 Philips Semiconductors Product specification Fault-tolerant CAN transceiver TJA1054A DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Bare die All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used. 2004 Mar 23 24 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. SCA76 (c) Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R16/03/pp25 Date of release: 2004 Mar 23 Document order number: 9397 750 11722