DF005S thru DF10S
FEATURES
Rating to 1000V PRV
Ideal for printed circuit board
Low forward voltage drop high current capability.
Reliable low cost construction utilizing molded plastic
technique results in inexp ensiv e product
The plastic material has UL flammability classification
94V-0
UL recognized file # E95060
MECHANICAL DATA
Polarity :As marked on Body
Weight : 0.02 ounces, 0. 38 grams
Mounting position : Any
MAXIM UM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25
℃
ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%
DF-S
A
C
D
E
F
G
H
B
J
I
All Dimensions in millim et er
DF-S
DIM. MIN. MAX.
A
C
D
E
F
G
H
B8.20 8.50
6.506.20 10.30
7.90
7.40
2.40 2.60
5.0 0 5.20
1.0 0
0.22 .330
J
I .076
1.53 1.02
DF10SDF08SDF06SDF04SDF02SDF005S DF01S
CHARACTERISTICS SYMBOL
1000
700
1000
800
560
800
600
420
600
400
280
400
200
140
200
50
35
50
100
70
100
V
RMS
V
DC
V
RRM
I
(AV)
I
FSM
V
F
@T
A
=
40 C
Maximum Av erage Forward
Rectified Current
Peak Forward Surge Current
8.3ms single half sine-wave
superimposed on rated load (JEDEC METHOD)
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum forward Voltage at 1.0A DC
1.0
50
1.1
T
J
Operating Temperature Range
-55 to +150 C
T
STG
Storage Tem perature Range
-55 to +150 C
Typical Thermal Resistance (Note 2)
R
0JA
40
C/W
I
R
Maximum DC Reverse Current
at Rated DC Blocking Voltage
@T
J
=125 C
@T
J
=25 C 10
500
uA
V
A
A
V
UNIT
V
V
10.4
A S
2
I t
2
I t Rating for fusing (t < 8.3ms)
2
C
J
25
pF
Typical Junction
Capacitance per element (Note 1)
NOTES : 1.Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
2.Thermal resistanc e from junction to ambient mounted on P.C.B
with 0.5x0.5"(13x13mm) copper pads.
0.30
SURFAC E MOUNT
GLASS PASSIV ATED BRIDGE RE CTIFIERS
REVERSE VOLTAGE
- 50
to
100 0
Volts
FOR WARD CURRENT
- 1.0
Amperes
SEMICONDUCTOR
LITE-ON
REV. 4, Apr-2005, KBDA01