MC74LCX06DTR2G - ON Semiconductor

July, 2012 − Rev. 9

1Publication Order Number:

MC74LCX06/D

MC74LCX06

Low-Voltage CMOS Hex

Inverter with Open Drain

Outputs

With 5 V − Tolerant Inputs

The MC74LCX06 is a high performance hex inverter operating

from a 2.3 V to 3.6 V supply. High impedance TTL compatible inputs

significantly reduce current loading to input drivers. These LCX

devices have open drain outputs which provide the ability to set output

levels, or do active−HIGH AND or active−LOW OR functions. A VI

specification of 5.5 V allows MC74LCX06 inputs to be safely driven

from 5.0 V devices.

Features

•Designed for 2.3 V to 3.6 V VCC Operation

•5.0 V Tolerant Inputs/Outputs

•LVTTL Compatible

•LVCMOS Compatible

•24 mA Output Sink Capability

•Near Zero Static Supply Current (10 mA) Substantially Reduces

System Power Requirements

•Latchup Performance Exceeds 500 mA

•Wired−OR, Wired−AND

•Output Level Can Be Set Externally Without Affecting Speed of

Device

•Functionally Compatible with LCX05

•ESD Performance: Human Body Model >1500 V;

Machine Model >200 V

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

1314 12 11 10 9 8

21 34567

VCC A3 O3 A4 O4 A5 O5

A0 O0 A1 O1 A2 O2 GND

Figure 1. Pinout: 14−Lead (Top View)

MARKING

DIAGRAMS

A = Assembly Location

WL, L = Wafer Lot

Y = Year

WW, W = Work Week

G or G= Pb−Free Package

See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

ORDERING INFORMATION

TSSOP−14

DT SUFFIX

CASE 948G

SOIC−14

D SUFFIX

CASE 751A

LCX

ALYWG

LCX06G

AWLYWW

http://onsemi.com

(Note: Microdot may be in either location)

MC74LCX06

http://onsemi.com

2O0

4O1

6O2

12 O3

10 O4

8O5

Figure 2. Logic Diagram

* OD

Table 1. PIN NAMES

Pins Function

Data Inputs

Outputs

Table 2. TRUTH TABLE

An On

MAXIMUM RATINGS

Symbol Parameter Value Condition Unit

VCC DC Supply Voltage −0.5 to +7.0 V

VIDC Input Voltage −0.5 ≤ VI ≤ +7.0 V

VODC Output Voltage −0.5 ≤ VO ≤ +7.0 Output in HIGH or LOW State (Note 1) V

IIK DC Input Diode Current −50 VI < GND mA

IOK DC Output Diode Current −50 VO < GND mA

+50 VO > VCC mA

IODC Output/Sink Current +50 mA

ICC DC Supply Current Per Supply Pin ±100 mA

IGND DC Ground Current Per Ground Pin ±100 mA

TSTG Storage Temperature Range −65 to +150 °C

MSL Moisture Sensitivity Level 1

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit

values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.

1. IO absolute maximum rating must be observed.

ORDERING INFORMATION

Device Package Shipping†

MC74LCX06DG SOIC−14

(Pb−Free)

55 Units / Rail

MC74LCX06DR2G SOIC−14

(Pb−Free)

2500 / Tape & Reel

MC74LCX06DTG TSSOP−14

(Pb−Free)

96 Units / Rail

MC74LCX06DTR2G TSSOP−14

(Pb−Free)

2500 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

MC74LCX06

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RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Typ Max Unit

VCC Supply Voltage Operating

Data Retention Only

2.0

1.5

2.5, 3.3

3.6

VIInput Voltage 0 5.5 V

VOOutput Voltage (HIGH or LOW State) 0 VCC V

IOL LOW Level Output Current VCC = 3.0 V − 3.6 V

Sink VCC = 2.7 V − 3.0 V

VCC = 2.3 V − 2.7 V

+24

+12

TAOperating Free−Air Temperature −40 +85 °C

Dt/DVInput Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V

DC ELECTRICAL CHARACTERISTICS (TA = −40°C to +85°C)

Symbol Characteristic Condition Min Max Unit

VIH HIGH Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 1.7 V

2.7 V ≤ VCC ≤ 3.6 V 2.0

VIL LOW Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 0.7 V

2.7 V ≤ VCC ≤ 3.6 V 0.8

VOL LOW Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA0.2 V

VCC = 2.3 V; IOL= 8 mA 0.3

VCC = 2.7 V; IOL= 12 mA 0.4

VCC = 3.0 V; IOL = 16 mA 0.4

VCC = 3.0 V; IOL = 24 mA 0.55

IOZ 3−State Output Current VCC = 3.6 V, VIN = VIH or VIL,

VOUT = 0 to 3.6 V

±5mA

IOFF Power Off Leakage Current VCC = 0, VIN = 3.6 V or VOUT = 3.6 V 10 mA

IIN Input Leakage Current VCC = 0 to 3.6 V, VIN = 3.6 V or GND ±5mA

ICC Quiescent Supply Current VCC = 3.6 V, VIN = 3.6 V or VOUT = 3.6 V 10 mA

DICC Increase in ICC per Input 2.3 V ≤ VCC ≤ 3.6 V

One Input at VIH = VCC − 0.6 V

500 mA

2. These values of VI are used to test DC electrical characteristics only.

AC ELECTRICAL CHARACTERISTICS (TA = −40°C to +85°C)

Symbol Parameter

VCC = 3.3 V ± 0.3 V

CL = 50 pF

VCC= 2.7 V

CL = 50 pF

VCC = 2.5 V ± 0.2 V

CL = 30 pF

Unit

Min Max Min Max Min Max

tPLZ

tPZL

Propagation Delay

Input to Output

0.8

3.7

1.0

4.1

0.8

3.5

DYNAMIC SWITCHING CHARACTERISTICS (TA = +25°C)

Symbol Characteristic Condition Min Typ Max Unit

VOLP Dynamic LOW Peak Voltage (Note 3) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V

VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V

0.9

0.7

VOLV Dynamic LOW Valley Voltage (Note 3) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V

VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V

−0.8

−0.6

3. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is

measured in the LOW state.

MC74LCX06

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CAPACITIVE CHARACTERISTICS

Symbol Parameter Condition Typical Unit

CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF

COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF

CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF

PROPAGATION DELAYS

tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns

VCC

0 V

VLZ

tPLZ

tPZL

Vmi

Vmo

VOL

Vmi

Table 3. AC WAVEFORMS

Symbol

VCC

3.3 V $ 0.3 V 2.7 V 2.5 V $ 0.2 V

Vmi 1.5 V 1.5 V VCC / 2

Vmo 1.5 V 1.5 V VCC / 2

VLZ VOL + 0.3 V VOL + 0.3 V VOL + 0.15 V

PULSE

GENERATOR

DUT

VCC

6 V or VCC × 2

GND

Table 4. TEST CIRCUIT

TEST SWITCH

tPZL, tPLZ 6 V

Open Collector/Drain tPLH and tPHL 6 V

tPZH, tPHZ GND

CL= 50 pF at VCC = 3.3 $ 0.3 V or equivalent (includes jig and

probe capacitance)

CL= 30 pF at VCC = 2.5 $ 0.2 V or equivalent (includes jig and

probe capacitance)

RL= R1 = 500 W or equivalent

RT= ZOUT of pulse generator (typically 50 W)

MC74LCX06

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PACKAGE DIMENSIONS

TSSOP−14

DT SUFFIX

CASE 948G−01

ISSUE B

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A4.90 5.10 0.193 0.200

B4.30 4.50 0.169 0.177

C−−− 1.20 −−− 0.047

D0.05 0.15 0.002 0.006

F0.50 0.75 0.020 0.030

G0.65 BSC 0.026 BSC

H0.50 0.60 0.020 0.024

J0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L6.40 BSC 0.252 BSC

M0 8 0 8

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL

NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

____

U0.15 (0.006) T

2X L/2

0.10 (0.004) V S

L−U−

SEATING

PLANE

0.10 (0.004)

−T−

ÇÇÇ

SECTION N−N

DETAIL E

JJ1

ÉÉÉ

DETAIL E

−W−

0.25 (0.010)

PIN 1

IDENT.

U0.15 (0.006) T

−V−

14X REFK

7.06

14X

0.36 14X

1.26

0.65

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

MC74LCX06

http://onsemi.com

PACKAGE DIMENSIONS

SOIC−14

D SUFFIX

CASE 751A−03

ISSUE J

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.127

(0.005) TOTAL IN EXCESS OF THE D

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

−A−

−B−

P7 PL

14 8

0.25 (0.010) B M

0.25 (0.010) A S

−T−

RX 45

SEATING

PLANE D14 PL K

_DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A8.55 8.75 0.337 0.344

B3.80 4.00 0.150 0.157

C1.35 1.75 0.054 0.068

D0.35 0.49 0.014 0.019

F0.40 1.25 0.016 0.049

G1.27 BSC 0.050 BSC

J0.19 0.25 0.008 0.009

K0.10 0.25 0.004 0.009

M0 7 0 7

P5.80 6.20 0.228 0.244

R0.25 0.50 0.010 0.019

__ __

7.04

14X

0.58

14X

1.52

1.27

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

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Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

MC74LCX06/D

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