HT36B0 8-Bit Music Synthesizer MCU Features * Operating voltage: 3.6V~5.0V * Polyphonic up to 16 notes * Operating frequency: 3.58MHz~12MHz, * Independent pan and volume mix can be assigned to RC typ. 11.059MHz each sound component * 36 bidirectional I/O lines * Sampling rate of 44.1kHz as 11.059MHz for system frequency * Two 16-bit programmable timer/event counters with * Eight-level subroutine nesting overflow interrupts * Watchdog Timer * HALT function and wake-up feature to reduce power consumption * Built-in 8-bit MCU with 7688 bits RAM * Bit manipulation instructions * Built-in 256K16-bit ROM for program/data shared * 16-bit table read instructions * Digital output pins for external DAC * 63 powerful instructions * Single data format with 16 bits digital stereo audio * All instructions in 1 or 2 machine cycles output * MIDI interface available * UART input/output 31.25kbps * Two High D/A converter resolution: 16 bits * 28-pin SOP, 64-pin QFP package General Description The HT36B0 is an 8-bit high performance RISC-like microcontroller specifically designed for music applications. It provides an 8-bit MCU and a 16 channel wavetable synthesizer. The program ROM is composed of both program control codes and wavetable voice codes, and can be easily programmed. The HT36B0 has a built-in 8-bit microprocessor which programs the synthesizer to generate the melody by setting the special register from 20H~2AH. A HALT feature is provided to reduce power consumption. Block Diagram P A P B P C P D P E 0 ~ 0 ~ 0 ~ 0 ~ 0 ~ P A P B P C P D P E 7 7 7 7 8 - B it M C U 7 6 8 8 R A M M u ltip lie r /P h a s e G e n e ra l S te re o 1 6 - B it D A C R C H L C H D C L K 1 L O A D D O U T Rev. 1.00 V D D V D D A V S S V S S A 3 IN T O S C 1 O S C 2 M ID I_ IN M ID I_ O U T M ID I_ T H R U R E S 2 5 6 K 1 6 - b it R O M June 30, 2003 HT36B0 Pin Assignment M ID I_ O U T 4 2 5 V D D A M ID I_ T H R U 5 2 4 L C H M ID I_ IN 6 2 3 R C H N C 7 2 2 N C N C 8 2 1 N C N C 9 2 0 IN T N C 1 0 1 9 P A 0 N C 1 1 1 8 P A 1 P A 7 1 2 1 7 P A 2 P A 6 1 3 1 6 P A 3 P A 5 1 4 1 5 P A 4 1 5 1 P E 2 L C H 2 5 0 P E 3 V D D A 3 4 9 IN T V S S A 4 4 8 P A 0 O S C 2 5 4 7 P A 1 O S C 1 6 4 6 P A 2 V S S 7 4 5 P A 3 V D D 8 4 4 P A 4 R E S 9 4 3 P A 5 4 2 P A 6 4 1 P A 7 H T 3 6 B 0 6 4 Q F P -A M ID I_ O U T 1 0 M ID I_ T H R U 1 1 M ID I_ IN 1 2 4 0 P B 0 P C 7 1 3 3 9 P B 1 P C 6 1 4 3 8 P B 2 P C 5 1 5 3 7 P B 3 P C 4 1 6 3 6 P B 4 P C 3 1 7 3 5 P B 5 P C 2 1 8 3 4 P B 6 N C 1 9 3 3 P B 7 2 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 3 0 3 1 3 2 P C 0 P C 1 N C N C N C N C N C N C N C N C N C 2 N C N C H T 3 6 B 0 2 8 S O P -A Rev. 1.00 P E 1 V S S A P E 0 2 6 P D 7 3 P D 6 R E S P D 5 O S C 2 P D 4 2 7 P D 3 2 P D 2 V D D P D 1 O S C 1 P D 0 2 8 D O U T D C K 1 L O A D V S S 6 4 6 3 6 2 6 1 6 0 5 9 5 8 5 7 5 6 5 5 5 4 5 3 5 2 R C H June 30, 2003 HT36B0 Pad Assignment V S S A V D D A L C H R C H 4 3 O S C 2 4 4 V S S 4 6 4 5 O S C 1 4 7 R E S 4 8 V D D 4 9 M ID I_ O U T P C 6 P C 5 5 0 M ID I_ T H R U P C 4 5 1 M ID I_ IN P C 3 5 2 P C 7 P C 2 1 4 2 4 1 4 0 3 9 3 8 3 7 3 6 (0 , 0 ) P C 1 D C K 3 4 L O A D 3 3 D O U T 3 2 P D 0 3 1 P D 1 3 0 P D 2 2 9 P D 3 2 8 P D 4 2 7 P D 5 2 6 P D 6 2 5 P D 7 2 4 P E 0 2 3 P E 1 2 2 P E 2 2 3 P C 0 P B 7 3 5 4 1 5 1 6 1 7 1 8 1 9 P A 5 P A 4 P A 3 P A 2 P A 0 2 0 2 1 IN T 1 4 P E 3 1 3 P A 1 1 2 P A 6 1 1 P A 7 1 0 P B 0 9 P B 1 8 P B 2 P B 5 P B 6 7 P B 3 6 P B 4 5 Chip size: 132.5 194.7 (mil) * The IC substrate should be connected to VSS in the PCB layout artwork. Rev. 1.00 3 June 30, 2003 HT36B0 Pad Coordinates Unit: mm Pad No. X Y Pad No. X 1 2 Y -1496.60 2302.60 27 1515.85 85.70 -1517.35 -1856.15 28 1515.85 196.30 3 -1517.35 -1966.75 29 1515.85 296.30 4 -1517.35 -2066.75 30 1515.85 406.90 5 -1496.90 -2307.35 31 1515.85 506.90 6 -1396.90 -2307.35 32 1515.85 617.50 7 -1286.30 -2307.35 33 1515.85 717.75 8 -1186.30 -2307.35 34 1515.85 825.85 9 -1075.70 -2307.35 35 1515.85 926.35 10 -975.70 -2307.35 36 1517.85 2262.00 11 -2307.35 37 1404.55 2262.00 12 -865.10 546.65 -2307.35 38 1292.11 2262.00 13 657.25 -2307.35 39 1143.45 2262.00 14 757.25 -2307.35 40 975.076 2282.60 15 867.85 -2307.35 41 294.224 2282.60 16 967.85 -2307.35 42 176.10 2300.10 17 1078.45 -2307.35 43 -431.00 2300.10 18 1178.45 -2307.35 44 -547.124 2302.60 19 1289.05 -2307.35 45 -654.20 2302.60 20 1391.25 -2307.35 46 -754.20 2302.60 21 1499.65 -2307.35 47 -864.80 2302.60 22 1515.85 -435.50 48 -964.80 2302.60 23 1515.85 -335.50 49 -1075.40 2302.60 24 1515.85 -224.90 50 -1175.40 2302.60 25 1515.85 -124.90 51 -1286.00 2302.60 26 1515.85 -14.30 52 -1386.00 2302.60 Pad Description I/O Internal Connection PA7~PA0 I/O Pull-High or None Bidirectional 8-bit Input/Output port, wake-up by mask option PB7~PB0 I/O Pull-High or None Bidirectional 8-bit Input/Output port PC7~PC0 I/O Pull-High or None Bidirectional 8-bit Input/Output port PD0~PD7 I/O Pull-High or None Bidirectional 8-bit Input/Output port PE0~PE3 I/O Pull-High or None Bidirectional 4-bit Input/Output port External interrupt Pad Name Function INT I Pull-High DOUT O 3/4 DAC data out LOAD O 3/4 DAC word clock DCLK O 3/4 DAC bit clock RCH O 3/4 R channel audio output LCH O 3/4 L channel audio output Rev. 1.00 4 June 30, 2003 HT36B0 I/O Internal Connection VDDA 3/4 3/4 DAC power supply VSSA 3/4 3/4 Negative power supply of DAC, ground OSC1 OSC2 I O 3/4 OSC1 and OSC2 are connected to an RC network or a crystal (by mask option) for the internal system clock. In the case of RC operation, OSC2 is the output terminal for 1/8 system clock. The system clock may come from the crystal, the two pins cannot be floating. GND 3/4 3/4 Negative power supply, ground VDD 3/4 3/4 Positive power supply RES I 3/4 Reset input, active low MIDI_OUT O 3/4 MIDI Output MIDI_THRN O 3/4 MIDI through MIDI_IN I 3/4 MIDI input Pad Name Function Absolute Maximum Ratings Supply Voltage .............................VSS-0.3V to VSS+6V Storage Temperature ...........................-50C to 125C Input Voltage .............................VSS-0.3V to VDD+0.3V Operating Temperature ..........................-25C to 70C Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maximum Ratings may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. D.C. Characteristics Symbol Ta=25C Parameter Test Conditions VDD Conditions Min. Typ. Max. Unit VDD Operating Voltage 3/4 3/4 3.6 4.5 5.5 V IDD Operating Current 4.5V No load, fOSC=11.0592MHz 3/4 16 32 mA ISTB Standby Current (WDT Disabled) 4.5V No load, System HALT 3/4 1 3 mA IOH I/O Ports Source Current 4.5V VOH=4.5V 5 3/4 3/4 mA IOL I/O Ports Sink Current 4.5V VOL=0.5V 5 3/4 3/4 mA VIH Input High Voltage for I/O Ports 4.5V 3/4 0.8VDD 3/4 VDD V VIL Input Low Voltage for I/O Ports 4.5V 3/4 0 3/4 0.2VDD V RPH Pull-High Resistance of I/O Ports (INT) 4.5V VIL=0V 3/4 30 3/4 kW Rev. 1.00 5 June 30, 2003 HT36B0 A.C. Characteristics Symbol Test Conditions Parameter VDD Conditions 11.059MHz crystal Min. Typ. Max. Unit 3/4 11.059 3/4 MHz MCU interface fOSC System Frequency 5V fSYS System Clock 5V 3/4 8 3/4 12 MHz tWDT Watchdog Time-Out Period (RC) 3/4 Without WDT prescaler 9 17 35 ms tRES External Reset Low Pulse Width 3/4 3/4 1 3/4 3/4 ms Symbol Parameter Figure Min. Typ. Max. Unit DAC interface fBC DCK Bit Clock Frequency Fig 1 3/4 fSYS/16 3/4 MHz tCH DCK Bit Clock H Level Time Fig 1 600 3/4 3/4 ns tDOS Data Output Setup Time Fig 1 200 3/4 3/4 ns tDOH Data Output Hold Time Fig 1 200 3/4 3/4 ns tLCS Load Clock Setup Time Fig 1 200 3/4 3/4 ns tLCH Load Clock Hold Time Fig 1 200 3/4 3/4 ns 1 /fB C D C L K tC D O U T V O H V O L H tD O S tD O H V O H V O L V O H V O L L S B tL C H tL L O A D C S Fig 1. Audio output timing Rev. 1.00 6 June 30, 2003 HT36B0 Application Circuit V D D V 1 0 W 4 7 m F 0 .1 m F V D D A 4 7 m F V D D L C H 0 .1 m F 2 2 0 k W V P E 0 ~ P E 3 D D 4 7 m F D D R C H 0 .1 m F 2 0 k W 1 0 0 k W R E S O U T P C E P D 0 ~ P D 7 V S S A 0 .1 m F S P K 8 W 7 V S S 4 5 P B 0 ~ P B 7 O S C 2 O U T N 1 H T 8 2 V 7 3 3 P C 0 ~ P C 7 1 1 .0 5 9 M H z V IN 8 V D D V re f 3 1 m F P A 0 ~ P A 7 O S C 1 D D 1 0 m F V S S 2 IN 8 V D D O U T N 1 H T 8 2 V 7 3 3 V re f 3 5 V S S 4 S P K 8 W 7 O U T P C E H T 3 6 B 0 V D D 1 0 W 4 7 m F 0 .1 m F V D D A V D D V D D S P K 8 W 1 k W L C H 7 5 0 W P A 0 ~ P A 7 O S C 1 P B 0 ~ P B 7 P C 0 ~ P C 7 V P D 0 ~ P D 7 V P E 0 ~ P E 3 D D 1 0 0 k W R E S 7 5 0 W V S S A 0 .1 m F S P K 8 W 1 k W R C H D D V S S H T 3 6 B 0 Rev. 1.00 7 June 30, 2003 HT36B0 V D D 1 0 W 4 7 m F 0 .1 m F V D D A V D D P A 0 ~ P A 7 P B 0 ~ P B 7 P C 0 ~ P C 7 P D 0 ~ P D 7 P E 0 ~ P E 3 O S C 1 M ID I_ IN M ID I_ O U T M ID I_ T H R U 1 1 .0 5 9 M H z O S C 2 V D D D O U T L O A D D C L K 1 0 0 k W M ID I D e v ic e D A C O P H T 8 2 V 7 3 1 R E S V S S A 0 .1 m F V S S H T 3 6 B 0 Rev. 1.00 8 June 30, 2003 HT36B0 Package Information 28-pin SOP (300mil) Outline Dimensions 2 8 1 5 A B 1 1 4 C C ' G H D E Symbol Rev. 1.00 a F Dimensions in mil Min. Nom. Max. A 394 3/4 419 B 290 3/4 300 C 14 3/4 20 C 697 3/4 713 D 92 3/4 104 E 3/4 50 3/4 F 4 3/4 3/4 G 32 3/4 38 H 4 3/4 12 a 0 3/4 10 9 June 30, 2003 HT36B0 64-pin QFP (1420) Outline Dimensions C H D 5 1 G 3 3 I 5 2 3 2 F A B E 2 0 6 4 K a J 1 Symbol Rev. 1.00 1 9 Dimensions in mm Min. Nom. Max. A 18.80 3/4 19.20 B 13.90 3/4 14.10 C 24.80 3/4 25.20 D 19.90 3/4 20.10 E 3/4 1 3/4 F 3/4 0.40 3/4 G 2.50 3/4 3.10 H 3/4 3/4 3.40 I 3/4 0.10 3/4 J 1.15 3/4 1.45 K 0.10 3/4 0.20 a 0 3/4 7 10 June 30, 2003 HT36B0 Product Tape and Reel Specifications Reel Dimensions D T 2 A C B T 1 SOP 28W (300mil) Symbol Description Dimensions in mm A Reel Outer Diameter 3301.0 B Reel Inner Diameter 621.5 C Spindle Hole Diameter 13.0+0.5 -0.2 D Key Slit Width 2.00.5 T1 Space Between Flange 24.8+0.3 -0.2 T2 Reel Thickness 30.20.2 Rev. 1.00 11 June 30, 2003 HT36B0 Carrier Tape Dimensions P 0 D P 1 t E F W C D 1 B 0 P K 0 A 0 SOP 28W (300mil) Symbol Description Dimensions in mm W Carrier Tape Width 24.00.3 P Cavity Pitch 12.00.1 E Perforation Position 1.750.1 F Cavity to Perforation (Width Direction) 11.50.1 D Perforation Diameter 1.5+0.1 D1 Cavity Hole Diameter 1.5+0.25 P0 Perforation Pitch 4.00.1 P1 Cavity to Perforation (Length Direction) 2.00.1 A0 Cavity Length 10.850.1 B0 Cavity Width 18.340.1 K0 Cavity Depth 2.970.1 t Carrier Tape Thickness 0.350.01 C Cover Tape Width Rev. 1.00 21.3 12 June 30, 2003 HT36B0 Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shanghai Sales Office) 7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China 200233 Tel: 021-6485-5560 Fax: 021-6485-0313 http://www.holtek.com.cn Holtek Semiconductor Inc. (Shenzhen Sales Office) 43F, SEG Plaza, Shen Nan Zhong Road, Shenzhen, China 518031 Tel: 0755-8346-5589 Fax: 0755-8346-5590 ISDN: 0755-8346-5591 Holtek Semiconductor Inc. (Beijing Sales Office) Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031 Tel: 010-6641-0030, 6641-7751, 6641-7752 Fax: 010-6641-0125 Holmate Semiconductor, Inc. (North America Sales Office) 46712 Fremont Blvd., Fremont, CA 94538 Tel: 510-252-9880 Fax: 510-252-9885 http://www.holmate.com Copyright O 2003 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holteks products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.00 13 June 30, 2003