TLP7820(B.E(O - TOSHIBA - Datasheet.Directory

TMP96C141B

I 2008-02-20

Document Change Notification

The purpose of this notification is to inform customers about the launch of the Pb-free version of the

device. The introduction of a Pb-free replacement affects the datasheet. Please understand that this

notification is intended as a substitute for a revision of the datasheet.

Changes to the datasheet may include the following, though not all of them may apply to this

particular device.

1. Part number

Example: TMPxxxxxxF → TMPxxxxxxFG

All references to the previous part number were left unchanged in body text. The new

part number is indicated on the prelims pages (cover page and this notification).

2. Package code and package dimensions

Example: LQFP100-P-1414-0.50C → LQFP100-P-1414-0.50F

All references to the previous package code and package dimensions were left unchanged

in body text. The new ones are indicated on the prelims pages.

3. Addition of notes on lead solderability

Now that the device is Pb-free, notes on lead solderability have been added.

4. RESTRICTIONS ON PRODUCT USE

The previous (obsolete) provision might be left unchanged on page 1 of body text. A new

replacement is included on the next page.

5. Publication date of the datasheet

The publication date at the lower right corner of the prelims pages applies to the new

device.

TMP96C141B

II 2008-02-20

1. Part number

Previous Part Num ber (in Bod y Text) New Part Numbe r

TMP96C141BF TMP96C141BFG

2. Package code and dimensions

Previous Package Code (in Body Text) New Pack age Code

QFP80-P-1420-0.80 QFP80-P-1420-0.80M

*: For the dimensions of the new package, see the attached Package Dimensions diagram.

3. Addition of notes on lead solderability

The following solderability test is conducted on the new device.

Solderability of lead free products

Test Parameter Test Condition Note

Use of S n-3 7Pb solde r Bat h

Solder bath temperature = 230°C, Dipping time = 5 seconds

The number of times = one, Use of R-type flux

Solderability Use of Sn-3.0Ag-0.5Cu solder bath

Solder bath temperature = 245°C, Dipping time = 5 seconds

The number of times = one, Use of R-type flux

(use of lead f ree)

Pass:

Solderability rate until forming

≥ 95%

4. RESTRICTIONS ON PRODUCT USE

The following replaces the “RESTRICTIONS ON PRODUCT USE” on page 1 of body text.

5. Publication date of the datasheet

The publication date of this datasheet is printed at the lower right corner of this notification.

RESTRICTION S ON PRODUCT USE 20070701-EN

• The information contained her ein i s subject to change without notice.

• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor

devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical

stress. It is th e re s ponsibility of the b uyer, whe n utilizing TOSHIBA products , to comply with th e standards of safety

in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such

TOSHIBA products could caus e los s of human life, bodily injury or damage to propert y.

In devel oping your designs, please ensure t hat TOSHIBA products ar e used wi thin s pecified o perating ra nges as

set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and

conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability

Handbook” etc.

• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer ,

personal equipme nt, office equipment, measuring equi pment, industri al robotics, domestic appli ances, etc.).These

TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high

quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury

(“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship

instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical

instruments, all types of safety devic es, etc. . Unintended Usa ge of TOSHIBA products li sted in his document shall

be m ade at the customer’s own r is k.

• The products described in this document shall not be used or embedded to any downstream products of which

manufacture, use and/ or sale are prohibited under any applicable laws and regul ations.

• The informatio n con tain ed he rein is pre sented only as a guide fo r the app licatio ns of o ur prod ucts. N o respo nsib ility

is assumed by TOSHIBA for any infringements of patents or other right s of the third parties which may result from its

use. No license is gr anted b y implication or otherwise under any patents or other r ights of TOSHIBA or the third

parties.

• Please contact your sales representative for product-by-product details in this document regarding RoHS

compatibility . Please use these products in this document in compliance with all applicable laws and regulations that

regula te the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring

as a result of noncompliance with applicable laws and regulations.

• For a disc ussion of h ow the relia bility of micro cont roller s can b e p redicted , plea se re fer to S ection 1.3 of th e chap te r

entitled Quality and Reliability Assurance/Handling Precautions.