Ver 201208
FEATURES
APPLICATION
DIMENSION
Type Dimension [mm]
L W t d
05 1.0±0.05 0.5±0.05 0.5±0.05 0.25±0.1
DESCRIPTION
Chip
ChipChip
Chip Bead
BeadBead
Bead
For
ForFor
For GHz
GHzGHz
GHz noise
noisenoise
noise suppression
suppressionsuppression
suppression
RECOMMENDED LAND PATTERN
CIV05 Series (1005/ EIA 0402)
CIV Series have high impedance in aGHz band
and suppress GHz noise which is usually made
due to high frequency of the electronic appliances,
high speed and mass storage of the data.
Excellent solderability and high heat resistance for
either flow or reflow soldering
Monolithic inorganic material construction for high
reliability
0.40~0.50mm 0.40~0.50mm
0.45~0.55mm
0.45~0.55mm
High frequency EMI prevention application to
computers, printers, VCRs, TVs and mobile phones.
Part no. Impedance
(Ω)±25%@100MHz Impedance
(Ω)±40%@1GHz DC Resistance
(Ω)Max. Rated Current
(mA) Max.
CIV05U601 600 1000 0.7 300
CIV05U102 1000 1400 1.1 250
CIV05J102 1000 2000 1.25 250
CIV05J182 1800 2700 2.20 200
Ver 201208
CI V 05 U 102 N C
(1) (2) (3) (4) (5) (6) (7)
(1) Chip Beads (2) Multi-layer type for GHz Noies suppression
(3) Dimension (4) Material Code
(5) Nominal impedance (601:600Ω, 102:1000Ω)
(6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(7) Packaging(C:paper tape, E:embossed tape)
CHARACTERISTIC DATA
PRODUCT IDENTIFICATION
Ver 201208
■NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
PACKAGING
Packaging Style Quantity(pcs/reel)
Card Board Taping 4000
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING FLOW SOLDERING
