ZSC31150GAG1-R - ZMDI - Datasheet.Directory

Data Sheet

Rev. 2.41 / July 27, 2015

ZSC31150

Fast Automotive Sensor Signal Conditioner

Multi-Market Sensing Platforms

Precise and Deliberate

For more information, contact ZMDI via PRODUCT@ZMDI.COM.

ZSC31150

Fast Automotive Sensor Signal Conditioner

stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

Brief Description

The ZSC31150 is a CMOS integrated circuit for

highly accurate amplification and sensor-specific

correction of bridge sensor signals. Digital com-

pensation of sensor offset, sensitivity, temperature

drift, and non-linearity is accomplished via an inter-

nal 16-bit RISC microcontroller running a correction

algorithm, with calibration coefficients stored in an

EEPROM.

The ZSC31150 is adjustable to nearly all bridge sen-

sor types. Measured values are provided at the

analog voltage output or at the digital ZACwire™

and I²C™* interface. The digital interface can be

used for a simple PC-controlled calibration proce-

dure in order to program a set of calibration coeffi-

cients into an on-chip EEPROM. A specific sensor

and a ZSC31150 can be mated digitally: fast,

precise, and without the cost overhead associated

with trimming by external devices or a laser.

Features

 Digital compensation of sensor offset, sensitivity,

temperature drift, and non-linearity

 Adjustable to nearly all bridge sensor types

 Analog gain of up to 420

 Output options: ratiometric analog voltage output

(5% to 95% maximum, 12.4-bit resolution) or

ZACwire™ (digital one-wire-interface)

 Temperature compensation: internal or external

diode, bridge resistance, thermistor

 Sensor biasing by voltage or constant current

 Sample rate: up to 7.8kHz

 High voltage protection up to 33V

 Supply current: max. 5.5mA

 Reverse polarity and short-circuit protection

 Wide operation temperature depending on part

number: up to -40 to +150°C

 Traceability by user-defined EEPROM entries

 Safety and diagnostic functions

* I²C™ is a trademark of NXP.

Benefits

 No external trimming components required

 Only a few external protection devices needed

 PC-controlled configuration and single pass

calibration via I²C™ or ZACwire™ interface:

simple, cost efficient, quick, and precise

 End-of-line calibration via I²C™ or ZACwire™

interface

 High accuracy (0.25% FSO @ -25 to 85°C; 0.5%

FSO @ -40 to 125°C)

 Excellent EMC/ESD robustness and AEC-Q100

qualification

Available Support

 Evaluation Kits

 Application Notes

 Mass Calibration System

Physical Characteristics

 Supply voltage: 4.5 to 5.5 V

 Operation temperature: -40°C to 125°C

(-40°C to +150°C extended temperature range)

 Available as DFN14 (5mm x 4mm; wettable

flanks), SSOP14, and die

ZSC31150 Application Circuit

Serial Interface

Sensor Bridge

SDA

SCL

Out / OWI

GND

VSUPP

47nF +4.5V to +5.5V

ZSC31150

VDDA

VSSA

SDA

SCL

n.c.

VDD

VDDE

IRTEMP

VBR_T

VBP

VBR_B

VBN

AOUT

VSSE

100nF

Temperature Sensor

C5C4

ZSC31150

Fast Automotive Sensor Signal Conditioner

ZSC31150 Block Diagram

PGA

ADC CMC

ROM

RAM EEPROM

DAC BAMP

ZACwire™

C™

MUX

Analog Block

Digital Block

ZSC31150

Digital

Data I/O

Analog

Out

Ordering Information

Sales Code

Description

Package

ZSC31150GE

ZSC31150 Die — Temperature range: -40°C to +150°C

Unsawn on Wafer: add “B” to sales code

Sawn on Wafer Frame: add “C”

Waffle Pack: add “D”

ZSC31150GEG2-R

ZSC31150 DFN14 (5mmx4mm; wettable flanks) —Temperature

range: -40°C to 150°C

Tape & Reel

ZSC31150GAG2-R

ZSC31150 DFN14 (5mmx4mm; wettable flanks) —Temperature

range: -40°C to 125°C

Tape & Reel

ZSC31150GEG1

ZSC31150 SSOP14—Temperature range: -40°C to +150°C

Tube: add “-T” to sales code

Tape & Reel: add “-R”

ZSC31150GLG1

ZSC31150 SSOP14—Temperature range: -40°C to +150°C

(Long life: 5000h @150°C)

ZSC31150GAG1

ZSC31150 SSOP14—Temperature range: -40°C to +125°C

ZSC31150KIT

Evaluation Kit V1.2

ZSC31150 SSC Evaluation Kit: three interconnecting boards, five ZSC31150 SSOP14 samples,

USB cable (software can be downloaded from product page at www.zmdi.com/zsc31150)

ZSC31150 Mass

Calibration System V1.1

Modular Mass Calibration System (MSC) for ZSC31150: MCS boards, cable, connectors

(software can be downloaded from product page)

Sales and Further Information www.zmdi.com PRODUCT@ZMDI.COM

Zentrum Mikroelektronik

Dresden AG

Global Headquarters

Grenzstrasse 28

01109 Dresden, Germany

Central Office:

Phone +49.351.8822.306

Fax +49.351.8822.337

ZMD America, Inc.

1525 McCarthy Blvd., #212

Milpitas, CA 95035-7453

USA

USA Phone 1.855.275.9634

Zentrum Mikroelektronik

Dresden AG, Japan Office

2nd Floor, Shinbashi Tokyu Bldg.

4-21-3, Shinbashi, Minato-ku

Tokyo, 105-0004

Japan

ZMD FAR EAST, Ltd.

3F, No. 51, Sec. 2,

Keelung Road

11052 Taipei

Taiwan

Zentrum Mikroelektronik

Dresden AG, Korea Office

U-space 1 Building

Unit B, 906-1

660, Daewangpangyo-ro

Bundang-gu, Seongnam-si

Gyeonggi-do, 463-400

Korea

Phone +82.31.950.7679

Fax +82.504.841.3026

Phone +1.408.883.6310

Fax +1.408.883.6358

Phone +81.3.6895.7410

Fax +81.3.6895.7301

Phone +886.2.2377.8189

Fax +886.2.2377.8199

European Technical Support

Phone +49.351.8822.7.772

Fax +49.351.8822.87.772

DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice.

Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The

information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer,

licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or

in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any

customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for

any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty,

tort (including negligence), strict liability, or otherwise.

European Sales (Stuttgart)

Phone +49.711.674517.55

Fax +49.711.674517.87955

ZSC31150

Fast Automotive Sensor Signal Conditioner

Data Sheet

July 27, 2015

prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

4 of 29

Contents

1 Electrical Characteristics .............................................................................................................................. 6

1.1. Absolute Maximum Ratings ................................................................................................................... 6

1.2. Operating Conditions ............................................................................................................................. 6

1.3. Electrical Parameters ............................................................................................................................ 7

1.3.1. Supply Current and System Operation Conditions ......................................................................... 7

1.3.2. Analog Front-End (AFE) Characteristics ........................................................................................ 7

1.3.3. Temperature Measurement 2) .......................................................................................................... 8

1.3.4. Analog-to-Digital Conversion (ADC) ............................................................................................... 8

1.3.5. Sensor Connection Check .............................................................................................................. 8

1.3.6. Digital-to-Analog Conversion (DAC) and Analog Output (AOUT Pin) ............................................ 8

1.3.7. System Response ........................................................................................................................... 9

1.4. Interface Characteristics and EEPROM .............................................................................................. 10

1.4.1. I²CTM Interface 1) ............................................................................................................................ 10

1.4.2. ZACwire™ One Wire Interface (OWI) ........................................................................................... 10

1.4.3. EEPROM ....................................................................................................................................... 10

2 Circuit Description ...................................................................................................................................... 11

2.1. Signal Flow .......................................................................................................................................... 11

2.2. Application Modes ............................................................................................................................... 12

2.3. Analog Front End (AFE) ...................................................................................................................... 13

2.3.1. Programmable Gain Amplifier (PGA) ............................................................................................ 13

2.3.2. Offset Compensation .................................................................................................................... 14

2.3.3. Measurement Cycle ...................................................................................................................... 14

2.3.4. Analog-to-Digital Converter ........................................................................................................... 15

2.4. Temperature Measurement ................................................................................................................. 17

2.5. System Control and Conditioning Calculation ..................................................................................... 17

2.5.1. Operation Modes........................................................................................................................... 17

2.5.2. Start Up Phase .............................................................................................................................. 18

2.5.3. Conditioning Calculation ............................................................................................................... 18

2.6. Analog Output AOUT ........................................................................................................................... 19

2.7. Serial Digital Interface ......................................................................................................................... 19

2.8. Failsafe Features, Watchdog and Error Detection .............................................................................. 19

2.9. High Voltage, Reverse Polarity, and Short Circuit Protection ............................................................. 20

3 Application Circuit Examples ...................................................................................................................... 21

4 Pin Configuration, Latch-Up and ESD Protection ...................................................................................... 23

4.1. Pin Configuration and Latch-up Conditions ......................................................................................... 23

4.2. ESD Protection .................................................................................................................................... 24

5 Package ...................................................................................................................................................... 24

5.1. SSOP14 Package ................................................................................................................................ 24

5.2. DFN14 Package .................................................................................................................................. 25

ZSC31150

Fast Automotive Sensor Signal Conditioner

Data Sheet

July 27, 2015

prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

5 of 29

6 Quality and Reliability ................................................................................................................................. 26

7 Customization ............................................................................................................................................. 26

8 Ordering Information .................................................................................................................................. 26

9 Related Documents and Tools ................................................................................................................... 27

10 Glossary ..................................................................................................................................................... 27

11 Document Revision History ........................................................................................................................ 28

List of Figures

Figure 2.1 Block Diagram of the ZSC31150 .................................................................................................. 11

Figure 2.2 Measurement Cycle ...................................................................................................................... 15

Figure 3.1 Bridge in Voltage Mode, External Diode Temperature Sensor .................................................... 21

Figure 3.2 Bridge in Voltage Mode, External Thermistor ............................................................................... 22

Figure 3.3 Bridge in Current Mode, Temperature Measurement via Bridge TC ............................................ 22

Figure 5.1 SSOP14 Pin Diagram ................................................................................................................... 24

Figure 5.2 Outline Drawing for DFN14 Package with Wettable Flanks ......................................................... 25

List of Tables

Table 1.1 Absolute Maximum Ratings ............................................................................................................ 6

Table 1.2 Operating Conditions ...................................................................................................................... 6

Table 1.3 Electrical Parameters ...................................................................................................................... 7

Table 1.4 Interface and EEPROM Characteristics ....................................................................................... 10

Table 2.1 Adjustable Gains, Resulting Sensor Signal Spans, and Common Mode Ranges ....................... 13

Table 2.2 Analog Zero Point Shift Ranges (XZC) ......................................................................................... 14

Table 2.3 Analog Output Resolution versus Sample Rate ........................................................................... 16

Table 3.1 Application Circuit Parameters ..................................................................................................... 21

Table 4.1 Pin Configuration and Latch-Up Conditions ................................................................................. 23

ZSC31150

Fast Automotive Sensor Signal Conditioner

Data Sheet

July 27, 2015

prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

6 of 29

1 Electrical Characteristics

1.1. Absolute Maximum Ratings

The absolute maximum ratings are stress ratings only. The ZSC31150 might not function or be operable above

the recommended operating conditions. Stresses exceeding the absolute maximum ratings might also damage

the device. In addition, extended exposure to stresses above the recommended operating conditions might affect

device reliability. ZMDI does not recommend designing to the “Absolute Maximum Ratings.”

Parameters apply in operation temperature range and without time limitations.

Table 1.1 Absolute Maximum Ratings

No.

Parameter

Symbol

Conditions

Min

Max

Unit

1.1.1.

Supply voltage 1)

VDDE

To VSSE.

-33

VDC

1.1.2.

Potential at the AOUT pin 1)

VOUT

Relative to VSSE.

-33

VDC

1.1.3.

Analog supply voltage 1)

VDDA

Relative to VSSA.

VDDE - VDDA < 0.35 V

-0.3

6.5

VDC

1.1.4.

Voltage at all analog and

digital IO pins

VA_IO

VD_IO

Relative to VSSA.

-0.3

VDDA + 0.3

VDC

1.1.5.

Storage temperature

TSTG

-55

150

C

1) Refer to the ZSC31150 Technical Note – High Voltage Protection for specification and detailed conditions for high voltage protection.

1.2. Operating Conditions

All voltages are related to VSSA. See important table notes at the end of the table.

Table 1.2 Operating Conditions

No.

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

1.2.1.

1.2.1.1 TQE ambient

temperature range for part

numbers ZSC31150xExx 1)

TAMB_TQE

TQE

-40

150

C

1.2.1.2 TQA ambient

temperature range for part

numbers ZSC31150xAxx 2)

TAMB_TQA

TQA

-40

125

C

1.2.1.3 TQI ambient

temperature range for

advanced performance 2)

TAMB_TQI

TQI

-25

C

1.2.2.

Supply voltage

VDDE

4.5

5.0

5.5

VDC

1.2.3.

Bridge resistance—Bridge

Voltage Mode 2), 3)

RBR_V

k

1.2.4.

Bridge resistance—Bridge

Current Excitation Mode 2), 3)

RBR_C

See specification 1.2.6

for IBR_MAX

k

ZSC31150

Fast Automotive Sensor Signal Conditioner

Data Sheet

July 27, 2015

prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

7 of 29

No.

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

1.2.5.

Current reference resistor 2),4)

RIBR

IBR = VDDA / (16 * RIBR)

0.07 *

RBR

k

1.2.6.

Maximum bridge current

IBR_MAX

1.2.7.

Maximum bridge top voltage

VBR_TOP

(15/16 * VDDA) - 0.3

1.2.8.

TC current reference

resistor 2)

TC RIBR

Behavior influences

current generated

ppm/K

1) Refer to the temperature profile description in the ZSC31150 Technical Note – Die and Package Specifications for operation in

temperature range > 125°C.

2) No measurement in mass production; parameter is guaranteed by design and/or quality observation.

3) Symmetric behavior and identical electrical properties (especially with regard to the low pass characteristic) of both sensor inputs of

the ZSC31150 are required. Unsymmetrical conditions of the sensor and/or external components connected to the sensor input pins

of ZSC31150 can generate a failure in signal operation.

4) See application circuit components in Table 3.1.

1.3. Electrical Parameters

All parameter values are valid for operating conditions specified in section 1.2 except as noted. All voltages

related to VSSA. See important table notes at the end of the table.

Table 1.3 Electrical Parameters

No.

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

1.3.1. Supply Current and System Operation Conditions

1.3.1.1.

Supply current

Without bridge and load

current; TAMB_TQA;

fCLK  3 MHz

5.5

1.3.1.2.

Clock frequency 1)

fOSC

Guaranteed adjustment

range (see the ZSC31150

Functional Description for

details); TAMB_TQA

MHz

1.3.2. Analog Front-End (AFE) Characteristics

1.3.2.1.

Input span

VIN_SP

Analog gain: 420 to 2.8

275

mV/V

1.3.2.2.

Analog offset compensation

range

Depends on gain adjust;

refer to section 2.3.1

-300

300

% VIN_SP

1.3.2.3.

Parasitic differential input

offset current 1)

IIN_OFF

Within TAMB_TQE

-10

Within TAMB_TQI

-2

1.3.2.4.

Common mode input range

VIN_CM

Depends on gain adjustment;

no XZC; see section 2.3.1

0.29 *

VDDA

0.65 *

VDDA

ZSC31150

Fast Automotive Sensor Signal Conditioner

Data Sheet

July 27, 2015

prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

8 of 29

No.

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

1.3.3. Temperature Measurement 2)

1.3.3.1.

External temperature diode

channel gain

aTSED

300

1300

ppm FS

/ (mV/V)

1.3.3.2.

External temperature diode

bias current

ITSE

A

1.3.3.3.

External temperature diode

input range 1)

1.5

1.3.3.4.

External temperature resistor

channel gain

aTSER

1200

3500

ppm FS

/ (mV/V)

1.3.3.5.

External temperature resistor /

input voltage range 1)

VTSER

600

mV/V

1.3.3.6.

Internal temperature diode

sensitivity

STTSI

Raw values – without

conditioning

700

2700

ppm FS /

1.3.4. Analog-to-Digital Conversion (ADC)

1.3.4.1.

ADC resolution 1)

rADC

Bit

1.3.4.2.

ADC differential nonlinearity

(DNL) 1)

DNLADC

rADC =13-bit; fCLK=3MHz;

best fit, 2nd order; complete

AFE; with ADC input range

specified in 1.3.4.5

0.95

LSB

1.3.4.3.

ADC integral nonlinearity

(INL) within TQA 1)

INLADC

LSB

1.3.4.4.

ADC INL within TQE

INLADC

LSB

1.3.4.5.

ADC input range

Range

%VDDA

1.3.5. Sensor Connection Check

1.3.5.1.

Sensor connection loss

detection threshold

RSCC_min

100

k

1.3.5.2.

Sensor input short check

RSSC_short

Short detection guaranteed



1.3.5.3.

Sensor input no-short

threshold

RSSC_pass

A short is not indicated

above this threshold

1000



1.3.6. Digital-to-Analog Conversion (DAC) and Analog Output (AOUT Pin)

1.3.6.1.

DAC resolution

rDAC

Analog output, 10-90%

Bit

1.3.6.2.

Output current sink and

source for VDDE=5V

ISRC/SINK_OUT

VOUT: 5-95%, RLOAD  2kΩ

2.5

VOUT: 10-90%, RLOAD  1kΩ

1.3.6.3.

Short circuit current

IOUT_max

To VSSE or VDDE 3)

-25

1.3.6.4.

Addressable output signal

range

VSR_OUT95

@ RLOAD  2k

0.05

0.95

VDDE

VSR_OUT90

@ RLOAD  1k

0.1

0.9

VDDE

ZSC31150

Fast Automotive Sensor Signal Conditioner

Data Sheet

July 27, 2015

prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

9 of 29

No.

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

1.3.6.5.

Output slew rate 1)

SROUT

CLOAD < 50nF

0.1

V/µs

1.3.6.6.

Output resistance in

diagnostic mode

ROUT_DIA

Diagnostic Range:

<4|96>%, RLOAD  2k

<8|92>%, RLOAD  1k



1.3.6.7.

Load capacitance 1)

CLOAD

C3 (see section 3)

150

1.3.6.8.

DNL (DAC)

DNLOUT

-1.5

1.5

LSB

1.3.6.9.

INL TQA (DAC) 1)

INLOUT

Best fit, rDAC =12-bit

-5

LSB

1.3.6.10.

INL TQE (DAC)

INLOUT

Best fit, rDAC =12-bit

-8

LSB

1.3.6.11.

Output leak current @150°C

ILEAK_OUT

power or ground loss

-25

µA

1.3.7. System Response

1.3.7.1.

Startup time 4)

tSTA

To 1st output; fCLK=3MHz;

no ROM check; ADC 14-bit

and 2nd order

1.3.7.2.

Response time (100% jump)1)

tRESP

fCLK=4MHz; 13-bit, 2nd

order; refer to Table 2.3

256

512

µs

1.3.7.3.

Bandwidth 1)

Comparable to analog SSCs

kHz

1.3.7.4.

Analog output noise

peak-to-peak 1)

VNOISE,PP

Shorted inputs;

bandwidth  10kHz

1.3.7.5.

Analog output noise RMS 1)

VNOISE,RMS

Shorted inputs;

bandwidth  10kHz

1.3.7.6.

Ratiometricity error

REOUT_5

Maximum error of

VDDE=5V to 4.5/5.5V

1000

ppm

1.3.7.7.

Overall failure (deviation from

ideal line including the INL,

gain, offset and temperature

errors) 5)

FALL TQI

13-bit, 2nd order ADC;

fCLK  3MHz; XZC=0

No sensor caused effects;

value in parentheses is the

digital readout.

0.25 (0.1)

% FS

FALL TQA

0.5 (0.25)

% FS

FALL TQE

1.0 (0.5)

% FS

1) No measurement in mass production; parameter is guaranteed by design and/or quality observation.

2) Refer to section 2.4.

3) Minimum output voltage to VDDE or maximum output voltage to VSSE.

4) Depends on resolution and configuration - start routine begins approximately 0.8ms after power on.

5) XZC is active: additional overall failure of 25ppm/K for XZC=31 at maximum; failure decreases linearly for XZC adjustments

lower than 31.

ZSC31150

Fast Automotive Sensor Signal Conditioner

Data Sheet

July 27, 2015

prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

10 of 29

1.4. Interface Characteristics and EEPROM

Table 1.4 Interface and EEPROM Characteristics

No.

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

1.4.1. I²CTM Interface 1)

1.4.1.1

Input-high level 2)

VI2C_IN_H

0.8

VDDA

1.4.1.2

Input-low level 2),

VI2C_IN_L

0.2

VDDA

1.4.1.3

Output-low level 2)

VI2C_OUT_L

Open Drain, IOL<2mA

0.15

VDDA

1.4.1.4

SDA load capacitance 2)

CSDA

400

1.4.1.5

SCL clock frequency 2)

fSCL

400

kHz

1.4.1.6

Internal pull-up resistor 2)

RI2C

100

k

1.4.2. ZACwire™ One Wire Interface (OWI)

1.4.2.1

Input-low level 2)

VOWI_IN_L

0.2

VDDA

1.4.2.2

Input-high level 2)

VOWI_IN_H

0.75

VDDA

1.4.2.3

Pull-up resistance master

ROWI_PUP

0.3

3.3

k

1.4.2.4

OWI load capacitance

COWI_LOAD

Summarized OWI line

load

1.4.2.5

Start window 2)

Typ: @ fCLK=3MHz

175

455

1.4.3. EEPROM

1.4.3.1

Ambient temperature

EEPROM programming 2)

TAMB_EEP

-40

150

C

1.4.3.2

Write cycles 2)

nWRI_EEP

Write temperature:

<=85°C

100k

Write temperature:

up to 150°C

100

1.4.3.3

Read cycles 2), 3)

nREAD_EEP

Read temperature:

<=175°C

8 * 108

1.4.3.4

Data retention 2), 4)

tRET_EEP

1300h at 175°C =100000h

at 55°C; 27000h at 125°C;

3000h at 150°C)

years

1.4.3.5

Programming time 2)

tWRI_EEP

Per written word,

fCLK=3MHz

1) Refer to ZSC31150 Functional Description for timing details.

2) No measurement in mass production; parameter is guaranteed by design and/or quality observation.

3) Note that the package and temperature versions cause additional restrictions.

4) Over lifetime; use calculation sheet SSC Temperature Profile Calculation Spreadsheet for temperature stress calculation; note

additional restrictions are caused by different package and temperature versions.

ZSC31150

Fast Automotive Sensor Signal Conditioner

Data Sheet

July 27, 2015

prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

11 of 29

2 Circuit Description

Note: This data sheet provides specifications and a general overview of ZSC31150 operation. For details of

operation, including configuration settings and related EEPROM registers, refer to the ZSC31150 Functional

Description.

2.1. Signal Flow

The ZSC31150’s signal path includes both analog (shown in blue in Figure 2.1) and digital (pink) sections. The

analog path is differential; i.e., the differential bridge sensor signal is handled internally via two signal lines that

are symmetrical around a common mode potential (analog ground = VDDA/2), which improves noise rejection.

Consequently, it is possible to amplify positive and negative input signals, which are located within the common

mode range of the signal input.

Figure 2.1 Block Diagram of the ZSC31150

PGA

ADC CMC

ROM

RAM EEPROM

DAC BAMP

ZACwire™

C™

MUX

Analog Block

Digital Block

ZSC31150

Digital

Data I/O

Analog

Out

PGA Programmable Gain Amplifier

MUX Multiplexer

ADC Analog-to-Digital Converter

CMC Calibration Microcontroller

DAC Digital-to-Analog Converter

BAMP Buffer Amplifier – Output Buffer OPAMP

EEPROM Non Volatile Memory for Calibration Parameters and Configuration

TS On-Chip Temperature Sensor (pn-junction)

ROM Memory for Correction Formula and Algorithm

RAM Volatile Memory for Calibration Parameters and Configuration

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Fast Automotive Sensor Signal Conditioner

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The differential signal from the bridge sensor is pre-amplified by the programmable gain amplifier (PGA). The

multiplexer (MUX) transmits the signals from either the bridge sensor, the external diode, or the separate

temperature sensor to the analog-to-digital converter (ADC) in a specific sequence (the internal pn-junction (TS)

can be used instead of the external temperature diode). Next, the ADC converts these signals into digital values.

The digital signal correction takes place in the calibration microcontroller (CMC). It is based on a correction

formula located in the ROM and sensor-specific coefficients stored in the EEPROM during calibration. Depending

on the programmed output configuration, the corrected sensor signal is output as an analog value or in a digital

format (I²C™ or ZACwire™). The configuration data and the correction parameters can be programmed into the

EEPROM via the digital interfaces.

2.2. Application Modes

For each application, a configuration set must be established (generally prior to calibration) by programming the

on-chip EEPROM regarding to the following modes:

Sensor Channel

 Sensor mode: ratiometric bridge excitation in voltage or current supply mode.

 Input range: the gain adjustment of the AFE with respect to the maximum sensor signal span and the

zero point of the ADC have to be chosen.

 An additional analog offset compensation, the Extended Zero-Point Compensation (XZC), must be

enabled if required; e.g., if the sensor offset voltage is close to or larger than the sensor span.

 Resolution/response time: The ADC must be configured for resolution and conversion settings (1st or 2nd

order). These settings influence the sampling rate, signal integration time, and, as a result, the noise

immunity.

Temperature

 Temperature measurement: the source for the temperature correction must be chosen.

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Fast Automotive Sensor Signal Conditioner

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13 of 29

2.3. Analog Front End (AFE)

The analog front end (AFE) consists of the programmable gain amplifier (PGA), the multiplexer (MUX), and the

analog-to-digital converter (ADC).

2.3.1. Programmable Gain Amplifier (PGA)

Table 2.1 shows the adjustable gains, the sensor signal spans, and the allowed common mode range.

Table 2.1 Adjustable Gains, Resulting Sensor Signal Spans, and Common Mode Ranges

No.

Overall Gain

aIN

Max. Span

VIN_SP

[mV/V] 1)

Gain

Amp1

Gain

Amp2

Gain

Amp3

Input common mode range

VIN_CM as % of VDDA 2)

XZC = Off

XZC = On

420

1.8

29 to 65

45 to 55

280

2.7

4.66

29 to 65

45 to 55

210

3.6

29 to 65

45 to 55

140

5.4

4.66

29 to 65

45 to 55

105

7.1

7.5

29 to 65

45 to 55

10.7

7.5

4.66

29 to 65

45 to 55

52.5

14.3

3.75

29 to 65

45 to 55

21.4

3.75

4.66

29 to 65

45 to 55

26.3

28.5

3.75

3.5

29 to 65

45 to 55

53.75

29 to 65

45 to 55

9.3

4.66

29 to 65

45 to 55

107

3.5

29 to 65

45 to 55

2.8

267

1.4

32 to 57

not applicable

1) Recommended internal signal range maximum is 80% of the VDDA voltage.

Span is calculated by the following formula: Span = 80% / gain.

2) Bridge in Voltage Mode with maximum input signal (with XZC = +300% Offset), 14-bit accuracy. Refer to the ZSC31150 Functional

Description for usable input signal/common mode range at bridge in current mode. See section 2.3.2 for an explanation of the

extended analog zero compensation (XZC).

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Fast Automotive Sensor Signal Conditioner

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2.3.2. Offset Compensation

The ZSC31150 supports two methods of sensor offset compensation (zero shift):

 Digital offset correction

 XZC: analog compensation for large offset values (up to a maximum of approximately 300% of the span,

depending on the gain adjustment)

The digital sensor offset correction will be processed during the digital signal correction/conditioning by the

calibration microcontroller (CMC).

Analog sensor offset pre-compensation is needed for compensation of large offset values, which would overdrive

the analog signal path by uncompensated gaining. For analog sensor offset pre-compensation, a compensation

voltage is added in the analog pre-gaining signal path (coarse offset removal). The analog offset compensation in

the AFE can be adjusted by 6 EEPROM bits (refer to the ZSC31150 Functional Description for details).

Table 2.2 Analog Zero Point Shift Ranges (XZC)

PGA gain

aIN

Max. Span VIN_SP

[mV/V]

Offset shift per step

as % of full span

Approximate maximum

offset shift [mV/V]

Approximate maximum

shift [% VIN_SP] (at ± 31)

420

1.8

12.5 %

7.8

388 %

280

2.7

7.6 %

7.1

237 %

210

3.6

12.5 %

15.5

388 %

140

5.4

7.6 %

14.2

237 %

105

7.1

12.5 %

388 %

10.7

7.6 %

237 %

52.5

14.3

12.5 %

388 %

21.4

7.6 %

237 %

26.3

28.5

5.2 %

161 %

53.75

12.5 %

194

388 %

9.3

7.6 %

189

237 %

107

5.2 %

161

161 %

2.8

267

0.83 %

26 %

2.3.3. Measurement Cycle

The complete measurement cycle is controlled by the CMC. Depending on EEPROM settings, the multiplexer

(MUX) selects the following input signals in a defined sequence:

 Temperature measured by external diode or thermistor, internal pn-junction, or bridge

 Internal offset of the input channel (VOFF)

 Pre-amplified bridge sensor signal

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Fast Automotive Sensor Signal Conditioner

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The cycle diagram in Figure 2.2 shows the basic structure of the measurement cycle. The bridge sensor

measurement count can be configured in EEPROM for a value within n=<1,31>.

After power-on, the startup routine is processed, which performs all measurements needed to acquire an initial

valid conditioned sensor output. After the startup routine, the normal measurement cycle runs.

Note: The “CMV,” “SSC/SCC+” and “SSC/SCC-” measurements are always performed in every cycle indepen-

dent of the EEPROM configuration.

Figure 2.2 Measurement Cycle

Start routine

Temperature auto-zero



Bridge sensor measurement



Temperature measurement



Bridge sensor measurement



Bridge sensor auto-zero



Bridge sensor measurement



CMV



Bridge sensor measurement



SSC/SCC+



Bridge sensor measurement



SSC/SCC-



Bridge sensor measurement

2.3.4. Analog-to-Digital Converter

The ADC is an integrating analog-to-digital converter in full differential switched capacitor technique.

Programmable ADC resolutions are rADC=<13, 14> or with segmentation, rADC=<15, 16> bit.

The ADC can be used as a first or second order converter. In the first order mode, it is inherently monotone and

insensitive to short and long-term instability of the clock frequency. The conversion cycle time depends on the

desired resolution and can be roughly calculated by the following equation where rADC is the ADC resolution and

tADC_1 is the conversion cycle time in seconds in first-order mode:















tADC_1 OSC

ADC

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Fast Automotive Sensor Signal Conditioner

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In the second order mode, two conversions are stacked with the advantage of a much shorter conversion cycle

time but the drawback of a lower noise immunity caused by the shorter signal integration period. The approximate

conversion cycle time tADC_2 in second-order mode is calculated by the following equation:

















t2/)3(

ADC_2 OSC

ADC

The calculation formulas for tADC give an overview of conversion time for one AD conversion. Refer to the

ZSC31150 Bandwidth Calculation Spreadsheet for detailed calculations for sampling time and bandwidth.

The result of the AD conversion is a relative counter result corresponding to the following equation (see the

ZSC31150 Functional Description for more detailed equations):











 ADC

ADC_REF

ADC_DIFF

ADC RS

2Z ADC

ZADC Number of counts (result of the conversion)

rADC Selected ADC resolution in bits

VADC_DIFF Differential input voltage of the ADC

VADC_REF Reference voltage of the ADC

RSADC Digital ADC range shift (RSADC = 1/16, 1/8, 1/4, 1/2,

controlled by the EEPROM setting)

The sensor input signal can be shifted to the optimal input range of the ADC with the RSADC value.

Table 2.3 Analog Output Resolution versus Sample Rate

ADC

Adjustment

Approximated Output

Resolution 2)

Sample Rate

fCON 2)

Averaged

Bandwidth at fCLK

ADC Order

rADC

Digital

Analog

fCLK=3MHz

fCLK=4MHz

fCLK=3MHz

fCLK=4MHz

[Bit]

[Hz]

345

460

130

172

178

237

120

5859

7813

2203

2937

3906

5208

1469

1958

2930

3906

1101

1468

1953

2604

734

979

1) The ADC resolution should be one bit higher than the required output resolution if the AFE gain is adjusted so that more than 50% of

the input range is used. Otherwise the ADC resolution should be more than one bit higher than the required output resolution.

2) The sampling rate (A/D conversion time) is only a part of the whole cycle; refer to the ZSC31150 Bandwidth Calculation Spreadsheet

for detailed information.

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Note: The ADC’s reference voltage ADCVREF is defined by the potential between <VBR_T> and <VBR_B> (or

<VDDA> to <VSSA>, if selected in EEPROM by the bit CFGAPP:BREF=1). Theoretically, the input range

ADCRANGE_INP of the ADC is equivalent to the ADC’s reference voltage.

In practice, the maximum ADC input range used should be from 10% to 90% of ADCRANGE_INP, which is a

necessary condition for ensuring the specified accuracy, stability, and nonlinearity parameters of the AFE. This

condition is also valid for whole temperature range and all applicable sensor tolerances. The ZSC31150 does not

have an internal failsafe function that verifies that the input meets this condition.

2.4. Temperature Measurement

The ZSC31150 supports four different methods for acquiring the temperature data needed for calibration of the

sensor signal in the specified temperature range.

Temperature data can be acquired using one of these temperature sensors:

 an internal pn-junction temperature sensor

 an external pn-junction temperature sensor connected to sensor top potential (VBRTOP)

 an external resistive half bridge temperature sensor

 the temperature coefficient of the sensor bridge at bridge current excitation

Refer to the ZSC31150 Functional Description for a detailed explanation of temperature sensor adaptation and

adjustment.

2.5. System Control and Conditioning Calculation

The system control supports the following tasks/features:

 Controlling the measurement cycle according to the EEPROM-stored configuration data

 Performing the16-bit correction calculation for each measurement signal using the EEPROM-stored

calibration coefficients and ROM-based algorithms; i.e., the signal conditioning

 Managing the start-up sequence and starting signal conditioning

 Handling communication requests received by the digital interface

 Managing failsafe tasks for the functions of the ZSC31150 and indicating detected errors with diagnostic

states

Refer to the ZSC31150 Functional Description for a detailed description.

2.5.1. Operation Modes

The internal state machine has three main states:

 The continuously running signal conditioning mode, which is called Normal Operation Mode (NOM)

 The calibration mode with access to all internal registers and states, which is called Command Mode (CM)

 The failure messaging mode, which is called Diagnostic Mode (DM)

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Fast Automotive Sensor Signal Conditioner

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2.5.2. Start Up Phase

The start-up phase consists of following segments:

1. Internal supply voltage settling phase (i.e., the VDDA - VSSA potential), which is ended when the reset

signal is disabled through the power-on clear block (POR). Refer to the ZSC31150 Technical Note – High

Voltage Protection document, section 4 for power on/off thresholds.

Time (from beginning with VDDA-VSSA=0V): 500µs to 2000µs; AOUT is in tri-state

2. System start, EEPROM read out, and signature check (and ROM check if selected by setting EEPROM bit

CFGAPP:CHKROM=1).

Time: ~200µs (~9000µs with ROM-check; i.e., 28180 clocks); AOUT is LOW (DM)

3. Processing the start routine for signal conditioning (all measurements and conditioning calculations).

Time: 5 x A/D conversion time; AOUT behavior depends on selected OWI mode (refer to section 2.6):

 OWIANA & OWIDIS => AOUT is LOW (DM)

 OWIWIN & OWIENA => AOUT is in tri-state

The analog output AOUT will be activated at the end of the start-up phase depending on the adjusted output and

communication mode (refer to section 2.6). If errors are detected, the Diagnostic Mode (DM) is activated and the

diagnostic output signal is driven at the output.

After the start-up phase, the continuously running measurement and calibration cycle is started. Refer to

ZSC31150 Bandwidth Calculation Spreadsheet for detailed information about output update rate.

2.5.3. Conditioning Calculation

The digitalized value for the bridge sensor measurement (acquired raw data) is processed with the correction

formula to remove offset and temperature dependency and to compensate nonlinearity up to 3rd order. The result

of the correction calculation is a non-negative 15-bit value for the bridge sensor in the range [0; 1). This value P is

clipped with programmed limitation coefficients and continuously written to the output register of the digital serial

interface and the output DAC.

Note: The conditioning includes up to third-order nonlinearity sensor input correction. The available adjustment

ranges depend on the specific calibration parameters; for a detailed description, refer to ZSC31150 Functional

Description. Basically, offset compensation and linear correction are only limited by the loss of resolution they will

cause. The second-order correction is possible up to approximately 30% of the full scale difference from a straight

line; third order is possible up to approximately 20% (ADC resolution = 13-bit). The calibration principle used is

able to reduce existing nonlinearity errors of the sensor up to 90%. The temperature calibration includes first and

second order correction and should be fairly sufficient in all relevant cases. ADC resolution also influences

calibration possibilities; e.g., 1 additional bit of resolution reduces the calibration range by approximately 50%.

The maximum calculation input data width is 14-bit. The 15 or 16 bit ADC resolution mode uses only a 14-bit

segment of the ADC range.

All timings described are roughly estimated values and are affected by the internal clock frequency. Timings are estimated for fCLK=3MHz.

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2.6. Analog Output AOUT

The analog output is used for outputting the analog signal conditioning result and for “end of line” communication

via the ZACwireTM interface one-wire communication interface (OWI). The ZSC31150 supports four different

modes of the analog output in combination with the OWI behavior:

 OWIENA: Analog output is deactivated; OWI communication is enabled.

 OWIDIS: Analog output is active (~2ms after power-on); OWI communication is disabled.

 OWIWIN: Analog output will be activated after the time window;

OWI communication is enabled in a time window of ~500ms (maximum);

transmission of the “START_CM” command must be finished during the time window.

 OWIANA: Analog output will be activated after a ~2ms power on time;

OWI communication is enabled in a time window of ~500ms (maximum);

transmission of the START_CM” command must be finished during time window;

to communicate, the internal driven potential at AOUT must be overwritten

by the external communication master (AOUT drive capability is current limited).

The analog output potential is driven by a unity gain output buffer for which the input signal is generated by a

12.4-bit resistor-string DAC. The output buffer (BAMP), which is a rail-to-rail op amp, is offset compensated and

current limited. Therefore, a short-circuit of the analog output to ground or the power supply does not damage the

ZSC31150.

2.7. Serial Digital Interface

The ZSC31150 includes a serial digital interface (SIF), which is used for communication with the circuit to

calibrate the sensor module. The serial interface is able to communicate with two communication protocols: I²C™

and the ZACwire™ one-wire communication interface (OWI). The OWI can be used to for an “end of line”

calibration via the analog output AOUT of the complete assembled sensor module.

Refer to the ZSC31150 Functional Description for a detailed description of the serial interfaces and com-

munication protocols.

2.8. Failsafe Features, Watchdog and Error Detection

The ZSC31150 detects various possible errors. A detected error is indicated by a change in the internal status in

Diagnostic Mode (DM). In this case, the analog output is set to LOW (minimum possible output value; i.e., the

lower diagnostic range LDR) and the output registers of the digital serial interface are set to a significant error

code.

A watchdog oversees the continuous operation of the CMC and the running measurement loop. The operation of

the internal clock oscillator is verified continuously by the oscillator failure detection.

A check of the sensor bridge for broken wires is done continuously by two comparators watching the input voltage

of each input (sensor connection and short check). Additionally, the common mode voltages of the sensor and

sensor input short are watched continuously (sensor aging).

Different functions and blocks in the digital section, e.g. the RAM, ROM, EEPROM, and register content, are

watched continuously. Refer to the ZSC31150 Functional Description for a detailed description of safety features

and methods of error indication.

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2.9. High Voltage, Reverse Polarity, and Short Circuit Protection

The ZSC31150 is designed for 5V power supply operation.

The ZSC31150 and the connected sensor are protected from overvoltage and reverse polarity damage by an

internal supply voltage limiter. The analog output AOUT can be connected with all potentials (short circuit, over-

voltage, and reverse voltage) in the protection range under all potential conditions at the VDDE and VSSE pins.

All external components (see section 3) are required to guarantee this operation. The protection is not time

limited. Refer the ZSC31150 Technical Note – High Voltage Protection for a detailed description of protection

cases and conditions.

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3 Application Circuit Examples

The application circuits contain external components that are needed for over-voltage, reverse polarity, and short

circuit protection.

Recommendation: Check the ZSC31150 product page www.zmdi.com/zsc31150 for other application examples

given in application notes. Note: Some application notes require a customer login—see section 9 for details.

Table 3.1 Application Circuit Parameters

Symbol

Parameter

Min

Typ

Max

Unit

Notes

100

470

100

C3 1)

160

The value of C3 is the sum of the load capacitor

and the cable capacitance

C4, C5 1)

Recommended to increase EMC immunity.

kΩ

RIBR

Refer to section 1.2.

Ω

1) Higher values for C3, C4, and C5 increase EMC immunity.

Figure 3.1 Bridge in Voltage Mode, External Diode Temperature Sensor

Serial Interface

Sensor Bridge

SDA

SCL

Out / OWI

GND

VSUPP

47nF +4.5V to +5.5V

ZSC31150

VDDA

VSSA

SDA

SCL

n.c.

VDD

VDDE

IRTEMP

VBR_T

VBP

VBR_B

VBN

AOUT

VSSE

100nF

Temperature Sensor

C5C4

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Figure 3.2 Bridge in Voltage Mode, External Thermistor

Serial Interface

Sensor Bridge

SDA

SCL

Out / OWI

GND

VSUPP

47nF +4.5V to +5.5V

ZSC31150

VDDA

VSSA

SDA

SCL

n.c.

VDD

VDDE

IRTEMP

VBR_T

VBP

VBR_B

VBN

AOUT

VSSE

100nF

Temperature Sensor

PT1000

Figure 3.3 Bridge in Current Mode, Temperature Measurement via Bridge TC

Serial Interface

Sensor Bridge

SDA

SCL

Out / OWI

GND

VSUPP

47nF +4.5V to +5.5V

ZSC31150

VDDA

VSSA

SDA

SCL

n.c.

VDD

VDDE

IRTEMP

VBR_T

VBP

VBR_B

VBN

AOUT

VSSE

100nF

C4*

RIBR

* C4 and C5 must be connected

to VBR_B when using Current

Mode because VBR_B and

VSSA are not shorted in this

case.

C5*

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Fast Automotive Sensor Signal Conditioner

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23 of 29

4 Pin Configuration, Latch-Up and ESD Protection

4.1. Pin Configuration and Latch-up Conditions

Table 4.1 Pin Configuration and Latch-Up Conditions

Name

Description

Notes

Usage/

Connection 1)

Latch-up Related Application Circuit

Restrictions and/or Notes

VDDA

Positive analog supply

voltage

Analog IO

Required/-

VSSA

Negative analog supply

voltage

Analog IO

Required/-

SDA

I²CTM data IO

Digital IO,

pull-up

-/VDDA

Trigger Current/Voltage to VDDA/VSSA:

+/-100mA or 8/-4V

SCL

I²C™ clock

Digital IN,

pull-up

-/VDDA

N.C.

No connection

VDD

Positive digital supply

voltage

Analog IO

Required or

open/-

Only capacitor to VSSA is allowed,

otherwise no application access

VDDE

Positive external supply

voltage

Supply

Required/-

Trigger Current/Voltage: -100mA/33V

VSSE

Negative external supply

voltage

Ground

Required/-

AOUT

Analog output & one wire IF

Required/-

Trigger Current/Voltage: -100mA/33V

VBN

Negative input sensor bridge

Analog IN

Required/-

VBR_B

Bridge bottom potential

Analog IO

Required/VSSA

Depending on application circuit,

short to VDDA/VSSA possible

VBP

Positive input sensor bridge

Analog IN

Required/-

VBR_T

Bridge top potential

Analog IO

Required/VDDA

IRTEMP

Temp sensor & current

source resistor

Analog IO

-/VDDA, VSSA

Depending on application circuit

1) Usage: If “Required” is specified, an electrical connection is necessary; refer to the application circuits in section 3.

Connection: To be connected to this potential if not used or if no application/configuration-related constraints are given.

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4.2. ESD Protection

All pins have an ESD protection of >2000V. Additionally, the pins VDDE, VSSE and AOUT have an ESD

protection of >4000V.

ESD protection referenced to the Human Body Model is tested with devices during product qualification. The ESD

test follows the Human Body Model with 1.5kΩ/100pF based on MIL 883, Method 3015.7.

5 Package

5.1. SSOP14 Package

The standard packages of the ZSC31150 are the SSOP14 green package (5.3mm body width) with a lead pitch of

0.65mm and the DFN14 (4mmx5mm) package with a lead pitch of 0.5mm.

For the SSOP14 package markings shown in Figure 5.1, YYWW refers to the last two digits of the year (YY) and

two digits for the work-week designation (WW). XXXXXXXX refers to the lot number.

Figure 5.1 SSOP14 Pin Diagram

VDDE

VDD

N.C.

SCL

SDA

VSSA

VDDA

VSSE

AOUT

VBN

VBR_B

VBP

VBR_T

IRTEMP

ZSC

31150GEG1

XXXXXXXX

YYWW

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5.2. DFN14 Package

For the DFN14 package, the pin assignment is the same as in SSOP14. Refer to the ZSC31150 Technical Note –

Die and Package Specifications for a description of package markings.

Figure 5.2 provides the dimensions for the DFN14 package option, which are based on JEDEC MO-229. The

DFN14 package has wettable flanks.

Figure 5.2 Outline Drawing for DFN14 Package with Wettable Flanks

0,08

148

1 7 1

814

Exposed Pad

4.4 x 2.5 mm

Top View Bottom View

Dimension

Minimum

Maximum

0.8

0.9

0.05

0.2

0.3

0.5 nominal

3.9

4.1

4.9

5.1

0.3

0.5

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Fast Automotive Sensor Signal Conditioner

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6 Quality and Reliability

The ZSC31150 is qualified according to the AEC-Q100 standard, operating temperature grade 0. A fit rate < 5fit

(temperature =55°C, S=60%) is guaranteed. A typical fit rate of the C7D technology, which is used for ZSC31150,

is 2.5fit.

7 Customization

For high-volume applications, which require an upgraded or downgraded functionality compared to the standard

ZSC31150, ZMDI can customize the circuit design by adding or removing certain functional blocks.

For this purpose, ZMDI has a considerable library of sensor-dedicated circuitry blocks. As a result, ZMDI can

provide a custom solution quickly. Please contact ZMDI for further information.

8 Ordering Information

Product Sales Code

Description

Package

ZSC31150GEB

ZSC31150 Die — Temperature range: -40°C to +150°C

Unsawn on Wafer

ZSC31150GEC

ZSC31150 Die — Temperature range: -40°C to +150°C

Sawn on Wafer Frame

ZSC31150GED

ZSC31150 Die — Temperature range: -40°C to +150°C

Waffle Pack

ZSC31150GEG2-R

ZSC31150 DFN14, 5x4mm with wettable flank—Temperature

range: -40°C to 150°C

Tape & Reel

ZSC31150GAG2-R

ZSC31150 DFN14, 5x4mm with wettable flank —Temperature

range: -40°C to 125°C

Tape & Reel

ZSC31150GEG1

ZSC31150 SSOP14—Temperature range: -40°C to +150°C

Tube: add “-T” to sales code

Tape & Reel: add “-R”

ZSC31150GLG1

ZSC31150 SSOP14—Temperature range: -40°C to +150°C

(Long life: 5000h @150°C)

Tube: add “-T” to sales code

Tape & Reel: add “-R”

ZSC31150GAG1

ZSC31150 SSOP14—Temperature range: -40°C to +125°C

Tube: add “-T” to sales code

Tape & Reel: add “-R”

ZSC31150KIT Evaluation

Kit V1.2

ZSC31150 SSC Evaluation Kit: three interconnecting boards, five ZSC31150 SSOP14 samples,

USB cable (software can be downloaded from product page at www.zmdi.com/zsc31150)

ZSC31150 Mass

Calibration System V1.1

Modular Mass Calibration System (MSC) for ZSC31150: MCS boards, cable, connectors

(software can be downloaded from product page at www.zmdi.com/zsc31150)

ZSC31150

Fast Automotive Sensor Signal Conditioner

Data Sheet

July 27, 2015

prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

27 of 29

9 Related Documents and Tools

Note: X_xy refers to the current revision of the document.

Note: Documents marked with an asterisk (*) require a login account for access on the web. For detailed instructions, visit

www.zmdi.com/login-account-setup-procedure.

Note: Documents marked with a double asterisk (**) are only available upon request. For these documents, please contact

ZMDI (see contact information on last page).

Note: Documents/tools marked with three asterisks (***) are available on our “SSC Tools” web page www.zmdi.com/ssc-tools.

Document/Tool

File Name

ZSC31150 Feature Sheet

ZSC31150_FeatureSheet_RevX_xy.pdf

ZSC31150 Functional Description

ZSC31150_FunctionalDescription_RevX_xy.pdf

ZSC31150 Evaluation Kit Description

ZSC31150 Evaluation Kit Description RevX_xy.pdf

SSC AN - Single Ended Input

SSC AN - Single Ended Input RevX_xy.pdf

ZSC31150 Technical Note – High Voltage Protection *

ZSC31150_Tech_Note_HighVoltageProt_RevX_xy.pdf

SSC Temperature Profile Calculation Spreadsheet *

SSC Temperature Profile Calculation Spreadsheet RevX_xy.pdf

ZSC31150 Technical Note – Die and Package

Specifications **

ZSC31150_TN_Die+PackageSpec_RevX_xy.pdf

ZSC31150 Bandwidth Calculation Spreadsheet **

ZSC31150_BandwidthCalculationRev.X_xy

CAD Model Library Files for ZMDI SSC ICs ***

Access files by clicking on the link below the heading “CAD

Model Files” on the ZMDI web page www.zmdi.com/ssc-tools.

Visit the ZSC31150 product page www.zmdi.com/zsc31150 on ZMDI’s website www.zmdi.com or contact your

nearest sales office for the latest version of these documents.

10 Glossary

Term

Description

ADC

Analog-to-Digital Converter

AEC

Automotive Electronics Council

AFE

Analog Front End

AOUT

Analog Output

BAMP

Buffer Amplifier

Command Mode

CMC

Calibration Microcontroller

CMV

Common Mode Voltage

CMOS

Complementary Metal Oxide Semiconductor

DAC

Digital-to-Analog Converter

ZSC31150

Fast Automotive Sensor Signal Conditioner

Data Sheet

July 27, 2015

prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

28 of 29

Term

Description

Diagnostic Mode

EEPROM

Electrically Erasable Programmable Read Only Memory

ESD

Electrostatic Device

LDR

Lower Diagnostic Range

MUX

Multiplexer

NOM

Normal Operation Mode

OWI

One Wire Interface

Bridge Sensor Measurement; e.g., Pressure Sensor

PGA

Programmable Gain Amplifier

POC

Power on Clear

RAM

Random-Access Memory

RISC

Reduced Instruction Set Computer

RMS

Root-Mean-Square

ROM

Read Only Memory

SCC

Sensor Connection Check

SIF

Serial Interface

SSC+

Positive-biased Sensor Short Check

SSC-

Negative-biased Sensor Short Check

Temperature Sensor

XZC

eXtended Zero Compensation

11 Document Revision History

Revision

Date

Description

0.46

June 12, 2008

First release after format update

0.47

July 20, 2008

Update after review

1.01

September 20, 2008

Section 6: fit rate added. Section 1.5.2: ROM check time revised/corrected.

Section 5.3.4.3: SC – no detection limit added

1.02

September 20, 2009

Update to new ZMDI template

1.03

October 2, 2009

Update to ZMDI denotation

1.04

October 22, 2009

Formatting and linking issues solved

ZSC31150

Fast Automotive Sensor Signal Conditioner

Data Sheet

July 27, 2015

prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

29 of 29

Revision

Date

Description

1.05

February 26, 2010

Update for ZMDI template, including ZSC31150 Feature Sheet at page 2&3

Added ordering codes for ZSC31150 and evaluation kits. Extended glossary.

Update for contact information.

1.06

July 29, 2010

Correct “Offset shift per step” and “Approx. maximum offset shift” in Table 2.2 for PGA

gain = 105 and 52.5. Moved 1.4.1.6 “Internal pull-up resistor” into section 1.4.1 in Table

1.2. Redrew of Sensor Bridge in Figure 3.1, Figure 3.2 and Figure 3.3.

Added comment for C4 and C5 in Figure 3.3. Renamed ZMD31150 as ZSC31150.

1.07

August 31, 2010

Connection of RIBR in Figure 3.3 corrected

1.08

August 15, 2011

Update ordering information with “Long Life Automotive” in “Ordering Information” on

page 3 and section 8)

2.00

December 15, 2012

Update for part numbers and ZMDI contact information. Minor edits.

2.10

March 31, 2014

Revision of specifications in section 1.4.2. Recommended internal signal range revised to

80%. OWI interface parameters list extended. ADC formula corrected. DFN14 package

added. Minor edits for clarity. Updated contact information. Updated imagery for cover

and headings.

2.20

April 30, 2014

Added notation that DFN14 package has wettable flanks.

Update for contact information and addition of CAD model files to section 9.

2.30

August 27, 2014

Minor edits on page 2.

Minor edits for die description in part code tables.

2.40

December 3, 2014

Corrected connection of temperature PTC sensor in Figure 3.2

Update for contact information.

2.41

July 27, 2015

Update for order code for ZSC31150 SSC Evaluation Kit order code.