FEATURES FUNCTIONAL BLOCK DIAGRAM 5 kV rms/3 kV rms signal and power isolated CAN transceivers isoPower integrated isolated dc-to-dc converter VIO pin for 1.7 V to 5.5 V logic levels ISO 11898-2:2016 compliant (CAN FD) Data rates up to 12 Mbps for CAN FD Low maximum loop propagation delay: 150 ns Extended common-mode range: 25 V Bus fault protection: 40 V on CANH and CANL pins Low power standby support remote wake request Extra isolated signal for control (such as termination switches) Passes EN 55022 Class B by 6 dB Slope control for reduced EMI Safety and regulatory approvals (ADM3055E) VDE certificate of conformity, VDE V 0884-10 (pending) VIORM = 849 VPEAK UL: 5000 V rms for 1 minute per UL 1577 (pending) CSA Component Acceptance Notice 5A (pending) IEC 60950-1, IEC 61010-1 Creepage and clearance ADM3055E: 8.3 mm minimum with 20-lead SOIC_IC ADM3057E: 7.8 mm minimum with 20-lead SOIC_W High common-mode transient immunity: >75 kV/s Industrial operating temperature range: -40C to +105C APPLICATIONS CANOpen, DeviceNet, and other CAN bus implementations Industrial automation Process control and building control Transport and infrastructure GENERAL DESCRIPTION The ADM3055E/ADM3057E are 5 kV rms and 3 kV rms isolated controller area network (CAN) physical layer transceivers with integrated isolated dc-to-dc converters. The ADM3055E/ ADM3057E meet flexible data rate (CAN FD) requirements for operation to 5 Mbps and higher and comply with the ISO 11898-2: 2016 standard. The ADM3055E/ADM3057E are capable of supporting data rates as high as 12 Mbps. The devices employ Analog Devices, Inc., iCoupler(R) technology to combine a 3-channel isolator, a CAN transceiver, and an Analog Devices isoPower(R) dc-to-dc converter into a single, surfacemount, small outline integrated circuit (SOIC) package. The devices are powered by a single 5 V supply, realizing a fully isolated solution for CAN and CAN FD. Radiated emissions from the high frequency switching of the dc-to-dc convertors are kept below EN 55022 Class B limits by continuous adjustments to the switching frequency. Rev. B VCC VISOOUT VISOIN ADM3055E/ ADM3057E LOW EMI ISOLATED DC-TO-DC CONVERTER OSC RECTIFICATION REG VIO CAN TRANSCEIVER DIGITAL ISOLATOR THERMAL SHUTDOWN DOMINANT TIMEOUT SILENT RS SLOPE MODE TXD CANH RXD CANL RXD STANDBY MODE STBY TRANSCEIVER STANDBY AUXIN AUXOUT GND1 GNDISO GND2 Figure 1. The ADM3055E/ADM3057E provide complete isolation between the CAN controller and physical layer bus. Safety and regulatory approvals (pending) for 5 kV rms isolation voltage, 10 kV surge test, and 8.3 mm creepage and clearance ensure the ADM3055E meets application reinforced isolation requirements. The ADM3057E has an isolation voltage of 3 kV rms and 7.8 mm creepage in a 20-lead, wide body SOIC. Low propagation delays through the isolation support longer bus cables. Slope control mode is available for standard CAN at low data rates. Standby mode minimizes power consumption when the bus is idle or if the node goes offline. Silent mode allows the TXD input to be ignored for listen only mode. Dominant timeout functionality protects against bus lock up in a fault condition. The current limiting and thermal shutdown features protect against output short circuits. The devices are fully specified over an industrial temperature range of -40C to +105C. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 (c)2018-2019 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com 14972-001 Data Sheet 5 kV rms/3 kV rms, Signal and Power Isolated, CAN Transceivers for CAN FD ADM3055E/ADM3057E ADM3055E/ADM3057E Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Theory of Operation ...................................................................... 20 Applications ....................................................................................... 1 CAN Transceiver Operation ..................................................... 20 General Description ......................................................................... 1 Signal and Power Isolation ........................................................ 20 Functional Block Diagram .............................................................. 1 Standby Mode ............................................................................. 20 Revision History ............................................................................... 2 Remote Wake Up ........................................................................ 20 Specifications..................................................................................... 3 Silent Mode ................................................................................. 20 Timing Specifications .................................................................. 5 RS Pin ........................................................................................... 21 Insulation and Safety Related Specifications ............................ 7 Auxiliary Channel ...................................................................... 21 Package Characteristics ............................................................... 7 Integrated and Certified IEC EMC Solution .......................... 21 Regulatory Information ............................................................... 8 Fault Protection .......................................................................... 21 DIN V VDE V 0884-10 (VDE V 0884-10) Insulation Characteristics .............................................................................. 9 Fail-Safe Features ........................................................................ 21 Absolute Maximum Ratings .......................................................... 11 Applications Information .............................................................. 22 Thermal Resistance .................................................................... 11 PCB Layout ................................................................................. 22 ESD Caution ................................................................................ 11 Radiated Emissions and PCB Layout ...................................... 22 Pin Configuration and Function Descriptions ........................... 12 Thermal Analysis ....................................................................... 22 Operational Truth Table ............................................................ 13 Insulation Lifetime ..................................................................... 22 Typical Performance Characteristics ........................................... 14 Outline Dimensions ....................................................................... 24 Test Circuits ..................................................................................... 18 Ordering Guide .......................................................................... 24 Thermal Shutdown .................................................................... 21 Terminology .................................................................................... 19 REVISION HISTORY 9/2019--Rev. A to Rev. B Changes to Figure 33 ...................................................................... 22 11/2018--Rev. 0 to Rev. A Added ADM3057E and 20-Lead SOIC_W ..................... Universal Changes to Features Section and General Description Section........ 1 Changes to Table 2 ............................................................................ 5 Added Figure 5; Renumbered Sequentially .................................. 6 Changes to Table 3 ............................................................................ 7 Added ADM3055E Section ............................................................. 8 Changes to Table 5.............................................................................8 Added ADM3057E Section and Table 6; Renumbered Sequentially ........................................................................................9 Changes to Table 7.............................................................................9 Added Table 8 and Figure 7 .......................................................... 10 Changes to Table 10 and Table 11 ................................................ 11 Changes to Table 12 ....................................................................... 12 Changes to Table 13 ....................................................................... 13 8/2018--Revision 0: Initial Version Rev. B | Page 2 of 24 Data Sheet ADM3055E/ADM3057E SPECIFICATIONS All voltages are relative to their respective ground. 4.5 V VCC 5.5 V, 1.7 V VIO 5.5 V, TMIN to TMAX, and STBY low, unless otherwise noted. Typical specifications are at VCC = VIO = 5 V and TA = 25C, unless otherwise noted. Table 1. Parameter SUPPLY CURRENT Logic Side isoPower Current Standby Symbol Min Typ Max Unit Test Conditions/Comments 13.5 30 mA 27 180 40 260 mA mA STBY high, AUXIN low, load resistance (RL) = 60 TXD and/or SILENT high, RL = 60 Fault condition, see the Theory of Operation section, RL = 60 Worst case, see the Theory of Operation section, RL = 60 138 151 177 180 200 220 mA mA mA MHz Frequency hopping center 3.6 1.2 5 2 mA mA TXD high, low or switching, AUXIN low STBY high ICC Recessive State (or Silent) Dominant State 70% Dominant/30% Recessive 1 Mbps 5 Mbps 12 Mbps Switching Frequency Logic Side iCoupler Current Normal Mode Standby Mode DRIVER Differential Outputs Recessive State, Normal Mode CANH, CANL Voltage Differential Output Voltage Dominant State, Normal Mode CANH Voltage CANL Voltage Differential Output Voltage Standby Mode CANH, CANL Voltage Differential Output Voltage Output Symmetry (VISOIN - VCANH - VCANL) Short-Circuit Current Absolute CANH CANL Steady State CANH CANL Logic Inputs (TXD, SILENT, STBY, AUXIN) Input Voltage High Low fOSC IIO See Figure 28 TXD high, RL and common-mode filter capacitor (CF) open VCANL, VCANH VOD 2.0 3.0 V -500 +50 mV VCANH VCANL VOD 2.75 0.5 1.5 1.4 1.5 4.5 2.0 3.0 3.3 5.0 V V V V V VCANL, VCANH VOD VSYM -0.1 +0.1 V -200 -0.55 +200 +0.55 mV V |ISC| VIH VIL TXD and SILENT low, CF open 50 RL 65 50 RL 65 50 RL 65 45 RL 70 RL = 2240 STBY high, RL and CF open RL = 60 , CF = 4.7 nF, RS low RL open 115 115 mA mA VCANH = -3 V VCANL = 18 V 115 115 mA mA VCANH = -24 V VCANL = 24 V 0.35 x VIO V V 0.65 x VIO Rev. B | Page 3 of 24 ADM3055E/ADM3057E Parameter Complementary Metal-Oxide Semiconductor (CMOS) Logic Input Currents RECEIVER Differential Inputs Differential Input Voltage Range Data Sheet Symbol |IIH|, |IIL| Max 10 Unit A +0.5 +0.4 5.0 5.0 VHYS |IIN (OFF)| RINH, RINL RDIFF mR 10 V V V V mV A 25 100 +0.03 k k / 150 6 20 -0.03 CINH, CINL CDIFF 35 12 VOL VOH 0.2 STBY high STBY high VCANH, VCANL = 5 V, VCC = 0 V mR = 2 x (RINH - RINL)/(RINH + RINL) pF pF 0.4 VIO - 0.2 +2.4 V Output current (IOUT) = 2 mA V V IOUT = -2 mA IOUT = -2 mA mA Output voltage (VOUT) = GND1 or VIO Common-mode voltage (VCM) 1 kV, transient magnitude 800 V VIN = VIO (AUXIN, TXD) or CANH/CANL recessive VIN = 0 V (AUXIN, TXD) or CANH/CANL dominant IOS 7 85 Input High, Recessive |CMH| 75 100 kV/s Input Low, Dominant |CML| 75 100 kV/s VSTB ISLOPE VSLOPE VHS 4.0 SLOPE CONTROL Input Voltage for Standby Mode Current for Slope Control Mode Slope Control Mode Voltage Input Voltage for High Speed Mode Test Conditions/Comments Input high or low See Figure 29, CRXD open, -25 V < VCANL, VCANH < +25 V -1.0 -1.0 0.9 1.15 Dominant 1 Typ VID Recessive Input Voltage Hysteresis Unpowered Input Leakage Current Input Resistance CANH, CANL Differential Matching Input Capacitance CANH, CANL Differential Logic Outputs (RXD, AUXOUT) Output Voltage Low High RXD AUXOUT Short-Circuit Current RXD COMMON-MODE TRANSIENT IMMUNITY 1 Min -240 2.1 1 V A V V RS voltage (VRS) = 0 V RS current (IRS) = 10 A |CMH| is the maximum common-mode voltage slew rate that can be sustained while maintaining AUXOUT 2.4 V, CANH/CANL recessive, or RXD VIO - 0.2 V. |CML| is the maximum common-mode voltage slew rate that can be sustained while maintaining AUXOUT 0.4 V, CANH/CANL dominant, or RXD 0.4 V. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. Rev. B | Page 4 of 24 Data Sheet ADM3055E/ADM3057E TIMING SPECIFICATIONS All voltages are relative to their respective ground. 4.5 V VCC 5.5 V, 1.7 V VIO 5.5 V, TMIN to TMAX, and STBY low, unless otherwise noted. Typical specifications are at VCC = VIO = 5 V and TA = 25C, unless otherwise noted. Table 2. Parameter DRIVER Maximum Data Rate Propagation Delay from TXD to Bus (Recessive to Dominant) Propagation Delay from TXD to Bus (Dominant to Recessive) Transmit Dominant Timeout RECEIVER Falling Edge Loop Propagation Delay (TXD to RXD) Full Speed Mode Slope Control Mode Rising Edge Loop Propagation Delay (TXD to RXD) Full Speed Mode Slope Control Mode Loop Delay Symmetry (Minimum Recessive Bit Width) 2 Mbps 5 Mbps 8 Mbps 12 Mbps CANH, CANL SLEW RATE STANDBY MODE Minimum Pulse Width Detected (Receiver Filter Time) Wake-Up Pattern Detection Reset Time Normal Mode to Standby Mode Time Standby Mode to Normal Mode Time AUXILIARY SIGNAL Maximum Switching Rate AUXIN to AUXOUT Propagation Delay SILENT MODE Normal Mode to Silent Mode Time Silent Mode to Normal Mode Time Symbol Min Typ Max Unit tTXD_DOM 35 60 Mbps ns tTXD_REC 46 70 ns 4000 s TXD low, see Figure 5 SILENT low, see Figure 2 and Figure 30, RL = 60 , CL = 100 pF, RXD capacitance (CRXD) = 15 pF 150 300 ns ns RSLOPE = 0 , tBIT_TXD = 200 ns RSLOPE = 47 k, tBIT_TXD = 1 s 150 300 ns ns RSLOPE = 0 , tBIT_TXD = 200 ns RSLOPE = 47 k, tBIT_TXD = 1 s 550 220 140 91.6 ns ns ns ns V/s tBIT_TXD = 500 ns tBIT_TXD = 200 ns tBIT_TXD = 125 ns tBIT_TXD = 83.3 ns SILENT low, see Figure 30, RL = 60 , CL = 100 pF, RSLOPE = 47 k 12 tDT 1175 Test Conditions/Comments SILENT low, bit time on the TXD pin as transmitted by the CAN controller (tBIT_TXD) = 200 ns, see Figure 2 and Figure 30, slope resistance (RSLOPE) = 0 , RL = 60 , load capacitance (CL) = 100 pF tLOOP_FALL tLOOP_RISE tBIT_RXD 450 160 85 50 |SR| 7 tFILTER 1 5 s STBY high, see Figure 4 tWUPR tSTBY_ON tSTBY_OFF 1175 4000 25 25 s s s STBY high, see Figure 4 fAUX tAUX 20 25 kHz s 100 100 ns ns tSILENT_ON tSILENT_OFF 40 50 Rev. B | Page 5 of 24 Time until RXD valid TXD low, RSLOPE = 0 , see Figure 3 TXD low, RSLOPE = 0 , see Figure 3 ADM3055E/ADM3057E Data Sheet Timing Diagrams TXD 0.7VIO 0.3VIO VIO 0.3VIO 0V tBIT_TXD 5 x tBIT_TXD tLOOP_FALL VOD/VID 0.9V 0.5V tTXD_REC tTXD_DOM tBIT_BUS VIO 0.7VIO 0.3VIO 0V tBIT_RXD tLOOP_RISE 14972-002 RXD Figure 2. Transceiver Timing Diagram VIO TXD 0V VIO 0.7 x VIO SILENT 0.3 x VIO 0V 900mV 500mV tSILENT_ON 14972-015 VOD tSILENT_OFF Figure 3. Silent Mode Timing Diagram CANH CANL VID <tFILTER <tFILTER <tFILTER RXD (NO PRIOR WAKE-UP PATTERN) tFILTER tFILTER tFILTER tFILTER Figure 4. Wake-Up Pattern Detection and Filtered RXD in Standby Mode Timing Diagram tDT 14972-103 TXD VOD Figure 5. Dominant Timeout Rev. B | Page 6 of 24 14972-004 tWUPR RXD (PRIOR WAKE-UP PATTERN) Data Sheet ADM3055E/ADM3057E INSULATION AND SAFETY RELATED SPECIFICATIONS For additional information, see www.analog.com/icouplersafety. Table 3. L (I01) Value ADM3055E ADM3057E 5000 3000 8.3 7.8 Unit V rms mm min Minimum External Tracking (Creepage) L (I02) 8.3 7.8 mm min Minimum Clearance in the Plane of the Printed Circuit Board (PCB Clearance) L (PCB) 8.3 7.8 mm min CTI 21 >600 21 >600 m min V I I Parameter Rated Dielectric Insulation Voltage Minimum External Air Gap (Clearance) Symbol Minimum Internal Gap (Internal Clearance) Tracking Resistance (Comparative Tracking Index) Material Group Test Conditions/Comments 1-minute duration Measured from input terminals to output terminals, shortest distance through air Measured from input terminals to output terminals, shortest distance path along body Measured from input terminals to output terminals, shortest distance through air, line of sight, in the PCB mounting plane Insulation distance through insulation IEC 60112 Material Group (IEC 60664-1) PACKAGE CHARACTERISTICS Table 4. Parameter Resistance (Input to Output) 1 Capacitance (Input to Output)1 Input Capacitance 2 1 2 Symbol RI-O CI-O CI Min Typ 1013 3.7 4.0 Max Unit pF pF Test Conditions/Comments f = 1 MHz The device is considered a 2-terminal device: Pin 1 through Pin 10 are shorted together, and Pin 11 through Pin 20 are shorted together. Input capacitance is from any input data pin to ground. Rev. B | Page 7 of 24 ADM3055E/ADM3057E Data Sheet REGULATORY INFORMATION ADM3055E See Table 11 and the Insulation Lifetime section for details regarding maximum working voltages for specific cross isolation waveforms and insulation levels. The ADM3055E is approved or pending approval by the organizations listed in Table 5. Table 5. UL (Pending) 1 Recognized under 1577 Component Recognition Program1 Single Protection, 5000 V rms Isolation Voltage CSA (Pending) Approved under CSA Component Acceptance Notice 5A VDE (Pending) 2 DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 CQC (Pending) Certified under CQC11-471543-2012 CSA 60950-1-07+A1+A2 and IEC 60950-1, second edition, +A1+A2 Reinforced insulation 849 VPEAK, surge isolation voltage (VIOTM) = 8000 VPEAK GB4943.1-2011: basic insulation at 830 V rms (1174 VPEAK) Reinforced insulation at 415 V rms (587 VPEAK) File 2471900-4880-0001 File (pending) Basic insulation at 830 V rms (1174 VPEAK) File E214100 1 2 Reinforced insulation at 415 V rms (587 VPEAK) IEC 60601-1 Edition 3.1: Basic insulation (1 MOPP), 519 V rms (734 VPEAK) Reinforced insulation (2 MOPP), 261V rms (369 VPEAK) CSA 61010-1-12 and IEC 61010-1 third edition Basic insulation at 300 V rms mains, 830 V secondary (1174 VPEAK) Reinforced insulation at 300 V rms mains, 415 V secondary (587 VPEAK) File 205078 In accordance with UL 1577, each ADM3055E is proof tested by applying an insulation test voltage 6000 V rms for 1 sec. In accordance with DIN V VDE V 0884-10, each ADM3055E is proof tested by applying an insulation test voltage 1592 VPEAK for 1 sec (partial discharge detection limit = 5 pC). The * marking branded on the component designates DIN V VDE V 0884-10 approval. Rev. B | Page 8 of 24 Data Sheet ADM3055E/ADM3057E ADM3057E See Table 11 and the Insulation Lifetime section for details regarding maximum working voltages for specific cross isolation waveforms and insulation levels. The ADM3057E is approved or pending approval by the organizations listed in Table 6. Table 6. UL (Pending) 1 Recognized under 1577 Component Recognition Program1 Single Protection, 3000 V rms Isolation Voltage CSA (Pending) Approved under CSA Component Acceptance Notice 5A VDE (Pending) 2 DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 CQC (Pending) Certified under CQC11-471543-2012 CSA 60950-1-07+A1+A2 and IEC 60950-1, second edition, +A1+A2 Reinforced insulation 849 VPEAK, surge isolation voltage (VIOTM) = 6000 VPEAK GB4943.1-2011: basic insulation at 780 V rms (1103 VPEAK) Reinforced insulation at 390 V rms (552 VPEAK) File 2471900-4880-0001 File (pending) Basic insulation at 780 V rms (1103 VPEAK) File E214100 1 2 Reinforced insulation at 390 V rms (552 VPEAK) IEC 60601-1 Edition 3.1: Basic insulation (1 MOPP), 490 V rms (693 VPEAK) Reinforced insulation (2 MOPP), 250 V rms (353 VPEAK) CSA 61010-1-12 and IEC 61010-1 third edition Basic insulation at 300 V rms mains, 780 V secondary (1103 VPEAK) Reinforced insulation at 300 V rms mains, 390 V secondary (552 VPEAK) File 205078 In accordance with UL 1577, each ADM3057E is proof tested by applying an insulation test voltage 3600 V rms for 1 sec. In accordance with DIN V VDE V 0884-10, each ADM3057E is proof tested by applying an insulation test voltage 1592 VPEAK for 1 sec (partial discharge detection limit = 5 pC). The * marking branded on the component designates DIN V VDE V 0884-10 approval. DIN V VDE V 0884-10 (VDE V 0884-10) INSULATION CHARACTERISTICS These isolators are suitable for reinforced electrical isolation only within the safety limit data. The protective circuits ensure the maintenance of the safety data. The asterisk (*) marking on packages denotes DIN V VDE V 0884-10 approval. Table 7. ADM3055E VDE Characteristics Description Installation Classification per DIN VDE 0110 For Rated Mains Voltage 150 V rms For Rated Mains Voltage 300 V rms For Rated Mains Voltage 400 V rms Climatic Classification Pollution Degree per DIN VDE 0110, Table 1 Maximum Working Insulation Voltage Input to Output Test Voltage, Method B1 Input to Output Test Voltage, Method A After Environmental Tests Subgroup 1 After Input or Safety Test Subgroup 2 and Subgroup 3 Highest Allowable Overvoltage Surge Isolation Voltage Reinforced Safety Limiting Values Case Temperature Total Power Dissipation at 25C Insulation Resistance at TS Test Conditions/Comments VIORM x 1.875 = VPR, 100% production test, tm = 1 sec, partial discharge < 5 pC VIORM x 1.5 = Vpd(m), tini = 60 sec, tm = 10 sec, partial discharge < 5 pC VIORM x 1.2 = Vpd(m), tini = 60 sec, tm = 10 sec, partial discharge < 5 pC Transient overvoltage, tTR = 10 sec VIOSM(TEST) = 10 kV, 1.2 s rise time, 50 s, 50% fall time Maximum value allowed in the event of a failure (see Figure 6) VIO = 500 V Rev. B | Page 9 of 24 Symbol Characteristic Unit VIORM Vpd(m) I to IV I to IV I to III 40/105/21 2 849 1592 VPEAK VPEAK Vpd(m) 1273 VPEAK Vpd(m) 1018 VPEAK VIOTM VIOSM 8000 6000 VPEAK VPEAK TS PS RS 150 2.55 >109 C W ADM3055E/ADM3057E Data Sheet Table 8. ADM3057E VDE Characteristics Description Installation Classification per DIN VDE 0110 For Rated Mains Voltage 150 V rms For Rated Mains Voltage 300 V rms For Rated Mains Voltage 400 V rms Climatic Classification Pollution Degree per DIN VDE 0110, Table 1 Maximum Working Insulation Voltage Input to Output Test Voltage, Method B1 Test Conditions/Comments VIORM x 1.875 = VPR, 100% production test, tm = 1 sec, partial discharge < 5 pC Input to Output Test Voltage, Method A After Environmental Tests Subgroup 1 VIORM x 1.5 = Vpd(m), tini = 60 sec, tm = 10 sec, partial discharge < 5 pC VIORM x 1.2 = Vpd(m), tini = 60 sec, tm = 10 sec, partial discharge < 5 pC Transient overvoltage, tTR = 10 sec VIOSM(TEST) = 10 kV, 1.2 s rise time, 50 s, 50% fall time Maximum value allowed in the event of a failure (see Figure 7) After Input or Safety Test Subgroup 2 and Subgroup 3 Highest Allowable Overvoltage Surge Isolation Voltage Reinforced Safety Limiting Values VIO = 500 V 3.0 3.0 2.5 2.5 SAFE LIMITING POWER (W) 2.0 1.5 1.0 0.5 Unit VIORM Vpd(m) I to IV I to IV I to III 40/105/21 2 849 1592 VPEAK VPEAK Vpd(m) 1273 VPEAK Vpd(m) 1018 VPEAK VIOTM VIOSM 6000 6000 VPEAK VPEAK TS PS RS 150 2.35 >109 C W 2.0 1.5 1.0 0.5 0 50 100 150 AMBIENT TEMPERATURE (C) 200 0 14972-105 0 Characteristic Figure 6. ADM3055E Thermal Derating Curve, Dependence of Safety Limiting Values with Ambient Temperature per DIN V VDE V 0884-10 0 50 100 150 AMBIENT TEMPERATURE (C) 200 14972-107 SAFE LIMITING POWER (W) Case Temperature Total Power Dissipation at 25C Insulation Resistance at TS Symbol Figure 7. ADM3057E Thermal Derating Curve, Dependence of Safety Limiting Values with Ambient Temperature per DIN V VDE V 0884-10 Rev. B | Page 10 of 24 Data Sheet ADM3055E/ADM3057E ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Pin voltages with respect to GNDx are on the same side, unless otherwise noted. Thermal performance is directly linked to PCB design and operating environment. Careful attention to PCB thermal design is required. Table 9. Parameter VCC VIO Logic Side Input/Output: TXD, RXD, AUXIN, SILENT, STBY CANH, CANL AUXOUT, RS Operating Temperature Range Storage Temperature Range Junction Temperature (TJ Maximum) Power Dissipation Electrostatic Discharge (ESD) IEC 61000-4-2, CANH/CANL Across Isolation Barrier to GND1 Contact Discharge to GND2 Air Discharge to GND2 Human Body Model (HBM), All Pins, 1.5 k, 100 pF Moisture Sensitivity Level (MSL) Rating -0.5 V to +6 V -0.5 V to +6 V -0.5 V to VIO + 0.5 V JA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 10. Thermal Resistance Package Type1 RI-20-1 RW-20 -40 V to +40 V -0.5 V to VISOIN + 0.5 V -40C to +105C -65C to +150C 150C (TJ maximum - TA)/JA 1 JA 49 53 Unit C/W C/W Thermocouple located at the center of the package underside, test conducted on a 4-layer board with thin traces. See the Thermal Analysis section for thermal model definitions. ESD CAUTION 8 kV 8 kV 15 kV 4 kV 3 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Table 11. Maximum Continuous Working Voltage1 Parameter AC Voltage Bipolar Waveform Basic Insulation Reinforced Insulation Unipolar Waveform Basic Insulation Reinforced Insulation DC Voltage Basic Insulation Reinforced Insulation 1 Rating ADM3055E ADM3057E Unit Constraint 566 467 566 467 VPEAK VPEAK Lifetime limited by insulation lifetime per VDE-0884-11 Lifetime limited by insulation lifetime per VDE-0884-11 1131 933 1131 933 VPEAK VPEAK Lifetime limited by insulation lifetime per VDE-0884-11 Lifetime limited by insulation lifetime per VDE-0884-11 1660 830 1560 780 VPEAK VPEAK Lifetime limited by package creepage per IEC 60664-1 Lifetime limited by package creepage per IEC 60664-1 Maximum continuous working voltage refers to the continuous voltage magnitude imposed across the isolation barrier. See the Insulation Lifetime section for more details. Rev. B | Page 11 of 24 ADM3055E/ADM3057E Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS GND1 1 20 GNDISO GND1 2 19 VISOOUT VCC 3 18 GNDISO VIO 4 RXD 5 ADM3055E/ ADM3057E SILENT 6 TOP VIEW (Not to Scale) TXD 7 14 CANH STBY 8 13 CANL AUXIN 9 12 RS 16 VISOIN 15 GND2 11 GND2 14972-007 GND1 10 17 AUXOUT Figure 8. Pin Configuration Table 12. Pin Function Descriptions Pin No. 1, 2, 10 3 4 5 6 Mnemonic GND1 VCC VIO RXD SILENT 7 8 TXD STBY 9 11, 15 12 AUXIN GND2 RS 13 14 16 CANL CANH VISOIN 17 AUXOUT 18, 20 GNDISO 19 VISOOUT Description Ground, Logic Side. isoPower Power Supply, 4.5 V to 5.5 V. This pin requires 0.1 F and 10 F decoupling capacitors. iCoupler Power Supply, 1.7 V to 5.5 V. This pin requires 0.01 F and 0.1 F decoupling capacitors. Receiver Output Data. Silent Mode Select with Input High. Bring this input low or leave the pin unconnected (internal pull-down) for normal mode. Driver Input Data. This pin has a weak internal pull-up resistor to VIO. Standby Mode Select with Input High. Bring this input low or leave the pin unconnected (internal pull-down) for normal mode. Auxiliary Channel Input. This pin sets the AUXOUT output. Ground, Bus Side. Slope Control Pin. Short this pin to ground for full speed operation or use a weak pull-down resistor (for example, 47 k) for slope control mode. An input high signal places the CAN transceiver in standby mode. CAN Low Input/Output. CAN High Input/Output. Isolated Power Supply Input for the CAN Transceiver Bus Side Digital Isolator. This pin requires 0.01 F and 0.1 F decoupling capacitors. Isolated Auxiliary Channel Output. The state of AUXOUT is latched when STBY is high. By default, AUXOUT is low at startup or when VIO is unpowered. Ground for the Isolated DC-to-DC Converter. Connect these pins together through one ferrite bead to PCB ground (bus side). Isolated Power Supply Output. This pin requires 0.22 F and 10 F capacitors to GNDISO. Connect this pin through a ferrite bead and short the PCB trace to VISOIN for operation. Rev. B | Page 12 of 24 Data Sheet ADM3055E/ADM3057E OPERATIONAL TRUTH TABLE Table 13. Truth Table Power VCC VIO On On TXD Low SILENT Low Inputs 1, 2 STBY AUXIN Low Low On On Low Low Low High On On High Low Low Low On On High Low Low High On On On On On On On On On On On Off X X X X X Z High High X X X Z Low Low High X X Z Low High X Low High Z Off Off On Off X Z X Z X Z X Z Outputs2 RS Low/ pull-down Low/ pull-down Low/ pull-down Low/ pull-down X X X Pull-up Pull-up Low/ pull-down X Z Mode Normal/ slope mode Normal/ slope mode Normal/ slope mode Normal/ slope mode Listen only Listen only Standby Standby 5 Standby5 Normal/ slope mode Transceiver off Transceiver off X means irrelevant. Z means high impedance within one diode drop of ground. 3 WUP means remote wake-up pattern. 4 Limited by tDT. 5 RS can only set the transceiver to standby mode. RS does not control the digital isolator. 1 2 Rev. B | Page 13 of 24 AUXOUT Low Input/Output CANH/CANL Dominant 4 Low High Dominant4 High/per bus Low Recessive/set by bus High/per bus High Recessive/set by bus High/per bus High/per bus High/WUP/filtered High/WUP/filtered High/WUP/filtered Z Low High Last state Low High Low Recessive/set by bus Recessive/set by bus Bias to GND2/set by bus Bias to GND2/set by bus Bias to GND2/set by bus Recessive/set by bus High Z Z Z High impedance/set by bus High impedance/set by bus RXD Low 3 ADM3055E/ADM3057E Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 140 3.0 2.5 1.5 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 DATA RATE (Mbps) 100 80 60 40 20 0 20 14972-108 2.0 120 35 40 45 50 55 60 85 105 Figure 12. Single-Ended Slew Rate vs. RSLOPE 140 160 140 120 100 60 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 DATA RATE (Mbps) 120 110 100 90 -55 14972-109 80 130 -35 -15 5 25 45 65 TEMPERATURE (C) 14972-112 RECEIVER INPUT HYSTERESIS (mV) 180 SUPPY CURRENT, I CC (mA) 30 RSLOPE (k) Figure 9. Supply Current, IIO vs. Data Rate Figure 13. Receiver Input Hysteresis vs. Temperature Figure 10. Supply Current, ICC vs. Data Rate 43 4.5 4.0 41 3.5 VIO = 5.0V VIO = 3.3V VIO = 2.5V VIO = 1.8V 39 tTXD_DOM (ns) STBY LOW, AUXIN HIGH STBY LOW, AUXIN LOW STBY HIGH 3.0 2.5 2.0 37 35 1.5 33 1.0 31 0.5 0 -55 -35 -15 5 25 45 65 85 105 TEMPERATURE (C) 14972-110 SUPPY CURRENT, I IO (mA) 25 29 -55 -35 -15 5 25 45 65 TEMPERATURE (C) Figure 14. tTXD_DOM vs. Temperature Figure 11. Supply Current, IIO vs. Temperature (Inputs Idle) Rev. B | Page 14 of 24 85 105 14972-113 SUPPY CURRENT, I IO (mA) 3.5 SINGLE-ENDED SLEW RATE (V/s) VIO = 5.0V VIO = 3.3V VIO = 2.5V VIO = 1.8V 14972-111 4.0 Data Sheet ADM3055E/ADM3057E 54 135 VIO = 5.0V VIO = 3.3V VIO = 2.5V VIO = 1.8V 52 130 48 46 120 115 44 110 42 105 40 -55 -35 -15 5 25 45 65 85 105 TEMPERATURE (C) 100 -55 -35 -15 5 25 45 65 85 105 TEMPERATURE (C) Figure 15. tTXD_REC vs. Temperature 14972-117 tLOOP_RISE (ns) 125 14972-114 tTXD_REC (ns) 50 VIO = 5.0V VIO = 3.3V VIO = 2.5V VIO = 1.8V Figure 18. tLOOP_RISE vs. Temperature (RSLOPE = 0 ) 125 260 VIO = 5.0V VIO = 3.3V VIO = 2.5V VIO = 1.8V 120 255 250 VIO = 5.0V VIO = 3.3V VIO = 2.5V VIO = 1.8V tLOOP_RISE (ns) tLOOP_FALL (ns) 245 115 110 240 235 230 225 105 220 -35 -15 5 25 45 65 85 105 TEMPERATURE (C) 210 -55 14972-115 100 -55 -15 5 25 45 65 85 105 TEMPERATURE (C) Figure 16. tLOOP_FALL vs. Temperature (RSLOPE = 0 ) Figure 19. tLOOP_RISE vs. Temperature (RSLOPE = 47 k) 2.40 190 DIFFERENTIAL OUTPUT VOLTAGE (V) VIO = 5.0V VIO = 3.3V VIO = 2.5V VIO = 1.8V 180 170 160 150 130 -55 -35 -15 5 25 45 65 85 TEMPERATURE (C) 105 14972-116 140 2.35 2.30 2.25 2.20 2.15 2.10 -55 -35 -15 5 25 45 65 85 105 TEMPERATURE (C) Figure 20. Differential Output Voltage (VOD) vs. Temperature Figure 17. tLOOP_FALL vs. Temperature (RSLOPE = 47 k) Rev. B | Page 15 of 24 14972-119 200 tLOOP_FALL (ns) -35 14972-118 215 ADM3055E/ADM3057E Data Sheet 118 130 RSLOPE = 0, 1Mbps DATA RATE DATA RATE 1Mbps 1mbps 116 SUPPLY CURRENT, ICC (mA) 110 100 90 80 70 -15 5 25 45 65 85 105 106 104 102 98 4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.5 SUPPLY VOLTAGE, VCC (V) 2.70 3.0 1mbps DATA RATE 1Mbps VIO = 5.0V VIO = 3.3V VIO = 2.5V VIO = 1.8V SUPPLY CURRENT, IIO (mA) 2.65 2.7 2.6 2.5 2.4 2.3 2.60 2.55 2.50 2.45 2.40 2.2 2.35 2.1 2.0 -55 -35 -15 5 25 45 65 85 105 TEMPERATURE (C) Figure 22. Supply Current, IIO vs. Temperature, RS = 0 , 1 Mbps 2.30 1.7 14972-121 SUPPLY CURRENT, IIO (mA) 108 Figure 23. Supply Current, ICC vs. Supply Voltage, VCC, RS = 0 , 1 Mbps Figure 21. Supply Current, ICC vs. Temperature 2.8 110 14972-122 -35 TEMPERATURE (C) 2.9 112 100 14972-120 60 -55 114 2.2 2.7 3.2 3.7 4.2 SUPPLY VOLTAGE, VIO (V) 4.7 5.2 5.7 14972-123 SUPPLY CURRENT, ICC (mA) 120 Figure 24. Supply Current, IIO vs. Supply Voltage, VIO, Data Rate = 1 Mbps Rev. B | Page 16 of 24 ADM3055E/ADM3057E 2200 200 2150 40 SUPPLY CURRENT, ICC (mA) 2100 2050 2000 1950 1900 -15 5 25 85 65 45 105 14972-124 -35 TEMPERATURE (C) Figure 25. Dominant Timeout, tDT vs. Temperature 550 500 450 400 4.6 4.7 4.8 4.9 5.0 5.1 5.2 SUPPLY VOLTAGE, VCC (V) 5.3 5.4 5.5 14972-125 SUPPLY CURRENT, ICC (mA) 30 25 20 60 0 5 10 TRANSMITTED DATA RATE (Mbps) Figure 27. Supply Current, ICC vs. Transmitted Data Rate 600 350 4.5 35 15 1850 1800 -55 +105C +25C -40C -55C Figure 26. Supply Current, ICC vs. Supply Voltage, VCC (VISOOUT Shorted to GNDISO) Rev. B | Page 17 of 24 15 14972-126 DOMNANT TIMEOUT, tDT (s) Data Sheet ADM3055E/ADM3057E Data Sheet TEST CIRCUITS TXD VOD RL 2 VCANH RL 2 CANH GND2 RDIFF 14972-008 VCANL CDIFF CANL GND2 14972-011 GND1 CF Figure 31. RDIFF and CDIFF Measured in Recessive State, Bus Disconnected Figure 28. Driver Voltage Measurement RINH CANH CINH RINL CINL CANH VID CANL 14972-009 GND1 GND2 GND2 Figure 32. RIN and CIN Measured in Recessive State, Bus Disconnected Figure 29. Receiver Voltage Measurement STBY SILENT CANH TXD CANL RL CL RXD CRXD GND2 RS NOTES 1. 1% TOLERANCE FOR ALL RESISTORS AND CAPACITORS. 14972-010 RSLOPE GND1 CANL 14972-012 RXD CRXD Figure 30. Switching Characteristics Measurements Rev. B | Page 18 of 24 Data Sheet ADM3055E/ADM3057E TERMINOLOGY ICC ICC is the current drawn by the VCC pin. This pin powers the isoPower dc-to-dc converter. tLOOP_RISE tLOOP_RISE is the propagation delay of a high signal on the TXD pin to the bus recessive and transitions high on the RXD pin. IIO IIO is the current drawn by the VIO pin. This pin powers the iCoupler digital isolator. tBIT_TXD tBIT_TXD is the bit time on the TXD pin as transmitted by the CAN controller. See Figure 2 for level definitions. ISC ISC is the current drawn by the VISOIN pin under the specified fault condition. tBIT_BUS tBIT_BUS is the bit time transmitted by the transceiver to the bus. When compared with a given tBIT_TXD, a measure of bit symmetry from the TXD digital isolation channel and CAN transceiver can be determined. See Figure 2 for level definitions. VOD The VOD is the difference of the CANH and CANL levels, which is VDIFF in ISO 11898-2:2016. fOSC fOSC is the carrier frequency of the isoPower dc-to-dc converter that provides isolated power to the bus side. tTXD_DOM tTXD_DOM is the propagation delay from a low signal on TXD to transition the bus to a dominant state. tTXD_REC tTXD_REC is the propagation delay from a high signal on TXD to transition the bus to a recessive state. tBIT_RXD tBIT_RXD is the bit time on the RXD output pin that can be compared with tBIT_TXD for a round trip measure of pulse width distortion through the TXD digital isolation channel, the CAN transceiver, and back through the RXD isolation channel. Wake-Up Pattern (WUP) WUP is a remote transmitted pattern required to trigger low speed data transmission by the CAN transceiver while in standby mode. The pattern does not force the transceiver out of standby mode. tLOOP_FALL tLOOP_FALL is the propagation delay of a low signal on the TXD pin to the bus dominant and transitions low on the RXD pin. Rev. B | Page 19 of 24 ADM3055E/ADM3057E Data Sheet THEORY OF OPERATION CAN TRANSCEIVER OPERATION The ADM3055E/ADM3057E facilitate communication between a CAN controller and the CAN bus. The CAN controller and the ADM3055E/ADM3057E communicate with standard 1.8 V, 2.5 V, 3.3 V, or 5.0 V CMOS levels. The internal transceiver translates the CMOS levels to and from the CAN bus. The CAN bus has two states: dominant and recessive. The recessive state is present on the bus when the differential voltage between CANH and CANL is less than 0.5 V. In the recessive state, the CANH and CANL pins are set to high impedance and are loosely biased to a single-ended voltage of 2.5 V. A dominant state is present on the bus when the differential voltage between CANH and CANL is greater than 1.5 V. The transceiver transmits a dominant state by driving the single-ended voltage of the CANH pin to 3.5 V and the CANL pin to 1.5 V. The recessive and dominant states correspond to CMOS high and CMOS low, respectively, on the RXD pin and TXD pin. A dominant state from another node overwrites a recessive state on the bus. A CAN frame can be set for higher priority by using a longer string of dominant bits to gain control of the CAN bus during the arbitration phase. While transmitting, a CAN transceiver also reads back the state of the bus. When a CAN controller receives a dominant state while transmitting a recessive state during arbitration, the CAN controller surrenders the bus to the node still transmitting the dominant state. The node that gains control during the arbitration phase reads back only its own transmission. This interaction between recessive and dominant states allows competing nodes to negotiate for control of the bus while avoiding contention between nodes. Industrial applications can have long cable runs. These long runs may have differences in local earth potential. Different sources may also power nodes. The ADM3055E transceiver has a 25 V common-mode range (CMR) that exceeds the ISO 11898-2:2016 requirement and further increases the tolerance to ground variation. See the AN-1123 Application Note for additional information on CAN. SIGNAL AND POWER ISOLATION The ADM3055E and the ADM3057E provide galvanic signal isolation implemented on the logic side of the interface. The RXD and TXD isolation channels transmit and receive with an on/off keying (OOK) architecture on the iCoupler digital isolation technology. The ADM3055E and the ADM3057E feature independent power supply pins for isolated power (the VCC pin) and isolated signal (the VIO pin). The VCC pin requires a nominal 5 V supply to produce the 5 V isolated power. The VIO pin may be supplied with a nominal 1.8 V to a nominal 5 V. The logic input and output levels scale to the voltage supplied to the VIO pin. The isolated power from the VISOOUT pin must be supplied to the VISOIN pin to power the bus side digital isolator and transceiver. STANDBY MODE The STBY pin engages a reduced power standby mode that modifies the operation of both the CAN transceiver and digital isolation channels. Standby mode disables the TXD signal isolation channel and sets the transmitter output to a high impedance state loosely biased to GND2. While in standby mode, the receiver filters bus data and responds only after the remote wake-up sequence is received. When entering or exiting standby mode, the TXD input must be kept high and the RXD output must be ignored for the full tSTBY_ON and tSTBY_OFF times. STBY does not control or modify behavior of the isoPower integrated dc-to-dc converter. The dc-to-dc converter continues to operate and provide the power to the bus side. REMOTE WAKE UP The ADM3055E and the ADM3057E respond to the remote wake-up sequence as defined in ISO 11898-2:2016. When CAN channels are presented with the defined slow speed high low high sequence within the low wake-up pattern detection reset time (tWUPR), low speed data transmission is allowed. Successful receipt of the remote wake-up pattern does not bring the ADM3055E and the ADM3057E out of standby mode. The ADM3055E STBY pin must be brought low externally to exit standby mode. After the ADM3055E or ADM3057E device receives the remote wake-up pattern, the transceiver continues to receive low speed data until standby mode is exited. SILENT MODE Asserting the SILENT pin disables the TXD digital isolation channel. Any inputs to the TXD pin are ignored in this mode, and the transceiver presents a recessive bus state. The operation of the RXD channel is unaffected. The RXD channel continues to output data received from the internal CAN transceiver monitoring the bus. Silent mode is useful when paired with a CAN controller using automatic baud rate detection. A CAN controller must be set to the same data rate as all attached nodes. The CAN controller produces an error frame and ties up the bus with a dominant state when the received data rate is different from expected. Other CAN nodes then echo this error frame. While in silent mode, the error frames produced by the CAN controller are kept from interrupting bus traffic, and the controller can continue listening to bus traffic to tune. Rev. B | Page 20 of 24 Data Sheet ADM3055E/ADM3057E RS PIN FAULT PROTECTION The RS pin sets the transceiver in one of three different modes of operation: high speed, slope control, or standby. This pin cannot be left floating. Miswire events commonly occur when the system power supply is connected directly to the CANH and CANL bus lines during assembly. The ADM3055E and the ADM3057E CAN bus pins are protected against such high voltage miswire events. The ADM3055E and the ADM3057E CANH and CANL signal lines can withstand continuous 40 V with respect to GND2 or +40 V between the CAN bus lines without damage. This level of protection applies when the device is either powered or unpowered. For high speed mode, connect the RS pin directly to GND2. Ensure that the transition time of the CAN bus signals are as short as possible to allow higher speed signaling. A shielded cable is recommended to avoid electromagnetic interference (EMI) problems in high speed mode. Slope control mode allows the use of unshielded twisted pair wires or parallel pair wires as bus lines. Slow the signal rise and fall transition times to reduce EMI and ringing in slope control mode. Adjust the rise and fall slopes by adding a resistor (RSLOPE) connected from RS to GND2. The slope is proportional to the current output at the RS pin. The RS pin can also set the CAN transceiver to standby mode, which occurs when the pin is driven to a voltage above VSTB. In standby mode, high speed data is filtered, and the CANH and CANL lines are biased to GND2. The RS pin can only set the CAN transceiver to standby mode. The state of the RS pin does not modify the operation of digital isolation channels or the auxiliary channel. AUXILIARY CHANNEL The auxiliary channel is available for low speed data transmission at up to 20 kHz (or 40 kbps nonreturn-to-zero format) when STBY is not asserted. The data rate limit of the channel allows the data channel to be shared by the STBY signal. In standby mode, or when STBY is driven high, the operation of the channel is modified to share the multiplexed signal path with the STBY signal (see Figure 1). The AUXOUT pin remains latched in the state when STBY is asserted. Periodic pulses (<25 s wide) are sent to indicate that the logic side is powered and remains in standby mode. In applications where AUXOUT may be shorted to GND2 or VDD2, add a series resistance to the output channel. An example of using this auxiliary channel to control a switchable termination from the logic side is demonstrated on the EVALADM3055EEBZ evaluation board. INTEGRATED AND CERTIFIED IEC EMC SOLUTION Typically, designers must add protections against harsh operating environments while also making the product as small as possible. To reduce board space and the design effort needed to meet system level ESD standards, the ADM3055E and the ADM3057E include robust protection circuitry on chip for the CANH and CANL lines. The ADM3055E provides IEC 61000-4-2 Level 4 ESD protection, but some applications may require further system level protection. The symmetrical nature of the ADM3055E 40 V bus fault protection and the 25 V CMR makes the selection of bidirectional transient voltage suppressor (TVS) diodes easier. FAIL-SAFE FEATURES In cases where the TXD input pin is allowed to float, to prevent bus traffic interruption, the TXD input channel has an internal pull-up to the VIO pin. The pull-up holds the transceiver in the recessive state. The ADM3055E and the ADM3057E feature a dominant timeout (tDT in Table 2). A TXD line shorted to ground or malfunctioning CAN controller are examples of how a single node can indefinitely prevent further bus traffic. The dominant timeout limits how long the dominant state can transmit to the CAN bus by the transceiver. When the TXD pin is presented with a logic high, normal TXD functionality is restored. The tDT minimum also inherently creates a minimum data rate. Under normal operation, the CAN protocol allows five consecutive bits of the same polarity before stuffing a bit of the opposite polarity into the transmitting bit sequence. When an error is detected, the CAN controller purposely violates the bit stuffing rules by producing six consecutive dominant bits. At any given data rate, the CAN controller must transmit as many as 11 consecutive dominant bits to effectively limit the ADM3055E and the ADM3057E minimum data rate to 9600 bps. THERMAL SHUTDOWN The ADM3055E and the ADM3057E contain thermal shutdown circuitry that protects the devices from excessive power dissipation during fault conditions. Shorting the driver outputs to a low impedance source can result in high driver currents. The thermal sensing circuitry detects the increase in die temperature under this condition and disables the driver outputs. The circuitry disables the driver outputs when the die temperature reaches 175C. When the die has cooled, the drivers are enabled again. Rev. B | Page 21 of 24 ADM3055E/ADM3057E Data Sheet APPLICATIONS INFORMATION PCB LAYOUT ADM3055E/ ADM3057E The integrated dc-to-dc converter supply input pin, VCC, requires parallel 10 F and 0.1 F bypass capacitors placed close to the pin. Noise suppression requires a low inductance, high frequency capacitor. Ripple suppression and proper regulation require a large value capacitor. Effective bypass capacitance is also required on the isolated output supply pin, VISOOUT, for proper operation of the integrated dc-to-dc converter. Note that the total trace length between the ends of the low ESR capacitors and the input power supply pins, VCC, VIO, VISOIN, and VISOOUT, must not exceed 2 mm. RADIATED EMISSIONS AND PCB LAYOUT The ADM3055E and the ADM3057E signal and power isolated CAN FD transceivers pass EN 55022 Class B by 6 dB on a 2-layer PCB design with ferrite beads. Neither PCB stitching capacitance nor high voltage surface-mounted technology (SMT) safety capacitors are required to meet this emissions level. The ADM3055E and the ADM3057E have an internal split pad lead frame on the bus side to isolate noise generated by the dcto-dc converter from the transceiver. For best noise suppression, filter both the VISOOUT power supply pin and GNDISO power supply return pin for high frequency currents before routing power to the transceiver. Use surface-mount ferrite beads in series with the signals, as shown in Figure 33. The isoPower integrated dc-to-dc converters of the ADM3055E and the ADM3057E produce a 180 MHz carrier frequency to transmit power through the chip scale transformer. The impedance of the ferrite bead must be approximately 2 k between the 100 MHz and 1 GHz frequency range to reduce the emissions of the 180 MHz primary switching frequency and 360 MHz secondary side rectifying frequency. See Table 14 for examples of appropriate surface-mount ferrite beads. Although the ferrite beads are beneficial for emissions performance, the ferrite beads are not required for functionality. 10F 0.1F 2 0.1F 0.01F 3 4 5 6 7 8 9 10 GND1 GNDISO GND1 VISOOUT VCC GNDISO VIO AUXOUT RXD VISOIN SILENT GND2 TXD CANH STBY CANL AUXIN RS GND1 GND2 20 19 0.22F 10F 18 17 FERRITES 16 0.01F 0.1F 15 14 13 12 11 RSLOPE Figure 33. Recommended PCB Layout THERMAL ANALYSIS The ADM3055E and the ADM3057E consist of six internal die attached to a split lead frame with four die attach pads. For the purposes of thermal analysis, the die are treated as a thermal unit, with the highest junction temperature reflected in the JA value in Table 10. The JA value is based on measurements taken with the devices mounted on a JEDEC standard, 4-layer board with fine width traces and still air. Under normal operating conditions, the ADM3055E and the ADM3057E can operate at full load across the full temperature range without derating the output current. INSULATION LIFETIME All insulation structures eventually break down when subjected to voltage stress over a sufficiently long period of time. The rate of insulation degradation is dependent on the characteristics of the voltage waveform applied across the insulation as well as on the materials and material interfaces. The two types of insulation degradation of primary interest are breakdown along surfaces exposed to the air and insulation wear out. Surface breakdown is the phenomenon of surface tracking and is the primary determinant of surface creepage requirements in system level standards. Insulation wear out is the phenomenon where charge injection or displacement currents inside the insulation material cause long-term insulation degradation. Table 14. Surface-Mount Ferrite Beads Example Manufacturer Taiyo Yuden Murata Electronics 1 14972-013 Power supply bypassing is required at the logic input supply, VIO, and at the shared CAN transceiver and digital isolator input supply pin, VISOIN. Low equivalent series resistance (ESR) bypass capacitors are required and must be placed as close to the chip pads as possible. The ADM3055E and the ADM3057E signal and power isolated CAN transceivers do not require external interface circuitry for the logic interfaces. Part No. BKH1005LM182-T BLM15HD182SN1 Rev. B | Page 22 of 24 Data Sheet ADM3055E/ADM3057E Calculation and Use of Parameters Example Surface tracking is addressed in electrical safety standards by setting a minimum surface creepage based on the working voltage, the environmental conditions, and the properties of the insulation material. Safety agencies perform characterization testing on the surface insulation of components, allowing the components to be categorized in different material groups. Lower material group ratings are more resistant to surface tracking and can therefore provide adequate lifetime with smaller creepage. The minimum creepage for a given working voltage and material group is in each system level standard and is based on the total rms voltage across the isolation, pollution degree, and material group. See Table 3 for the material group and creepage information for the ADM3055E and the ADM3057E isolated CAN transceivers. The following example frequently arises in power conversion applications. Assume that the line voltage on one side of the isolation is 240 VAC RMS, and a 400 VDC bus voltage is present on the other side of the isolation barrier. The isolator material is polyimide. To establish the critical voltages used to determine the creepage, clearance, and lifetime of a device, see Figure 34 and the equations that follow. The lifetime of insulation caused by wear out is determined by the thickness, material properties, and the voltage stress applied across the insulation. It is important to verify that the product lifetime is adequate at the application working voltage. The working voltage supported by an isolator for wear out may not be the same as the working voltage supported for tracking. The working voltage applicable to tracking is specified in most standards. Testing and modeling show that the primary driver of long-term degradation is displacement current in the polyimide insulation, causing incremental damage. The stress on the insulation can be divided into broad categories, such as dc stress and ac component, time varying voltage stress. DC stress causes little wear out because there is no displacement current, whereas ac component, time varying voltage stress causes wear out. The ratings in certification documents are typically based on 60 Hz sinusoidal stress to reflect isolation from the line voltage. However, many practical applications have combinations of 60 Hz ac and dc across the barrier, as shown in Equation 1. Because only the ac portion of the stress causes wear out, the equation can be rearranged to solve for the ac rms voltage, as shown in Equation 2. For insulation wear out with the polyimide materials used in these products, the ac rms voltage determines the product lifetime. = VRMS + VDC 2 (1) VRMS 2 - VDC 2 (2) VAC RMS 2 or VAC = RMS where: VRMS is the total rms working voltage. VAC RMS is the time varying portion of the working voltage. VDC is the dc offset of the working voltage. VAC RMS VPEAK VRMS VDC TIME 14972-014 Insulation Wear Out ISOLATION VOLTAGE Surface Tracking Figure 34. Critical Voltage Example The working voltage across the barrier from Equation 1 is = VRMS = VRMS VAC RMS 2 + VDC 2 2402 + 4002 VRMS = 466 V Use this VRMS value as the working voltage in conjunction with the material group and pollution degree to determine the creepage required by a system standard. To determine if the lifetime is adequate, obtain the time varying portion of the working voltage. To obtain the ac rms voltage, use Equation 2. VAC = RMS VRMS 2 - VDC 2 VAC= RMS 4662 - 4002 VAC RMS = 240 VRMS In this case, the ac rms voltage is simply the line voltage of 240 VRMS. This calculation is more relevant when the waveform is not sinusoidal. The calculated ac rms voltage is compared to the limits for the working voltage in Table 11 for the expected lifetime of the device, which is less than a 60 Hz sine wave, and is well within the limit for a 50-year service life. The dc working voltage limit is set by the creepage of the package as specified in IEC 60664-1. This value can differ for specific system level standards. Rev. B | Page 23 of 24 ADM3055E/ADM3057E Data Sheet OUTLINE DIMENSIONS 15.54 15.40 15.27 20 11 7.59 7.50 7.39 1 PIN 1 INDICATOR 10.54 10.30 10.06 10 TOP VIEW 2.44 2.24 SIDE VIEW 0.76 0.25 0.25 BSC GAGE PLANE 2.64 2.50 2.36 45 0.33 0.23 END VIEW SEATING PLANE 1.27 BSC 0.48 0.36 8 0 0.89 0.65 0.41 12-16-2016-B 0.25 0.10 COPLANARITY 0.10 COMPLIANT TO JEDEC STANDARDS MS-013-AD Figure 35. 20-Lead Standard Small Outline Package with Increased Creepage [SOIC_IC] Wide Body, (RI-20-1) Dimensions shown in millimeters 13.00 (0.5118) 12.60 (0.4961) 11 20 7.60 (0.2992) 7.40 (0.2913) 10 10.65 (0.4193) 10.00 (0.3937) 2.65 (0.1043) 2.35 (0.0925) 0.30 (0.0118) 0.10 (0.0039) COPLANARITY 0.10 1.27 (0.0500) BSC 0.51 (0.0201) 0.31 (0.0122) SEATING PLANE 0.75 (0.0295) 45 0.25 (0.0098) 8 0 0.33 (0.0130) 0.20 (0.0079) COMPLIANT TO JEDEC STANDARDS MS-013-AC CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. 1.27 (0.0500) 0.40 (0.0157) 06-07-2006-A 1 Figure 36. 20-Lead Standard Small Outline Package [SOIC_W] Wide Body, (RW-20) Dimensions shown in millimeters and (inches) ORDERING GUIDE Model 1, 2 ADM3055EBRIZ ADM3055EBRIZ-RL EVAL-ADM3055EEBZ ADM3057EBRWZ ADM3057EBRWZ-RL 1 2 Temperature Range -40C to +105C -40C to +105C -40C to +105C -40C to +105C Package Description 20-Lead Standard Small Outline Package with Increased Creepage [SOIC_IC] 20-Lead Standard Small Outline Package with Increased Creepage [SOIC_IC] ADM3055E Evaluation Board 20-Lead Standard Small Outline Package [SOIC_W] 20-Lead Standard Small Outline Package [SOIC_W] Z = RoHS Compliant Part. Use the EVAL-ADM3055EEBZ evaluation board to evaluate the ADM3057E. (c)2018-2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D14972-0-9/19(B) Rev. B | Page 24 of 24 Package Option RI-20-1 RI-20-1 RW-20 RW-20