Table 12: DDR2 IDD Specifications and Conditions – 2GB (Die Revision M) (Continued)
Values shown for MT47H128M8 DDR2 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) com-
ponent data sheet
Parameter Symbol
-80E/
-800 -667 Units
Active power-down current: All device banks open; tCK = tCK
(IDD); CKE is LOW; Other control and address bus inputs are stable;
Data bus inputs are floating
Fast PDN exit
MR[12] = 0
IDD3P2540 540 mA
Slow PDN exit
MR[12] = 1
360 360
Active standby current: All device banks open; tCK = tCK (IDD), tRAS = tRAS MAX
(IDD), tRP = tRP (IDD); CKE is HIGH, S# is HIGH between valid commands; Other con-
trol and address bus inputs are switching; Data bus inputs are switching
IDD3N2594 540 mA
Operating burst write current: All device banks open; Continuous burst writes;
BL = 4, CL = CL (IDD), AL = 0; tCK = tCK (IDD), tRAS = tRAS MAX (IDD), tRP = tRP (IDD);
CKE is HIGH, S# is HIGH between valid commands; Address bus inputs are switching;
Data bus inputs are switching
IDD4W21215 1125 mA
Operating burst read current: All device banks open; Continuous burst read, IOUT
= 0mA; BL = 4, CL = CL (IDD), AL = 0; tCK = tCK (IDD), tRAS = tRAS MAX (IDD), tRP = tRP
(IDD); CKE is HIGH, S# is HIGH between valid commands; Address bus inputs are
switching; Data bus inputs are switching
IDD4R21170 1080 mA
Burst refresh current: tCK = tCK (IDD); REFRESH command at every tRFC (IDD) inter-
val; CKE is HIGH, S# is HIGH between valid commands; Other control and address
bus inputs are switching; Data bus inputs are switching
IDD521485 1440 mA
Self refresh current: CK and CK# at 0V; CKE ≤ 0.2V; Other control and address bus
inputs are floating; Data bus inputs are floating
IDD62126 126 mA
Operating bank interleave read current: All device banks interleaving reads,
IOUT = 0mA; BL = 4, CL = CL (IDD), AL = tRCD (IDD) - 1 × tCK (IDD); tCK = tCK (IDD), tRC =
tRC (IDD), tRRD = tRRD (IDD), tRCD = tRCD (IDD); CKE is HIGH, S# is HIGH between valid
commands; Address bus inputs are stable during deselects; Data bus inputs are
switching
IDD711980 1755 mA
Notes: 1. Value calculated as one module rank in this operating condition. All other module ranks
in IDD2P (CKE LOW) mode.
2. Value calculated reflects all module ranks in this operating condition.
Table 13: DDR2 IDD Specifications and Conditions – 4GB (Die Revision C)
Values shown for MT47H256M8 DDR2 SDRAM only and are computed from values specified in the 2Gb (256 Meg x 8) com-
ponent data sheet
Parameter Symbol
-80E/
-800 -667 Units
Operating one bank active-precharge current: tCK = tCK (IDD), tRC = tRC (IDD),
tRAS = tRAS MIN (IDD); CKE is HIGH, S# is HIGH between valid commands; Address
bus inputs are switching; Data bus inputs are switching
IDD01783 738 mA
Operating one bank active-read-precharge current: IOUT = 0mA; BL = 4, CL =
CL (IDD), AL = 0; tCK = tCK (IDD), tRC = tRC (IDD), tRAS = tRAS MIN (IDD), tRCD = tRCD
(IDD); CKE is HIGH, S# is HIGH between valid commands; Address bus inputs are
switching; Data pattern is same as IDD4W
IDD11882 882 mA
1GB, 2GB, 4GB (x72, ECC, DR) 240-Pin DDR2 SDRAM RDIMM
IDD Specifications
PDF: 09005aef83d3d893
htf18c128_256_512x72pdz.pdf - Rev. F 4/14 EN 15 Micron Technology, Inc. reserves the right to change products or specifications without notice.
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