www.ti.com
FEATURES
DESCRIPTION/ORDERING INFORMATION
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1A
1Y
1Z
G
2Z
2Y
2A
GND
VCC
4A
4Y
4Z
G
3Z
3Y
3A
D, DB, N, NS, J, OR W PACKAGE
(TOP VIEW)
192013 2
17
18
16
15
14
1312119 10
5
4
6
7
8
4Y
4Z
NC
G
3Z
1Z
G
NC
2Z
2Y
1Y
1A
NC
V
4A
GND
NC
3A
3Y
2A
FK PACKAGE
(TOP VIEW)
CC
AM26LS31C , AM26LS31MQUADRUPLE DIFFERENTIAL LINE DRIVER
SLLS114I JANUARY 1979 REVISED FEBRUARY 2006
Meets or Exceeds the Requirements of ANSITIA/EIA-422-B and ITUOperates From a Single 5-V SupplyTTL Compatible
Complementary OutputsHigh Output Impedance in Power-OffConditions
Complementary Output-Enable Inputs
The AM26LS31 is a quadruple complementary-outputline driver designed to meet the requirements of ANSITIA/EIA-422-B and ITU (formerly CCITT)Recommendation V.11. The 3-state outputs havehigh-current capability for driving balanced lines suchas twisted-pair or parallel-wire transmission lines, andthey are in the high-impedance state in the power-offcondition. The enable function is common to all fourdrivers and offers the choice of an active-high oractive-low enable (G, G) input. Low-power Schottkycircuitry reduces power consumption withoutsacrificing speed.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
PDIP N Tube AM26LS31CN AM26LS31CNTube AM26LS31CDSOIC D AM26LS31C0°C to 70 °C Tape and reel AM26LS31CDRSOP NS Tape and reel AM26LS31CNSR 26LS31SSOP DB Tape and reel AM26LS31CDBR SA31CCDIP J Tube AM26LS31MJB AM26LS31MJB–55 °C to 125 °C LCCC FK Tube AM26LS31MFKB AM26LS31MFKBCFP W Tube AM26LS31MWB AM26LS31MWB
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1979–2006, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
1Z
1Y
G
G
1A
4
12
12
3
2Z
2Y
2A 76
5
3Z
3Y
3A 910
11
4Z
4Y
4A 15 14
13
AM26LS31C , AM26LS31MQUADRUPLE DIFFERENTIAL LINE DRIVER
SLLS114I JANUARY 1979 REVISED FEBRUARY 2006
FUNCTION TABLE
(1)
(EACH DRIVER)
ENABLES OUTPUTSINPUT
A
G G Y Z
H H X H LL H X L HH X L H LL X L L HX L H Z Z
(1) H = high level, L = low level,X = irrelevant,
Z = high impedance (off)
LOGIC DIAGRAM (POSITIVE LOGIC)
2
Submit Documentation Feedback
www.ti.com
22 k
To Three Other Drivers
Common to All Four Drivers
GND
Enable G
Enable G
VCC
V
V
Output Y
9
Input A
22 k
22 k
All resistor values are nominal.
Output Z
9
Absolute Maximum Ratings
(1)
AM26LS31C , AM26LS31MQUADRUPLE DIFFERENTIAL LINE DRIVER
SLLS114I JANUARY 1979 REVISED FEBRUARY 2006
SCHEMATIC (EACH DRIVER)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage
(2)
7 VV
I
Input voltage 7 VOutput off-state voltage 5.5 VD package 73DB package 82θ
JA
Package thermal impedance
(3)
°C/WN package 67NS package 64Lead temperature 1,6 mm (1/16 in) from case for 10 s 260 °CLead temperature 1,6 mm (1/16 in) from case for 60 s J package 300 °CT
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values, except differential output voltage V
OD
, are with respect to network GND.(3) The package thermal impedance is calculated in accordance with JESD 51-7.
3Submit Documentation Feedback
www.ti.com
Recommended Operating Conditions
Electrical Characteristics
(1)
Switching Characteristics
AM26LS31C , AM26LS31MQUADRUPLE DIFFERENTIAL LINE DRIVER
SLLS114I JANUARY 1979 REVISED FEBRUARY 2006
MIN NOM MAX UNIT
AM26LS31C 4.75 5 5.25V
CC
Supply voltage VAM26LS31M 4.5 5 5.5V
IH
High-level input voltage 2 VV
IL
Low-level input voltage 0.8 VI
OH
High-level output current –20 mAI
OL
Low-level output current 20 mAAM26LS31C 0 70T
A
Operating free-air temperature °CAM26LS31M –55 125
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
V
IK
Input clamp voltage V
CC
= MIN, I
I
= –18 mA –1.5 VV
OH
High-level output voltage V
CC
= MIN, I
OH
= –20 mA 2.5 VV
OL
Low-level output voltage V
CC
= MIN, I
OL
= 20 mA 0.5 VV
O
= 0.5 V –20Off-state (high-impedance-state)
I
OZ
V
CC
= MIN, µAoutput current
V
O
= 2.5 V 20I
I
Input current at maximum input voltage V
CC
= MAX, V
I
= 7 V 0.1 mAI
IH
High-level input current V
CC
= MAX, V
I
= 2.7 V 20 µAI
IL
Low-level input current V
CC
= MAX, V
I
= 0.4 V –0.36 mAI
OS
Short-circuit output current
(3)
V
CC
= MAX –30 –150 mAI
CC
Supply current V
CC
= MAX, All outputs disabled 32 80 mA
(1) For C-suffix devices, V
CC
min = 4.75 V and V
CC
max = 5.25 V. For M-suffix devices, V
CC
min = 4.5 V and V
CC
max = 5.5 V.(2) All typical values are at V
CC
= 5 V and T
A
= 25 °C.(3) Not more than one output should be shorted at a time, and duration of the short circuit should not exceed one second.
V
CC
= 5 V (see Figure 1 )
T
A
= 25 °C AM26LS31MPARAMETER TEST CONDITIONS UNITMIN TYP MAX MIN MAX
Propagation delay time, low- tot
PLH
14 20 30high-level output
C
L
= 30 pF, S1 and S2 open nsPropagation delay time, high- tot
PHL
14 20 30low-level outputt
PZH
Output enable time to high level R
L
= 75 25 40 60C
L
= 30 pF nst
PZL
Output enable time to low level R
L
= 180 37 45 68t
PHZ
Output disable time from high level 21 30 45C
L
= 10 pF, S1 and S2 closed nst
PLZ
Output disable time from low level 23 35 53t
SKEW
Output-to-output skew C
L
= 30 pF, S1 and S2 open 1 6 9 ns
4
Submit Documentation Feedback
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Waveform 1
(see Note E)
Output Z
Output Y
Input A
(see Notes B
and C)
VOL
VOH
VOL
VOH
3 V
tPHL
Skew Skew
tPLH
tPLH
tPHL
0 V
PROPAGATION DELAY TIMES AND SKEW TEST CIRCUIT
VCC
Test Point
S1
S2
75
180
CL
(see Note A)
From Output
Under Test
VOH
VOL
1.5 V
0 V
3 V
Enable G
Enable G
(see Note D)
S1 Open
S2 Closed
S1 Closed
S2 Open
tPZH
tPZL
tPHZ
tPLZ
S1 Closed
S2 Closed
0.5 V
0 V
4.5 V S1 Closed
S2 Closed
1.5 V
ENABLE AND DISABLE TIME WAVEFORMS
See Note D
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO 50 , tr 15 ns, tf 6 ns.
C. When measuring propagation delay times and skew, switches S1 and S2 are open.
D. Each enable is tested separately.
E. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
1.3 V 1.3 V
1.5 V
1.5 V
1.5 V 1.5 V
Waveform 2
(see Note E)
0.5 V
1.5 V
1.5 V
AM26LS31C , AM26LS31MQUADRUPLE DIFFERENTIAL LINE DRIVER
SLLS114I JANUARY 1979 REVISED FEBRUARY 2006
Figure 1. Test Circuit and Voltage Waveforms
5Submit Documentation Feedback
www.ti.com
TYPICAL CHARACTERISTICS
VI − Enable G Input Voltage − V
OUTPUT VOLTAGE
vs
ENABLE G INPUT VOLTAGE


VCC = 5.25 V
VCC = 5 V


VCC = 4.75 V



Load = 470 to GND
TA = 25°C
See Note A
− Y Output Voltage − VVO
4
3
2
1
00 1 2 3
VI − Enable G Input Voltage − V
OUTPUT VOLTAGE
vs
ENABLE G INPUT VOLTAGE



VCC = 5 V
Load = 470 to GND
See Note A


TA = 70°C


TA = 0°C


TA = 25°C
− Y Output Voltage − VVO
4
3
2
1
00 1 2 3
VI − Enable G Input Voltage − V
− Output Voltage − V
OUTPUT VOLTAGE
vs
ENABLE G INPUT VOLTAGE
VO


VCC = 5.25 V

VCC = 5 V


VCC = 4.75 V
4
3
2
1
00 1 2 3
5
6



Load = 470to VCC
TA = 25°C
See Note B
VI − Enable G Input Voltage − V
OUTPUT VOLTAGE
vs
ENABLE G INPUT VOLTAGE


TA = 25°C

TA = 0°C

TA = 70°C
− Output Voltage − VVO
4
3
2
1
00 1 2 3
5
6



VCC = 5 V
Load = 470 to VCC
See Note B
AM26LS31C , AM26LS31MQUADRUPLE DIFFERENTIAL LINE DRIVER
SLLS114I JANUARY 1979 REVISED FEBRUARY 2006
Figure 2. Figure 3.
Figure 4. Figure 5.
A. The A input is connected to V
CC
during testing of the Y outputs and to ground during testing of the Z outputs.B. The A input is connected to ground during testing of the Y outputs and to V
CC
during testing of the Z outputs.
6
Submit Documentation Feedback
www.ti.com
− High-Level Output Voltage − V
TA − Free-Air Temperature − °C

IOH = −20 mA


IOH = −40 mA
HIGH-LEVEL OUTPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
VOH


VCC = 5 V
See Note A
4
3
2
1
00 25 50 75
5
IOH − High-Level Output Current − mA
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT


VCC = 5.25 V

VCC = 4.75 V


VCC = 5 V



TA = 25°C
See Note A
− High-Level Output Voltage − V
VOH
4
3
2
1
00 −20 −40 −60 −80 −100
− Low-Level Output Voltage − V
TA − Free-Air Temperature − °C



VCC = 5 V
IOL = 40 mA
See Note B
LOW-LEVEL OUTPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
VOL
0.4
0.3
0.2
0.1
025 50 75
0.5
0
IOL − Low-Level Output Current − mA
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT


VCC = 5.25 V

VCC = 4.75 V


TA = 25°C
See Note B
− Low-Level Output Voltage − VVOL
0.4
0.3
0.2
0.1
040 80 120
0.5
0 1006020
0.6
0.7
0.8
0.9
1
AM26LS31C , AM26LS31MQUADRUPLE DIFFERENTIAL LINE DRIVER
SLLS114I JANUARY 1979 REVISED FEBRUARY 2006
TYPICAL CHARACTERISTICS (continued)
Figure 6. Figure 7.
Figure 8. Figure 9.
A. The A input is connected to V
CC
during testing of the Y outputs and to ground during testing of the Z outputs.B. The A input is connected to ground during testing of the Y outputs and to V
CC
during testing of the Z outputs.
7Submit Documentation Feedback
www.ti.com
VCC = 5 V
VI − Data Input Voltage − V
Y OUTPUT VOLTAGE
vs
DATA INPUT VOLTAGE

VCC = 4.75 V


No Load
TA = 25°C


VCC = 5.25 V
− Y Output Voltage − VVO
4
3
2
1
00 1 2 3
5
Y OUTPUT VOLTAGE
vs
DATA INPUT VOLTAGE


TA = 25°C


No Load


TA = 0°C


TA = 70°C
VI − Data Input Voltage − V
− Y Output Voltage − VVO
4
3
2
1
00 1 2 3
5
AM26LS31C , AM26LS31MQUADRUPLE DIFFERENTIAL LINE DRIVER
SLLS114I JANUARY 1979 REVISED FEBRUARY 2006
TYPICAL CHARACTERISTICS (continued)
Figure 10. Figure 11.
8
Submit Documentation Feedback
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
5962-7802301M2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
5962-7802301MEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
5962-7802301MFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
AM26LS31CD ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LS31CDBR ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LS31CDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LS31CDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LS31CDE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LS31CDG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LS31CDR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LS31CDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LS31CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LS31CN ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
AM26LS31CNE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
AM26LS31CNSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LS31CNSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
AM26LS31MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
AM26LS31MJB ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
AM26LS31MWB ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 1
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
AM26LS31CDBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
AM26LS31CDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
AM26LS31CDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
AM26LS31CNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Jun-2009
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
AM26LS31CDBR SSOP DB 16 2000 346.0 346.0 33.0
AM26LS31CDR SOIC D 16 2500 346.0 346.0 33.0
AM26LS31CDR SOIC D 16 2500 333.2 345.9 28.6
AM26LS31CNSR SO NS 16 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Jun-2009
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDLP® Products www.dlp.com Broadband www.ti.com/broadbandDSP dsp.ti.com Digital Control www.ti.com/digitalcontrolClocks and Timers www.ti.com/clocks Medical www.ti.com/medicalInterface interface.ti.com Military www.ti.com/militaryLogic logic.ti.com Optical Networking www.ti.com/opticalnetworkPower Mgmt power.ti.com Security www.ti.com/securityMicrocontrollers microcontroller.ti.com Telephony www.ti.com/telephonyRFID www.ti-rfid.com Video & Imaging www.ti.com/videoRF/IF and ZigBee® Solutions www.ti.com/lprf Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2009, Texas Instruments Incorporated