5962-0722902QZA - Texas Instruments High-Performance Analog

LM117HVQML, LM117HVQML-SP

www.ti.com

SNVS357D –MARCH 2006–REVISED APRIL 2013

LM117HVQML 3-Terminal Adjustable Regulator

Check for Samples: LM117HVQML,LM117HVQML-SP

1FEATURES DESCRIPTION

The LM117HV are adjustable 3-terminal positive

2• Available with Radiation Ensured voltage regulators capable of supplying either 0.5A or

– Total Ionizing Dose 100 krad(Si) 1.5A over a 1.2V to 57V output range. They are

– Low Dose Rate Qualified 100 krad(Si) exceptionally easy to use and require only two

external resistors to set the output voltage. Further,

• Adjustable Output down to 1.2V both line and load regulation are better than standard

• Specified 0.5A or 1.5A Output Current fixed regulators.

• Line Regulation Typically 0.01%/V In addition to higher performance than fixed

• Load Regulation Typically 0.1% regulators, the LM117HV series offers full overload

• Current Limit Constant with Temperature protection available only in IC's. Included on the chip

are current limit, thermal overload protection and safe

• Eliminates the Need to Stock Many Voltages area protection. All overload protection circuitry

• 80 dB Ripple Rejection remains fully functional even if the adjustment

• Output is Short-Circuit Protected terminal is disconnected.

Normally, no capacitors are needed unless the device

is situated more than 6 inches from the input filter

capacitors in which case an input bypass is needed.

An optional output capacitor can be added to improve

transient response. The adjustment terminal can be

bypassed to achieve very high ripple rejections ratios

which are difficult to achieve with standard 3-terminal

regulators.

Besides replacing fixed regulators, the LM117HV is

useful in a wide variety of other applications. Since

the regulator is “floating” and sees only the input-to-

output differential voltage, supplies of several

hundred volts can be regulated as long as the

maximum input to output differential is not exceeded,

i.e. do not short the output to ground.

Also, it makes an especially simple adjustable

switching regulator, a programmable output regulator,

or by connecting a fixed resistor between the

adjustment and output, the LM117HV can be used as

a precision current regulator. Supplies with electronic

shutdown can be achieved by clamping the

adjustment terminal to ground which programs the

output to 1.2V where most loads draw little current.

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

N/C N/C1 16

N/C N/C2 15

ADJ N/C3 14

N/C OUTPUT/SENSE4 13

INPUT OUTPUT5 12

N/C N/C6 11

N/C N/C7 10

N/C N/C

LM117HVQML, LM117HVQML-SP

SNVS357D –MARCH 2006–REVISED APRIL 2013

www.ti.com

CONNECTION DIAGRAMS

(See Physical Dimension section for further information)

CASE IS OUTPUT

Figure 1. 3-Pin TO Metal Can Package Figure 2. 2-Pin TO Metal Can Package

Bottom View Bottom View

See NDT003A Package See K0002C Package

For the CFP device to function properly, the “Output” and “Output/Sense” pins must be connected on the users

printed circuit board.

Figure 3. 16-Pin CFP

Top View

Table 1. LM117HV Series Packages

Part Number Suffix Package Design Load Current

H TO 0.5A

K TO 1.5A

WG, GW CFP 0.5A

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

www.ti.com

SNVS357D –MARCH 2006–REVISED APRIL 2013

Schematic Diagram

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

SNVS357D –MARCH 2006–REVISED APRIL 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings(1)

Power Dissipation(2) Internally limited

Input - Output Voltage Differential +60V, −0.3V

Maximum Junction Temperature +150°C

Storage Temperature −65°C ≤TA≤+150°C

Lead Temperature (Soldering, 10 sec.) 300°C

Thermal Resistance θJA TO Metal Can - Still Air 39°C/W

TO Metal Can - 500LF/Min Air flow 14°C/W

TO Metal Can - Still Air 186°C/W

TO Metal Can - 500LF/Min Air flow 64°C/W

CFP "WG" (device 01, 61) - Still Air 115°C/W

CFP "WG" (device 01, 61) - 500LF/Min Air flow 66°C/W

CFP "GW" (device 02, 62) - Still Air 130°C/W

CFP "GW" (device 02, 62) - 500LF/Min Air flow 80°C/W

θJC TO Metal Can 1.9°C/W

TO Metal Can 21°C/W

CFP "WG" (device 01, 61)(3) 3.4°C/W

CFP "GW" (device 02, 62) 7°C/W

ESD Tolerance(4) 2000V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the

Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions.

(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),

θJA (package junction to ambient thermal resistance), and TA(ambient temperature). The maximum allowable power dissipation at any

temperature is PDmax = (TJmax - TA) / θJA or the number given in the Absolute Maximum Ratings, whichever is lower. "Although power

dissipation is internally limited, these specifications are applicable for power dissipations of 2W for the PFM package and 20W for the

TO package."

(3) The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full

advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either

metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be

calculated using θJA, rather than θJC, thermal resistance. It must not be assumed that the device leads will provide substantial heat

transfer out the package, since the thermal resistance of the lead frame material is very poor, relative to the material of the package

base. The stated θJC thermal resistance is for the package material only, and does not account for the additional thermal resistance

between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and

must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device.

(4) Human body model, 1.5 kΩin series with 100 pF.

Recommended Operating Conditions

Operating Temperature Range −55°C ≤TA≤+125°C

Table 2. Quality Conformance Inspection

Mil-Std-883, Method 5005 - Group A

Subgroup Description Temp °C

1 Static tests at 25

2 Static tests at 125

3 Static tests at -55

4 Dynamic tests at 25

5 Dynamic tests at 125

6 Dynamic tests at -55

7 Functional tests at 25

8A Functional tests at 125

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

www.ti.com

SNVS357D –MARCH 2006–REVISED APRIL 2013

Table 2. Quality Conformance Inspection (continued)

Mil-Std-883, Method 5005 - Group A

Subgroup Description Temp °C

8B Functional tests at -55

9 Switching tests at 25

10 Switching tests at 125

11 Switching tests at -55

12 Settling time at 25

13 Settling time at 125

14 Settling time at -55

LM117HVH, HVWG Electrical Characteristics DC Parameters

The following conditions apply, unless otherwise specified. VDiff = (VI−VO), IL= 8mA, VOUT = 1.25V (Nominal) Sub-

Symbol Parameter Conditions Notes Min Max Unit groups

IAdj Adjustment Pin Current VDiff = 3V 100 µA 1

VDiff = 3.3V 100 µA 2, 3

VDiff = 40V 100 µA 1, 2, 3

IQMinimum Load Current VDiff = 3V, VO= 1.7V 5.0 mA 1

VDiff = 3.3V, VO= 1.7V 5.0 mA 2, 3

VI= 40V, VO= 1.7V 5.0 mA 1, 2, 3

VI= 60V, VO= 1.7V 8.2 mA 1

VRef Reference Voltage VDiff = 3V 1.2 1.3 V 1

VDiff = 3.3V 1.2 1.3 V 2, 3

VDiff = 40V 1.2 1.3 V 1, 2, 3

VRLine Line Regulation 3V ≤VDiff ≤40V, -8.64 8.64 mV 1

VO= VRef

3.3V ≤VDiff ≤40V, -18 18 mV 2, 3

VO= VRef

40V ≤VDiff ≤60V, -25 25 mV 1

IL= 60mA

VRLoad Load Regulation VDiff = 3V, -15 15 mV 1

IL= 10mA to 500mA

VDiff = 3.3V, -15 15 mV 2, 3

IL= 10mA to 500mA

VDiff = 40V, -15 15 mV 1

IL= 10mA to 150mA

VDiff = 40V, -15 15 mV 2, 3

IL= 10mA to 100mA

Delta IAdj / Adjustment Pin Current Change VDiff = 3V, -5.0 5.0 µA 1

Load IL= 10mA to 500mA

VDiff = 3.3V, -5.0 5.0 µA 2, 3

IL= 10mA to 500mA

VDiff = 40V, -5.0 5.0 µA 1

IL= 10mA to 150mA

VDiff = 40V, -5.0 5.0 µA 2, 3

IL= 10mA to 100mA

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

SNVS357D –MARCH 2006–REVISED APRIL 2013

www.ti.com

LM117HVH, HVWG Electrical Characteristics DC Parameters (continued)

The following conditions apply, unless otherwise specified. VDiff = (VI−VO), IL= 8mA, VOUT = 1.25V (Nominal) Sub-

Symbol Parameter Conditions Notes Min Max Unit groups

Delta IAdj / Adjustment Pin Current Change 3V ≤VDiff ≤40V -5.0 5.0 µA 1

Line 3.3V ≤VDiff ≤40V -5.0 5.0 µA 2, 3

IOS Short Circuit Current VDiff = 60V 0.0 0.4 A 1

VDiff = 4.25V 0.5 1.8 A 1

θRThermal Regulation VDiff = 40V, IL= 150mA, 6.0 mV 1

t = 20mS

LM117HVH, HVWG Electrical Characteristics AC Parameters

The following conditions apply, unless otherwise specified. VDiff = (VI−VO), IL= 8mA, VOUT = 1.25V (Nominal) Sub-

Symbol Parameter Conditions Notes Min Max Unit groups

RR Ripple Rejection VI= +6.25V, ƒ = 120Hz, See(1) 66 dB 4, 5, 6

eI= 1VRMS, IL= 125mA,

VO= VRef

(1) Tested @ 25°C; specified, but not tested @ 125°C & −55°C

LM117HVH, HVWG Delta Electrical Characteristics DC Delta Parameters

The following conditions apply, unless otherwise specified.

Deltas performed on QMLV devices at Group B, Subgroup 5, only.

Symbol Parameter Conditions Notes Min Max Unit Sub-

groups

IAdj Adjust Pin Current VDiff = 3V -10 10 µA 1

VDiff = 40V -10 10 µA 1

VRef Reference Voltage VDiff = 3V -0.01 0.01 V 1

VDiff = 40V -0.01 0.01 V 1

VRLine Line Regulation 3V ≤VDiff ≤40V, -4.0 4.0 mV 1

VO= VRef

40V ≤VDiff ≤60V, -6.0 6.0 mV 1

IL= 60mA

LM117HVH, HVWG Post Radiation Electrical Characteristics DC Parameters

The following conditions apply, unless otherwise specified. VDiff = (VI−VO), IL= 8mA, VOUT = 1.25V (Nominal) Sub-

Symbol Parameter Conditions Notes Min Max Unit groups

VRef Reference Voltage VDiff = 3V 1.2 1.45 V 1

VDiff = 40V 1.2 1.45 V 1

VRLine Line Regulation 3V ≤VDiff ≤40V, -40 40 mV 1

VO= VRef

VRLoad Load Regulation VDiff = 3V, -27 27 mV 1

IL= 10mA to 500mA

LM117HVH, HVWG Post Radiation Electrical Characteristics AC Parameters

The following conditions apply, unless otherwise specified. VDiff = (VI−VO), IL= 8mA, VOUT = 1.25V (Nominal) Sub-

Symbol Parameter Conditions Notes Min Max Unit groups

RR Ripple Rejection VI= +6.25V, ƒ = 120Hz, 55 dB 4

eI= 1VRMS, IL= 125mA,

VO= VRef

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

www.ti.com

SNVS357D –MARCH 2006–REVISED APRIL 2013

LM117HVK Electrical Characteristics DC Parameters

The following conditions apply, unless otherwise specified. VDiff =(VI−VO), IL= 10mA, VOUT = 1.25V (Nominal) Sub-

Symbol Parameter Conditions Notes Min Max Unit groups

IAdj Adjustment Pin Current VDiff = 3V 100 µA 1

VDiff = 3.3V 100 µA 2, 3

VDiff = 40V 100 µA 1, 2, 3

IQMinimum Load Current VDiff = 3V, VO= 1.7V 5.0 mA 1

VDiff = 3.3V, VO= 1.7V 5.0 mA 2, 3

VI= 40V, VO= 1.7V 5.0 mA 1, 2, 3

VI= 60V, VO= 1.7V 0.25 8.2 mA 1

VRef Reference Voltage VDiff = 3V 1.2 1.3 V 1

VDiff = 3.3V 1.2 1.3 V 2, 3

VDiff = 40V 1.2 1.3 V 1, 2, 3

VRLine Line Regulation 3V ≤VDiff ≤40V, -8.64 8.64 mV 1

VO= VRef

3.3V ≤VDiff ≤40V, -18 18 mV 2, 3

VO= VRef

40V ≤VDiff ≤60V, -25 25 mV 1

IL= 60mA

VRLoad Load Regulation VDiff = 3V, -15 15 mV 1

IL= 10mA to 1.5A

VDiff = 3.3V, -15 15 mV 2, 3

IL= 10mA to 1.5A

VDiff = 40V, -15 15 mV 1

IL= 10mA to 300mA

VDiff = 40V, -15 15 mV 2, 3

IL= 10mA to 195mA

Delta IAdj / Adjustment Pin Current Change VDiff = 3V, -5.0 5.0 µA 1

Load IL= 10mA to 1.5A

VDiff = 3.3V, -5.0 5.0 µA 2, 3

IL= 10mA to 1.5A

VDiff = 40V, -5.0 5.0 µA 1

IL= 10mA to 300mA

VDiff = 40V, -5.0 5.0 µA 2, 3

IL= 10mA to 195mA

Delta IAdj / Adjustment Pin Current Change 3V ≤VDiff ≤40V -5.0 5.0 µA 1

Line 3.3V ≤VDiff ≤40V -5.0 5.0 µA 2, 3

IOS Short Circuit Current VDiff = 60V 0.0 0.4 A 1

VDiff = 3V 1.5 3.5 A 1

θRThermal Regulation VDiff = 40V, IL= 300mA, 10.5 mV 1

t = 20mS

LM117HVK Electrical Characteristics AC Parameters

The following conditions apply, unless otherwise specified. VDiff = (VI−VO), IL= 10mA. Sub-

Symbol Parameter Conditions Notes Min Max Unit groups

RR Ripple Rejection VI= +6.25V, ƒ = 120Hz, See(1) 66 dB 4, 5, 6

eI= 1VRMS, IL= 0.5A,

VO= VRef

(1) Tested @ 25°C; specified, but not tested @ 125°C & −55°C

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

SNVS357D –MARCH 2006–REVISED APRIL 2013

www.ti.com

Typical Performance Characteristics

Output capacitor = 0 μF unless otherwise noted.

Load Regulation Current Limit

Figure 4. Figure 5.

Adjustment Current Dropout Voltage

Figure 6. Figure 7.

Temperature Stability Minimum Operating Current

Figure 8. Figure 9.

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

www.ti.com

SNVS357D –MARCH 2006–REVISED APRIL 2013

Typical Performance Characteristics (continued)

Output capacitor = 0 μF unless otherwise noted.

Ripple Rejection Ripple Rejection

Figure 10. Figure 11.

Ripple Rejection Output Impedance

Figure 12. Figure 13.

Line Transient Response Load Transient Response

Figure 14. Figure 15.

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

SNVS357D –MARCH 2006–REVISED APRIL 2013

www.ti.com

Typical Radiation Characteristics

Irradiation conditions: VI= 60V; low dose rate = 10 mrad(Si)/s

Reference Voltage Load Regulation

Figure 16. Figure 17.

Line Regulation Ripple Rejection

Figure 18. Figure 19.

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

www.ti.com

SNVS357D –MARCH 2006–REVISED APRIL 2013

APPLICATION HINTS

In operation, the LM117HV develops a nominal 1.25V reference voltage, VREF, between the output and

adjustment terminal. The reference voltage is impressed across program resistor R1 and, since the voltage is

constant, a constant current I1then flows through the output set resistor R2, giving an output voltage of

(1)

Figure 20.

Since the 100 μA current from the adjustment terminal represents an error term, the LM117HV was designed to

minimize IADJ and make it very constant with line and load changes. To do this, all quiescent operating current is

returned to the output establishing a minimum load current requirement. If there is insufficient load on the output,

the output will rise.

EXTERNAL CAPACITORS

An input bypass capacitor is recommended. A 0.1 μF disc or 1 μF solid tantalum on the input is suitable input

bypassing for almost all applications. The device is more sensitive to the absence of input bypassing when

adjustment or output capacitors are used but the above values will eliminate the possibility of problems.

The adjustment terminal can be bypassed to ground on the LM117HV to improve ripple rejection. This bypass

capacitor prevents ripple from being amplified as the output voltage is increased. With a 10 μF bypass capacitor

80 dB ripple rejection is obtainable at any output level. Increases over 10 μF do not appreciably improve the

ripple rejection at frequencies above 120 Hz. If the bypass capacitor is used, it is sometimes necessary to

include protection diodes to prevent the capacitor from discharging through internal low current paths and

damaging the device.

In general, the best type of capacitors to use are solid tantalum. Solid tantalum capacitors have low impedance

even at high frequencies. Depending upon capacitor construction, it takes about 25 μF in aluminum electrolytic to

equal 1 μF solid tantalum at high frequencies. Ceramic capacitors are also good at high frequencies; but some

types have a large decrease in capacitance at frequencies around 0.5 MHz. For this reason, 0.01 μF disc may

seem to work better than a 0.1 μF disc as a bypass.

Although the LM117HV is stable with no output capacitors, like any feedback circuit, certain values of external

capacitance can cause excessive ringing. This occurs with values between 500 pF and 5000 pF. A 1 μF solid

tantalum (or 25 μF aluminum electrolytic) on the output swamps this effect and insures stability. Any increase of

load capacitance larger than 10 μF will merely improve the loop stability and output impedance.

LOAD REGULATION

The LM117HV is capable of providing extremely good load regulation but a few precautions are needed to obtain

maximum performance. The current set resistor connected between the adjustment terminal and the output

terminal (usually 240Ω) should be tied directly to the output of the regulator rather than near the load. This

eliminates line drops from appearing effectively in series with the reference and degrading regulation. For

example, a 15V regulator with 0.05Ωresistance between the regulator and load will have a load regulation due to

line resistance of 0.05Ω× IL. If the set resistor is connected near the load the effective line resistance will be

0.05Ω(1 + R2/R1) or in this case, 11.5 times worse.

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

SNVS357D –MARCH 2006–REVISED APRIL 2013

www.ti.com

Figure 21 shows the effect of resistance between the regulator and 240Ωset resistor.

Figure 21. Regulator with Line Resistance in Output Lead

With the TO package, it is easy to minimize the resistance from the case to the set resistor, by using two

separate leads to the case. However, care should be taken to minimize the wire length of the output lead. The

ground of R2 can be returned near the ground of the load to provide remote ground sensing and improve load

regulation.

PROTECTION DIODES

When external capacitors are used with any IC regulator it is sometimes necessary to add protection diodes to

prevent the capacitors from discharging through low current points into the regulator. Most 10 μF capacitors have

low enough internal series resistance to deliver 20A spikes when shorted. Although the surge is short, there is

enough energy to damage parts of the IC.

When an output capacitor is connected to a regulator and the input is shorted, the output capacitor will discharge

into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage

of the regulator, and the rate of decrease of VIN. In the LM117HV, this discharge path is through a large junction

that is able to sustain 15A surge with no problem. This is not true of other types of positive regulators. For output

capacitors of 25 μF or less, there is no need to use diodes.

The bypass capacitor on the adjustment terminal can discharge through a low current junction. Discharge occurs

when either the input or output is shorted. Internal to the LM117HV is a 50Ωresistor which limits the peak

discharge current. No protection is needed for output voltages of 25V or less and 10 μF capacitance. Figure 22

shows an LM117HV with protection diodes included for use with outputs greater than 25V and high values of

output capacitance.

CURRENT LIMIT

Internal current limit will be activated whenever the output current exceeds the limit indicated in the Typical

Performance Characteristics. However, if during a short circuit condition the regulator's differential voltage

exceeds the Absolute Maximum Rating of 60V (e.g. VIN ≥60V, VOUT = 0V), internal junctions in the regulator may

break down and the device may be damaged or fail. Failure modes range from an apparent open or short from

input to output of the regulator, to a destroyed package (most common with the TO-220 package). To protect the

regulator, the user is advised to be aware of voltages that may be applied to the regulator during fault conditions,

and to avoid violating the Absolute Maximum Ratings.

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

www.ti.com

SNVS357D –MARCH 2006–REVISED APRIL 2013

D1 protects against C1

D2 protects against C2

Figure 22. Regulator with Protection Diodes

Typical Applications

Full output current not available at high input-output voltages

†Optional—improves transient response. Output capacitors in the range of 1 μF to 1000 μF of aluminum or tantalum

electrolytic

are commonly used to provide improved output impedance and rejection of transients.

*Needed if device is more than 6 inches from filter capacitors.

Figure 23. 1.2V-45V Adjustable Regulator

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

SNVS357D –MARCH 2006–REVISED APRIL 2013

www.ti.com

*Sets maximum VOUT

Figure 24. Digitally Selected Outputs

*Min. output ≈1.2V

Figure 25. 5V Logic Regulator with Electronic Shutdown*

Figure 26. Slow Turn-On 15V Regulator

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

www.ti.com

SNVS357D –MARCH 2006–REVISED APRIL 2013

†Solid tantalum

*Discharges C1 if output is shorted to ground

Figure 27. Adjustable Regulator with Improved Ripple Rejection

Figure 28. High Stability 10V Regulator

†Solid tantalum

*Minimum load current = 30 mA

‡Optional—improves ripple rejection

Figure 29. High Current Adjustable Regulator

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

SNVS357D –MARCH 2006–REVISED APRIL 2013

www.ti.com

Full output current not available at high input-output voltages

Figure 30. 0 to 30V Regulator

Figure 31. Power Follower

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

www.ti.com

SNVS357D –MARCH 2006–REVISED APRIL 2013

†Solid tantalum

*Lights in constant current mode

Figure 32. 5A Constant Voltage/Constant Current Regulator

Figure 33. 1A Current Regulator

*Minimum load current ≈4 mA

Figure 34. 1.2V–20V Regulator with Minimum Program Current

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

SNVS357D –MARCH 2006–REVISED APRIL 2013

www.ti.com

Figure 35. High Gain Amplifier

†Solid tantalum

*Core—Arnold A-254168-2 60 turns

Figure 36. Low Cost 3A Switching Regulator

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

www.ti.com

SNVS357D –MARCH 2006–REVISED APRIL 2013

†Solid tantalum

*Core—Arnold A-254168-2 60 turns

Figure 37. 4A Switching Regulator with Overload Protection

* 0.8Ω ≤ R1 ≤120Ω

Figure 38. Precision Current Limiter

Figure 39. Tracking Preregulator

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

SNVS357D –MARCH 2006–REVISED APRIL 2013

www.ti.com

*All outputs within ±100 mV

†Minimum load—10 mA

Figure 40. Adjustable Multiple On-Card Regulators with Single Control*

Figure 41. AC Voltage Regulator

Use of RSallows low charging rates with fully charged battery.

**The 1000 μF is recommended to filter out input transients

Figure 42. 12V Battery Charger

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

www.ti.com

SNVS357D –MARCH 2006–REVISED APRIL 2013

Figure 43. 50 mA Constant Current Battery Charger

Figure 44. Adjustable 4A Regulator

*Sets peak current (0.6A for 1Ω)

**The 1000 μF is recommended to filter out input transients

Figure 45. Current Limited 6V Charger

Product Folder Links: LM117HVQML LM117HVQML-SP

LM117HVQML, LM117HVQML-SP

SNVS357D –MARCH 2006–REVISED APRIL 2013

www.ti.com

REVISION HISTORY

Date Revision Section Originator Changes

Released

03/14/06 A New Release, Corporate format L. Lytle 2 MDS datasheets converted into one

Corporate datasheet format. Corrected ILfrom

60mA to 8mA for RLine. Separated Delta IAdj /

Line from Delta IAdj / Load for both the H & K

devices. Removed drift from MNLM117HV-H

electrical characteristics since not performed on

883 product. MNLM117HV-K Rev 0C1 &

MNLM117HV-H Rev 2A1 will be archived.

07/06/07 B Features, Ordering Information, Larry McGee Added Radiation information and WG

Connection Diagram, Absolute information to data sheet. Revision A to be

Maximum Ratings, Electrical's, Notes Archived.

and Physical Dimensions

02/13/08 C Features, Ordering Information, Larry McGee Added ELDRS NSID information, HVH &

Electrical's, Notes and Typical Radiation HVWG Delta and Post Radiation Table, Typical

Characteristics, Physical Dimensions Radiation Characteristics Plots, Note 8, 9 and

Drawing WG Market Drawing. Revision B to be

Archived.

09/02/11 D Ordering Information, Absolute Larry McGee Added 'GW' NSIDS & SMD numbers. Added

Maximum Ratings Theta JA and Theta JC for 'GW' devices.

Revision C to be Archived. Deleted Ordering

Information table.

04/17/2013 D Changed layout of National Data Sheet to TI

format.

Product Folder Links: LM117HVQML LM117HVQML-SP

PACKAGE OPTION ADDENDUM

www.ti.com 16-Apr-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

5962-0722901QXA ACTIVE TO NDT 3 20 TBD Call TI Call TI -55 to 125 LM117HVH-QML

5962-0722901QXA Q

ACO

5962-0722901QXA Q

5962-0722902QZA ACTIVE CFP NAC 16 42 TBD Call TI Call TI -55 to 125 LM117HVGW

QML Q

5962-07229

02QZA ACO

02QZA >T

5962R0722901V9A ACTIVE DIESALE Y 0 42 Green (RoHS

& no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 125

5962R0722901VXA ACTIVE TO NDT 3 20 TBD Call TI Call TI -55 to 125 LM117HVHRQMLV

5962R0722901VXA Q

ACO

5962R0722901VXA Q

5962R0722902VXA ACTIVE TO NDT 3 20 TBD Call TI Call TI -55 to 125 LM117HVHRLQMLV

5962R0722961VXA Q

ACO

5962R0722961VXA Q

5962R0722902VZA ACTIVE CFP NAC 16 42 TBD Call TI Call TI -55 to 125 LM117HVGWR

QMLV Q

5962R07229

02VZA ACO

02VZA >T

5962R0722961V9A ACTIVE DIESALE Y 0 42 Green (RoHS

& no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 125

5962R0722961VXA ACTIVE TO NDT 3 20 TBD Call TI Call TI -55 to 125 LM117HVHRLQMLV

5962R0722961VXA Q

ACO

5962R0722961VXA Q

5962R0722962VZA ACTIVE CFP NAC 16 42 TBD Call TI Call TI -55 to 125 LM117HVGWRL

QMLV Q

5962R07229

PACKAGE OPTION ADDENDUM

www.ti.com 16-Apr-2013

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

62VZA ACO

62VZA >T

LM117HVGW-QML ACTIVE CFP NAC 16 42 TBD Call TI Call TI -55 to 125 LM117HVGW

QML Q

5962-07229

02QZA ACO

02QZA >T

LM117HVGWRLQMLV ACTIVE CFP NAC 16 42 TBD Call TI Call TI -55 to 125 LM117HVGWRL

QMLV Q

5962R07229

62VZA ACO

62VZA >T

LM117HVGWRQMLV ACTIVE CFP NAC 16 42 TBD Call TI Call TI -55 to 125 LM117HVGWR

QMLV Q

5962R07229

02VZA ACO

02VZA >T

LM117HVH MDE ACTIVE DIESALE Y 0 42 Green (RoHS

& no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 125

LM117HVH MDR ACTIVE DIESALE Y 0 42 Green (RoHS

& no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 125

LM117HVH-QML ACTIVE TO NDT 3 20 TBD Call TI Call TI -55 to 125 LM117HVH-QML

5962-0722901QXA Q

ACO

5962-0722901QXA Q

LM117HVH/883 ACTIVE TO NDT 3 20 TBD Call TI Call TI -55 to 125 LM117HVH/883 Q ACO

LM117HVH/883 Q >T

LM117HVHRLQMLV ACTIVE TO NDT 3 20 TBD Call TI Call TI -55 to 125 LM117HVHRLQMLV

5962R0722961VXA Q

ACO

5962R0722961VXA Q

LM117HVHRQMLV ACTIVE TO NDT 3 20 TBD Call TI Call TI -55 to 125 LM117HVHRQMLV

5962R0722901VXA Q

ACO

5962R0722901VXA Q

PACKAGE OPTION ADDENDUM

www.ti.com 16-Apr-2013

Addendum-Page 3

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

LM117HVK/883 ACTIVE TO K 2 50 TBD Call TI Call TI -55 to 125 LM117HVK

/883 Q ACO

/883 Q >T

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a

continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF LM117HVQML, LM117HVQML-SP :

•Military: LM117HVQML

•Space: LM117HVQML-SP

PACKAGE OPTION ADDENDUM

www.ti.com 16-Apr-2013

Addendum-Page 4

NOTE: Qualified Version Definitions:

•Military - QML certified for Military and Defense Applications

•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

MECHANICAL DATA

NAC0016A

www.ti.com

WG16A (RevG)

K0002C

MECHANICAL DATA

www.ti.com

4214774/A 03/2013

K02C (Rev E)

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Leads not to be bent greater than 15º

MECHANICAL DATA

NDT0003A

www.ti.com

H03A (Rev D)

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of

non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265