EHHD020A0F41-HZ - GE - Datasheet.Directory

Data Sheet

August 7, 2012

EHHD020A0F S e ries (Eighth-Brick) DC-DC Converter Power Modules

18 - 75Vdc Input; 3.3V /20Adc Output

is a registered trademark of Underwriters Laboratories, Inc.

†

CSA is a registered trademark of Canadian Standards Association.

‡

VDE is a trademark of Verband Deutscher El ektrotechniker e.V.

This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.

IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.

** ISO is a registered trademark of the International Organization of Standards

Document No: DS10-003 ver. 1.06

PDF name: EHHD020A0F.pdf

Hammerhead S eri es™

Features

 Compliant to RoHS EU Directive 2002/95/EC (-Z

versions)

 Flat and high efficiency curve

 Industr y standard, DOSA compliant footprint

57.9mm x 22.8mm x 7.6mm

(2.28 in x 0.9 in x 0.30 in)

 Low profile hei ght and reduced component skyl ine

 Ultra wide input voltage range: 18-75 Vdc

 Tightly regulated output

 Remote sense

 Output Voltage adjust: 80% to 110% of VO,nom

 Constant switching frequency

 Positive remote On/Off logic

 Input under/over voltage protection

 Output overcurrent and overvoltage protection

 Overtemperature protecti on

 No reverse current during output shutdown

 Wide operating temperature range (-40°C to 85°C)

 Suitable for cold wall cooling using suitable Gap

Pad applied directly to top side of module

 UL*Recognized to UL60950-1, CAN/CSA† C22.2

No.60950-1, and EN6 095 0-1(VDE ‡ 0805-1)

Licensed

 CE mark me et s 2006/95/EC directive§

 M eets the voltage and curre nt r equir eme nts for

ETSI 300-132-2 and complies with and licensed for

Basic insulation rating per EN60950-1

 2250 Vdc Isolation tested in compliance with IEEE

802.3¤ PoE stan dard s

 ISO**9001 and ISO 14001 certified manufacturing

facilities

Applications

 Distributed Power Architectures

 Wireless Networks

 Acce ss and Optical Network Equipment

 Industrial Equipment

Options

 Negative Remote On/Off logic (preferred)

 Over current/Over temperature/Over voltage

protections (Auto-restart) (preferred)

 Heat plate versions (-H)

 Surface Mount version (-S)

Description

The EHHD020A0F [Hammerhead™] Series, eighth-bric k, low-height power modules are isolated dc-dc converters

that provide a single, precisely regulated output voltage over an ultra wide input voltage range of 18-75Vdc. The

EHHD020A0F provides 3.3Vdc nominal output voltage rated for 20Adc output current. The module incorporates

Lineage Power’s vast heritage for reliability and quality, while also using the latest in technology, and component and

process standardization to achieve highly competitive cost. The open frame module construction, available in both

surface-mount and through-hole pack agi ng, enab le desi gners to develop cost and space effici ent sol utio ns. The

module achieves typical full load efficiency greater than 91% at VIN=24Vdc or at VIN=48Vdc. Standard features include

remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and overtemperature protection.

An optional heat plate allows for external standard, eighth-brick heat sink attachment to achieve higher output current

in high temperature applications.

RoHS Compliant

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

LINEAGE POWER 2

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute

stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those

given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can

adversely affect the device reliability.

Parameter Device Symbol Min Max Unit

Input Voltage

Continuous All VIN -0.3 80 Vdc

Transient, operat i onal (≤100 ms) All VIN,trans -0.3 100 Vdc

Operating Ambient Temperature All TA -40 85 °C

Maximum Heat Plate Operating Temperat ure -18H, H TC -40 110 °C

(see Thermal Considerations sect ion)

Storage Temperature All Tstg -55 125 °C

I/O Isolati on voltage (100% fact ory Hi-Pot tested) All



2250 Vdc

Electri cal Sp ec i fi cat i o ns

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature

conditions.

Parameter Device Symbol Min Typ Max Unit

Operating Input Voltage All VIN 18 24/48 75 Vdc

Maximum Input Current All IIN 4.4 5.0 Adc

(VIN= VIN, min to VIN, max, VO= VO, set , IO=IO, max)

Input No Load Current All IIN,No load 70 mA

(VIN = 48V, IO = 0, module enabled)

Input Stand-by Current All IIN,stand-by 5 8 mA

(VIN = 48V, module disabled)

Inrush Transient All I2t 0.5 A2s

Input Reflected Rippl e Current, peak-to-peak

(5Hz to 20MHz, 1μH source impedance; VIN , min to VIN, max,

IO= IOmax ; See Test configuration section) All 30 mAp-p

Input Ripple Rejection (120Hz) All 50 dB

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This power module can be used in a wide variety of applications, ranging from simple standalone operation to an

integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included,

however, to achieve maximum safety and system protection, always use an input line fuse. The safety agenci es

require a fast-acting fuse with a maximum rating of 10 A (see Safety Considerations section). Based on the

information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a

lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

LINEAGE POWER 3

Electri cal Sp ec i fi cat i o ns (continued)

Parameter Device Symbol Min Typ Max Unit

Nominal Output Volt age Set-point All VO, set 3.24 3.30 3.36 Vdc

VIN= 24V to 48V IO=IO, max, TA=25°C)

Output Voltage

All VO 3.20  3.40 Vdc

(Over all operating input volt age, resist i ve load, and

temperature condi tions until end of life)

Output Regulation

Line (VIN=VIN, min to VIN, max)

All



±0.2

% VO, se t

Load (IO=IO, min to IO, max)

All



±0.2

% VO, se t

Temperature (Tref=TA, min to TA, max)

All



±1.0

% VO, se t

Output Ripple and Noise

(VIN=VIN, m in t o VIN, max, IO= IO, max , TA=TA, min to TA, max)

RMS (5Hz to 20MHz bandwidth) All 

10 30 mVrms

Peak-to-Peak (5Hz to 20MHz bandwidt h) All 

35 100 mVpk-pk

External Capacitance

All

O, max



5,000

μF

Output Current All IO 0 20 Adc

Output Current Limit Inc eption (Hicc up Mode ) All IO, lim 21 24 26 Adc

(VO= 90% of VO , set)

Output Short-Circuit Current

All IO, s/c 5 Arms

(VO≤250mV) ( Hiccup Mode )

Efficiency

VIN=24V, TA=25°C, IO=10A, VO = 3.3V All η 91.0 %

VIN=24V, TA=25°C, IO=20A, VO = 3.3 V All η 91.0 %

VIN=48V, TA=25°C, IO=10A, VO = 3. 3V All η 89.5 %

VIN=48V, TA=25°C, IO=20A, VO = 3.3 V All η 91.0 %

Switching Frequency All fsw 300 kHz

Dynamic Load Response

(dI

/dt=0.1A/µs; V

= 24V or 48V; T

=25°C;

CO>100μF)

Load Change from Io= 50% to 75% or 25% to 50% of

Io,max

Peak Deviation All Vpk  5  % VO, se t

Settling Time (Vo<10% peak deviation)

All ts  200  µs

Isolation Specifications

Parameter Device Symbol Min Typ Max Unit

Isolation Capacitanc e All Ciso  1000  pF

Isolation Resist ance All Riso 100   MΩ

I/O Isolati on Voltage (100% fact ory Hi-pot test ed) All All   2250 Vdc

General Specifications

Parameter Device Symbol Min Typ Max Unit

Calculated Reliabi l i t y based upon Telcordia SR-332

Issue 2: Method I Case 3 (IO=80%IO, max, TA=40°C,

airflow = 200 lfm, 90% confidence)

All FIT 317.3 109/Hours

All MTBF 3,151,604 Hours

Weight (Open Frame) All 19 (0.7) g (oz.)

Weight (with Heatpl at e) All 30 (1.1) g (oz.)

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

LINEAGE POWER 4

Feature Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature

conditions. See Feature Descriptions for additional information.

Parameter Device Symbol Min Typ Max Unit

Remote On /Off Signal Interfa ce

IN, min

to V

IN, max

; open collector or equivalent,

Signal referenced t o VIN- terminal)

Negative Logic: devic e code suffix “1”

Logic Low = module On, Logic High = module Off

Positive Logic: No device code suffix required

Logic Low = module Off, Logic High = module On

Logic Low - Remote On/Off Current All Ion/off   0.15 mA

Logic Low - On/Off Voltage All Von/off -0.7  0.6 Vdc

Logic High Voltage – (Typ = Open Collector) All Von/off 2.5  6.7 Vdc

Logic High maximum allowable leakage current All Ion/off   25 μA

Turn-On Delay and Rise Times

(IO=IO, max , VIN=VIN, nom, TA = 25

Case 1: Input power is applied for at least 1 second,

and then the On/Off input is set from OFF to ON

(Tdelay = on/off pi n transit i on until VO = 10% of VO, set) All Tdelay ― 20 ― msec

Case 2: On/Off input is set to Logic Low (Module

ON) and then input power is applied

(Tdelay = VIN reaches VIN, min until Vo=10% of VO,set) All Tdelay ― 20 150 msec

Output voltage Rise time (time for Vo to rise from 10%

of Vo,set to 90% of Vo, set) All Trise ― 18 25 msec

Output voltage overshoot – Startup All ― 3 % VO, se t

IO= IO, max; VIN=VIN, m in t o V IN, max, TA = 25oC

Remote Sense Range All VSENSE 10 % VO, set

Output Voltage Adjustment Range All 80 110 % VO, set

Output Overvoltage Protection

All VO, limit 3.8 

4.3 Vdc

Overtemperature Protection – Hi ccup Auto Restart

Open

frame Tref 135 OC

Heat Plate

Heat

Plate

Tref 120 OC

Input Undervoltage Lock out All VUVLO

Turn-on Threshold  17 18 Vdc

Turn-off Threshold 14 15 16 Vdc

Hysteresis 1 2 Vdc

Input Overvoltage Lock out All VOVLO

Turn-on Threshold 76 79 

Vdc

Turn-off Threshold 

81 83 Vdc

Hysteresis 1 2  Vdc

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

LINEAGE POWER 5

Characteristic Curves

The following figures provide typical characteristics for the EHHD020A0F (3.3V, 20A) at 25oC. The figures are

identical for either positive or negative remote O n/Off log ic.

EFFICIENCY, η (%)

OUTPUT VOLTAGE OUTPUT CURRENT

VO (V) (100mV/div) Io(A) (5A/div)

OUTPUT CURRENT, I

(A)

TIME , t ( 200µs/div)

Figure 1. Converter Efficiency versus Output Current.

Figure 4. Transient Response to 0.1A/µS Dynamic

Load Change from 50% to 75% to 50% of full load,

Vin=48V, CO>100μF.

OUTPUT VOLTAGE

VO (V) (50mV/div)

OUTPUT VOLTAGE On/Off

VOLTAGE

VO (V) (1V/div) VOn/Off (V) (2V/div)

TIME , t ( 2µs/div)

TIME , t ( 10ms/div)

Figure 2. Typical output ripple and noise (I

= I

o,max

Figure 5. Typical Start-up Using Remote On/Off,

negative logic version shown (VIN = 24V or 48V, Io =

Io,max).

OUTPUT VOLTAGE OUTPUT CURRENT

VO (V) (100mV/div) Io(A) (5A/div)

OU TP UT VOLTAGE INPUT

VOLTAGE

VO (V) (1V/div) VIN (V) (10V/div)

TIME , t ( 200µs/div)

TIME, t (10ms/div)

Figure 3. Transient Response to 0.1A/µS Dynamic

Load Change from 50% to 75% to 50% of full load,

Vin=24V, CO>100μF.

Figure 6. Typical Start-up Using Input Voltage (V

24V, Io = Io,max).

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

LINEAGE POWER 6

Test Configurations

TO OSCILLOSCOPE

CURRENT PROBE

TEST

12μH

BATTERY

220μF

E.S.R.<0.1Ω

@ 20°C 100kHz

33-100μF

Vin+

Vin-

NOTE: Measure input reflected ripple current with a simulated

source inductance (LTEST) of 12μH. Capacitor CS offsets

possible battery impedance. Measure current as shown

above.

Figure 7. Input Reflected Ripple Current Test

Setup.

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then

Kelvin connections are required at the module terminals

to avoid measurement errors due to socket contact

resistance.

(+)

(

–

)

RESISTIVE

LOAD

SCOPE

COPPER STRIP

GROUND PLANE

10uF

1uF

Figure 8. Output Ripple and Noise Test Setup.

Vout+

Vout-

Vin+

Vin-

RLOAD

Rcontact

Rdistribution

Rcontact

Rdistribution

Rcontact

Rdistribution

VIN

NOTE: All voltage measurem ents to be taken at the module

terminals, as shown above. If sockets are used then

Kelvin connections are required at the module terminals

to avoid measurement errors due to socket contact

resistance.

Figure 9. Output Voltage and Efficiency Test

Setup.

100

Efficiency

Design Considerations

Input Filtering

The power module should be connected to a low

ac-impedance source. Highly inductive source

impedance can affect the stability of the power

module. For the test configuration in Figure 7 a 33-

100μF electrolytic capacitor (ESR<0.7Ω at 100kHz),

mounted close to the power module helps ensure the

stability of the unit. Consult the factory for further

application guidelines.

Safety Considerations

For safety-agency approval of the system in which the

power module is used, the power module must be

installed in compliance with the spacing and

separation requirements of the end-use safety agency

standard, i.e. UL60950-1, CSA C22.2 No.60950-1,

and VDE0805-1(IEC60950-1).

If the input source is non-SELV (ELV or a hazardous

voltage greater than 60 Vdc and less than or equal to

75Vdc), for the module’s output to be considered as

meeting the requirements for safety extra-low voltage

(SELV), all of the following must be true:

 The input source is to be provided with reinforced

insulation from any other hazardous voltages,

including the ac mains.

 One VIN pin and one VOUT pin are to be

grounded, or both the input and output pins are

to be kept floating.

 The input pins of the module are not operator

accessible.

 Another SELV reliability test is conducted on the

whole system (combination of supply source and

subject module), as required by the safety

agencies, to verify that under a single fault,

hazardous voltages do not appear at the

module’s output.

Note: Do not ground either of the input pins of t he

module without grounding one of the output

pins. This may allow a non-SELV voltage to

appear between the output pins and ground.

The power module has extra-low voltage (ELV)

outputs when all inputs are ELV.

All flammable materials used in the manuf a cturi ng of

these modules are ra ted 94V-0, or tested to the

UL60950 A.2 for reduced thickness.

For input voltages exceeding –60 Vdc but less than or

equal to –75 Vdc, these converters have been

evaluated to the applicable requirements of BASIC

INSULATION between secondary DC MAINS

DISTRIBUTION input (classified as TNV-2 in Europe)

and unearthed SELV outputs.

The input to these units is to be provided with a

maximum 10 A fast-acting fuse in the ungrounded

lead.

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

LINEAGE POWER 7

Feature Descriptions

Remote On/Off

Two remote on/off options are available. Positive logic

turns the module on during a logic high voltage on the

ON/OFF pin, and off during a logic low. Negative logic

remote On/Off, device code suffix “1”, turns the

module off during a logic high and on during a logic

low.

ON/OFF

Vin+

Vin-

Ion/off

Von/off

Vout+

TRIM

Vout-

Figure 10. Remote On/Off Implementation.

To turn the power module on and off, the user must

supply a switch (open collector or equivalent) to

control the voltage (Von/off) between the ON/OFF

terminal and the VIN(-) term ina l (see Figur e 10). Logic

low is 0V ≤ Von/off ≤ 0.6V. The maximum Ion/off during a

logic low is 0.15mA; the switch should maintain a

logic low level whilst sinking this current.

During a logic high, the typical maximum Von/off

generated by the module is 6.7V, and the maximum

allowable leakage current at Von/off = 2.5V is 25μA.

If not using the remote on/off feature:

For positive logic, leave the ON/OFF pin open.

For negative logic, short the ON/OFF pin to VIN(-).

Remote Sense

Remote sense minimizes the effects of distribution

losses by regulating the voltage at the remote-sense

connections (See Figure 11). The voltage between

the remote-sense pins and the output terminals must

not exceed the output volta ge sen se range giv en in

the Feature Specifications t able:

[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] ≤ 0.5 V

Although the output voltage can be increased by both

the remote sense and by the trim, the maximum

increase for the output voltage is not the sum of both.

The maximum increase is the larger of either the

remote sense or the trim.

The amount of power delivered by the module is

defined as the voltage at the output terminals

multiplied by the output current. When using remote

sense and trim, the output voltage of the module can

be increased, which at the same output current would

increase the power output of the module. Care should

be taken to ensure that the maximum output power of

the module remains at or below the maximum rated

power (Maximum rated power = Vo,set x Io,max).

Figure 11. Circuit Configuration for remote

sense.

Input Undervoltage Lockout

At input voltages below the input undervoltage lockout

limit, the module operation is disabled. The module

will only begin to operate once the input voltage is

raised above the undervoltage lockout turn-on

threshold, VUV/ON.

Once operating, the module will continue to operate

until the input voltage is taken below the undervoltage

turn-off threshold, VUV/OFF.

Overtemperature Protection

To provide protection under certain fault conditions,

the unit is equipped with a thermal shutdown circuit.

The unit will shutdown if the thermal reference point,

Tref, exceeds 135oC (Figure 13, typical) or 120 oC

(Figure 14, typic al), but the thermal shutdown is not

intended as a guarantee that the unit will survive

temperatur es bey ond its rati ng. The module will

automatically restart upon cool-down to a safe

temperature.

Output Overvoltage Protection

The output over voltage protection scheme of the

modules has an independent over voltage loop to

prevent single point of failure. This protection feature

latches in the event of over voltage across the output.

Cycling the on/off pin or input voltage resets the

latching prot ect ion feat ur e. If the auto-re star t opti on

(4) is ordered, the module will automatically restart

upon an internally programmed time elapsing.

Overcurrent Protection

To provide protection in a fault (output overload)

condition, the unit is equipped with internal

current-limiting circuitr y and ca n endure current

limiting continuously. At the point of current-limit

inception, the unit enters hiccup mode. If the unit is

not configured with auto–restart, then it will latch off

following the over current condition . The module can

be restarted by cycling the dc input power for at least

one second or by toggling the r emot e on/off sig nal for

at least one second.

(+)

SENSE(+)

SENSE(–)

(–)

(+)

(-)

LOAD

CONTACTAND

DISTRIBUTION LOSSES

SUPPLYI

CONTACT

RESISTANCE

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

LINEAGE POWER 8

Feature Descriptions (continued)

If the unit is configured with the auto-restart option (4),

it will remain in the hiccup mode as long as the

overcurren t condi tio n ex ists; it oper at es norm ally ,

once the output current is brought back into its

specified range. The average output current during

hiccup is 10% IO, max.

Output Voltage Programming

Trimming allows the outp ut vol tage set point to be

increased or decreased from the default value; this is

accomplished by connecting an external resistor

between the TRIM pin and either the VO(+) pin or the

VO(-) pin.

(+)

TRIM

(-)

trim-down

LOAD

(+)

ON/OFF

(-)

trim-up

Figure 12. Circuit Configuration to Trim Output

Voltage.

Connecting an external resistor (Rtrim-down) between

the TRIM pin and the VO(-) (or Sense(-)) pin

decreases the output voltage set point. To maintain

set point accuracy, the trim resistor tolerance should

be ±1.0%.

The following equation determines the required

external resistor value to obtain a percentage output

voltage change of Δ%

ΚΩ











−

∆

−

22.10

511

downtrim

Where

100

3.3

%×











−

=∆ V

VV desired

For example, to trim-down the output voltage of the

module by 6% to 3.10V, Rtrim-down is calculated as

follows:

6% =∆

ΚΩ











−=

−

22.10

511

downtrim

ΚΩ=

−

9.74

downtrim

Connecting an external resistor (Rtrim-up) between the

TRIM pin and the VO(+) (or Sense (+)) pin increases

the output voltage set point. The following equation

determines the required external resistor value to

obtain a percentage output voltage change of Δ%:

ΚΩ











−

∆

−

∆×

∆+××

−

22.10

511

%225.1 %)100(3.311.5

uptrim

Where

100

3.3 3.3

%×











−

=∆

desired

For example, to trim-up the output volt age of the

module by 4% to 3.43V, Rtrim-up is calculated is as

follows:

4% =∆

ΚΩ











−−

+××

−

22.10

511

4225.1 )4100(3.311.5

uptrim

ΚΩ=

−

9.219

uptrim

The voltage between the VO(+) and VO(–) terminals

must not exceed the minimum output overvoltage

protection value shown in the Feature Specifications

table. This limit includes any increase in voltage due

to remote-sense compensatio n and output voltage

set-point adjust men t trim.

Although the output voltage can be increased by both

the remote sense and by the trim, the maximum

increase for the output voltage is not the sum of both.

The maximum increase is the larger of either the

remote sense or the trim. The amount of power

delivered by the module is defined as the voltage at

the output terminals multiplied by the output current.

When using remote sense and trim, the output

voltage of the module can be increased, which at the

same output current would increase the power output

of the module. Care should be taken to ensure that

the maximum output power of the module remains at

or below the maximum rated power (Maximum rated

power = VO,set x IO,max).

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

LINEAGE POWER 9

Thermal Cons i dera tions

The power modules operate in a variety of thermal

environments; however, sufficient cooling should be

provided to help ensure reliable operation.

Considerations include ambient temperature, airflow,

module power dissipation, and the need for increased

reliability. A reduction in the operating temperature of

the module will result in an increase in reliability. The

thermal data presented here is based on physical

measurements taken in a wind tunnel.

The thermal reference points, Tref, used in the

specifications for open frame modules is shown in

Figure 13. For reliable operation these temperatures

should not exceed 125oC.

Figure 13. Tref Temperatu re Meas ur ement

Locations for Open Frame Module.

The thermal reference point, Tref, used in the

specifications for modules with heatplate is shown in

Figure 14. For reliable operation this temperature

should not exceed 110oC.

Figure 14. Tref Temperatur e Meas urement

Location for Module with Heatplate.

Heat Transfer via Convection

Increased airflow over the module enhances the heat

transfer via convection. Derating curves showing the

maximum output current that can be deliv ered by

each module versus local ambient temperature (TA)

for natural convection and up to 1m/s (200 ft./min)

forced airflow are shown in Figures 16 - 19.

Please refer to the Application Note “Thermal

Characterization Process For Open-Frame Board-

Mounted Power Modules” for a detailed discussion of

thermal aspects including maximum device

temperatures.

Figure 15. Output Current Derating for the Open

Frame Module; Airflow in the Transverse Direction

from Vout(-) to Vout(+); VIN =48.

OUTPUT CURRENT, IO (A)

AMBIENT TEMEPERATURE, T

(oC)

Figure 16. Output Current Derating for the Open

Frame Module; Airflow in the Transverse Direction

from Vout(-) to Vout(+); VIN =48.

OUTPUT CURRENT, IO (A)

AMBIENT TEMEPERATURE, T

(oC)

Figure 17. Output Current Derating for the Module

with Heatplate; Airflow in the Transverse Direction

from Vout(-) to Vout(+);VIN =48V.

OUTPUT CURRENT, IO (A)

AMBIENT TEMEPERATURE, T

(oC)

Figure 18. Output Current Derating for the Open

Frame Module; Airflow in the Transverse Direction

from Vout(-) to Vout(+); VIN =24V.

AIRFLOW

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

LINEAGE POWER 10

Thermal Cons i dera tions (continued)

OUTPUT CURRENT, IO (A)

AMBIENT TEMEPERATURE, T

(oC)

Figure 19. Output Current Derating for the Module

with Heatplate; Airflow in the Transverse Direction

from Vout(-) to Vout(+);VIN =24V.

Heat Transfer via Conduction

The module can also be used in a sealed

environment with cooling via conduction from the

module’s to p surf a ce throug h a gap pad material to a

cold wall, as shown in Figure 19. This capability is

achieved by insuring the top side component skyline

profile achieves no more than 1mm height difference

between the tallest and the shortest power train part

that benefits from contact with the gap pad material.

The output current derating versus cold wall

temperature, when using a gap pad such as Bergquist

GP2500S20, is shown in Figure 21.

Figure 20. Cold Wall Mounting

OUTPUT CURRENT, IO (A)

COLD PL ATE TEMEPERATURE, T

(oC)

Figure 21. Derated Output Current versus Cold

Wall Temperature with local ambient temperature

around module at 85C; VIN =24V or 48V.

Through-Hole Soldering Information

Lead-Free Soldering

The EHHD020A0Fxx RoHS-compliant through-hole

products use SAC (Sn/Ag/Cu) Pb-free solder and

RoHS-compliant compon ents . They are designed to

be processed through single or dual wave soldering

machines. The pins have a RoHS-compliant finish

that is compatible with both Pb and Pb-free wave

soldering processes. A maximum preheat rate of

3°C/s is suggested. The wave preheat process

should be such that the temperature of the power

module board is kept below 210°C. For Pb solder,

the recommended pot temperature is 260°C , w hile the

Pb-free solder pot is 270°C max.

Paste-in-Hole Soldering

The EHHD020A0Fxx module is compatible with

reflow paste-in-hole solder ing proce sses shown in

Figures 23-25. Since the EHHD020A0FxxZ module is

not packaged per J-STD-033 Rev.A, the module must

be baked prior to the paste-in-hole reflow process.

EHHD020A0Fxx-HZ modules are not compatible with

paste-in-hole reflow soldering. Please contact your

Lineage Power Sales Representative for further

information.

Surface Mount Information

MSL Rating

The EHHD020A0F-SZ module has a MSL rating of

2a.

Storage a n d Handling

The recommended storage environment and handling

procedures for moisture-s en sit iv e surf ace mount

packages is detai led in J-STD-033 Rev. A (Handling,

Packing, Shipping and Use of Moisture/Reflow

Sensitive Surface Mount Devices). Moisture barrier

bags (MBB) with desiccant are provided for the

EHHD020A0Fxx-SZ modules. These sealed

packages should not be broken until time of use.

Once the original package is broken, the floor life of

the product at conditions of ≤ 30°C and 60% relative

humidity varies according to the MSL rating (see J-

STD-033A). The shelf life for dry packed SMT

packages is a minimum of 12 months from the bag

seal date, when stored at the following conditions: <

40° C, < 90% relative humidity.

Surface Mount Information

Pick and Place

The EHHD020A0F modules use an open frame

construction and are designed for a fully automated

assembly process. The modules are fitted with a

label designed to provide a large surface area for pick

and place operations. The label meets all the

requireme nts for surface mount processing, as well as

safety standards, and is able to withstand reflow

temperatures of up to 300oC. The label also carries

product information such as product code, serial

number and the location of manufacture.

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

LINEAGE POWER 11

Surface Mount Information (continued)

Figure 22. Pick and Place Location.

Nozzle Rec o m m endations

The module weight has been kept to a minimum by

using open frame construction. Even so, these

modules have a relatively large mass when compared

to conventional SMT components. Variables such as

nozzle size, tip style, vacuum pressure and pla ce ment

speed should be considered to optimize this process.

The minimum recommended nozzle diameter for

reliable operation is 6mm. The maximum nozzle outer

diameter, which will safely fit within the allowable

component spa cin g, is 9 mm.

Oblong or oval nozzles up to 11 x 9 mm may also be

used within the space available.

Reflow Soldering Information

The surface mountable modules in the EHHD family

use our newest SMT technology called “Column Pin”

(CP) connectors. Figure 23 shows the new CP

connector before and after reflow soldering onto the

end-board assembly. The CP is constructed from a

solid copper pin with an integral solder ball attached,

which is composed of tin/lead (Sn/Pb) solder for non-

Z codes, or Sn/Ag3/Cu (SAC) solder for –Z codes.

Figure 23. Column Pin Connector Before and After

Reflow Soldering .

The CP connector design is able to compensate for

large amount s of co-planar ity and stil l ensur e a

reliable SMT solder joint. Typically, the eutectic solder

melts at 183oC (Sn/Pb solder) or 217-218 oC (SAC

solder), wets the land, and subsequently wicks the

device connec tio n. Sufficient time must be allowed to

fuse the plating on the connect ion t o ensure a reliable

solder joint. There are several types of SMT reflow

technologies currently used in the industry. These

surface mount power modules can be reliably

soldered using natural forced convec tion , IR (radian t

infrared), or a combination of convection/IR. The

following instr uc tion s must be observed when SMT

soldering these units. Failure to observe these

instructions may result in the failure of or cause

damage to the modules, and can adversely affect

long-term reliability.

Tin Lead Soldering

The EHHD020A0F power modules are lead free

modules and can be soldered either in a lead-free

solder process or in a conventional Tin/Lead (Sn/Pb)

process. It is recommended that the customer review

data sheets in order to customize the solder reflow

profile for each application board assembly. The

following ins truc tion s mus t be observed w hen

soldering these units. Failure to observe these

instructions may result in the failure of or cause

damage to the modules, and can adversely affect

long-term reliability.

In a conventional Tin/Lead (Sn/Pb) solder process

peak reflow temperatures are limited to less than

235oC. Typically, the eutectic solder melts at 183oC,

wets the land, and subsequently wicks the device

connection. Sufficient time must be allowed to fuse

the plating on the connection to ensure a reliable

solder joint. There are several types of SMT reflow

technologies currently used in the industry. These

surface mount power modules can be reliably

soldered using natural forced convec tion , IR (radian t

infrared), or a combination of convection/IR. For

reliable soldering the solder reflow profile should be

established by accurately measuring the modules CP

connector temperatures.

Lead Free Soldering

The –Z version of the EHHD020A0F modules are

lead-free (Pb-free) and RoHS compliant and are both

forward and backward compatible in a Pb-free and a

SnPb soldering pro ces s. Failure to observe the

instructions below may result in the failure of or cause

damage to the modules and can adversely affect

long-term reliability.

REFLOW TEMP (°C)

REFLOW TIME (S)

Figure 24. Reflow Profile for Tin/Lead (Sn/Pb)

process.

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

LINEAGE POWER 12

Surface Mount Information (continued)

MAX TEMP SOLDER (°C)

Figure 25. Time Limit Curve Above 205oC for

Tin/Lead (Sn/Pb) proces s.

Pb-free Reflow Profile

Power Systems will comply with J-STD-015 Rev. C

(Moisture/Reflow Sensitivity Classification for

Nonhermetic Solid State Surface Mount Devices) for

both Pb-free solder profiles and MSL classification

procedures. This standard provides a recommended

forced-air-convection reflow profile based on the

volume and thickn es s of the package (t abl e 4-2). The

suggested Pb-free solder paste is Sn/Ag/Cu (SAC).

The recommended linear reflow profile using

Sn/Ag/Cu solder is shown in Figure 25.

Figure 26. Recommended linear reflow profile

using Sn/Ag/Cu solder.

Post Solde r Cleaning and Drying

Considerations

Post solder cleaning is usually the final circuit-board

assembly process prior to electrical board testing. The

result of inadequate cleaning and drying can affect

both the reliability of a power module and the

testability of the finished circuit-board assembly. For

guidance on appropr i ate sol de r ing, cle ani ng and

drying procedures, refer to Lineage Power Board

Mounted Power Modules: Soldering and Cleaning

Application Note (AN04-001).

Per J-STD-020 Rev. C

100

150

200

250

300

Reflow Time (Seconds)

Ref low Temp ( °C)

Heating Zone

1°C/Second

Peak Temp 260°C

* Min. Time Above 235°C

15 Seconds

*Time Above 217°C

60 Seconds

Cooling

Zone

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

LINEAGE POWER 13

EMC Considerati ons

The circuit and plots in Figure 27 shows a suggested configuration to meet the conducted emission limits of EN55022

Cla ss B.

Figure 27. EMC Considerations

For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).

VIN = 48V, I o = Io,max, L Line

VIN = 48V, I o = Io,max, N Line

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

LINEAGE POWER 14

Mechanical O utl i ne for Through-Hole Modul e

Dimensions are in millimeters and [inches].

Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)

x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]

*Top side label includes Lineage Power name, product designation and date code.

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

LINEAGE POWER 15

Mechanical O utl i ne for Surface Mount Modul e (-S Option)

Dimensions are in millimeters and [inches].

Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)

x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]

* Top side label includes Lineage Power name, product designation and date code.

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

LINEAGE POWER 16

Mechanical O utl i ne for Through-Hole Mo dule with Heat Plate (-H Option)

Dimensions are in millimeters and [inches].

Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)

x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

LINEAGE POWER 17

Mechanical O utl i ne for Through-Hole Module with ¼ Brick Heat Plate (-18H

Option)

Dimensions are in millimeters and [inches].

Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)

x.xx mm ± 0.25 mm [x.xx x in ± 0.010 in.]

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

LINEAGE POWER 18

Recommended Pad Layout

Dimensions are in millimeters and [inches].

Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)

x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]

Function

Vi(+)

ON/OFF

Vi(-)

Vo(-)

SENSE(-)

TRIM

SENSE(+)

Vo(+)

SMT Recommended Pa d Layout (Component Side View)

Function

Vi(+)

ON/OFF

Vi(-)

Vo(-)

SENSE(-)

TRIM

SENSE(+)

Vo(+)

NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH HOLE DIAMETER

FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH HOLE DIAMETER

TH Recomme nded Pad Layout (Compone nt S ide View)

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

LINEAGE POWER 19

Packaging Details

The surface mount versions of the EHHD020A0F (suffix

–S) are supplied as standard in the plastic trays shown

in Figure 28.

Tray Specifi catio n

Material Antistatic coated PVC

Max surface resistivity 1012Ω/sq

Color Clear

Capacity 12 power modules

Min order quantity 48 pcs (1 box of 4 full trays

+ 1 empty top tray)

Each tray contains a total of 12 power modules. The

trays are self-stacking and each shipping box for the

EHHD020A0F (suffix –S) surface mount module will

contain 4 full trays plus one empty hold down tray

giving a total number of 48 power modules.

Figure 28. Surface Mount Packaging Tray

Data Sheet

August 7, 2012

EHHD020A0F Series Eighth -B rick Po wer M od u les

18 - 75Vdc Input; 3.3V/20Adc Output

Document No: DS10-003 ver. 1.06

PDF name : EHHD020A0F.pdf

Ordering Information

Please contact your Lineage Power Sales Representative for pricing, availability and optional features.

Table 1. Device Codes

Product Codes Input Voltage

Output

Voltage

Output

Current

On/Off

Logic

Connector

Type

Comcodes

EHHD020A0F41Z 24/48V (18-75Vdc) 3.3V 20A Negative Through hole CC109161447

EHHD020A0F64Z

24/48V (18-75Vdc)

3.3V

20A

Positive

Through hole

CC109171427

EHHD020A0F641Z 24/48V (18-75Vdc) 3.3V 20A Negative Through hole 150022799

EHHD020A0F41-HZ 24/48V (18-75Vdc) 3.3V 20A Negative Through hole CC109161964

EHHD020A0F641-HZ 24/48V (18-75Vdc) 3.3V 20A Negative Through hole 150022798

EHHD020A0F64-18HZ 24/48V (18-75Vdc) 3.3V 20A Positive Through hole CC109171435

EHHD020A0F41-SZ

24/48V (18-75Vdc)

3.3V

20A

Negative

Surface mount

CC109161972

Table 2. Device Coding Scheme and Options

Characteristic

Definition

Form F act or EE = Ei ght h Bri ck

Fam i l y Desi gnat or HH

HH = HAMMERHEAD Series

Input Vol t age DD = Ultra Wi de Range, 18V-75V

Out put Current

020A0 020A0 = 020.0 A m ps Maxim um O ut put Current

Out put Vol t age FF = 3.3V nom i nal

Om i t = Default Pi n Lengt h shown i n M echani cal Outl i ne Fi gures

66 = Pi n Lengt h: 3.68 m m ± 0.25m m , (0.145 i n. ± 0. 010 i n.)

88 = Pi n Lengt h: 2.79 m m ± 0.25m m , (0.110 i n. ± 0. 010 i n.)

Om i t = Latchi ng M ode

44 = Aut o-rest art foll owing shutdown (Overcurrent /Overvoltage)

Om i t = Posi t i ve Logic

11 = Negat i ve Logic

Cus tom er S peci fic XY XY = Cus tom er S peci fic M odi fied Code, O m it for Standard Code

Om i t = St andard open F ram e M odul e

H = 1/ 8th B ri ck si ze heat pl at e, for

us e wi t h heat si nks (not avai l abl e wi t h –S opt i on)

18H

18H = 1/ 4th B ri ck si ze heat pl at e wi t h unthreaded i nsert s for

us e i n col dwal l appli cati ons (not avail abl e with –S opti on)

SS = S urfac e m ount connecti ons

Om i t = RoHS 5/ 6, Lead Based S ol der Us ed

ZZ = RoHS 6/ 6 Com pl i ant , Lead free

Char act er and Posi t i on

Ratings

P i n Lengt h

A cti on followi ng

P rot ecti ve Shutdown

On/ O ff Logic

M ec hani cal F eatures

RoHS

Options

World Wide Headquarters

Lineage Power Corporation

601 Shiloh Road, Plano, TX 75074, USA

+1-888-LINEAGE(546-3243)

(Outside U.S.A.: +1-972-244-WATT(9288))

www.lineagepower.com

e-mail: techsupport1@lineagepower.com

Asia-Pacific Headquarters

Tel: +86.021.54279977*808

Europe, Middle-East and Africa Headquarters

Tel: +49.89.878067-280

India Headquarters

Tel: +91.80.28411633

Lineage Power reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or

application. No rights under any patent accompany the sale of any such product(s) or information.

Lineage Power DC -DC products are protected under various patents. Information on these patents is available at www.lineagepower.com/patents.