CLT SERIES
(2.00 mm) .0787"
CLT–105–02–F–D
Tiger ClawTM
contacts
Available with optional
Pick & Place Pads
Suitable for
pass-through
applications
Low-profile
(2.21 mm)
.087"
CLT–115–02–F–D–A–K–BE
CLT–125–02–L–D
(2.00 mm)
.0787" pitch
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
PLATING
OPTION
NO. PINS
PER ROW
1
CLT D
02 thru 50
OTHER
OPTIONS
All options require
Style –02
–BE
= Bottom Entry
(Required for bottom
entry applications)
–A
= Alignment Pin
(3 positions minimum)
Metal or plastic at
Samtec’s discretion
–K
= (5.00 mm) .197" DIA
Polyimide Film
Pick & Place Pad
(04 thru 50 only)
–P
= Pick & Place Pad
(4 positions minimum)
(Not always necessary
for auto placement.)
–TR
= Tape & Reel
Packaging
(36 positions max)
Mates with:
TMM, TMMH, MTMM,
MMT, TW, TSH
For complete specifications and
recommended PCB layouts
see www.samtec.com?CLT
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating: Sn or Au over
50 µ" (1.27 µm) Ni
Current Rating (TMMH/CLT):
4.1 A per pin
(2 pins powered)
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
Top Entry=
(1.40 mm) .055" minimum
Bottom Entry=
(2.57 mm) .101" minimum
(add board thickness for
correct post OAL)
Max Cycles:
100 with 10 µ" (0.25 µm) Au
RoHS Compliant:
Ye s
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
LEAD
STYLE
–01
= Through-
hole
–02
= Surface
Mount
–03
= Through-
hole
–01 or –03
SPECIFICATIONS
LEAD
STYLE
–01
–03
A
(2.16) .085
(2.95) .116
LOW-PROFILE DUAL WIPE SOCKET
–F
= Gold flash
on contact,
Matte Tin on tail
–L
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
–G
= 10 µ" (0.25 µm)
Gold on contact,
Gold flash on tail
Pass-Thru
(4.00)
.157
No. of positions x
(2.00) .0787
01
02
(2.00)
.0787
(2.13)
.084
(0.51)
.020
(0.51)
.020
(0.64)
.025
DIA
(0.81)
.032
(5.08)
.200
x
(5.71)
.225
(5.16)
.203
(2.27)
.090
(3.02)
.119
A
–02
–A
–P
APPLICATION
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
ALSO AVAILABLE
(MOQ Required)
• Other platings
FILE NO. E111594
PROCESSING
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-25)
(0.15 mm) .006" max (26-34)*
(0.20 mm) .008" max (35-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 30 µ" GOLD
HIGH MATING
CYCLES
F-219
