HLMP-S100, HLMP-S201, HLMP-S301,
HLMP-S400, HLMP-S401, HLMP-S501, HLMP-S600
2 mm x 5 mm Rectangular LED Lamps
Data Sheet
Package Dimensions
Features
•  Rectangular light emitting surface
•  Excellent for ush mounting on panels
•  Choice of ve bright colors
•  Long life: solid state reliability
•  Excellent uniformity of light output
Description
The HLMP-S100, -S201, -5301, -S400, -S401, -S501,
-S600 are epoxy encapsulated lamps in rectangu-
lar packages which are easily stacked in arrays or
used for discrete front panel indicators. Contrast and
light uniformity are enhanced by a special epoxy diusion
and tinting process.
The HLMP-S100 uses double heterojunction (DH)
absorbing substrate (AS) aluminum gallium arsenide
(AlGaAs) LEDs to produce outstanding light output over a
wide range of drive currents.
2.41 (0.100)
2.03 (0.085)
2.23 (0.088)
1.98 (0.078)
8.00 (0.315)
7.37 (0.290)
25.40 (1.00) MIN.
CATHODE LEAD
BOTTOM VIEW
SIDE VIEW
1.27 (0.50)
NOMINAL
NOTES:
1. ALL DIMENSIONS ARE IN
MILLIMETERS (INCHES).
2. AN EPOXY MENISCUS MAY EXTEND
ABOUT 1 mm (0.040") DOWN THE LEADS.
3. THERE IS A MXIMUM 1 TAPER FROM
BASE TO THE TOP OF LAMP.
2.54 (0.100)
NOMINAL
0.46 (0.018)
SQ. NOMINAL
5.46 (0.215)
4.95 (0.195)
5.18 (0.204)
4.93 (0.194)
2
Selection Guide
Luminous Intensity Iv (mcd) at 20 mA
Color Part Number Min. Typ. Max.
AlGaAs Red HLMP-S100 3.4 7.5 –
HER HLMP-S201
HLMP-S201-D00xx 2.1 3.5 –
HLMP-S201-E00xx 3.4 7.5 –
HLMP-S201-EF0xx 3.4 7.5 10.8
Orange HLMP-S400 2.1 3.5 –
HLMP-S401 3.4 7.5 –
Yellow HLMP-S301
HLMP-S301-B00xx 1.4 2.1 –
HLMP-S301-C00xx 2.2 4.0 –
HLMP-S301-CDBxx 2.2 4.0 7.2
Green HLMP-S501
HLMP-S501-C00xx 2.6 4.0 –
HLMP-S501-D00xx 4.2 8.0 –
HLMP-S501-DE0xx 4.2 8.0 13.4
Emerald Green[1] HLMP-S600-A00xx 1.0 3.0 –
Note:
1. Please refer to Application Note 1061 for information comparing standard green and emerald green light output degradation.
Part Numbering System
HLMP - S x xx - x x x xx
Mechanical Option
00: Bulk
02: Tape & Reel, Straight Leads
DG: Ammo Pack
Color Bin Options
0: Full Color Bin Distribution
B: Color Bins 2 & 3 only
Maximum Iv Bin Options
0: Open (no max. limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Brightness Level
00: Less Brightness
01: Higher Brightness
Color Options
1: AlGaAs Red
2: GaP HER
3: GaP Yellow
4: GaP Orange
5: GaP Green
6: GaP Emerald Green
3
Electrical/Optical Characteristics at TA = 25°C
Sym. Description Device HLMP- Min. Typ. Max. Units Test Conditions
2q1/2 Included Angle Between Half All 110 Deg. IF = 20 mA
Luminous Intensity Points See Note 1
lPEAK Peak Wavelength AlGaAs Red 645 nm Measurement at
High Eciency Red 635 Peak
Orange 600
Yellow 583
Green 565
Emerald Green 558
ld Dominant Wavelength AlGaAs Red 637 nm See Note 2
High Eciency Red 626 Time const, e-t/ts
Orange 602
Yellow 585
Green 569
Emerald Green 560
ts Speed of Response AlGaAs Red 30 ns
High Eciency Red 90
Orange 280
Yellow 90
Green 500
Emerald Green 3100
C Capacitance AlGaAs Red 30 pF VF = 0; f = 1 MHz
High Eciency Red 11
Orange 4
Yellow 15
Green 18
Emerald Green 35
RqJ-PIN Thermal Resistance All 260 °C/W Junction to Cathode
Lead at Seating
Plane
VF Forward Voltage AlGaAs Red 1.6 1.8 2.2 V IF = 20 mA
HER/Orange 1.5 1.9 2.6
Yellow 1.5 2.1 2.6
Green/Emerald 1.5 2.2 3.0
Green
VR Reverse Breakdown Voltage All 5.0 V IR = 100 mA
hV Luminous Ecacy AlGaAs Red 80
High Eciency Red 145
Orange 380 lumens/ See Note 3
Yellow 500 watt
Green 595
Emerald Green 656
Notes:
1. q1/2 is the o-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which denes the color of the
device.
3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the
luminous ecacy in lumens/watt.
4. Please refer to Application Note 1061 for information comparing standard green and emerald green light output degradation.
4
Figure 1. Relative intensity vs. wavelength.
Absolute Maximum Ratings at TA = 25°C
High Eciency Red/ Green/
Parameter AlGaAs Red Orange Yellow Emerald Green Units
Peak Forward Current 300 90 60 90 mA
Average Forward Current[1] 20 25 20 25 mA
DC Current[2] 30 30 20 30 mA
Transient Forward Current[3] 500 500 500 500 mA
(10 µsec Pulse)
LED Junction Temperature 110 110 110 110 °C
Operating Temperature Range -20 to +100 -40 to +100 -40 to +100 -20 to +100 °C
Storage Temperature Range -40 to +100 -40 to +100 -40 to +100 -40 to +100 °C
Notes:
1. See Figure 5 to establish pulsed operating conditions.
2. For AlGaAs Red, Red, Orange, and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.34 mA/°C.
3. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wire
bond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum
Ratings.
ORANGE
HIGH EFFICIENCY RED
WAVELENGTH – nm
RELATIVE INTENSITY
1.0
0.5
0
500 550 600 650 700 750
YELLOW
EMERALD GREEN
HIGH
PERFORMANCE
GREEN
TA = 25 C
AlGaAs RED
5
Figure 4. Relative eciency (luminous intensity
per unit current) vs. LED peak current. hv
(300 mA) for AlGaAs Red = 0.7.
Figure 2. Forward current vs. forward voltage
characteristics. VF (300 mA) for AlGaAs Red = 2.6
volts typical.
Figure 3. Relative luminous intensity vs. DC
forward current.
Figure 5. Maximum tolerable peak current vs. peak duration.
(IPEAK MAX determined from temperature derated IDC MAX).
Figure 6. Relative luminous intensity vs. angular displacement.
IF – FORWARD CURRENT – mA
1.0
VF – FORWARD VOLTAGE – V
0
20
40
60
2.0 3.0
90
70
GREEN/EMERALD GREEN
YELLOW
RED
AlGaAs
RED
10
30
50
80
4.0 5.0
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0
IDC – DC CURRENT PER LED – mA
0305 15
2.5
2.0
AlGaAs RED
0.5
1.0
1.5
10 20 25
HER, YELLOW,
EMERALD GREEN
ηPEAK – RELATIVE EFFICIENCY
(NORMALIZED AT 20 mA)
0
IPEAK – PEAK SEGMENT CURRENT – mA
0.4
0.6
0.8
1.0
9020 705040
1.3
1.1
GREEN
YELLOW
RED/ORANGE
AlGaAs RED
0.5
0.7
0.9
1.2
30 60 8010
EMERALD GREEN
RATIO OF MAXIMUM TOLERABLE
PEAK CURRENT TO MAXIMUM
TOLERABLE DC CURRENT
1
tP – PULSE DURATION – s
HER, ORANGE, YELLOW, and GREEN
1.0
2.0
3.0
10,0001000
4.0
1.5
10010
IPEAK MAX.
IDC MAX.
100 KHz
30 KHz
10 KHz
3 KHz
1 KHz
300 Hz
100 Hz
tp – PULSE DURATION – s
AlGaAs RED
3
1
10
10 1000010001001
3 KHz
10 KHz
1 KHz
300 Hz
f – REFRESH RATE – 100 Hz
2
9
8
7
6
5
4
RATIO OF MAXIMUM PEAK CURRENT
TO TEMPERATURE DERATED
MAXIMUM DC CURRENT
IPEAK MAX.
IDC MAX.
10 10040 7020 60 8030 50 90
0
10
20
30
40
50
60
70
80
90
1.0
0.6
0.8
0.2
0.4
6
Intensity Bin Limits
Intensity Range (mcd)
Color Bin Min. Max.
D 2.4 3.8
E 3.8 6.1
F 6.1 9.7
G 9.7 15.5
H 15.5 24.8
I 24.8 39.6
J 39.6 63.4
K 63.4 101.5
L 101.5 162.4
M 162.4 234.6
N 234.6 340.0
Red/Orange O 340.0 540.0
P 540.0 850.0
Q 850.0 1200.0
R 1200.0 1700.0
S 1700.0 2400.0
T 2400.0 3400.0
U 3400.0 4900.0
V 4900.0 7100.0
W 7100.0 10200.0
X 10200.0 14800.0
Y 14800.0 21400.0
Z 21400.0 30900.0
B 1.6 2.5
C 2.5 4.0
D 4.0 6.5
E 6.5 10.3
F 10.3 16.6
G 16.6 26.5
H 26.5 42.3
I 42.3 67.7
J 67.7 108.2
K 108.2 173.2
Yellow L 173.2 250.0
M 250.0 360.0
N 360.0 510.0
O 510.0 800.0
P 800.0 1250.0
Q 1250.0 1800.0
R 1800.0 2900.0
S 2900.0 4700.0
T 4700.0 7200.0
U 7200.0 11700.0
V 11700.0 18000.0
W 18000.0 27000.0
Intensity Bin Limits, continued
Intensity Range (mcd)
Color Bin Min. Max.
A 1.1 1.8
B 1.8 2.9
C 2.9 4.7
D 4.7 7.6
E 7.6 12.0
F 12.0 19.1
G 19.1 30.7
H 30.7 49.1
I 49.1 78.5
J 78.5 125.7
Green/ K 125.7 201.1
Emerald Green L 201.1 289.0
M 289.0 417.0
N 417.0 680.0
O 680.0 1100.0
P 1100.0 1800.0
Q 1800.0 2700.0
R 2700.0 4300.0
S 4300.0 6800.0
T 6800.0 10800.0
U 10800.0 16000.0
V 16000.0 25000.0
W 25000.0 40000.0
Maximum tolerance for each bin limit is ±18%.
7
Color Categories
Lambda (nm)
Color Category # Min. Max.
9 552.5 555.5
Emerald Green 8 555.5 558.5
7 558.5 561.5
6 561.5 564.5
6 561.5 564.5
5 564.5 567.5
Green 4 567.5 570.5
3 570.5 573.5
2 573.5 576.5
1 582.0 584.5
3 584.5 587.0
Yellow 2 587.0 589.5
4 589.5 592.0
5 592.0 593.0
1 597.0 599.5
2 599.5 602.0
3 602.0 604.5
Orange 4 604.5 607.5
5 607.5 610.5
6 610.5 613.5
7 613.5 616.5
8 616.5 619.5
Tolerance for each bin limit is ±0.5 nm.
Mechanical Option Matrix
Mechanical Option Code Denition
00 Bulk Packaging, minimum increment 500 pcs/bag
02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag
DG Ammo Pack, straight leads with minimum increment 2K/pack
Note:
All categories are established for classication of products. Products may not be available in all categories. Please contact your local Avago representative
for further clarication/information.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4266EN
AV02-1563EN - October 13, 2008
Precautions
Lead Forming
•  The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
•  If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of LED
to length after soldering process at room temperature.
The solder joint formed will absorb the mechanical
stress of the lead cutting from traveling to the LED chip
die attach and wirebond.
•  It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Conditions
•  Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
•  The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without stando.
•  Recommended soldering conditions:
Manual Solder
Wave Soldering Dipping
Pre-heat Temperature 105°C Max. –
Pre-heat Time 30 sec Max. –
Peak Temperature 250°C Max. 260°C Max.
Dwell Time 3 sec Max. 5 sec Max.
•  Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering prole to ensure
the soldering prole used is always conforming to
recommended soldering condition.
•  If necessary, use xture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
•  Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool to
room temperature, 25°C, before handling.
•  Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
•  Recommended PC board plated through hole sizes for
LED component leads:
LED Component Plated Through
Lead Size Diagonal Hole Diameter
0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm
(0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch)
0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm
(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
Note:
Refer to application note AN1027 for more information on soldering
LED components.
Figure 7. Recommended wave soldering prole.