LM384
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SNAS547C –FEBRUARY 1995–REVISED APRIL 2013
LM384 5W Audio Power Amplifier
Check for Samples: LM384
1FEATURES DESCRIPTION
The LM384 is a power audio amplifier for consumer
2• Wide Supply Voltage Range: 12V to 26V applications. In order to hold system cost to a
• Low Quiescent Power Drain minimum, gain is internally fixed at 34 dB. A unique
• Voltage Gain Fixed at 50 input stage allows ground referenced input signals.
The output automatically self-centers to one-half the
• High Peak Current Capability: 1.3A supply voltage.
• Input Referenced to GND The output is short-circuit proof with internal thermal
• High Input Impedance: 150kΩlimiting. The package outline is standard dual-in-line.
• Low Distortion: 0.25% (PO=4W, RL=8Ω)A copper lead frame is used with the center three
• Quiescent Output Voltage is at One Half of the pins on either side comprising a heat sink. This
Supply Voltage makes the device easy to use in standard p-c layout.
• 14-Pin PDIP Package Uses include simple phonograph amplifiers,
intercoms, line drivers, teaching machine outputs,
alarms, ultrasonic drivers, TV sound systems, AM-FM
radio and sound projector systems. See SNAA086 for
circuit details.
Schematic Diagram
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1995–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM384
SNAS547C –FEBRUARY 1995–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage 28V
Peak Current 1.3A
Power Dissipation(3)(4) 1.67W
Input Voltage ±0.5V
Storage Temperature −65°C to +150°C
Operating Temperature 0°C to +70°C
Lead Temperature (Soldering, 10 sec.) 260°C
Thermal Resistance θJC 30°C/W
θJA 79°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum junction temperature of the LM384 is 150°C.
(4) The package is to be derated at 15°C/W junction to heat sink pins.
Electrical Characteristics(1)
Symbol Parameter Conditions Min Typ Max Units
ZIN Input Resistance 150 kΩ
IBIAS Bias Current Inputs Floating 100 nA
AVGain 40 50 60 V/V
POUT Output Power THD = 10%, RL= 8Ω5 5.5 W
IQQuiescent Supply Current 8.5 25 mA
VOUT Q Quiescent Output Voltage 11 V
BW Bandwidth POUT = 2W, RL= 8Ω450 kHz
V+Supply Voltage 12 26 V
ISC Short Circuit Current(2) 1.3 A
PSRRRTO Power Supply Rejection Ratio(3) 31 dB
THD Total Harmonic Distortion POUT = 4W, RL= 8Ω0.25 1.0 %
(1) V+= 22V and TA= 25°C operating with a Staver V7 heat sink for 30 seconds.
(2) Output is fully protected against a shorted speaker condition at all voltages up to 22V.
(3) Rejection ratio referred to the output with CBYPASS = 5 μF, freq = 120 Hz.
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LM384
SNAS547C –FEBRUARY 1995–REVISED APRIL 2013
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Typical Performance Characteristics
Device Dissipation vs Ambient Temperature Thermal Resistance vs Square Inches
Figure 2. Figure 3.
Supply Decoupling vs Frequency Total Harmonic Distortion vs Output Power
Figure 4. Figure 5.
Output Voltage Gain vs Frequency Total Harmonic Distortion vs Frequency
Figure 6. Figure 7.
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LM384
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SNAS547C –FEBRUARY 1995–REVISED APRIL 2013
Typical Performance Characteristics (continued)
Power Supply Current vs Supply Voltage Device Dissipation vs Output Power—16ΩLoad
Figure 8. Figure 9.
Device Dissipation vs Output Power—8ΩLoad Device Dissipation vs Output Power—4ΩLoad
Figure 10. Figure 11.
Copyright © 1995–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LM384
LM384
SNAS547C –FEBRUARY 1995–REVISED APRIL 2013
www.ti.com
Block and Connection Diagrams
Note: Heatsink Pins
Figure 12. 14-Pin PDIP (Top View)
See NFF0014A Package
Typical Applications
Figure 13. Typical 5W Amplifier
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Product Folder Links: LM384
LM384
SNAS547C –FEBRUARY 1995–REVISED APRIL 2013
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REVISION HISTORY
Changes from Revision B (April 2013) to Revision C Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 7
8Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: LM384
PACKAGE OPTION ADDENDUM
www.ti.com 1-Mar-2015
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM384N/NOPB ACTIVE PDIP NFF 14 25 Green (RoHS
& no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM384N
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 1-Mar-2015
Addendum-Page 2
MECHANICAL DATA
N0014A
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N14A (Rev G)
NFF0014A
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