MT38M5071A3063RZZI
Data Sheets (1)
JY28, JYE8; MT38M4071A3063RZZI.Y28, MT38M5071A3063RZZI.YE8
File Type:
PDF
Updated:
03/2015
Data Sheet
R
Parallel NOR and LPDDR 133-Ball MCP Combination Memory Data Sheet
Multichip Packages
NOR Based MCP
NOR LPDDR
DOWNLOAD
Specs
Orderable Parts for:
MT38M5071A3063RZZI
Status
Media
FBGA
Code
SPD
Data
Chipset
Validation
PLP
Start
Date
Alternative
Part
MT38M5071A3063RZZI.YE8
Contact
Factory
N/A
RC015
N/A
N/A
No
N/A
Detailed Specifications
Part
Status
Contact
Factory
NOR
Density
512Mb
DRAM
Type
LPDDR
DRAM
Density
512Mb
Voltage
1.8V
Package
VFBGA
Package
Size
8 x 8 x 1
Pin Count
133-ball
Package
Type
Green
Op. Temp.
-40C to +85C
NOR
Family
M-Series
Configuration
Uniform
RoHS
Yes
SEE ALL NOR-BASED MCP
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MT38M5071A3063RZZI
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DATA SHEET (1)
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Sim Models & Software
Sim Models
(ZIP)
MT38M5071A3063RZZI.YE8
File Type:
ZIP
Updated:
01/26/2015
IBIS
R
IBIS MCP JYE8 512Mb NOR + 512Mb LPDDR 133 balls
Multichip Packages
NOR LPDDR
DOWNLOAD
RoHS Certificates
RoHS Certificate of Compliance
(PDF)
Part-specific certification of how this product meets the requirements of the current DIRECTIVE
2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.
File Type:
(PDF)
Updated:
01/2017
RoHS Certificates
MT38M5071A3063RZZI
DOWNLOAD
China RoHS Certificate
(PDF)
Part-specific certification as required by China's Management Methods for Controlling Pollution by
Electronic Information Products.
File Type:
(PDF)
Updated:
01/2017
RoHS Certificates
MT38M5071A3063RZZI
DOWNLOAD
Documentation & Support
See All NOR Based MCP Documentation
Technical Notes
SEARCH (1) NOR BASED MCP TECHNICAL NOTES
Technical Notes
(PDF)
(TN-00-01)
This technical note describes shipping procedures for preventing memory devices from
absorbing moisture and recommendations for baking devices exposed to excessive moisture.
File Type:
PDF
Updated:
02/14/2013
TN-00-01: Moisture Sensitivity of Plastic Packages
DDR SDRAM
DDR2 SDRAM
DDR3 SDRAM
DDR3L-RS
See More Tags
DOWNLOAD
SEARCH (1) NOR BASED MCP TECHNICAL NOTES
Parts with the same Data Sheet (1)
MT38M5071A3063RZZI
( Current )
MT38M4071A3063RZZI
Part Status
Contact
Factory
Obsolete
NOR
Density
512Mb
256Mb
DRAM Type
LPDDR
LPDDR
DRAM
Density
512Mb
512Mb
Voltage
1.8V
1.8V
Package
VFBGA
VFBGA
Package Size
8 x 8 x 1
8 x 8 x 1
Pin
Count
133-ball
133-ball
Package
Type
Green
Green
Op.
Temp.
-40C to +85C
-40C to +85C
NOR
Family
M-Series
M-Series
Configuration
Uniform
Uniform
RoHS
Yes
Yes
B
D
Where to Buy
Orderable Parts
MT38M5071A3063RZZI
( Current )
Part Status
Contact Factory
NOR Density
512Mb
DRAM Type
LPDDR
DRAM
Density
512Mb
Voltage
1.8V
Package
VFBGA
Package Size
8 x 8 x 1
Pin Count
133-ball
Package
Type
Green
Op. Temp.
-40C to +85C
NOR Family
M-Series
Configuration
Uniform
RoHS
Yes
Contact Your Sales Rep
- OR -
Check with Distributors
Your Region:
Americas
Status
Media
FBGA
Code
SPD
Data
Chipset
Validation
PLP
Start
Date
Alternative
Part
MT38M5071A3063RZZI.YE8
Contact
Factory
N/A
RC015
N/A
N/A
No
N/A
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