DATA SH EET
Product specification
Supersedes data of 1999 Apr 22 2004 Oct 11
DISCRETE SEMICONDUCTORS
BC549; BC550
NPN general purpose transistors
b
ook, halfpage
M3D186
2004 Oct 11 2
Philips Semiconductors Product specification
NPN general purpose transistors BC549; BC550
FEATURES
Low current (max. 100 mA)
Low voltage (max. 45 V).
APPLICATIONS
Low noise stages in audio frequency equipment.
DESCRIPTION
NPN transistor in a TO-92; SOT54 plastic package.
PNP complements: BC559 and BC560.
PINNING
PIN DESCRIPTION
1 emitter
2 base
3 collector
Fig.1 Simplified outline (TO-92; SOT54)
and symbol.
handbook, halfpage
1
3
2
MAM182
3
2
1
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1. Transistor mounted on an FR4 printed-circuit board.
TYPE NUMBER PACKAGE
NAME DESCRIPTION VERSION
BC549C SC-43A plastic single-ended leaded (through hole) package; 3 leads SOT54
BC550C
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCBO collector-base voltage open emitter
BC549 30 V
BC550 50 V
VCEO collector-emitter voltage open base
BC549 30 V
BC550 45 V
VEBO emitter-base voltage open collector 5V
ICcollector current (DC) 100 mA
ICM peak collector current 200 mA
IBM peak base current 200 mA
Ptot total power dissipation Tamb 25 °C; note 1 500 mW
Tstg storage temperature 65 +150 °C
Tjjunction temperature 150 °C
Tamb ambient temperature 65 +150 °C
2004 Oct 11 3
Philips Semiconductors Product specification
NPN general purpose transistors BC549; BC550
THERMAL CHARACTERISTICS
Note
1. Transistor mounted on an FR4 printed-circuit board.
CHARACTERISTICS
Tamb =25°C unless otherwise specified.
Notes
1. VBEsat decreases by about 1.7 mV/K with increasing temperature.
2. VBE decreases by about 2 mV/K with increasing temperature.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth(j-a) thermal resistance from junction to ambient note 1 250 K/W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
ICBO collector-base cut-off current VCB = 30 V; IE=0 A −−15 nA
VCB = 30 V; IE= 0 A; Tj= 150 °C−−5µA
IEBO emitter-base cut-off current VEB =5V; I
C=0 A −−100 nA
hFE DC current gain VCE = 5 V; see Fig.2
IC=10µA270
IC= 2 mA 420 520 800
VCEsat collector-emitter saturation voltage IC= 10 mA; IB= 0.5 mA 90 250 mV
IC= 100 mA; IB=5mA 200 600 mV
VBEsat base-emitter saturation voltage IC= 10 mA; IB= 0.5 mA; note 1 700 mV
IC= 100 mA; IB= 5 mA; note 1 900 mV
VBE base-emitter voltage VCE =5V; I
C= 2 mA; note 2 580 660 700 mV
VCE =5V; I
C= 10 mA; note 2 −−770 mV
Cccollector capacitance VCB = 10 V; IE=i
e= 0 A;
f = 1 MHz 1.5 pF
Ceemitter capacitance VEB = 0.5 V; IC=i
c= 0 A;
f = 1 MHz 11 pF
fTtransition frequency VCE =5V; I
C=10mA;
f = 100 MHz 100 −−MHz
F noise figure VCE =5V; I
C= 200 µA;
RS=2k; f = 10 Hz to 15.7 kHz −−4dB
VCE =5V; I
C= 200 µA;
RS=2k; f = 1 kHz; B = 200 Hz −−4dB
2004 Oct 11 4
Philips Semiconductors Product specification
NPN general purpose transistors BC549; BC550
Fig.2 DC current gain; typical values.
handbook, full pagewidth
0
600
200
400
MBH725
102101
hFE
1IC (mA)
10 103
102
VCE = 5 V
BC549C; BC550C.
2004 Oct 11 5
Philips Semiconductors Product specification
NPN general purpose transistors BC549; BC550
PACKAGE OUTLINE
UNIT A
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 5.2
5.0
b
0.48
0.40
c
0.45
0.38
D
4.8
4.4
d
1.7
1.4
E
4.2
3.6
L
14.5
12.7
e
2.54
e1
1.27
L
1(1)
max.
2.5
b1
0.66
0.55
DIMENSIONS (mm are the original dimensions)
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
SOT54 TO-92 SC-43A 97-02-28
04-06-28
A L
0 2.5 5 mm
scale
b
c
D
b
1
L1
d
E
Plastic single-ended leaded (through hole) package; 3 leads SOT54
e1e
1
2
3
2004 Oct 11 6
Philips Semiconductors Product specification
NPN general purpose transistors BC549; BC550
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
LEVEL DATA SHEET
STATUS(1) PRODUCT
STATUS(2)(3) DEFINITION
I Objective data Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseoratanyotherconditionsabovethosegiveninthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythatsuchapplications willbe
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomers usingorsellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no license or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
© Koninklijke Philips Electronics N.V. 2004 SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825
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Printed in The Netherlands R75/04/pp7 Date of release: 2004 Oct 11 Document order number: 9397 750 13569