TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
1
The LUMENOLOGY r Company r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
Features
DProximity Detection with an Integrated LED
Driver in a Single Device
DProximity Detection
− Programmable Number of IR Pulses
− Programmable Current Sink for the IR
LED — No Limiting Resistor Needed
− Programmable Interrupt Function with
Upper and Lower Threshold
− Covers a 2000:1 Dynamic Range
DProgrammable Wait Timer
− Programmable from 2.72 ms
to > 8 Seconds
− Wait State — 65 mA Typical Current
DI2C Interface Compatible
− Up to 400 kHz (I2C Fast Mode)
− Dedicated Interrupt Pin
DSmall 2 mm 2 mm ODFN Package
DSleep Mode — 2.5 mA Typical Current
Applications
DCell Phone Touch Screen Disable
DNotebook/Monitor Security
DAutomatic Speakerphone Enable
DAutomatic Menu Popup
Description
The TSL2671 family of devices provides a complete proximity detection system and digital interface logic in a
single 6-pin package. The device includes a digital proximity sensor with integrated LED driver for the required
external IR LED. The proximity function offers a wide range of performance, with four programmable LED drive
currents and a pulse repetition range of 1 to 32 pulses. The proximity detection circuitry compensates for
ambient light, allowing it to operate in environments ranging from bright sunlight to dark rooms. This wide
dynamic range also allows operation in short-distance detection applications behind dark glass, such as cell
phones. An internal state machine provides the ability to put the device into a low-power mode for very low
average power consumption.
The proximity function specifically targets near-field proximity applications. In cell phones, for example, the
proximity detection function can detect when the user positions the phone close to their ear. The device is fast
enough to provide proximity information at the high repetition rate needed when answering a phone call. This
provides both improved green power saving capability and the added security to lock the screen when the user
may accidently deploy a touch.
Communication with the device is accomplished through a simple two-wire I2C interface with data rates up to
400 kHz. An interrupt output pin is provided for connection to the host processor. This interrupt pin can be used
to eliminate the need to poll the device on a repetitive basis. There is also a digital filter that compares the
proximity ADC results to programmed values so that an interrupt is generated only upon a proximity event.
The TSL2671 is supplied in a very small form factor 2-mm × 2-mm, 6-pin optical package, requiring very little
PCB area. Also, the package height is only 0.65 mm high, which makes the TSL2671 suitable for very thin
mechanical applications.
r
r
Texas Advanced Optoelectronic Solutions Inc.
1001 Klein Road S Suite 300 S Plano, TX 75074 S (972) 673-0759
PACKAGE FN
DUAL FLAT NO-LEAD
(TOP VIEW)
VDD 1
SCL 2
GND 3
6 SDA
5 INT
4 LDR
Package Image Not Actual Size
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
2
r
r
Copyright E 2011, TAOS Inc. The LUMENOLOGY r Company
www.taosinc.com
Functional Block Diagram
SDA
VDD
INT
SCL
LDR
Wait Control
Prox
ADC
Prox Control
Prox
Data
IR LED Constant
Current Sink
Prox
Integration
Upper Limit
Lower Limit
Interrupt
I2C Interface
GND CH0
CH1
Detailed Description
The TSL2671 light-to-digital device provides on-chip photodiodes, integrating amplifiers, ADCs, accumulators,
clocks, buffers, comparators, a state machine, and an I2C interface. Each device combines a Channel 0
photodiode (CH0), which is responsive to both visible and infrared light, and a channel 1 photodiode (CH1),
which is responsive primarily to infrared light. Proximity detection can occur using either or both photodiodes.
Two integrating ADCs simultaneously convert the amplified photodiode currents into a digital value providing
up to 16 bits of resolution. Upon completion of the conversion cycle, the conversion result is transferred to the
data registers.
Proximity detection requires only a single external IR LED. An internal LED driver can be configured to provide
a constant current sink of 12.5 mA, 25 mA, 50 mA, or 100 mA of current. No external current limiting resistor
is required. The number of proximity LED pulses can be programmed from 1 to 255 pulses. Each pulse has a
16-μs period. This LED current, coupled with the programmable number of pulses, provides a 2000:1
contiguous dynamic range.
Communication to the device is accomplished through a fast (up to 400 kHz), two-wire I2C serial bus for easy
connection to a microcontroller or embedded controller. The digital output of the device is inherently more
immune to noise when compared to an analog interface.
The device provides a separate pin for level-style interrupts. When interrupts are enabled and a pre-set value
is exceeded, the interrupt pin is asserted and remains asserted until cleared by the controlling firmware. The
interrupt feature simplifies and improves system efficiency by eliminating the need to poll a sensor for a proximity
value. An interrupt is generated when the value of a proximity conversion exceeds either an upper or lower
threshold. In addition, a programmable interrupt persistence feature allows the user to determine how many
consecutive exceeded thresholds are necessary to trigger an interrupt.
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
3
The LUMENOLOGY r Company r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
Terminal Functions
TERMINAL
TYPE
DESCRIPTION
NAME NO. TYPE DESCRIPTION
GND 3 Power supply ground. All voltages are referenced to GND.
INT 5 O Interrupt — open drain.
LDR 4 O LED driver for proximity emitter — up to 100 mA, open drain.
SCL 2 I I2C serial clock input terminal — clock signal for I2C serial data.
SDA 6 I/O I2C serial data I/O terminal — serial data I/O for I2C .
VDD 1Supply voltage.
Available Options
DEVICE ADDRESS PACKAGE − LEADS INTERFACE DESCRIPTION ORDERING NUMBER
TSL26711 0x39 FN−6 I2C Vbus = VDD Interface TSL26711FN
TSL26713 0x39 FN−6 I2C Vbus = 1.8 V Interface TSL26713FN
TSL26715 0x29 FN−6 I2C Vbus = VDD Interface TSL26715FN
TSL26717 0x29 FN−6 I2C Vbus = 1.8 V Interface TSL26717FN
Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VDD (see Note 1) 3.8 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital output voltage range, VO −0.5 V to 3.8 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital output current, IO −1 mA to 20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD tolerance, human body model 2000 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltages are with respect to GND.
Recommended Operating Conditions
MIN NOM MAX UNIT
Supply voltage, VDD 2.6 3 3.6 V
Supply voltage accuracy, VDD total error including transients −3 3 %
Operating free-air temperature, TA−30 70 °C
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
4
r
r
Copyright E 2011, TAOS Inc. The LUMENOLOGY r Company
www.taosinc.com
Operating Characteristics, VDD = 3 V, TA = 25C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Active — LDR pulse off 175 250
IDD Supply current Wait mode 65 μA
IDD
Supply
current
Sleep mode 2.5 4
μA
V
INT SDA output low voltage
3 mA sink current 00.4
V
VOL INT, SDA output low voltage 6 mA sink current 00.6 V
ILEAK Leakage current, SDA, SCL, INT pins −5 5 μA
ILEAK Leakage current, LDR pin ± 10 μA
V
SCL SDA input high voltage
TSL26711, TSL26715 0.7 VDD
V
VIH SCL, SDA input high voltage TSL26713, TSL26717 1.25 V
V
SCL SDA input low voltage
TSL26711, TSL26715 0.3 VDD
V
VIL SCL, SDA input low voltage TSL26713, TSL26717 0.54 V
Proximity Characteristics, VDD = 3 V, TA = 25C, PEN = 1 (unless otherwise noted)
PARAMETER TEST CONDITIONS CONDITION MIN TYP MAX UNIT
IDD Supply current LDR pulse on 3 mA
ADC conversion time step size PTIME = 0xFF 2.58 2.72 2.9 ms
ADC number of integration steps 1 256 steps
ADC counts per step PTIME = 0xFF 0 1023 counts
IR LED pulse count 0 255 pulses
Pulse period 16.3 μs
Pulse — LED on time 7.2 μs
PDRIVE=0 75 100 125
LED Drive
I
S
INK sink current @ 600 mV, PDRIVE=1 50
mA
LED Drive
ISINK
sink
current
@
600
mV
,
LDR pin PDRIVE=2 25 mA
PDRIVE=3 12.5
Operating distance (See note 1) 18 inches
NOTE 1: Proximity Operating Distance is dependent upon emitter properties and the reflective properties of the proximity surface. The nominal
value shown uses an IR emitter with a peak wavelength of 850 nm and a 20° half angle. The proximity surface used is 90% reflective
(white surface) 16 × 20-inch Kodak Gray Card. 60 mw/SR, 100 mA, 64 pulses, open view (no glass). Note: Greater distances are
achievable with appropriate system considerations.
Wait Characteristics, VDD = 3 V, TA = 25C, WEN = 1 (unless otherwise noted)
PARAMETER TEST CONDITIONS CHANNEL MIN TYP MAX UNIT
Wait step size WTIME = 0xFF 2.58 2.72 2.9 ms
Wait number of integration steps 1 256 steps
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
5
The LUMENOLOGY r Company r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
AC Electrical Characteristics, VDD = 3 V, TA = 25C (unless otherwise noted)
PARAMETER†TEST CONDITIONS MIN TYP MAX UNIT
f(SCL) Clock frequency (I2C only) 0 400 kHz
t(BUF) Bus free time between start and stop condition 1.3 μs
t(HDSTA)
Hold time after (repeated) start condition. After
this period, the first clock is generated. 0.6 μs
t(SUSTA) Repeated start condition setup time 0.6 μs
t(SUSTO) Stop condition setup time 0.6 μs
t(HDDAT) Data hold time 0μs
t(SUDAT) Data setup time 100 ns
t(LOW) SCL clock low period 1.3 μs
t(HIGH) SCL clock high period 0.6 μs
tFClock/data fall time 300 ns
tRClock/data rise time 300 ns
CiInput pin capacitance 10 pF
†Specified by design and characterization; not production tested.
PARAMETER MEASUREMENT INFORMATION
SDA
SCL
StopStart
SCLACK
t(LOWMEXT) t(LOWMEXT)
t(LOWSEXT)
SCLACK
t(LOWMEXT)
Start
Condition
Stop
Condition
P
SDA
t(SUSTO)
t(SUDAT)
t(HDDAT)
t(BUF)
VIH
VIL
SCL
t(SUSTA)
t(HIGH)
t(F)
t(R)
t(HDSTA)
t(LOW)
VIH
VIL
PSS
Figure 1. Timing Diagrams
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
6
r
r
Copyright E 2011, TAOS Inc. The LUMENOLOGY r Company
www.taosinc.com
TYPICAL CHARACTERISTICS
Figure 2
SPECTRAL RESPONSIVITY
λ − Wavelength − nm
0
400
0.2
0.4
0.6
0.8
1
500 600 700 800 900 1000 1100
Normalized Responsivity
300
Ch 0
Ch 1 25 mA
12.5 mA
Figure 3
VOL − Output Low Voltage − V
12.5
25
37.5
50
62.5
75
87.5
100
112.5
0
Load Current — mA
0 0.3 0.6 0.9 1.2
LDR OUTPUT COMPLIANCE
50 mA
100 mA
Figure 4
NORMALIZED IDD
vs.
VDD and TEMPERATURE
VDD — V
IDD Normalized @ 3 V, 25C
94%
96%
98%
100%
102%
104%
106%
108%
110%
92%
2.7 2.8 2.9 3 3.1 3.2 3.3
75C
50C 25C
0C
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
7
The LUMENOLOGY r Company r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
PRINCIPLES OF OPERATION
System State Machine
The device provides control of proximity detection and power management functionality through an internal
state machine. After a power-on-reset, the device is in the sleep mode. As soon as the PON bit is set, the device
will move to the start state. It will then cycle through the Proximity and Wait states. If these states are enabled,
the device will execute each function. If the PON bit is set to a 0, the state machine will continue until the current
conversion is complete and then go into a low-power sleep mode.
PON = 1
(r0x00:b0)
Sleep
Start
Wait
Prox
PON = 0
(r0x00:b0)
Figure 5. Simplified State Diagram
NOTE: In this document, the nomenclature uses the bit field name in italics followed by the register number and
bit number to allow the user to easily identify the register and bit that controls the function. For example, the
power on (PON) is in register 0x00, bit 0. This is represented as PON (r0x00:b0).
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
8
r
r
Copyright E 2011, TAOS Inc. The LUMENOLOGY r Company
www.taosinc.com
Proximity Detection
Proximity sensing uses an external light source (generally an infrared emitter) to emit light, which is then viewed
by the integrated light detector to measure the amount of reflected light when an object is in the light path
(Figure 6). The amount of light detected from a reflected surface can then be used to determine an object’s
proximity to the sensor.
IR LED
2771
Surface Reflectivity (SR)
Background Energy (BGE) Optical Crosstalk (OC)
Glass Attenuation (GA)
Distance (D)
Figure 6. Proximity Detection
The device has controls for the number of IR pulses (PPCOUNT), the integration time (PTIME), the LED drive
current (PDRIVE), and the photodiode configuration (PDIODE) (Figure 7). The photodiode configuration can
be set to CH1 diode (recommended), CH0 diode, or a combination of both diodes. At the end of the integration
cycle, the results are latched into the proximity data (PDATAx) registers.
CH1
Prox
Integration
Prox Control
Prox
ADC
IR LED Constant
Current Sink
CH0
PDATAH(r0x19), PDATAL(r0x18)
PDRIVE(r0x0F, b7:6)
Prox
Data
IR
LED
PTIME(r0x02)
PPCOUNT(r0x0E)
VDD
Figure 7. Proximity Detection Operation
The LED drive current is controlled by a regulated current sink on the LDR pin. This feature eliminates the need
to use a current limiting resistor to control LED current. The LED drive current can be configured for 12.5 mA,
25 mA, 50 mA, or 100 mA. For higher LED drive requirements, an external P type transistor can be used to
control the LED current.
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
9
The LUMENOLOGY r Company r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
The number of LED pulses can be programmed to any value between 1 and 255 pulses as needed. Increasing
the number of LED pulses at a given current will increase the sensor sensitivity. Sensitivity grows by the square
root of the number of pulses. Each pulse has a 16-μs period.
LED On LED Off
16 ms
IR LED Pulses
Subtract
Background
Add IR +
Background
Figure 8. Proximity IR LED Waveform
The proximity integration time (PTIME) is the period of time that the internal ADC converts the analog signal
to a digital count. It is recommend that this be set to a minimum of PTIME = 0xFF or 2.72 ms.
The combination of LED power and number of pulses can be used to control the distance at which the sensor
can detect proximity. Figure 9 shows an example of the distances covered with settings such that each curve
covers 2× the distance. Counts up to 64 pulses provide a 16× range.
Figure 9
PROXIMITY ADC COUNT
vs.
RELATIVE DISTANCE
Proximity ADC Count
Relative Distance
124816
0
200
400
600
800
1000
100 mA,
64 Pulses
100 mA,
16 Pulses
100 mA,
4 Pulses
100 mA,
1 Pulse
25 mA,
1 Pulse
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
10
r
r
Copyright E 2011, TAOS Inc. The LUMENOLOGY r Company
www.taosinc.com
Interrupts
The interrupt feature simplifies and improves system efficiency by eliminating the need to poll the sensor for
a proximity value. The interrupt mode is determined by the state of the PIEN field in the ENABLE register.
Two 16-bit-wide interrupt threshold registers allow the user to define upper and lower threshold limits. An
interrupt can be generated when the proximity data (PDATA) exceeds the upper threshold value (PIHTx) or falls
below the lower threshold (PILTx).
To further control when an interrupt occurs, the device provides an interrupt persistence feature. This feature
allows the user to specify a number of conversion cycles for which an event exceeding the proximity interrupt
threshold must persist (PPERS) before actually generating an interrupt. See the register descriptions for details
on the length of the persistence.
Prox
ADC
Prox
Data
Prox
Integration
CH0
Upper Limit
Lower Limit
Prox Persistence
PILTH(r0x09), PILTL(r0x08)
PIHTH(r0x0B), PIHTL(r0x0A) PPERS(r0x0C, b7:4)
CH1
Figure 10. Programmable Interrupt
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
11
The LUMENOLOGY r Company r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
State Diagram
The following state diagram shows a more detailed flow for the state machine. The device starts in the sleep
mode. The PON bit is written to enable the device. A 2.72-ms Start Delay will occur before entering the start
state. If the PEN bit is set, the state machine will step through the proximity accumulate, then proximity ADC
conversion states. As soon as the conversion is complete, the state machine will move to the Wait Check state.
If the WEN bit is set, the state machine will then cycle through the wait state. If the WLONG bit is set, the wait
cycles are extended by 12× over normal operation. When the wait counter terminates, the state machine will
move to the 2.72-ms Wait Delay state before returning to the Start state.
1 to 256 steps
Step: 2.72 ms
Time: 2.72 ms − 696 ms
Recommended − 2.72 ms 1023 Counts
PEN = 0
Prox
Check
PON = 1
PON = 0
Sleep
Wait
Check
Start
Wait
WEN = 1
Prox
Accum
Prox
ADC
Wait
Delay
PEN = 1
1 to 255 LED Pulses
Pulse Frequency: 62.5 kHz
Time: 16.3 ms − 4.2 ms WLONG = 0
1 to 256 steps
Step: 2.72 ms
Time: 2.72 ms − 696 ms
WLONG = 1
1 to 256 steps
Step: 32.6 ms
Time: 32.6 ms − 8.35 s
5.44 ms
WEN = 0
Start
Delay
2.72 ms
Figure 11. Expanded State Diagram
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
12
r
r
Copyright E 2011, TAOS Inc. The LUMENOLOGY r Company
www.taosinc.com
Power Management
Power consumption can be controlled through the use of the wait state timing because the wait state consumes
only 65 μA of power. Figure 14 shows an example of using the power management feature to achieve an
average power consumption of 138 μA current with four 100-mA pulses of proximity detection.
4 IR LED Pulses
65 ms (29 ms LED On Time)
2.72 ms
43.52 ms
5.44 ms
Prox ADC
Prox Accum
Wait
Wait
Delay
Average Current = ((0.029 100) + (2.72 0.175) + (43.52 0.065) + (5.44 0.175)) / 52 = 138 mA
State Duration (ms) Current (mA)
Prox Accum 0.065 (Note 1)
LED On 0.029 (Note 2) 100.0
Prox ADC 2.72 0.175
Wait 43.52 0.065
Wait Delay 5.44 0.175
Example: ~49 ms Cycle TIme
Note 1: Prox Accum = 16.3 ms per pulse 4 pulses = 65 ms = 0.065 ms
Note 2: LED On = 7.2 ms per pulse 4 pulses = 29 ms = 0.029 ms
Figure 12. Power Consumption Calculations
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
13
The LUMENOLOGY r Company r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
I2C Protocol
Interface and control are accomplished through an I2C serial compatible interface (standard or fast mode) to
a set of registers that provide access to device control functions and output data. The devices support the 7-bit
I2C addressing protocol. Devices TSL26711 and TSL26713 are at slave address 0x39, while the TSL26715 and
TSL26717 devices are at slave address 0x29.
The I2C standard provides for three types of bus transaction: read, write, and a combined protocol (Figure 13).
During a write operation, the first byte written is a command byte followed by data. In a combined protocol, the
first byte written is the command byte followed by reading a series of bytes. If a read command is issued, the
register address from the previous command will be used for data access. Likewise, if the MSB of the command
is not set, the device will write a series of bytes at the address stored in the last valid command with a register
address. The command byte contains either control information or a 5-bit register address. The control
commands can also be used to clear interrupts.
The I2C bus protocol was developed by Philips (now NXP). For a complete description of the I2C protocol, please
review the NXP I2C design specification at http://www.i2c−bus.org/references/.
AAcknowledge (0)
NNot Acknowledged (1)
PStop Condition
RRead (1)
SStart Condition
SRepeated Start Condition
WWrite (0)
... Continuation of protocol
Master-to-Slave
Slave-to-Master
W
7
Data ByteSlave AddressS
1
AAA
811 1 8
Command Code
1
P
1
...
I2C Write Protocol
I2C Read Protocol
I2C Read Protocol — Combined Format
R
7
DataSlave AddressS
1
AAA
811 1 8
Data
1
P
1
...
W
7
DataSlave AddressS
1
ARA
811 1 8 11
Command Code S
1
A
Data AA
81 8
Data
1
P
1
...
Figure 13. I2C Protocols
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
14
r
r
Copyright E 2011, TAOS Inc. The LUMENOLOGY r Company
www.taosinc.com
Register Set
The device is controlled and monitored by data registers and a command register accessed through the serial
interface. These registers provide for a variety of control functions and can be read to determine results of the
ADC conversions. The register set is summarized in Table 1.
Table 1. Register Address
ADDRESS RESISTER NAME R/W REGISTER FUNCTION RESET VALUE
−− COMMAND W Specifies register address 0x00
0x00 ENABLE R/W Enables states and interrupts 0x00
0x02 PTIME R/W Proximity ADC time 0xFF
0x03 WTIME R/W Wait time 0xFF
0x08 PILTL R/W Proximity interrupt low threshold low byte 0x00
0x09 PILTH R/W Proximity interrupt low threshold high byte 0x00
0x0A PIHTL R/W Proximity interrupt high threshold low byte 0x00
0x0B PIHTH R/W Proximity interrupt high threshold high byte 0x00
0x0C PERS R/W Interrupt persistence filter 0x00
0x0D CONFIG R/W Configuration 0x00
0x0E PPCOUNT R/W Proximity pulse count 0x00
0x0F CONTROL R/W Control register 0x00
0x12 ID R Device ID ID
0x13 STATUS R Device status 0x00
0x18 PDATAL R Proximity ADC low data register 0x00
0x19 PDATAH R Proximity ADC high data register 0x00
The mechanics of accessing a specific register depends on the specific protocol used. See the section on I2C
protocols on the previous pages. In general, the COMMAND register is written first to specify the specific
control/status register for following read/write operations.
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
15
The LUMENOLOGY r Company r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
Command Register
The command registers specifies the address of the target register for future write and read operations.
Table 2. Command Register
6754
ADD
2310
COMMAND COMMAND TYPE − −
FIELD BITS DESCRIPTION
COMMAND 7 Select Command Register. Must write as 1 when addressing COMMAND register.
TYPE 6:5 Selects type of transaction to follow in subsequent data transfers:
FIELD VALUE DESCRIPTION
00 Repeated byte protocol transaction
01 Auto-increment protocol transaction
10 Reserved — Do not use
11 Special function — See description below
Transaction type 00 will repeatedly read the same register with each data access.
Transaction type 01 will provide an auto-increment function to read successive register bytes.
ADD 4:0 Address register/special function register. Depending on the transaction type, see above, this field either
specifies a special function command or selects the specific control-status-register for following write and
read transactions:
FIELD VALUE DESCRIPTION
00000 Normal — no action
00101 Proximity interrupt clear
Proximity Interrupt Clear clears any pending proximity interrupt. This special function is self clearing.
Enable Register (0x00)
The ENABLE register is used to power the device on/off, enable functions, and interrupts.
Table 3. Enable Register
6754
PON
2310
ENABLE Reserved Resv Reserved Address
0x00
PIEN WEN PEN
FIELD BITS DESCRIPTION
Reserved 7:6 Reserved. Write as 0.
PIEN 5 Proximity interrupt mask. When asserted, permits proximity interrupts to be generated.
Reserved 4 Reserved. Write as 0.
WEN 3 Wait Enable. This bit activates the wait feature. Writing a 1 activates the wait timer. Writing a 0 disables the
wait timer.
PEN 2:1 Proximity enable. These bits activate the proximity function. Writing a 11b enables proximity. Writing a 00b
disables proximity. The Wait Time register should be configured before asserting proximity enable.
PON 1, 20Power ON. This bit activates the internal oscillator to permit the timers and ADC channel to operate. Writing
a 1 activates the oscillator. Writing a 0 disables the oscillator.
NOTES: 1. See Power Management section for more information.
2. A minimum interval of 2.72 ms must pass after PON is asserted before proximity can be initiated. This required time is enforced
by the hardware in cases where the firmware does not provide it.
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
16
r
r
Copyright E 2011, TAOS Inc. The LUMENOLOGY r Company
www.taosinc.com
Proximity Time Control Register (0x02)
The proximity timing register controls the integration time of the proximity ADC in 2.72 ms increments. It is
recommended that this register be programmed to a value of 0xFF (1 integration cycle).
Table 4. Proximity Time Control Register
FIELD BITS DESCRIPTION
PTIME 7:0 VALUE INTEG_CYCLES TIME MAX COUNT
0xFF 1 2.72 ms 1023
Wait Time Register (0x03)
Wait time is set 2.72 ms increments unless the WLONG bit is asserted, in which case the wait times are 12×
longer. WTIME is programmed as a 2’s complement number.
Table 5. Wait Time Register
FIELD BITS DESCRIPTION
WTIME 7:0 REGISTER VALUE WAIT TIME TIME (WLONG = 0) TIME (WLONG = 1)
0xFF 1 2.72 ms 0.032 sec
0xB6 74 201 ms 2.4 sec
0x00 256 696 ms 8.3 sec
NOTE: The Wait Time register should be configured before PEN is asserted.
Proximity Interrupt Threshold Registers (0x08 − 0x0B)
The proximity interrupt threshold registers provide the values to be used as the high and low trigger points for
the comparison function for interrupt generation. If the value generated by proximity channel crosses below the
lower threshold specified, or above the higher threshold, an interrupt is signaled to the host processor.
Table 6. Proximity Interrupt Threshold Registers
REGISTER ADDRESS BITS DESCRIPTION
PILTL 0x08 7:0 Proximity low threshold lower byte
PILTH 0x09 7:0 Proximity low threshold upper byte
PIHTL 0x0A 7:0 Proximity high threshold lower byte
PIHTH 0x0B 7:0 Proximity high threshold upper byte
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
17
The LUMENOLOGY r Company r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
Persistence Register (0x0C)
The persistence register controls the filtering interrupt capabilities of the device. Configurable filtering is
provided to allow interrupts to be generated after each ADC integration cycle or if the ADC integration has
produced a result that is outside of the values specified by threshold register for some specified amount of time.
Table 7. Persistence Register
6754
Reserved
2310
PERS PPERS
Address
0x0C
FIELD BITS DESCRIPTION
PPERS 7:4 Proximity interrupt persistence. Controls rate of proximity interrupt to the host processor.
FIELD VALUE MEANING INTERRUPT PERSISTENCE FUNCTION
0000 −−− Every proximity cycle generates an interrupt
0001 1 1 proximity value out of range
0010 2 2 consecutive proximity values out of range
... ... ...
1111 15 15 consecutive proximity values out of range
Reserved 3:0 Default setting is 0x00.
Configuration Register (0x0D)
The configuration register sets the wait long time.
Table 8. Configuration Register
67542310
CONFIG Reserved WLONG Address
0x0D
Reserved
FIELD BITS DESCRIPTION
Reserved 7:2 Reserved. Write as 0.
WLONG 1 Wait Long. When asserted, the wait cycles are increased by a factor 12× from that programmed in the
WTIME register.
Reserved 0 Reserved. Write as 0.
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
18
r
r
Copyright E 2011, TAOS Inc. The LUMENOLOGY r Company
www.taosinc.com
Proximity Pulse Count Register (0x0E)
The proximity pulse count register sets the number of proximity pulses that will be transmitted. PPULSE defines
the number of pulses to be transmitted at a 62.5-kHz rate.
While the value can be programmed up to 255 pulses, the practical limit of the device is 32 pulses. It is
recommended that 32 or fewer pulses be used to achieve maximum signal-to-noise ratio.
Table 9. Proximity Pulse Count Register
67542310
PPULSE PPULSE Address
0x0E
FIELD BITS DESCRIPTION
PPULSE 7:0 Proximity Pulse Count. Specifies the number of proximity pulses to be generated.
Control Register (0x0F)
The Control register provides four bits of control to the analog block. These bits control the diode drive current
and diode selection functions.
Table 10. Control Register
67542310
CONTROL PDRIVE Resv Address
0x0F
PDIODE Reserved
FIELD BITS DESCRIPTION
PDRIVE 7:6 LED Drive Strength.
FIELD VALUE LED STRENGTH
00 100 mA
01 50 mA
10 25 mA
11 12.5 mA
PDIODE 5:4 Proximity Diode Select.
FIELD VALUE DIODE SELECTION
00 Reserved
01 Proximity uses the Channel 0 diode
10 Proximity uses the Channel 1 diode
11 Proximity uses both diodes
Reserved 3:0 Reserved. Write bits as 0.
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
19
The LUMENOLOGY r Company r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
ID Register (0x12)
The ID Register provides the value for the part number. The ID register is a read-only register.
Table 11. ID Register
67542310
ID ID Address
0x12
FIELD BITS DESCRIPTION
ID
7:0
Part number identification
0x00 = TSL26711 and TSL26715
ID 7:0 Part number identification 0x09 = TSL26713 and TSL26717
Status Register (0x13)
The Status Register provides the internal status of the device. This register is read only.
Table 12. Status Register
67542310
STATUS Reserved Resv Address
0x13
ReservedPINT
FIELD BIT DESCRIPTION
Reserved 7:6 Reserved.
PINT 5 Proximity Interrupt. Indicates that the device is asserting a proximity interrupt.
Reserved 4:0 Reserved.
Proximity Data Registers (0x18 − 0x19h)
Proximity data is stored as a 16-bit value. To ensure the data is read correctly, a two-byte I2C read transaction
should be utilized with auto increment protocol bits set in the command register. With this operation, when the
lower byte register is read, the upper eight bits are stored into a shadow register, which is read by a subsequent
read to the upper byte. The upper register will read the correct value even if the next ADC cycle ends between
the reading of the lower and upper registers.
Table 13. Proximity Data Registers
REGISTER ADDRESS BITS DESCRIPTION
PDATAL 0x18 7:0 Proximity data low byte
PDATAH 0x19 7:0 Proximity data high byte
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
20
r
r
Copyright E 2011, TAOS Inc. The LUMENOLOGY r Company
www.taosinc.com
APPLICATION INFORMATION: HARDWARE
LED Driver Pin with Proximity Detection
The application hardware circuit with proximity detection requires an LED connected as shown in Figure 14.
Vbat may be an independent power source. The 1-μF decoupling capacitors should be of the low-ESR type and
be placed as close as possible to the load and VDD to reduce noise. To maximize system performance, the use
of PCB power and ground planes are recommended. If mounted on a flexible circuit, the power and ground
traces back to the PCB should be sufficiently wide enough to have a low resistance, such as < 1Ω.
The I2C bus protocol was developed by Philips (now NXP). The pull-up resistor value (RP) is a function of the
I2C bus speed, the supply voltage, and the capacitive bus loading. Users should consult the NXP I2C design
specification (http://www.i2c−bus.org/references/) for assistance. With a lightly loaded bus running at 400 kbps
and VDD = 3 V, 1.5-kΩ resistors have been found to be viable.
TSL2671
VBUS VDD(digital)
1 mF
RPRP
SCL
SDA
RPI
INT
LDR
LED
1 mF
VDD(analog)
Figure 14. Application Hardware Circuit for Proximity Sensing with Internal LED Driver
The power supply connection — PCB routing and supply decoupling — has a significant effect on proximity
performance. Contact TAOS or see the application notes available at www.TAOSinc.com for power supply
guidance.
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
21
The LUMENOLOGY r Company r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
APPLICATION INFORMATION: HARDWARE
If the hardware application requires more than 100 mA of current to drive the LED, then an external transistor
should be used. Note, R2 should be sized adequately to bias the gate voltage given the LDR current mode
setting. See Figure 15.
TSL2671
VBUS VDD(digital)
1 mF
RPRP
SCL
SDA
RPI
INT
R1 LDR
LED
R2
1 mF
VDD(analog)
Figure 15. Application Hardware Circuit for Proximity Sensing with External LED Driver Using P-FET
Transistor
PCB Pad Layout
Suggested PCB pad layout guidelines for the Dual Flat No-Lead (FN) surface mount package are shown in
Figure 16.
400
2500
400
1000
1700
650
1000
650
Note: Pads can be
extended further if hand
soldering is needed.
NOTES: A. All linear dimensions are in micrometers.
B. This drawing is subject to change without notice.
Figure 16. Suggested FN Package PCB Layout
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
22
r
r
Copyright E 2011, TAOS Inc. The LUMENOLOGY r Company
www.taosinc.com
MECHANICAL DATA
PACKAGE FN Dual Flat No-Lead
203 8
6 SDA
5 INT
4 LDR
VDD 1
SCL 2
GND 3
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Lead Free
Pb
300
50
650
2000
75
2000 75
PIN 1
PIN 1
END VIEW
650 50
Seating Plane
PIN OUT
TOP VIEW
Photo-Active Area
750 150
300 50
650
Pin 1 Marker
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 20 μm unless otherwise noted.
B. The photodiode active area is 466 μm square and its center is 140 μm above and 20 μm to the right of the package center. The die
placement tolerance is ± 75 μm in any direction.
C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
E. This package contains no lead (Pb).
F. This drawing is subject to change without notice.
Figure 17. Package FN — Dual Flat No-Lead Packaging Configuration
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
23
The LUMENOLOGY r Company r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
MECHANICAL DATA
TOP VIEW
DETAIL A
2.18 0.05
Ao
0.254
0.02
5 Max
4.00
8.00
3.50 0.05
1.50
4.00
2.00 0.05
+ 0.30
− 0.10
1.75
B
B
AA
1.00
0.25
DETAIL B
2.18 0.05
Bo
5 Max
0.83 0.05
Ko
NOTES: A. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
B. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
C. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481−B 2001.
D. Each reel is 178 millimeters in diameter and contains 3500 parts.
E. TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B.
F. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
G. This drawing is subject to change without notice.
Figure 18. Package FN Carrier Tape
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
24
r
r
Copyright E 2011, TAOS Inc. The LUMENOLOGY r Company
www.taosinc.com
MANUFACTURING INFORMATION
The FN package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate.
The process, equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 14. Solder Reflow Profile
PARAMETER REFERENCE DEVICE
Average temperature gradient in preheating 2.5°C/sec
Soak time tsoak 2 to 3 minutes
Time above 217°C (T1) t1Max 60 sec
Time above 230°C (T2) t2Max 50 sec
Time above Tpeak −10°C (T3) t3Max 10 sec
Peak temperature in reflow Tpeak 260°C
Temperature gradient in cooling Max −5°C/sec
t3
t2
t1
tsoak
T3
T2
T1
Tpeak
Not to scale — for reference only
Time (sec)
Temperature (C)
Figure 19. Solder Reflow Profile Graph
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
25
The LUMENOLOGY r Company r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
MANUFACTURING INFORMATION
Moisture Sensitivity
Optical characteristics of the device can be adversely affected during the soldering process by the release and
vaporization of moisture that has been previously absorbed into the package. To ensure the package contains
the smallest amount of absorbed moisture possible, each device is dry-baked prior to being packed for shipping.
Devices are packed in a sealed aluminized envelope called a moisture barrier bag with silica gel to protect them
from ambient moisture during shipping, handling, and storage before use.
The Moisture Barrier Bags should be stored under the following conditions:
Temperature Range < 40°C
Relative Humidity < 90%
Total Time No longer than 12 months from the date code on the aluminized envelope if
unopened.
Rebaking of the reel will be required if the devices have been stored unopened for more than 12 months and
the Humidity Indicator Card shows the parts to be out of the allowable moisture region.
Opened reels should be used within 168 hours if exposed to the following conditions:
Temperature Range < 30°C
Relative Humidity < 60%
If rebaking is required, it should be done at 50°C for 12 hours.
The FN package has been assigned a moisture sensitivity level of MSL 3.
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
26
r
r
Copyright E 2011, TAOS Inc. The LUMENOLOGY r Company
www.taosinc.com
PRODUCTION DATA — information in this document is current at publication date. Products conform to
specifications in accordance with the terms of Texas Advanced Optoelectronic Solutions, Inc. standard
warranty. Production processing does not necessarily include testing of all parameters.
LEAD-FREE (Pb-FREE) and GREEN STATEMENT
Pb-Free (RoHS) TAOS’ terms Lead-Free or Pb-Free mean semiconductor products that are compatible with the current
RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous
materials. Where designed to be soldered at high temperatures, TAOS Pb-Free products are suitable for use in specified
lead-free processes.
Green (RoHS & no Sb/Br) TAOS defines Green to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and
Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
Important Information and Disclaimer The information provided in this statement represents TAOS’ knowledge and
belief as of the date that it is provided. TAOS bases its knowledge and belief on information provided by third parties,
and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate
information from third parties. TAOS has taken and continues to take reasonable steps to provide representative
and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and
chemicals. TAOS and TAOS suppliers consider certain information to be proprietary, and thus CAS numbers and other
limited information may not be available for release.
NOTICE
Texas Advanced Optoelectronic Solutions, Inc. (TAOS) reserves the right to make changes to the products contained in this
document to improve performance or for any other purpose, or to discontinue them without notice. Customers are advised
to contact TAOS to obtain the latest product information before placing orders or designing TAOS products into systems.
TAOS assumes no responsibility for the use of any products or circuits described in this document or customer product
design, conveys no license, either expressed or implied, under any patent or other right, and makes no representation that
the circuits are free of patent infringement. TAOS further makes no claim as to the suitability of its products for any particular
purpose, nor does TAOS assume any liability arising out of the use of any product or circuit, and specifically disclaims any
and all liability, including without limitation consequential or incidental damages.
TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS, INC. PRODUCTS ARE NOT DESIGNED OR INTENDED FOR
USE IN CRITICAL APPLICATIONS IN WHICH THE FAILURE OR MALFUNCTION OF THE TAOS PRODUCT MAY
RESULT IN PERSONAL INJURY OR DEATH. USE OF TAOS PRODUCTS IN LIFE SUPPORT SYSTEMS IS EXPRESSLY
UNAUTHORIZED AND ANY SUCH USE BY A CUSTOMER IS COMPLETELY AT THE CUSTOMER’S RISK.
LUMENOLOGY, TAOS, the TAOS logo, and Texas Advanced Optoelectronic Solutions are registered trademarks of Texas Advanced
Optoelectronic Solutions Incorporated.
