High Precision Thin Film Chip Resistors
± 0.05 %; ± 5 ppm/K
www.vishay.com For technical questions, contact: thinfilmchip@vishay.com Document Number: 28779
314 Revision: 12-Aug-10
TNPU e3
Vishay Draloric
TNPU e3 High Precision Thin Film Flat Chip Resistors
combine the proven reliability of TNPW e3 products with a
most advanced level of precision and stability. This unique
combination makes the product perfectly suited for all
applications with outstanding requirements towards size,
reliable precision and stability.
FEATURES
Low temperature coefficient and tight
tolerances (± 0.05 %; ± 5 ppm/K)
Superior moisture resistivity 0.25 % (85 °C;
56 days; 85 % RH)
Waste gas resistant
AEC-Q200 qualified
Compliant to RoHS directive 2002/95/EC
Find out more about Vishay’s Automotive Grade Product
requirements at: www.vishay.com/applications
APPLICATIONS
Industrial equipment
Telecommunication
Medical equipment
Instrumentation
Test and measuring equipment
Automotive
Notes
(1) Rated voltage . The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat
flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not
exceeded.
(2) Measuring conditions in accordance with EN 140401-801.
STANDARD ELECTRICAL SPECIFICATIONS
TNPU0603 e3 TNPU0805 e3 TNPU1206 e3
Metric size RR 1608M RR 2012M RR 3216M
Resistance range 100 Ω to 100 kΩ100 Ω to 332 kΩ100 Ω to 511 kΩ
Resistance tolerance ± 0.1 %; ± 0.05 %
Temperature coefficent ± 10 ppm/K; ± 5 ppm/K
Climatic category (LCT/UCT/days) 55/125/56 55/125/56 55/125/56
Rated dissipation, P70 (1) 0.1 W 0.125 W 0.25 W
Operating voltage, Umax. AC/DC 75 V 150 V 200 V
Maximum permissible film temperature 125 °C 125 °C 125 °C
Thermal resistance (2) 550 K/W 440 K/W 220 K/W
Max. resistance change at P70; |ΔR/R|
1000 h 0.05 % 0.05 % 0.05 %
8000 h 0.10 % 0.10 % 0.10 %
225 000 h 0.30 % 0.30 % 0.30 %
Insulation voltage:
Uins 1 min 100 V 200 V 300 V
Continuous 75 V 75 V 75 V
FITobserved 0.1 x 10-9/h 0.1 x 10-9/h 0.1 x 10-9/h
Weight/1000 pieces 2 g 5.5 g 10 g
P x R
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Revision: 12-Aug-10 315
TNPU e3
High Precision Thin Film Chip Resistors
± 0.05 %; ± 5 ppm/K Vishay Draloric
DIMENSIONS
Notes
Products can be ordered using either the PRODUCT DESCRIPTION or the PART NUMBER.
(1) Please refer to PACKAGING table.
SIZE DIMENSIONS
in millimeters
INCH METRIC L W H T1 T2
0603 1608 1.6 ± 0.10 0.85 ± 0.10 0.45 ± 0.10 0.3 ± 0.20
0805 2012 2.0 ± 0.15 1.25 ± 0.15 0.45 ± 0.10 0.4 ± 0.20
1206 3216 3.2 ± 0.15 1.6 ± 0.15 0.55 ± 0.10 0.5 ± 0.25
SOLDER PAD DIMENSIONS
in millimeters
SIZE REFLOW SOLDERING WAVE SOLDERING
INCH METRIC a b l a b l
0603 1608 0.5 0.9 1.0 0.9 0.9 1.0
0805 2012 0.7 1.3 1.2 0.9 1.3 1.3
1206 3216 0.9 1.7 2.0 1.1 1.7 2.3
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE TCR TOLERANCE RESISTANCE VALUE E-SERIES
TNPU0603 e3
± 10 ppm/K ± 0.05 %
100 Ω to 100 kΩ
E24 to E192
± 5 ppm/K ± 0.1 %
± 0.05 %
TNPU0805 e3
± 10 ppm/K ± 0.05 %
100 Ω to 332 kΩ
± 5 ppm/K ± 0.1 %
± 0.05 %
TNPU1206 e3
± 10 ppm/K ± 0.05 %
100 Ω to 511 kΩ
± 5 ppm/K ± 0.1 %
± 0.05 %
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: TNPU12061K32AZEA00
MODEL VALUE TOLERANCE TCR PACK AG I NG (1) SPECIAL
TNPU0603
TNPU0805
TNPU1206
R = Decimal
K = Thousand
M = Million
(4 digits)
B = ± 0.1 %
A = ± 0.05 %
Y = ± 10 ppm/K
Z = ± 5 ppm/K
EA
EN
Up to 2 digits
00 = Standard
Product Description: TNPU1206 1K32 0.05 % T-16 ET1 e3
TNPU1206 1K32 0.05 % T-16 ET1 e3
MODEL RESISTANCE
VALUE TOLERANCE TCR PACKAGING (1) LEAD (Pb)-FREE
TNPU0603
TNPU0805
TNPU1206
Examples:
1K32 = 1320 Ω
± 0.05 %
± 0.1 %
T-1 3 = ± 10 ppm/K
T- 1 6 = ± 5 ppm/K
ET1
E52
e3 = Pure tin
termination finish
TU120PN61K32AZEA00
www.vishay.com For technical questions, contact: thinfilmchip@vishay.com Document Number: 28779
316 Revision: 12-Aug-10
TNPU e3
Vishay Draloric High Precision Thin Film Chip Resistors
± 0.05 %; ± 5 ppm/K
DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high grade
AI2O3 ceramic substrate and conditioned to achieve the
desired temperature coefficient. Specially designed inner
contacts are deposited on both sides. A special laser is used
to achieve the target value by smoothly fine trimming the
resistive layer without damaging the ceramics. A further
conditioning is applied in order to stabilize the trimming
result. The resistor elements are covered by a protective
coating designed for electrical, mechanical and climatic
protection. The terminations receive a final pure tin on nickel
plating. The result of the determined production is verified by
an extensive testing procedure on 100 % of the individual
chip resistors. Only accepted products are laid directly into
the tape in accordance with IEC 60286-3 (3).
ASSEMBLY
The resistors are suitable for processing on automatic
SMD assembly systems. They are suitable for automatic
soldering using wave, reflow or vapour phase as shown in
IEC 61760-1. The encapsulation is resistant to all cleaning
solvents commonly used in the electronics industry,
including alcohols, esters and aqueous solutions. The
suitability of conformal coatings, if applied, shall be qualified
by appropriate means to ensure the long-term stability of the
whole system.
The resistors are RoHS compliant, the pure tin plating
provides compatibility with lead (Pb)-free and
lead-containing soldering processes. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
All products comply with the GADSL (1) and the
CEFIC-EECA-EICTA (2) list of legal restrictions on
hazardous substances. This includes full compliance with
the following directives:
2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)
2002/95/EC Restriction of the use of Hazardous
Substances Directive (RoHS)
2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
Solderability is specified for 2 years after production or
re-qualification. The permitted storage time is 20 years.
Notes
(1) Global Automotive Declarable Substance List, see www.gadsl.org.
(2) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation representing the information and communications technology and consumer electronics), see www.eicta.org issue
environment policy chemicals chemicals for electronics.
(3) The quoted IEC standards are also released as EN standards with the same number and identical contents.
PACKAGING
MODEL TAPE WIDTH
[mm]
PITCH
[mm]
REEL DIAMETER
[mm/inch]
PIECES PER
REEL
PACKAGING
CODE FOR
PRODUCT
DESCRIPTION
PACKAGING
CODE FOR PART
NUMBER
TYPE OF
CARRIER TAPE
TNPU0603 e3
TNPU0805 e3
TNPU1206 e3
8 4 180/7
1000 E52 EN
Paper
5000 ET1 EA
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Revision: 12-Aug-10 317
TNPU e3
High Precision Thin Film Chip Resistors
± 0.05 %; ± 5 ppm/K Vishay Draloric
TEST AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, generic specification (includes tests)
EN 140 400, sectional specification (includes schedule for
qualification approval)
EN 140 401-801, detail specification (includes schedule for
conformance inspection)
The following table contains only the most important tests.
For the full test schedule refer to the documents listed above.
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5202. The tests are carried out in
accordance with IEC 60068 and under standard atmospheric
conditions in accordance with IEC 60068-1, 5.3. Climatic
category LCT/UCT/56 (rated temperature range: Lower
category temperature, upper category temperature; damp
heat, long term, 56 days) is valid. Unless otherwise specified
the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
The components are mounted for testing on boards in
accordance with EN 60115-1, 4.31 unless otherwise
specified. The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140 401-801. However, some
additional tests and a number of improvements against those
minimum requirements have been included.
110
100
90
80
70
60
100 1K 10K 100K 1M
Non-Linearity
A y t i r a e n i L - n o N
3
B d n i
Resistance Value in Ω
TNPU0603 e3
TNPU1206 e3
TNPU0805 e3
40
1
100 1K 10K 100K 1M
Current Noise
Current Noise in
µV/V
Resistance Value in Ω
TNPU0805
e3
0.1
0.01
TNPU0603
e3
TNPU1206
e3
Derating
120
100
80
60
40
20
0
- 55 - 25 0 25 50 75 100 125 150 175
Ambient Temperature in °C
Rated Power in %
70
www.vishay.com For technical questions, contact: thinfilmchip@vishay.com Document Number: 28779
318 Revision: 12-Aug-10
TNPU e3
Vishay Draloric High Precision Thin Film Chip Resistors
± 0.05 %; ± 5 ppm/K
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
TEST METHOD TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE
Stability for product types:
TNPU0603 e3
TNPU0805 e3
TNPU1206 e3
4.5 - Resistance ± 0.1 %; ± 0.05 %
4.8.4.2 - Temperature
coefficient
At (20/- 55/20) °C and
(20/125/20) °C ± 10 ppm/K; ± 5 ppm/K
4.25.1 - Endurance at
70 °C
U= or
U = Umax.; whichever is the
less severe;
1.5 h “ON”; 0.5 h “OFF”;
70 °C; 1000 h ± (0.05 % R+0.01Ω)
70 °C; 8000 h ± (0.1 % R+0.02Ω)
4.25.3 -
Endurance at
upper
category
temperature
125 °C; 1000 h ± (0.05 % R+ 0.01 Ω)
4.24 78 (Cab) Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH ± (0.1 % R+ 0.01 Ω)
4.23 Climatic
sequence:
± (0.1 % R+ 0.02 Ω)
4.23.2 2 (Ba) Dry heat UCT; 16 h
4.23.3 30 (Db) Damp heat,
cyclic
55 °C; 24 h; > 90 % RH;
1 cycle
4.23.4 1 (Aa) Cold LCT; 2 h
4.23.5 13 (M) Low air
pressure 8.5kPa; 2h; 2 10 °C
4.23.6 30 (Db) Damp heat,
cyclic
55 °C; 5 days;
> 95 to 100 % RH; 5 cycles
4.23.7 - D.c. load
U= Umax.; 1 min
LCT = - 55 °C
UCT = 125 °C
- 1 (Aa) Cold - 55 °C; 2 h ± (0.05 % R+ 0.01 Ω)
4.19 14 (Na)
Rapid change
of
temperature
30 min at LCT and
30 min at UCT;
LCT = - 55 °C; UCT = 125 °C;
1000 cycles
± (0.1 % R+ 0.01 Ω)
4.13 - Short time
overload
U= 2.5 x or
U=2 x Umax.; whichever is
the less severe; 5 s
± (0.05 % R+ 0.01 Ω)
P70 x R
P70 x R
P70 x R
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Revision: 12-Aug-10 319
TNPU e3
High Precision Thin Film Chip Resistors
± 0.05 %; ± 5 ppm/K Vishay Draloric
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude 1.5 mm or
200 m/s2; 6 h
± (0.05 % R+0.01 Ω)
no visible damage
4.17.2 58 (Td) Solderability
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
Good tinning ( 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0,5 or SnAg3,5;
non-activated flux
(235 ± 3) °C; (2 ± 0.2) s
4.18.2 58 (Td) Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s ± (0.02 % R+0.01 Ω)
4.29 45 (XA)
Component
solvent
resistance
Isopropyl alcohol + 50 °C;
method 2 No visible damage
4.32 21 (Ue3)Shear
(adhesion)
RR 1005M and RR 1608M;
9N
No visible damage
RR 2012M and RR 3216M;
45 N
4.33 21 (Ue1)Substrate
bending Depth 2 mm, 3 times ± (0.05 % R+0.01 Ω)
no visible damage, no open circuit in bent position
4.7 - Voltage proof URMS =Uins; 60 ± 5 s No flashover or breakdown
4.35 - Flammability IEC 60695-11-5,
needle flame test; 10 s No burning after 30 s
- Damp heat (85 ± 5) °C; 56 days
(85 ± 5) % RH ± (0.25 R + 0.05 Ω)
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
TEST METHOD TEST PROCEDURE REQUIREMENTS
PERMISSIBLE CHANGE
Stability for product types:
TNPU0603 e3
TNPU0805 e3
TNPU1206 e3
Legal Disclaimer Notice
www.vishay.com Vishay
Revision: 12-Mar-12 1Document Number: 91000
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.