PC755CVGU300LE - Atmel Corporation

2138D–HIREL–06/03

Features

• 18.1SPECint95, Estimates 12.3 SPECfp95 at 400 MHz (PC755)

• 15.7SPECint95, 9SPECfp95 at 350 MHz (PC745)

• 733 MIPS at 400 MHz (PC755) at 641 MIPS at 350 MHz (PC745)

• Selectable Bus Clock (12 CPU Bus Dividers up to 10x)

• PD Typical 6.4W at 400 MHz, Full Operating Conditions

• Nap, Doze and Sleep Modes for Power Savings

• Superscalar (3 Instructions per Clock Cycle) Two Instruction + Branch

• 4 Beta Byte Virtual Memory, 4-GByte of Physical Memory

• 64-bit Data and 32-bit Address Bus Interface

• 32-KB Instruction and Data Cache

• Six Independent Execution Units

• Write-back and Write-through Operations

• fINT max = 400 MHz (TBC)

• fBUS max = 100 MHz

• Voltage I/O 2.5V/3.3V; Voltage Int 2.0V

Description

The PC755 and PC745 PowerPC® microprocessors are high-performance, low-

power, 32-bit implementations of the PowerPC Reduced Instruction Set Computer

(RISC) architecture, especially enhanced for embedded applications.

The PC755 and PC745 microprocessors differ only in that the PC755 features an

enhanced, dedicated L2 cache interface with on-chip L2 tags. The PC755 is a drop-in

replacement for the award winning PowerPC 750™ microprocessor and is footprint

and user software code compatible with the MPC7 400 microprocessor with AltiVec™

technology. The PC745 is a drop-in replacement for the PowerPC 740™ microproces-

sor and is also footprint and user software code compatible with the PowerPC 603e™

microprocessor. PC755/745 microprocessors provide on-chip debug support and are

fully JTAG-compliant.

The PC745 microprocessor is pin co mpatible with the TSPC603e family.

ZF suffix

PBGA255

Flip-Chip Plastic Ball Grid Array

ZF suffix

PBGA360

Flip-Chip Plastic Ball Grid Array

G suffix

CBGA360

Ceramic Ball Grid Array

GH suffix

HITCE 360

Ceramic Ball Grid Array

GS suffix

CI-CGA360

Ceramic Ball Grid Array with

Solder Column Interposer (SCI)

PowerPC

755/745 RISC

Microprocessor

PC755/745

Preliminary

β-site

Rev. 2138D–HIREL–06/03

2PC755/745 2138D–HIREL–06/03

Screening

This product is manufactured in full compliance with:

• CBGA + CI-CGA + FC-PBGA up screenings based upon Atmel standards

• HiTCE

• Full military temperature range (Tj = -55°C,+125°C)

industrial temperature range (Tj = -40°C,+110°C)

General Description

Simplified Block Diagram The PC755 is targeted for low power systems and supports power management fea-

tures such as doze, nap, sleep, and dynamic power management. The PC755 consists

of a processor core and an internal L2 Tag combined with a dedicated L2 cache inter-

face and a 60x bus.

Figure 1. PC755 Block Diagram

Additional Features

¥ Time Base Counter/Decrementer

¥ Clock Multiplier

¥ JTAG/COP Interface

¥ Thermal/Power Management

¥ Performance Monitor

Fetcher Branch Processing

BTIC

64-Entry

+ x Ö FPSCR

CR FPSCR

L2CR

CTR

BHT

Data MMU

Instruction MMU

Not in the PC745

+ x Ö

Instruction Unit

Unit

Instruction Queue

(6-Word)

2 Instructions

Reservation Station Reservation Station Reservation Station

Integer Unit 1 System Register

Unit

Dispatch Unit 64-Bit

(2 Instructions)

SRs

ITLB

(Shadow) IBAT

Array 32-Kbyte

I Cache

Tags

128-Bit

(4 Instructions)

Reservation Station

32-Bit

Floating-Point

Unit

Rename Buffers

(6)

FPR File

32-Bit 64-Bit 64-Bit

Reservation Station

(2-Entry)

Load/Store Unit

(EA Calculation)

Store Queue

GPR File

Rename Buffers

(6)

32-Bit

SRs

(Original)

DTLB

DBAT

Array

64-Bit

Completion Unit

Reorder Buffer

(6-Entry)

Tags 32-Kbyte

D Cache

60x Bus Interface Unit

Instruction Fetch Queue

L1 Castout Queue

Data Load Queue L2 Controller

L2 Tags

L2 Bus Interface

Unit

L2 Castout Queue

32-Bit Address Bus

32-/64-Bit Data Bus

17-Bit L2 Address Bus

64-Bit L2 Data Bus

Integer Unit 2

PC755/745

2138D–HIREL–06/03

General Parameters The following list provides a summary of the general parameters of the PC755:

Features This section summarizes featur es of the PC755’s implementation of the PowerPC archi-

tecture. Major features of the PC755 are as follows:

• Branch Processing Unit

– Four instructions fetched per clock

– One branch processed per cycle (plus resolving 2 speculations)

– Up to 1 speculative stream in execution, 1 additional speculative stream in

fetch

– 512-entry branch history table (BHT) for dynamic prediction

– 64-entry, 4-way set associative Branch Target Instruction Cache (BTIC) for

eliminating branch delay slots

• Dispatch Unit

– Full hardware detection of dependencies (resolved in the execution units)

– Dispatch two instructions to six independent units (system, branch,

load/store, fixed-point unit 1, fixed- point unit 2, floating-point)

– Serialization control (predispatch, postdispatch, execu tion serialization)

• Decode

– Register file access

– Forwarding control

– Partial instruction decode

• Completion

– 6 entry completion buffer

– Instruction tracking and peak completion of two instructions per cycle

– Completion of instructions in program order while supporting out-of-order

instruction execution, completion serialization and all instruction flow

changes

• Fixed Point Units (FXUs) that share 32 GPRs for Intege r Operands

– Fixed Point Unit 1 (FXU1)-multiply, divide, shift, rotate, arithmetic, logical

– Fixed Point Unit 2 (FXU2)-shift, rotate, arithmetic, logical

Technology 0.22 µm CMOS, six-layer metal

Die size 6.61 mm x 7.73 mm (51 mm2)

Transistor count 6.75 million

Logic design Fully-static Packages

PC745 Surface mount 255 Plastic Ball Grid Array (PBGA)

PC755 Surface mount 360 Plastic Ball Grid Array (PBGA)

Surface mount 360 Ceramic Ball Grid Array (CI-CGA, CBGA,

HiTCE)

Core power supply 2V ± 100 mV DC (nominal; some parts support core voltages

down to 1.8V; see Table 5 for recommended operating

conditions)

I/O power supply 2.5V ± 100 mV DC or 3.3V ± 165 mV DC (input threshol ds are

configuration pin selectable)

4PC755/745 2138D–HIREL–06/03

– Single-cycle arithmetic, shifts, rotates, logical

– Multiply and divide support (multi-cycle)

– Early out multiply

• Floating-point Unit and a 32-entry FPR File

– Support for IEEE-754 standard single and double precision floating point

arithmetic

– Hardware support for divide

– Hardware support for denormalized numbers

– Single-entry reservation station

– Supports non-IEEE mode for time-critical operations

• System Unit

– Executes CR logical instructions and miscellaneous system instructions

– Special register transfer instructions

• Load/Store Unit

– One cycle load or store cache access (byte, half-word, wo rd, double-word)

– Effective address generation

– Hits under misses (one outstanding miss)

– Single-cycle unaligned access within double word boundary

– Alignment, zero padding, sign extend for integer register file

– Floating point internal format conversion (alignment, normali zation)

– Sequencing for loa d/store multiples and string operations

– Store gath er in g

– Cache and TLB instructions

– Big and Little-endian byte addressing supported

– Misaligned Little-endian supported

– Level 1 Cache stru cture

– 32K, 32 bytes line, 8-way set associative instruction cache (iL1)

– 32K, 32 bytes line, 8-way set associative data cache (dL1)

– Cache locking for both instruction and data caches, selectable by group of

ways

– Single-cycle cache access

– Pseudo least-recently used (PLRU) replacement

– Copy-back or Write Through data cache (on a page per page basis)

– Supports all PowerPC memory coherency modes

– Non-Blocking instruction and data cache (one outstanding miss under hits)

– No snooping of inst ruction cache

• Level 2 (L2) Cache Interface (not implemented on PC745)

– Internal L2 cache controller and tags; external data SRAMs

– 256K, 512K, and 1-Mbyte 2-way set associative L2 cach e support

– Copyback or write-through data cache (on a page basis, or for all L2)

– Instruction-only mode and data-only mode.

– 64 bytes (256K/512K) or 128 bytes (1M) sectored line size

PC755/745

2138D–HIREL–06/03

– Supports flow through (register-buffer) synchronous burst SRAMs, pipelined

(register-re gister) synchron ous burst SRAMs (3-1-1 -1 or strobeless 4-1 -1-1)

and pipelined (register-r egister) late-write synchronous burst SRAMs

– L2 configurable to direct mapped SRAM interface or split cache/direct

mapped or private memory

– Core-to-L2 frequency divisors of 1, 1.5, 2, 2.5, and 3 suppo rted

– 64-bit data bus

– Selectable interface voltages of 2.5V and 3.3V

– Parity checking on both L2 address and data

• Memory Management Unit

– 128 entry, 2-way set associat ive instruction TLB

– 128 entry, 2-way set associative data TLB

– Hardwar e re loa d for TL Bs

– Hardware or optional software tablewalk support

– 8 instruction BATs and 8 data BATs

– 8 SPRGs, for assistance with software tablewalks

– Virtual memory support for up to 4 hexabytes (252) of virtual memory

– Real memory support for up to 4 gigabytes (232) of physical memory

• Bus Interface

– Compatible with 60X processor interface

– 32-bit address bus

– 64-bit data bu s, 32 - bit mo de se lect ab le

– Bus-to-core frequency multipliers of 2x, 3x, 3.5x, 4x, 4.5x, 5x, 5.5x, 6x, 6.5x,

7x, 7.5x, 8x, 10 x su pported

– Selectable interface voltages of 2.5V and 3.3V.

– Parity checking on both addr ess and data busses

• Power Management

– Low-power design with thermal requirements very similar to PC740/750.

– Selectable interface voltage of 1.8V/2.0V can redu ce power in o utput buffe rs

(compared to 3.3V)

– Three static power saving modes: doze, nap, and sleep

– Dynamic power management

• Testability

– LSSD scan design

– IEEE 1149.1 JTAG interface

• Integrated Thermal Ma nagement Assist Unit

– One-ship thermal sensor and control logic

– Thermal Management Interrupt for software regulation of junction

temperature

6PC755/745 2138D–HIREL–06/03

Pin Assignments Figure 2 (in part A) shows the pinout of the PC745, 255PBGA pack age as viewed from

the top surface. Part B shows the side p rofile of the PBGA package to indicate the direc-

tion of the top surface view.

Figure 2. Pinout of the PC745, 255 PBGA Package as Viewed from the Top Surface

12345678 91011121314151

Not to Scale

View Die

Substrate Assembly

Encapsulant

Part B

Part A

PC755/745

2138D–HIREL–06/03

Figure 3 (in p art A) shows the pinout of the PC75 5, 360 PBGA packa ges as viewed fro m

the top surface. Part B shows the side p rofile of the PBGA package to indicate the direc-

tion of the top surface view.

Figure 3. Pinout of the PC755, 360 PBG A, CBGA and CI-CGA Packages as Viewed

from the Top Surface

1234567891011121314151

Not to Scale

17 18 19

View Die

Substrate Assembly

Encapsulant

Part B

Part A

8PC755/745 2138D–HIREL–06/03

Pinout Listings Table 1 provides the pinout listing for the PC745, 255 PBGA package .

Table 1. Pinout Listing for the PC745, 255 PBGA Package

Signal Name Pin Number Active I/O

I/F Voltages Supported(1)

1.8V/2.0V 3.3V

A[0-31] C16, E4, D13, F2, D14, G1, D15, E2, D16, D4, E13, G2,

E15, H1, E16, H2, F13, J1, F14, J2, F1 5, H3, F16, F4, G13,

K1, G15, K2, H16, M1, J15, P1

High I/O – –

AACK L2 Low Input – –

ABB K4 Low I/O – –

AP[0-3] C1, B4, B3, B2 High I/O – –

ARTRY J4 Low I/O – –

AVDD A10 – – 2V 2V

BG L1 Low Input – –

BR B6 Low Output – –

BVSEL(3)(4)(5) B1 High Input GND 3.3V

CI E1 Low Output – –

CKSTP_IN D8 Low Input – –

CKSTP_OUT A6 Low Output – –

CLK_OUT D7 –Output – –

DBB J14 Low I/O – –

DBG N1 Low Input – –

DBDIS H15 Low Input – –

DBWO G4 Low Input – –

DH[0-31] P14, T16, R15, T15, R13, R12, P11, N11, R11, T12, T11,

R10, P9, N9, T10, R9, T9, P8, N8, R8, T8, N7, R7, T7, P6,

N6, R6, T6, R5, N5, T5, T4

High I/O – –

DL[0-31] K13, K15, K16, L16, L15, L13, L14, M16, M15, M13, N16,

N15, N13, N14, P16, P15, R16, R14, T14, N10, P13, N12,

T13, P3, N3, N4, R3, T1 , T2, P4, T3, R4

High I/O – –

DP[0-7] M2, L3, N2, L4, R1, P2, M4, R2 High I/O – –

DRTRY G16 Low Input – –

GBL F1 Low I/O – –

GND C5, C12, E3, E6, E8, E9, E11, E14, F5, F7, F10, F12, G6,

G8, G9, G11, H5, H7, H10, H12, J5, J7, J10, J12, K6, K8,

K9, K11, L5, L7, L10, L12, M3, M6, M8, M9, M11, M14, P5,

P12

HRESET A7 Low Input – –

INT B15 Low Input – –

L1_TSTCLK(2) D11 High Input – –

L2_TSTCLK(2) D12 High Input – –

LSSD_MODE(2) B10 Low Input –-–

PC755/745

2138D–HIREL–06/03

Notes: 1. OVDD supplies power to the processor bus, JTAG, and all control signals and VDD supplies power to the processo r core and

the PLL (after filtering to become AVDD). These columns serve as a reference for the nominal voltage supported on a given

signal as selected by the BVSEL pin configuration of Table 4 and the voltage supplied. For actual recommended value of VIN

or supply voltages see Table 3.

2. These are test signals for factory use only and must be pulled up to OVDD for normal machine operation.

3. To allow for future I/O voltage changes, provide the option to connect BVSEL independently to either OVDD (selects 3.3V) or

to OGND (selects 1.8V/2.0V).

4. Uses one of 15 existing no-connects in PC745’s 255-BGA package.

5. Internal pull up on die .

6. Internally tied to GND in the PC745 255-BGA package to indicate to the power supply that a low-voltage processor is

present. This signal is not a power supply input.

MCP C13 Low Input – –

NC (No-

Connect) B7, B8, C3, C6, C8, D5, D6, H4, J16, A4, A5, A2, A3, B5 – – – –

OVDD C7, E5, E7, E10, E12, G3, G5, G12, G14, K3, K5, K12, K14,

M5, M7, M10, M12, P7, P10 – – 1.8V/2.0V 3.3V

PLL_CFG[0-3] A8, B9, A9, D9 High Input – –

QACK D3 Low Input – –

QREQ J3 Low Output – –

RSRV D1 Low Output – –

SMI A16 Low Input – –

SRESET B14 Low Input – –

SYSCLK C9 –Input – –

TA H14 Low Input – –

TBEN C2 High Input – –

TBST A14 Low I/O – –

TCK C11 High Input – –

TDI(5) A11 High Input – –

TDO A12 High Output – –

TEA H13 Low Input – –

TLBISYNC C4 Low Input – –

TMS(5) B11 High Input – –

TRST(5) C10 Low Input – –

TS J13 Low I/O – –

TSIZ[0-2] A13, D10, B12 High Output – –

TT[0-4] B13, A15, B16, C14, C15 High I/O – –

WT D2 Low Output – –

VDD 2 F6, F8, F9, F11, G7, G10, H6, H8, H9, H11, J6, J8, J9, J11,

K7, K10, L6, L8, L9, L11 – – 2V 2V

VOLTDET(6) F3 High Output – –

Table 1. Pinout Listing for the PC745, 255 PBGA Package (Continued)

Signal Name Pin Number Active I/O

I/F Voltages Supported(1)

1.8V/2.0V 3.3V

10 PC755/745 2138D–HIREL–06/03

Table 2 provides the pinout listing for the PC755, 360 PBGA, CBGA and CI-CGA + HiTCE

Table 2. Pinout Listing for the PC755, 360 PBGA, CBGA and CI-CGA Packages + HiTCE(8)

Signal Name Pin Number Active I/O

I/F Voltages

Supported(1)

1.8V/2.0V 3.3V

A[0-31] A13, D2, H11, C1, B13, F2, C13, E5, D13, G7, F12, G3, G6, H2,

E2, L3, G5, L4, G4, J4, H7, E1, G2 , F3, J7, M3, H3, J2, J6, K3, K2,

High I/O – –

AACK N3 Low Input – –

ABB L7 Low I/O – –

AP[0-3] C4, C5, C6, C7 High I/O – –

ARTRY L6 Low I/O – –

AVDD A8 - - 2V 2V

BG H1 Low Input – –

BR E7 Low Output – –

BVSEL(3)(5)(6) W1 High Input GND 3.3V

CI C2 Low Output – –

CKSTP_IN B8 Low Input – –

CKSTP_OUT D7 Low Output – –

CLK_OUT E3 –Output – –

DBB K5 Low I/O – –

DBDIS G1 Low Input – –

DBG K1 Low Input – –

DBWO D1 Low Input – –

DH[0-31] W12, W11, V11, T9, W10, U9, U10, M11, M9, P8, W7, P9, W9,

R10, W6, V7, V6, U8, V9, T7, U7, R7, U6, W5, U5, W4, P7, V5, V4,

W3, U4, R5

High I/O – –

DL[0-31] M6, P3, N4, N5, R3, M7, T2, N6, U2, N7, P11, V13, U12, P12, T13,

W13, U13, V10, W8, T11, U11, V12, V8, T1, P1, V1, U1, N1, R2,

V3, U3, W2

High I/O – –

DP[0-7] L1, P2, M2, V2, M1, N2, T3, R1 High I/O – –

DRTRY H6 Low Input – –

GBL B1 Low I/O – –

GND D10, D14, D16, D4, D6, E12, E8, F4, F6, F10, F14, F16, G9, G11,

H5, H8, H10, H12, H15, J9, J11, K4, K6, K8, K10, K12, K14, K16,

L9, L11, M5, M8, M10, M12, M15, N9, N11, P4, P6, P10, P14, P16,

R8, R12, T4, T6, T10, T14, T16

– – GND GND

HRESET B6 Low Input – –

INT C11 Low Input – –

L1_TSTCLK(2) F8 High Input – –

L2ADDR[0-16] L17, L18, L19, M19, K18, K17, K15, J19, J18, J17, J16, H18, H17,

J14, J13, H19, G18 High Output – –

PC755/745

2138D–HIREL–06/03

L2AVDD L13 – – 2V 2V

L2CE P17 Low Output – –

L2CLKOUTA N15 –Output – –

L2CLKOUTB L16 –Output – –

L2DATA[0-63] U14, R13, W14, W15, V15, U15, W16, V16, W17, V17, U17, W18,

V18, U18, V19, U19, T18, T17, R19, R18, R17, R15, P19, P18,

P13, N14, N13, N19, N17, M17, M13, M18, H13, G19, G16, G1 5,

G14, G13, F19, F18, F13, E19, E18, E17, E15, D19, D18, D17,

C18, C17, B19, B18, B17, A18, A17, A16, B16, C16, A14, A15,

C15, B14, C14, E13

High I/O – –

L2DP[0-7] V14, U16, T19, N18, H14, F17, C19, B15 High I/O – –

L2OVDD D15, E14, E16, H16, J15, L15, M16, P15, R14, R16, T15, F15 – – 1.8V/2V 3.3V

L2SYNC_IN L14 –Input – –

L2SYNC_OUT M14 –Output – –

L2_TSTCLK(2) F7 High Input – –

L2VSEL(1)(3)(5)(6) A19 High Input GND 3.3V

L2WE N16 Low Output – –

L2ZZ G17 High Output – –

LSSD_MODE(2) F9 Low Input – –

MCP B11 Low Input – –

NC (No-Connect) B3, B4, B5, W19, K9, K114, K194– – – –

OVDD D5, D8, D12, E4, E6, E9, E11, F5, H4, J5, L5 , M4, P5, R4, R6, R9,

R11, T5, T8, T12 – – 1.8V/2V 3.3V

PLL_CFG[0-3] A4, A5, A6, A7 High Input – –

QACK B2 Low Input – –

QREQ J3 Low Output – –

RSRV D3 Low Output – –

SMI A12 Low Input – –

SRESET E10 Low Input – –

SYSCLK H9 –Input – –

TA F1 Low Input – –

TBEN A2 High Input – –

TBST A11 Low I/O – –

TCK B10 High Input – –

TDI(6) B7 High Input – –

TDO D9 High Output – –

Table 2. Pinout Listing for the PC755, 360 PBGA, CBGA and CI-CGA Packages + HiTCE(8) (Continued)

Signal Name Pin Number Active I/O

I/F Voltages

Supported(1)

1.8V/2.0V 3.3V

12 PC755/745 2138D–HIREL–06/03

Notes: 1. OVDD supplies power to the proce ssor bus, JTAG, and all control signals except the L2 cache co ntrols (L2CE, L2WE, and

L2ZZ); L2OVDD supplies power to the L2 cache interface (L2ADDR[0-16], L2DATA[0-63], L2DP[0-7] and L2SYNC-OUT)

and the L2 control signals; and VDD supplies power to the processor core and the PLL and DLL (after filtering to become

AVDD and L2AVDD respectively). These columns serve as a reference for the nominal voltage supported on a given signal as

selected by the BVSEL/L2VSEL pin configurations of Table 4 and the voltage supplied. For actual recommended value of

VIN or supply voltages see Table 5.

2. These are test signals for factory use only and must be pulled up to OVDD for normal machine operation.

3. To allow for future I/O voltage changes, provide the option to connect BVSEL and L2VSEL independently to either OVDD

(selects 3.3V) or to OGND (selects 1.8V/2.0V).

4. These pins are reserved for potential future use as additional L2 address pins.

5. Uses one of 9 existing no-connects in PC750’s 360-BGA package.

6. Internal pull up on die .

7. Internally tied to L2OVDD in the PC755 360-BGA package to indi cate the power present at the L 2 cache inte rface. This sig-

nal is not a power supply input.

8. This is different from the PC745 255-BGA package.

TEA J1 Low Input – –

TLBISYNC A3 Low Input – –

TMS(6) C8 High Input – –

TRST(6) A10 Low Input – –

TS K7 Low I/O – –

TSIZ[0-2] A9, B9, C9 High Output – –

TT[0-4] C10, D11, B12, C12, F11 High I/O – –

WT C3 Low Output – –

VDD G8, G10, G12, J8, J10, J12, L8, L10, L12, N8, N10, N12 – – 2V 2V

VOLTDET(7) K13 High Output – –

Table 2. Pinout Listing for the PC755, 360 PBGA, CBGA and CI-CGA Packages + HiTCE(8) (Continued)

Signal Name Pin Number Active I/O

I/F Voltages

Supported(1)

1.8V/2.0V 3.3V

PC755/745

2138D–HIREL–06/03

Signal Description

Figure 4. PC755 Microprocessor Signal Groups

ABB

TT[0-4]

AP[0-3]

TBST

TS1Z[0-2]

GBL

AACK

ARTRY

DBG

DBWO

DBB

L2ADDR [16-0]

L2DAT A [0-63]

L2DP [0-7]

L2CLK-OUT [A-B]

L2WE

A[0-31] L2SYNC_OUT

L2SYNC_IN

INT

SMI

MCP

HRESET

CKSTP_IN

CKSTP_OUT

SYSCLK,

PLL_CFG [0-3]

Factory Test

JTAG:COP

ADDRESS

ARBITRATION

ADDRESS

START

ADDRESS

BUS

TRANSFER

ATTRIBUTE

ADDRESS

TERMINATION

DATA

ARBITRATION

L2 CACHE

L2 VSEL

ADDRESS/

DATA

L2 CACHE

CLOCK/CONTROL

INTERRUPTS

RESET

CLOCK

CONTROL

TEST INTERFACE

D[0-63]

DATA

TRANSFER D[P0-7]

DBDIS

DATA

TERMINATION DRTRY

TEA

PC755B

L2AV

L2V

SRESET

RSRV

TBEN

TLBISYNC

QREQ

QACK

PROCESSOR

STATUS

CONTROL

CLK_OUT

L2CE

L2ZZ

Not supported in the PC745B

GND

OVDD

VOLTDET

14 PC755/745 2138D–HIREL–06/03

Detailed

Specification

Scope This drawing describes the specific requirements for the microprocessor PC7 55, in com-

pliance with Atmel Grenoble standard screening.

Applicable Documents 1) MIL-STD-883: Test methods and procedures for electronics.

2) MIL-PRF-38535 appendix A: General specifications for microcircuits.

Requirements

General The microcircuits are in accordance with the applicable documents and as specified

herein.

Design and Construction

Terminal Connections Depending on the package, the terminal connecti ons is shown in Table 1, Table 2 and

Figure 4.

Absolute Maximum Rating

Notes: 1. Functional and tested operating conditions are given in Table 5. Absolute maximum ratings are stress ratings only, and func-

tional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause

permanent damage to the device.

2. Caution: VIN must not exceed OVDD or L2OVDD by more than 0.3V at any time including during power-on reset.

3. Caution: L2OVDD/OVDD must not exceed VDD/AVDD/L2AVDD by more than 1.6V during normal operation. During power-on

reset and power-down sequences, L2OVDD/OVDD may exceed VDD/AVDD/L2AVDD by up to 3.3V for u p to 20 ms, or by 2.5V

for up to 40 ms. Excursions beyond 3.3V or 40 ms are not supported.

4. Caution: VDD/AVDD/L2AVDD must not exceed L2OVDD/OVDD by more than 0.4V during normal operation. During power-on

reset and power-down sequences, VDD/AVDD/L2AVDD may exceed L2OVDD/OVDD by up to 1.0 V for up to 20 ms, or by 0.7V

for up to 40 ms. Excursions beyond 1.0V or 40 ms are not supported.

5. This is a DC specifications only. VIN may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure

Table 3. Absolute Maximum Ratings(1)

Characteristic Symbol Maximum Value Unit

Core supply voltage(4) VDD -0.3 to 2.5 V

PLL supply voltage(4) AVDD -0.3 to 2.5 V

L2 DLL supply voltage(4) L2AVDD -0.3 to 2.5 V

Processor bus supply voltage(3) OVDD -0.3 to 3.6 V

L2 bus supply voltage(3) L2OVDD -0.3 to 3.6 V

Input voltage Processor bus(2)(5) Vin -0.3 to OVDD + 0.3V V

L2 Bus(2)(5) Vin -0.3 to L2OVDD + 0.3V V

JTAG Signals Vin -0.3 to 3.6 V

Storage temperature range Tstg -65 to 150 °C

Rework Temperature Trwk 220 °C

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2138D–HIREL–06/03

Figure 5 shows the allowable undersh oot and overshoot voltage on the PC755 and

PC745.

Figure 5. Overshoot/Undershoot Voltage

The PC755 provides several I/O volta ges to suppo rt bo th compatibili ty with existing sys-

tems and migration to future systems. The PC755 co re voltage must always be prov ided

at nominal 2.0V (see Table 5 for actual recommended core voltage). Volta ge to the L2

I/Os and Processor Interface I/Os are provided through separate sets of supply pins and

may be provided at the voltages shown in Table 4. The input voltage threshold for each

bus is selected by sampling the state of the voltage select pins BVSEL and L2VSEL dur-

ing operation. These signals must remain stable during part operation and cannot

change. The output voltage will swing from GND to the maximum voltage applie d to the

OVDD or L2OVDD power pins.

Table 4 describes the input threshold voltage setting.

Notes: 1. Caution: The input threshold selection must agree with the OVDD/L2OVDD voltages supplied.

2. The input threshold settings above are different for all revisions prior to Rev. 2.8 (Rev. E). For more information, contact your

local Atmel sales office.

(L2) OVDD +20%

(L2) OVDD +5%

(L2) OVDD

Gnd - 1.0V

Gnd - 0.3V

Gnd

VIH

Not to exceed 10%

of tSYSCLK

VIL

Table 4. Input Threshol d Volt ag e Se ttin g

Part Revision BVSEL Signal Processor Bus Interface Voltage L2VSEL Signal L2 Bus Interface Voltage

E 0 Not Available 0Not Available

12.5V/3.3V 12.5V/3.3V

16 PC755/745 2138D–HIREL–06/03
Notes: 1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not
guaranteed.
2. Revisions prior to Rev. 2.8 (Rev. E) offered differ en t I/O voltage support.
3. 2.0V nominal.
4. 2.5V nominal.
5. 3.3V nominal.
Thermal Characteristics
Package Characteristics Table 6 provides the package thermal ch aracteristics for the PC755.
Notes: 1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) tempera-
ture, ambient temperature, air flow, power dissipati on of other components on the board, and board thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single  layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
Table 5.  Recommended Operating Conditions(1)
Recommended Value
Unit300 MHz, 350 MHz 400 MHz
Characteristic Symbol Min Max Min Max
Core supply voltage(3) VDD 1.80 2.10 1.90 2.10 V
PLL supply voltage(3) AVDD 1.80 2.10 1.90 2.10 V
L2 DLL supply voltage(3) L2AVDD 1.80 2.10 1.90 2.10 V
Processor bus supply voltage(2)(4)(5) BVSEL = 1 OVDD 2.375 2.625 2.375 2.625 V
3.135 3.465 3.135 3.465 V
L2 bus supply voltage(2)(4)(5) L2VSEL = 1 L2OVDD 2.375 2.625 2.375 2.625 V
3.135 3.465 3.135 3.465 V
Input voltage Processor bus Vin GND OVDD GND OVDD V
L2 Bus Vin GND L2OVDD GND L2OVDD V
JTAG Signals Vin GND OVDD GND OVDD V
Die-juncti on temperat ure Military temperature range Tj-55 125 -55 125 °C
Industrial temperature Tj-40 110 -40 110 °C
Table 6.  Package Thermal Characteristics
Characteristic Symbol
Value
Unit
PC755 
CBGA PC755 
PBGA PC745 
PBGA
Junction-to-ambient thermal resistance , natural convection(1)(2) RθJA 24 31 34 °C/W
Junction-to-ambient thermal resistanc e, natural convection, four-layer 
(2s2p) board(1)(3) RθJMA 17 25 26 °C/W
Junction-to-ambient thermal resistance,  200 ft./min. airflow, single-layer 
(1s) board(1)(3) RθJMA 18 25 27 °C/W
Junction-to-ambient thermal resistance,  200 ft./min. airflow, four-layer 
(2s2p) board(1)(3) RθJMA 14 21 22 °C/W
Junction-to-board thermal resistance(4) RθJB 817 17 °C/W
Junction-to-case thermal resistance(5) RθJC < 0.1 < 0.1 < 0.1 °C/W

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2138D–HIREL–06/03

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1) with the calculated case temper ature. The actual value of RÉýJC for the part is less than 0.1°C/W.

Note: Refer to Section “Thermal Management Information“ page 19 for more details about thermal management.

Package Thermal

Characteristics for HiTCE Table 7 provides the package thermal characteristics for the PC755, HiTCE.

Notes: 1. Simulation, no conv ection air flow.

2. Per JEDEC JESD51-6 with the board horizontal.

The board designer can choose be tween several types of heat sinks to place on the

PC755. There are several commercially-available heat sinks for the PC755 provided by

the following vendors:

For the exposed-die packaging technology, shown in Table 5, the intrinsic conduction

thermal resistance paths are as follows:

• The die junction-to-case (or top-of-die for exposed silicon) thermal resistance

• The die junction-to-ball thermal resistance

Figure 6 depicts the primary heat transfer path for a package with an attached heat sink

mounted to a printed-circuit board.

Heat generated on the active side of the chip is conducted through the silicon, then

through the heat sink attach material (or thermal interface material) , and finally to the

heat sink where it is removed by forced-air convection.

Since the silicon thermal resistance is quite small, for a first-order analysis, the tempera-

ture drop in the silicon may be neglecte d. Thus, the heat sink attach material and the

heat sink conduction/convective thermal resistances are the dominant ter ms.

Table 7. Package Thermal Characteristics for HiTCE Package

Characteristic Symbol

Value

UnitPC755 HiTCE

Junction-to-bottom of balls(1) RθJ6.8 °C/W

Junction-to-ambient thermal resistance, natural

convection, four-layer (2s2p) board(1)(2) RθJMA 20.7 °C/W

Junction to board thermal resistance RθJB 11.0 °C/W

Table 8. Package Thermal Characteristics for CI-CGA

Characteristic Symbol

Value

UnitPC755 CI-CGA

Junction to board thermal resistance RθJB 8.42 °C/W

18 PC755/745 2138D–HIREL–06/03

Figure 6. C4 Package with Head Sink Mounted to a Printed-circuit Board

Note the internal versus external package resistance.

Thermal Management

Assistance The PC755 incorporates a thermal management assist unit (TAU) composed of a ther-

mal sensor, digital-to-analog converter, comparator, control logic, and dedicated

special-purpose register s (SPRs). Specifications for the thermal s ensor portion of the

TAU are found in Table 9. More information on the u se of this feature is given in the

Motorola PC755 RISC Microprocessor User’s manual.

Notes: 1. The temperature i s the junction tempe rature of the die. T he thermal assist un it’s raw

output does not indicate an absolute temperature, but must be interpreted by soft-

ware to derive the absolute juncti on temperature. For information about the use and

calibration of the TAU, se e Motorola Application Note AN1800/D, “Programming the

Thermal Assist Unit in the PC750 Microprocessor”.

2. The comparator settling time value must be converted into the number of CPU clocks

that need to be written into the THRM3 SPR.

3. Guaranteed by design and characterization .

External Resistance

Internal Resistance

Radiation Convection

Heat Sink

Printed ± Circuit Board

Thermal Interface Material

Package/Leads

Die Junction

Die/Package

Table 9. Thermal Sensor Specifications at Recommended Operating Conditions

(see Table 5)

Characteristic Min Max Unit

Temperature range(1) 0127 °C

Comparator settling time(2)(3) 20 – s

Resolution(3) 4 – °C

Accuracy(3) -12 +12 °C

PC755/745

2138D–HIREL–06/03

Thermal Management

Information This section provides thermal m anagement information for the ceramic ball grid array

(BGA) package for air-cooled applications. Proper thermal control design is primarily

dependent upon the system-level design-the heat sink, airflow and thermal interface

material. To reduce the die-junction temperature, heat sinks may be attached to the

package by several method s-adhesive, spr ing c lip to hole s in the printed -circuit board or

package, and mounting clip and screw assemb ly; see Figure 7. This spring force should

not exceed 5.5 pounds of force.

Figure 7. Package Exploded Cross-Sectional View with Several Heat Sink Options

Ultimately, the final selection of an appropriate heat sink depends on many factors, such

as thermal performance at a given air velocity, spatial volume, mass, attachment

method, assembly, and cost.

Adhesive

Thermal Interface Material

Heat Sink

Clip

Printed ± Circuit Board Option

BGA Package

20 PC755/745 2138D–HIREL–06/03

Adhesives and Thermal

Interface Materials Figure 8. Thermal Performance of Select Thermal Interface Material

A thermal interface material is recommended at the package lid-to-heat sink interface to

minimize the thermal contact resistance. For those applications where the heat sink is

attached by spring clip mechanism, Figure 8 shows the thermal performance of three

thin-sheet thermal-interface ma terials (silicone, graphite/oil, floroether oil), a bare joint,

and a joint with thermal grea se as a func tion of conta ct pressur e. As shown, the perfor -

mance of these thermal interfa ce materials improves with increasing contact pr essure.

The use of thermal grease significantly reduces the interface thermal resistance. That is,

the bare joint results in a ther mal resistance approximately 7 times greater than th e ther-

mal grease joint.

Heat sinks are attached to the package by means of a spri ng clip to holes in the p rin ted-

circuit board (see Figure 7) . This spring force should not exceed 5.5 pounds of force.

Therefore, the synthetic grease offers the best thermal performance, considering the

low interface pressure.

The board designer can choose between several types of thermal interface. Heat sink

adhesive materials should be selected based upon high conductivity, yet adequate

mechanical strength to meet equipment shock/vibration requirements.

Heat Sink Selection Example For preliminary heat sink sizing, the die-junction temperature can be expressed as

follows:

Tj = Ta + Tr + (θjc + θint + θsa) * Pd

Where:

Tj is the die-junction temperature

Ta is the inlet cabinet ambient temperature

Tr is the air temperature rise within the computer cabinet

0.5

1.5

2Silicone Sheet (0.006 inch)

Bare Joint

Floroether Oil Sheet (0.007 inch)

Graphite/Oil Sheet (0.005 inch)

Synthetic Grease

Contact Pressure (psi)

Specific Thermal Resistance (Kin2/W)

01020304050607080

PC755/745

2138D–HIREL–06/03

θjc is the junction-to-case thermal resistance

θint is the adhesive or interface material thermal resistance

θsa is the heat sink base-to-ambient thermal resistance

Pd is the power dissipated by the device

During operation the die-jun ction temperatures (Tj) sho uld be maintained less than the

value specified in Ta ble 5. The temperature of the a ir cooling the component greatly

depends upon the ambient inlet air tem perature and the air temperature rise within the

electroni c cab inet. An e lectro nic c abi net inlet-air tem per atur e (T a) ma y range fro m 30 to

40°C. The air temperature rise within a cabinet (Tr) may be in the rang e of 5 to 10°C.

The thermal resistance of the thermal interface material (θint) is typically about 1°C/W.

Assuming a Ta of 30°C, a Tr of 5oC, a CBGA package θjc = 0.03, and a power consump-

tion (Pd) of 5.0 watts, the following expression for Tj is obtained:

Die-junction temperature: Tj = 30°C + 5°C + (0.03°C/W + 1.0°C/W + θsa) * 5.0 W

For a Thermalloy heat sink # 2328B, the heat sink-to-ambient the rmal resistance (θsa)

versus airflow velocity is shown in Figure 9.

Figure 9. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Air-

flow Velocity

Assuming an air velocity of 0.5 m/s, we have an effective Rsa of 7°C/W, thus

Tj = 30°C+ 5°C+ (0.03°C/W +1.0°C/W + 7°C/W) * 5.0 W,

resulting in a die-junction temperature of approximately 81°C which is well within the

maximum operating temperature of the component.

Other heat sinks offered by Chip Coolers, IERC, Thermalloy, Wakefield Engineering,

and Aavid Engineering offer diffe rent heat sink-to-ambient thermal resistances, and may

or may not need air flow.

0 0.5 1 1.5 2 2.5 3 3.5

Thermalloy #2328B Pin±fin Heat Sink

Approach Air Velocity (m/s)

(25 x28 x 15 mm)

Heat Sink Thermal Resistance °C/W)

22 PC755/745 2138D–HIREL–06/03

Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances

are a common figu re-of-merit used for com paring the thermal performa nce of various

microelectronic packaging technologies, one should exercise caution when only using

this metric in determining thermal management because no single parameter can ade-

quately describe three-dimensional heat flow. The final die-junction operating

temperature, is not only a functio n of the component-level thermal resistance, but the

system-level design and its operating cond itions. In addition to the componen t’s power

consumption, a number of factors affect the fina l operating die-junction temperature —

airflow, board population (local heat flux of adjacent components), heat sink efficiency,

heat sink attach, heat sink placement, next-level interconnect technology, system air

temperature rise, altitude, etc.

Due to the complexity and the many variations of system-level boundary conditions for

today’s microelectronic equipment, the combin ed effects of the heat transfer mecha-

nisms (radiation, convection an d conduction) may vary widely. For these reasons, we

recommend using conjugate h eat transfer models for the board, as well as , system-level

designs. To expedite system-l evel therm al analysis, several “compact” the rma l-package

models are available within FLOTHERM®. These are available upo n request.

Power consideration

Power management The PC755 provides four power modes, selectable by setting the appropriate control

bits in the MSR and HIDO registers. The four power modes are as follows:

• Full-power: This is the default po wer state of the PC755. The PC755 is fully

powered and the internal functional units operate at the full processor clock speed.

If the dynamic power management mode is enabled, functional units that are idle

will automatically enter a low-power state without affecting perf ormance, software

execution, or external hardware.

• Doze: All the functional units of the PC755 are disabled except for the time

base/decrementer registers and the bus snooping logic. When the processor is in

doze mode, an external asynchronous interrupt, a system management interrupt, a

decrementer exception, a hard or soft reset, or machine check brings the PC755

into the full-power state. The PC755 in doze mode maintains the PLL in a fully

powered state and locked to the system external clock input (SYSCLK) so a

transition to the full-power state takes only a few processor clock cycles.

• Nap: The nap mode fur ther red uces power consum ption by disabling bus snooping,

leaving only the time base register and the PLL in a powered state. The PC755

returns to the full-power state upon receipt of an extern al asynchronous inte rrupt, a

system management interrupt, a decrementer exception, a hard or soft reset, or a

machine check input (MCP). A return to full-power state from a n ap state takes only

a few processor clock cycles. When the processor is in nap mode, if QACK is

negated, the processor is put in doze mode to support snooping.

• Sleep: Sleep mode minim izes power consump tion by disabling all intern al functional

units, after which external system logic may disa ble the PPL and SUSCLK.

Returning the PC755 to the full-power state requires the enabling of the PPL and

SYSCLK, followed by the assertion of an external asynchronous interrupt, a system

management interrupt, a hard or soft reset, or a machine check input (MCP) signal

after the time required to relock the PPL.

PC755/745

2138D–HIREL–06/03

Power Dissipation

Notes: 1. These values appl y for all valid processor bus and L2 bus ratios. The values do not

include I/O supply power (OVDD and L2OVDD) or PLL/DLL supply power (AVDD and

L2AVDD). OVDD and L2OVDD power is system dependent, but is typically < 10% of

VDD power. Worst case power consumption for AVDD = 15 mW and L2AVDD = 15 mW.

2. Maximum power is measured at nominal V DD (see Table 5) whil e running an entirely

cache-resident, contrived sequence of instructions which keep the execution units

maximally busy.

3. Typical power is an average value measured at the nominal recommended VDD

(see Table 5) and 65×C in a system while running a typical code sequence.

4. Not 100% tested. Characterized and periodically sampled.

Table 10. Power Consumption for PC755

Processor (CPU) Frequency

Unit300 MHz 350 MHz 400 MHz

Full-Power Mode

Typical(1)(3)(4) 3.1 3.6 5.4 W

Maximum(1)(2) 4.5 5.3 8 W

Doze Mode

Maximum(1)(2)(4) 1.8 22.3 W

Nap Mode

Maximum(1)(2)(4) 1 1 1 W

Sleep Mode

Maximum(1)(2)(4) 550 550 550 mW

Sleep Mode-PLL and DLL Disabled

Maximum(1)(2) 510 510 510 mW

24 PC755/745 2138D–HIREL–06/03

Electrical

Characteristics

Static Characteristics

Notes: 1. Nominal voltages; See Table 5 for recommended operating conditions.

2. For processor bus signals, the reference is OVDD while L2OVDD is the reference for the L2 bus signal s.

3. Excludes test signals (LSSD_MODE, L1_TSTCLK, L2_TSTCLK) and IEEE 1149.1 boundary scan (JTAG) signals.

4. Capacitance is periodically sampled rather than 100% tested.

5. The leakage is measured for nominal OVDD and VDD, or both OVDD and VDD must vary in the same dire ction (for example,

both OVDD and VDD vary by either +5% or -5%).

Dynamic Characteristics After fabrication, parts are sorted by maximum processor core frequency as sho wn in

the “Clock AC Specifications” Section on page 25 and tested for conformance to the AC

specifications for that frequency. These specifications are for 275, 300, 333 MHz pro-

cessor core frequencies. The processor core frequency is determined by the bus

(SYSCLK) frequency and the settings of the PLL_CFG[0-3] signals. Parts are sold by

maximum processor core frequency.

Table 11. DC Electrical Specifications at Recommended Operating Conditions (see Table 5)

Characteristic Nominal bus

Voltage(1) Symbol Min Max Unit

Input high voltage (all inputs except SYSLCK)(2)(3) 2.5 VIH 1.6 (L2)OVDD + 0.3 V

3.3 VIH 2(L2)OVDD + 0.3 V

Input low voltage (all inputs except SYSLCK)(2) 2.5 VIL -0.3 0.6 V

3.3 VIL -0.3 0.8 V

SYSCLK input high voltage 2.5 KVIH 1.8 OVDD + 0.3 V

3.3 KVIH 2.4 OVDD + 0.3 V

SYSCLK input low voltage 2.5 KVIL -0.3 0.4 V

3.3 KVIL -0.3 0.4 V

Input leakage current, (2)(3)

VIN = L2OVDD/OVDD

Iin –10 µA

Hi-Z (off-state) leakage current, (2)(3)(5)

VIN = L2OVDD/OVDD

ITSI –10 µA

Output high voltage, IOH = -6 mA 2.5 VOH 1.7 – V

3.3 VOH 2.4 – V

Output low vo ltage, IOL = 6 mA 2.5 VOL –0.45 V

3.3 VOL –0.4 V

Capacitance, VIN = 0V, f = 1 MHz (3)(4) Cin – 5 pF

25
PC755/745
2138D–HIREL–06/03
Clock AC Specifications Table 12 provides the clock AC timing specifications as defined in Table 3.
Notes: 1. Caution: The SYSCLK frequency and PLL_CFG[0-3] settings must be chosen such that the resulting SYSCLK (bus) fre-
quency, CPU (core) frequency, and  PLL (VCO) frequency do not e xceed their respective maximum or minimum operati ng
frequencies. Refer to the PLL_CFG[0-3] signa l description in Table 18,” for valid PLL_ CFG[0-3] settings
2. Rise and fall times measurements are now specified in terms of slew rates, rather than time to account for selectable I/O bus
interface levels. The minimum slew rate of 1v/ns is equivalent to a 2ns maximum rise/fall time measured at 0.4V and 2.4V or
a rise/fall time of 1ns measured at 0.4V to 1.4V.
3. Timing is guaranteed by design and characterization.
4. This represents total input jitter – short term and long term combined and is guaranteed by design.
5. Relock timing is guaranteed by design and characterization. PLL-relock time is the maximum amount of time required for
PLL lock after a stable VDD and SYSCLK are reached during th e power-on reset sequence. This spe cification also applies
when the PLL has been disabled and subsequently re-enabled during sleep mode. Also note that HRESET must be held
asserted for a minimum of 255 bus clocks after the PLL-relock time during the power-on reset sequence.
Figure 10 provides the SYSCLK input timing diagram.
Figure 10.  SYSCLK Input Timing Diagram
Table 12.  Clock AC Timing Specifications at Recommended Operating Conditions (See Table 5) 
Characteristic Symbol
Maximum Processor Core Frequency
Unit300 MHz 350 MHz 400 MHz
Min Max Min Max Min Max
Processor frequency(1) fcore 200 300 200 350 200 400 MHz
VCO frequency(1) fVCO 400 600 400 700 400 800 MHz
SYSCLK frequency(1) fSYSCLK 25 100 25 100 25 100 MHz
SYSCLK cycle time tSYSCLK 10 40 10 40 10 40 ns
SYSCLK rise and fall time(2) tKR & tKF – 2 – 2 – 2 ns
tKR & tKF –1.4 –1.4 –1.4 ns
SYSCLK duty cycle measured at OVDD/2(3) tKHKL/tSYSCLK 40 60 40 60 40 60 %
SYSCLK jitter(3)(4) –150 –150 –150 ps
Internal PLL relock time(3)(5) –100 –100 –100 µs
SYSCLK VMVMVM
KVIH
KVIL
VM = Midpoint Voltage (OVDD/2)
tSYSCLK
tKR tKF
tKHKL

26 PC755/745 2138D–HIREL–06/03
Processor Bus AC 
Specifications Table 13 provides the processor bus AC timing specifications for the PC755 as defined
in Figure 11 and Figure 13. Timing specifications for the L2 bus are provided in Section
“L2 Clock AC Specifications» page 28.
Notes: 1. All input specifications are measured from the midpoint of the signal in question to the midpoint of the rising edge of the input
SYSCLK. All output specifications are measured from the midpoint of the rising edge of SYSCLK to the midpoint of the sig-
nal in question. All output timings assume a purely resistive 50Ω load (See Figure 11). Input and output timings are
measured at the pin; time-of-flight delays must be added for trace lengths, vias, and connectors in the system.
2. THe symbology used for timing specifications herein follows the pattern of t(signal)(state)(reference)(state) for inputs and
t(reference)(state)(signal)(state) for outputs. For example, tIVKH symbolizes the time in put signals (I) reach the valid state (V) relative
to the SYSCLK reference (K) going to the high (H) state or input setup time. And tKHOV symbolizes the time from SYSCLK(K)
going highs) unti l outputs (O)  are vali d (V) or  ou tput valid  time . In put hold time ca n  be read as the time that the input signa l
(I) went invalid (X) with respect to the rising clock edge (KH) - note the position of the reference and its state for inputs – and
output hold time can be read as the time from the rising edge (KH) until the output went invalid (OX). For additional explana-
tion of AC ti ming specifications in Motoro la PowerPC micr oprocessors, see the application  note “Understanding AC Ti ming
Specifications for PowerPC Microprocessors.”
3. The setup and hold time is with respect to the rising edge of HRESET (see Figure 11).
4. This specification is for configuration mode select only. Also note that the HRESET must be held asserted for a minimum of
255 bus clocks after the PLL re-lock time during the power-on reset sequence.
5. tSYSCLK is the period of the external clock (SYSCLK) in nanoseconds (ns). The numbers given in the table must be multiplied
by the period of SYSCLK to compute the actu al time duration (in nanoseconds) of the parameter in question.
6. Mode select signals are BVSEL, L2VSEL, PLL_CFG[0-3]
7. Guaranteed by design and characterization.
8. Bus mode select pins must remain stable during operation. Changing the logic states of BVSEL or L2VSEL during operation
will cause the bus mode vol tage selection to change. Chan ging the logic sta tes of the PLL_CFG pins duri ng operation will
cause the PLL division ratio selection to change. Both  of these conditions are considered outsi de the specification and are
not supported. Once HRESET is negated the states of the bus mode selection pins must remain stable.
Figure 11 provides the mode select input timing diagram for the PC755.
Figure 11.  Mode Input Timing Diagram
Table 13.  Processor Bus Mode Selection AC Timing Specifications(1)
At VDD = AVDD = 2.0V 100 mV; -55  ≤ Tj ≤ +125°C, OVDD = 3.3V 165 mV and OVDD = 1.8V ± 1 00 mV and OVDD = 2.0V 100 mV
Parameter
Symbols(2) All Speed Grades
UnitMin Max
Mode select input setup to HRESET(3)(4)(5)(6)(7) tMVRH 8 – tSYSCLk
HRESET to mode select input hold(3)(4)(6)(7)(8) tMXRH 0 – ns
HRESET
MODE SIGNALS
VM = Midpoint Voltage (OVDD/2)
VM
tMVRH tMXRH

27
PC755/745
2138D–HIREL–06/03
Figure 12 provides the AC test load for the PC755.
Figure 12.  AC Test Load
Notes: 1. Revisions prior to Rev 2.8 (Rev E) were limite d in performance and did  not conform to  this specification. Contact you r local
Motorola sales office for more information.
2. Guaranteed by design and characterization.
3. tSYSCLK is the period of the external clock (SYSCLK) in nanoseconds (ns). The numbers given in the table must be multiplied
by the period of SYSCLK to compute the actual time duration (in ns) of the parameter in question.
4. Per the 60x bus protocol, TS, ABB and DBB are  driven o nly  by the  cu rrently a ctive b us master.  They are  a sserted l ow th en
precharged high befo re returni ng to  high -Z as  s hown in  Fi gure  6. Th e no mi nal precha rge w idth for T S , ABB or DBB is  0.5 x
tSYSCLK, i.e. less than the minimum tSYSCLK period, to ensure tha t another master asserting TS, ABB, or DBB on th e following
clock will not contend with the precharge. Output valid and output hold timing is tested for the signal asserte d. Output valid
time is tested for precharge.The high-Z behavior is guaranteed by design.
5. Per the 60x bus protocol, ARTRY can be driven by multiple bus masters through the clock period immediately following
AACK. Bus contention is not an issue since any master asserting ARTRY will be driving it low. Any master asserting it low in
the first clock following AACK will then go to high-Z for one clock before precharging it high during the second cycle after the
assertion of AACK. The nominal precharge width for ARTRY is 1.0 tSYSCLK; i.e., it should be high-Z as shown in Figure 6
before the first opportunity for anothe r master to assert ARTRY. Output vali d and output hold ti ming is tested for the  signal
asserted. Output valid time is tested for precharge. The high-Z and precharge behavior is guaranteed by design.
OVDD/2
OUTPUT Z0 = 50Ω
RL = 50Ω
Table 14.  Processor Bus AC Timing Specifications(1) at Recommended Operating Conditions
Parameter Symbols
All Speed Grades Unit
Min Max
Setup Times: All Inputs tIVKH 2.5 –ns
Input Hold Times: TLBISYNC, MCP, SMI tIXKH 0.6 –ns
Input Hold Times: All Inputs, except TLBISYNC, MCP, SMI tIXKH 0.2 –ns
Valid Times: All Outputs tKHOV –4.1 ns
Output Hold Times: All Outputs tKHOX 1 – ns
SYSCLK to Output Enable(2) tKHOE 0.5 –ns
SYSCLK to Output High Impedance (all except ABB, ARTRY, DBB)(2) tKHOZ – 6 ns
SYSCLK to ABB, DBB High Impedance After Precharge(2)(3)(4) tKHABPZ – 1 tSYSCLK
Maximum Delay to ARTRY Precharge(2)(3)(5) tKHARP – 1 tSYSCLK
SYSCLK to ARTRY High Impedance After Precharge(2)(3)(5) tKHARPZ – 2 tSYSCLK

28 PC755/745 2138D–HIREL–06/03

Figure 13 provides the input/outp ut timing diagram for the PC755.

Figure 13. Input/Out pu t Tim in g Dia gr am

L2 Clock AC Specifications The L2CLK frequency is programmed by the L2 Configuration Register (L2CR[4:6])

core-to-L2 divisor ratio. See Table 15 for example core and L2 frequencies at various

divisors. Table 15 provides the potential range of L2CLK outp ut AC timing specifications

as defined in Figure 14.

The minimum L2CLK frequency of Table 15 is specified by the maximum delay of the

internal DLL. The variable-tap DL L introduces up to a full clock period delay in the

L2CLKOUTA, L2CLKOUTB, and L2SYNC_OUT signals so that the returning

L2SYNC_IN signal is phase aligned with the next core clock (divided by the L2 divisor

ratio). Do not choose a core-to-L2 divisor which res ults in an L2 frequency below this

minimum, or the L2CLKOUT signa ls provided for SRAM clocking will not be phase

aligned with the PC755 core clock at the SRAMs.

The maximum L2CLK frequen cy shown in Table 15 is the core frequency divided by

one. Very few L2 SRAM designs will be able to operate in this mode. Most designs will

select a greater core-to-L2 divisor to provide a longer L2CLK period for read and write

access to the L2 SRAMs. The maximum L2CLK frequency for any application of the

PC755 will be a function of the AC timings of the PC755, the AC timings for the SRAM,

bus loading, an d pr int ed c ircu it bo ar d tr ace len gt h.

SYSCLK

ALL INPUTS

VM = Midpoint Voltage (OVDD/2 or Vin/2)

ALL OUTPUT S

(Except TS, ABB,

ARTRY, DBB)

TS,ABB,DBB

ARTRY

tIVKH tIXKH

tKHOE

tKHOV tKHOX

tKHABPZ

tKHOV

tKHOX

tKHOZ

tKHARPZ

tKHOV

tKHOX

tKHARP

tKHOV

tKHOZ

29
PC755/745
2138D–HIREL–06/03
Motorola is similarly limited by system constraints and cannot perform tests of the L2
interface on a socketed part on a functional tester at the maximum frequencies of Table
15. Therefore functional operation and AC timing information are tested at core-to-L2
divisors of 2 or greater. Functionality of core-to-L2 divisors of 1 or 1.5 is verified at less
than maximum rated frequencies.
L2 input and output signals are latched or enab led respectively by the internal L2CLK
(which is SYSCLK multiplied up to the core frequency and divided down to the L2CLK
frequency). In other words, the AC timings of Table 16 and Table 17 are entirely inde-
pendent of L2SYNC_IN. In a closed loop system, where L2SYNC_IN is driven through
the board trace by L2SYNC_OUT, L2SYNC_IN only controls the output phase of
L2CLKOUTA and L2CLKOUTB which are used to latch or enable data at the SRAMs.
However, since in a closed loop system L2SYNC_IN is held in phase alignment with the
internal L2CLK,  th e sign als of Table  16  and   Tab le 1 7 a re re fe re nced  to this signa l ra th er
than the not-externally-visible internal L2CLK. During manufacturing test, these times
are actually measured relative to SYSCLK.
The L2SYNC_OUT signal is intended to be routed  halfway out to the SRAMs and then
returned to the L2SYNC_IN input of the PC755 to synchronize L2CLKOUT at the SRAM
with the processo r’s internal clock. L2CLKOUT at the SRAM can be offset forward or
backward in time by shortening or lengthening the routing of L2SYNC_OUT to
L2SYNC_IN. See Motorola Application Note AN179/D “PowerPC™ Backside L2 Timing
Analysis for the PCB Design Engineer.”
The L2CLKOUTA and L2CLKOUTB signals should not have more than two loads.
Notes: 1. L2CLK outputs are L2CLK_OUTA, L2CLK_OUTB, L2CLK_OUT and L2SYNC_OUT pins. The L2CLK frequency to core fre-
quency settings must be chosen so that the resulting L2CLK frequen cy and core frequency do not exceed their respective
maximum or minimum operating frequencies. The maximum L2LCK frequency will be system dependent. L2CLK_OUTA
and L2CLK_OUTB must have equal loading.
2. The nominal duty cycle of the L2CLK is 50% measured at midpoint voltage.
3. The DLL re-lock time is specified in terms of L2CLKs. The number in the table must be multiplied by the period of L2CLK to
compute the actual time duration in nanoseconds. Re-lock timing is guaranteed by design and characterization.
4. The L2CR[L2SL] bit should be set for L2CLK frequencies less than 110 MHz. This adds more delay to each tap of the DLL.
5. Allowable skew between L2SYNC_OUT and L2SYNC_IN.
6. This output jitter number represents the maximum delay of one tap forward or one tap back fro m the current DLL tap as the
phase comparator seeks to minimize the p hase difference between L2SYNC_IN and the intern al L2CLK. This number must
be comprehended in the L2 timing analysis. The input jitter on SYSCLK affects L2CLKOUT and the L2 address/data/control
signals equally and therefore is already comprehended in the AC timing and does not have to be considered in the L2 timing
analysis.
7. Guaranteed by design.
Table 15.  L2CLK Output AC Timing Specification. At VDD = AVDD = 2.0V 100 mV; -55 ≤ Tj ≤ +125°C, OVDD = 3.3V
165 mV and OVDD = 1.8V 100 mV and OVDD = 2.0V 100 mV
Parameter Symbols
All Speed Grades
UnitMin Max
L2CLK frequency(1)(4) f L2CLK 80 450 MHz
L2CLK cycle time t L2CLK 2.5 12.5 ns
L2CLK duty cycle(2)(7) tCHCL/tL2CLK 45 55 %
Internal DLL-relock time(3)(7) –640 –L2CLK
DLL capture  wi n d ow (5)(7) – 0 10 ns
L2CLKOUT output-to-output skew(6)(7) tL2CSKW –50 ps
L2CLKOUT output jitter(6)(7) – – ±150 ps

30 PC755/745 2138D–HIREL–06/03
The L2CLK_OUT timing diagram is shown in Figure 14.
Figure 14.  L2CLK_OUT Output Timing Diagram
L2 Bus Input AC Specifications Table 16 provides the L2 bus interface AC timing specifications for the PC755 as
defined in Figure 15 and Figure 16 for the loading conditions described in Figure 17.
VM = Midpoint Voltage (L2OVdd/2)
L2CLK_OUTA
L2CLK_OUTB
L2 Differential Clock Mode
L2 Single-Ended Clock Mode
L2SYNC_OUT
L2CLK_OUTAVM
tL2CR tL2CF
VM
VM
VM
L2CLK_OUTB
VMVM
VM
VM
VM
L2SYNC_OUT
VM VM VM
VM VM VM
VM
VM
tL2CSKW
tL2CLK
tL2CLK
tCHCL
tCHCL
Table 16.  L2 Bus Interface AC Timing Specifications at Recommended Operating Conditions
Parameter Symbol
All Speed Grades
UnitMin Max
L2SYNC_IN rise and Fall Time(1) tL2CR & tL2CF –1.0 ns
Setup Times: Data and Parity(2) tDVL2CH 1.2 -ns
Input Hold Times: Data and Parity(2) tDXL2CH 0 - ns
Valid Times: (3)(4)
All Outputs when L2CR[14-15] = 00
All Outputs when L2CR[14-15] = 01
All Outputs when L2CR[14-15] = 10
All Outputs when L2CR[14-15] = 11
tL2CHOV -
-
-
-
3.1
3.2
3.3
3.7
ns
Output Hold Times: (3)
All Outputs when L2CR[14-15] = 00
All Outputs when L2CR[14-15] = 01
All Outputs when L2CR[14-15] = 10
All Outputs when L2CR[14-15] = 11
tL2CHOX 0.5
0.7
0.9
1.1
-
-
-
-
ns
L2SYNC_IN to High Impedance:(3)(5)
All Outputs when L2CR[14-15] = 00
All Outputs when L2CR[14-15] = 01
All Outputs when L2CR[14-15] = 10
All Outputs when L2CR[14-15] = 11
tL2CHOZ -
-
-
-
2.4
2.6
2.8
3.0
ns

PC755/745

2138D–HIREL–06/03

Notes: 1. Rise and fall times for the L2SYNC_IN input are measured from 20% to 80% of L2OVDD.

2. All input specifications are measure d from the midpoint of the signal in question to th e midpoint voltage of the rising edge of

the input L2SYNC_IN (see Fig ure 8). Input timings are measured at the pins.

3. All output specifications are measured from the midpoint voltage of the rising edge of L2SYNC_IN to the midpoint of the sig-

nal in question. The output timings are measured at the pins. All output timings assume a purely resistive 50Ω load (See

Figure 10).

4. The outputs are valid for both single-ended and differential L2CLK modes. For pipelined registered synchronous Bur-

stRAMs, L2CR[14-15] = 01 or 10 is recomme nded. For pipelined late write synchronous BurstRAMs, L2CR[14 -15] = 11 is

recommended.

5. Guaranteed by design and characterization.

6. Revisions prior to Rev 2.8 (Rev E) were limited in performanc e.and did not conform to this specification. Con tact your local

Atmel sales office for more information.

Figure 15 shows the L2 bus input timing diagrams for the PC755.

Figure 15. L2 Bus Input Timing Diagrams

Figure 16 shows the L2 bus output timing diagrams for the PC7 55.

Figure 16. L2 Bus Output Timing Diagrams

Figure 17 provides the AC test load for L2 interface of the PC755.

Figure 17. AC Test Load for the L2 Interface

L2SYNC_IN

L2 DATA AND DATA

VM = Midpoint Voltage (L2O V DD/2)

tDVL2CH tDXL2CH

tL2CR tL2CF

PARITY INPUTS

L2SYNC_IN

ALL OUTPUT S

VM = Midpoint Voltage (L2OVDD/2)

L2DATA BUS

tL2CHOX

tL2CHOZ

tL2CHOV

OUTPUT L2OVdd/2

RL = 50Ω

Z0 = 50Ω

32 PC755/745 2138D–HIREL–06/03
IEEE 1149.1 AC Timing 
Specifications
Timing Specifications Table 17 provides the IEEE 1149 .1 (JTAG) AC timing sp ecifications as d efined in  Figure
18, Figure 19, Figure 20, and Figure 21.
Notes: 1. All outputs are measured from the midpoint voltage  of the falling/rising edge o f TCLK to the midpoint of the signal in  ques-
tion. The output timing s are measured at the pins. All output timings assume a purely resistive 50 Ω load (See Figure  18).
Time-of-fli ght delays must be added for trace lengths, vias, and con nectors in the  system.
2. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only.
3. Non-JTAG signal input timing with respect to TCK.
4. Non-JTAG signal output timing with respect to TCK.
5. Guaranteed by design and characterization.
Figure 18 provides the AC test load for TDO and the boundary-scan outputs of the PC755.
Figure 18.  ALTERNATE AC Test Load for the JTAG Interface
Table 17.  JTAG AC Timing Specifications (Independent of SYSCLK)(1) 
Parameter Symbol Min Max Unit
TCK Frequency of operation fTCLK 016 MHz
TCK Cycle time fTCLK 62.5 -ns
TCK Clock pulse width measured at 1. 4V tJHJL 31 -ns
TCK Rise and fall times tJR & tJF 0 2 ns
TRST Assert time(2) tTRST 25 -ns
Input Setup Times:(3)
Boundary-scan data
TMS, TDI tDVJH
tIVJH
4
0-
-
ns
Input Hold Times:(3)
Boundary-scan data
TMS, TDI tDXJH
tIXJH
15
12 -
-
ns
Valid Times:(4)
Boundary-scan data
TDO tJLDV
tJLOV
-
-4
4
ns
Output Hold Times:(4)
Boundary-scan data
TDO tJLDV
tJLOV
25
12 -
-
ns
TCK to output high impedance:(4)(5)
Boundary-scan data
TDO tJLDZ
tJLOZ
3
319
9
ns
OVDD/2
OUTPUT Z0 = 50Ω
RL = 50Ω

PC755/745

2138D–HIREL–06/03

Figure 19 provides the JTAG clock input timing diagram.

Figure 19. JTAG Clock Input Timing Diagram

Figure 20 provides the TRST timing diagra m.

Figure 20. TRST Timing Diagram

Figure 21 provides the boundary-scan timing diagram.

Figure 21. Boundary-Scan Timing Diagram

TCLK VMVMVM

VM = Midpoint Voltage (OVDD/2)

tTCLK

tJR tJF

tJHJL

TRST tTRST

VM = Midpoint Voltage (OVDD/2)

VM VM

TCK

BOUNDARY

DATA OUTPUTS

DATA INPUTS

DATA OUTPUTS

VM = Midpoint Voltage (OVDD/2)

tDXJH

tDVJH

tJLDV

JLDZ

INPUT

DAT A VALID

OUTPUT

tJLDH

DATA

VALID

OUTPUT DATA VALID

34 PC755/745 2138D–HIREL–06/03

Figure 22 provides the test access port timing diagram.

Figure 22. Test Access Port Timing Diagram

JTAG Configuration Signals Boundary scan testing is enabled through the JTAG interface signals. The TRST signal

is optional in the IEEE 1149.1 specifica tion, but is provided on all processors that imple-

ment the PowerPC architecture. While it is possible to force the TAP controller to the

reset state using only the TCK and TMS sign als, more reliable power-on reset perfor-

mance will be obtained if the TRST signal is asserted d uring power-on reset. Becaus e

the JTAG interface is also used for accessing the com mon on-chip processor (COP)

function, simply tying TRST to HRESET is not practical.

The COP function of these processors allows a r emote computer system (typically, a PC

with dedicated hardware an d debugging software) to access and control the in ternal

operations of the processor. The COP interface connects primarily through the JTAG

port of the processor, with some additional status monitoring signals. The COP port

requires the ability to independently assert HRESET or TRST in order to fully control the

processor. If the target system has independent reset sources, such as voltage moni-

tors, watchdog timers, power supply failures, or push-button switches, then the COP

reset signals must bemerged into these signals with logic.

The arrangement shown in Figure 23 allows the COP port to independently assert

HRESET or TRST, while ensuring that the target can drive HRESET as well. If the JTAG

interface and COP header will not be used, TRST should be tied to HRESET through a

0Ω isolation resistor so that it is asserted when the systemreset signal (HRESET) is

asserted ens uring that th e JTAG scan chain is initialized during power-on. While Motor-

ola recommends that the COP header be designed into the system as shown in Figure

23, if this is not possible, the isolation resistor will allow future access to TRST in the

casewhere a JTAG int er fa ce ma y ne ed to be wired on to the sys te m in de bu g situatio ns.

The COP header shown in Figure 23 adds many bene fits — breakpoints, watchpoints,

are possible through this interface — and can be as inexpensive as an unpopulated

footprint for a header to be added when needed.

The COP interface ha s a standar d h ea der for conn ection to the targ et system, based on

the 0.025" square-post 0.100" centered header assembly (often called a Berg header).

The connector typically has pin 14 removed as a connector key.

TCK

TDI, TMS

TDO

VM = Midpoint Voltage (OVDD/2)

TDO

tIXJH

tIVJH

tJLOV

tJLOZ

INPUT

DATA VALID

OUTPUT

tJLOH

DATA

VALID

OUTPUT DATA VALID

PC755/745

2138D–HIREL–06/03

Figure 23. JTAG Interface Connection

Notes: 1. RUN/STOP, normally found on pin 5 of the COP header, is not implemented on the PC755. Connect pin 5 of the COP

header to OVDD with a 10 kΩ pull-up resistor.

2. Key location; pin 14 is not physically present on the COP header.

3. Component not populated. Populate only if debug tool does not drive QACK.

4. Populate only if debug tool uses an op en-drain type output and does not actively deassert QACK.

5. If the JTAG interface is implemented, connect HRESET from the target source to TRST from the COP header though an

AND gate to TRST of the part. If the JTAG interface is not implemented, connect HRESET fromthe target source to TRST of

the part through a 0Ω isolation resistor.

HRESET HRESET

From Target

Board Sources

13 SRESET

SRESET SRESET

VDD_SENSE

2kΩ10 kΩ

10 kΩ

OVDD

CHKSTP_IN CHKSTP_IN

8TMS

TDO

TDI

TCK

TMS

TDO

TDI

TCK

4TRST

(if any)

COP Header

14 2

Key

QACK

OVDD

10 kΩOVDD

TRST

10 kΩOVDD

10 kΩ

QACK

CHKSTP_OUT

KEY

No pin

COP Connector

Physical Pin Out

10 kΩ 4OVDD

2kΩ3

0Ω 5

HRESET

36 PC755/745 2138D–HIREL–06/03

The COP header shown in Figure 24 adds many benefits—breakpoints, watchpoints,

are possible through this interf ace – and can be as inexpensive as an unpopulated foot-

print for a header to be added when needed.

System design information

The COP interface ha s a standar d h ea der for conn ection to the targ et system, based on

the 0.025” square- post 0.100” cen tere d header assembly (o ften called a “Berg” he ader ).

The connector typically has pin 14 removed as a connector key.

Figure 24 shows the COP connector diag ram.

Figure 24. COP Connector Diagram

There is no standardized way to number the COP header shown in Figure 24; conse-

quently, many different pin numbers have been observed from emulator vendors. Some

are numbered top-to-bottom then left-to-righ t, while others use le ft-to-right then top -to-

bottom, while still others number the pins counter clockwise from pin one (as with an IC).

Regardless of the numbering, the signal placement recommended in Figure 24 is com-

mon to all known emulators.

The QACK signal shown in Table 17 is usually hooked up to the PCI bridge chip in a

system and is an input to the PC755 informing it that it can go into the quiescent state.

Under normal operation this occurs d uring a low power mode selection. In order for

COP to work the PC755 must see this signal asserted (pulled down). While shown on

the COP header, not all emulator products drive this signal. To preserve correct power

down operation, QACK should be merged so that it also can be driven by the PCI

bridge.

CKSTP_OUT

13 9 5 1

610 2

TOP VIEW

15 11 7

16 12 8 4

KEY

No pin

HRESET

SRESET

TMS

RUN/STOP

TCK

TDI

TDO

Ground

TRST

VDD_SENSE

Pins 10, 12 and 14 are no-con nec ts.

Pin 14 is not physically present

QACK

CHKSTP_IN

PC755/745

2138D–HIREL–06/03

Preparation for Delivery

Packaging Micr ocir cu its ar e pr ep a re d for de liv ery in accordance with MIL-PRF-38535.

Certificate of Compliance Atmel offers a certificate of compliances with each shipment of parts, affirming the prod-

ucts are in compliance either with MIL-PRF-883 and guarantying the para meters not

tested at temperature extremes for the entire temperature range.

Handling MOS devices must be handled with certain precautions to avoid damage due to accu-

mulation of static charge. Input protection devices have been designed in the chip to

minimize the effect of static buildup. However, the following handling practices are

recommended:

1. Devices should be handled on benches with conductive and grounded surfaces.

2. Ground test equipment, tools and operator.

3. Do not handle devices by the leads.

4. Store devices in conductive foam or carriers.

5. Avoid use of pla st i c, rubb er , or silk in MOS ar ea s.

6. Maintain relative humidity above 50 percent if practical.

7. For CI-CGA packages, use specific tray to take care of the highest height of the

package compared with the normal CBGA.

Package Mechanical

Data The following sections provide the package parameters and mechanical dimensions for

the PC745, 255 PBGA package as well as the PC755, 36 0 CBGA and PBGA packa ges.

While both the PC755 plastic and the ceramic packages are described here, both pack-

ages are not guaranteed to be available at the same time. All new designs should allow

for either ceramic or plastic BGA packages for this device. For more information on

designing a com mon footprint for both plastic and ceramic package types, please con-

tact your local Motorola sales office.

Parameters for the

PC745

Package Parameters for the

PC745 PBGA The package parameters are as p rovided in the following list. The package type is

21 x 21 mm, 255-lead plastic ball grid array (PBGA).

Mechanical Dimensions of the

PC745 PBGA Package Figure 25 provides the mechanical dimensions and bottom surface nomenclature of the

PC745, 255 PBGA package.

Package outline 21 x 21 mm

Interconnects 255 (16 x 16 ball array – 1)

Pitch 1.27 mm (50 mil)

Minimum module height 2.25 mm

Maximum module height 2.80 mm

Ball diameter (typical) 0.75 mm (29.5 mil)

38 PC755/745 2138D–HIREL–06/03

Figure 25. Mechanical Dime ns ion s an d Bot to m Sur f ace Nomenclature of the PC745 PBGA

Parameters for the PC755

PBGA

Package Parameter for the

PC755 PBGA The package parameters are as provided in the following list. The package type is 25 x

25 mm, 360-lead plastic ball grid array (PBGA).

Package outline 25 x 25 mm

Interconnects 360 (19 x 19 ball array – 1)

Pitch 1.27 mm (50 mil)

Minimum module height 2.22 mm

Maximum module height 2.77 mm

Ball diameter 0.75 mm (29.5 mil)

Table 1

Millimeters

DIM Min Max

A2.25 2.80

A1 0.50 0.70

A2 1.00 1.20

b0.60 0.90

D21.00 BSC

E21.00 BSC

e1.27 BSC

0.2

A1 CORNER

0.2

AA1

0.15 C

255X

12345678910111213141516

A0.3C

0.15

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH VARIOUS

SHAPES. BOTTOM SIDE A1 CORNER IS

DESIGNATED WITH A BALL MISSING

FROM THE ARRAY.

4. CAPACITOR PADS MAY BE UNPOPULATED.

PC755/745

2138D–HIREL–06/03

Mechanical Dimensions of the

PC755 PBGA Figure 26 provides the mechanical dimensions and bottom surface nomenclature of the

PC755, 360 PBGA package.

Figure 26. Mechanical Dime ns ion s an d Bot to m Sur f ace Nomenclature of the PC755 PBGA

NOTES:

A. DIMENSIONING AND T OLERANCING PER

ASME Y14.5M, 1994.

B. DIMENSIONS IN MILLIMETERS.

C. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEA TURE WITH VARIOUS

SHAPES. BOTT OM SIDE A1 CORNER IS

DESIGNATED WITH A BALL MISSING

FROM THE ARRA Y.

0.2

360X

A1 CORNER

0.2

12345678910111213141516

A0.3

0.15

AA1

0.15 C

171819

Millimeters

DIM Min Max

A2.22 2.77

A1 0.50 0.70

A2 1.00 1.20

b0.60 0.90

D25.00 BSC

E25.00 BSC

e1.27 BSC

40 PC755/745 2138D–HIREL–06/03

Mechanical Dimensions o f the

PC755 CBGA Package Figure 28 provides the mechanical dimensions and bottom surface nomenclature of the

PC755, 360 CBGA package.

Figure 27. Mechanical Dime ns ion s an d Bot to m Surface Nomenclature of PC755 (CBGA)

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH VARIOUS

SHAPES. BOTTOM SIDE A1 CORNER IS

DESIGNATED WITH A BALL MISSING

FROM THE ARRAY.

360X

12345678910111213141516

A0.3 C

0.15

AA1

171819

Millimeters

DIM Min Max

A2.65 3.20

A1 0.79 0.99

A2 1.10 1.30

A3 —0.60

b0.82 0.93

D25.00 BSC

D1 6.75

E25.00 BSC

E1 7.87

e1.27 BSC

0.2

A1 CORNER

0.2

0.15

PC755/745

2138D–HIREL–06/03

Mechanical Dimensions o f the

PC755 HiTCE Package Figure 28 provides the mechanical dimensions and bottom surface nomenclature of the

PC755, 360 HiTCE package.

Figure 28. Mechanical Dime ns ion s an d Bot to m Sur f ace Nomenclature of PC755 (HiTCE)

360X

12345678910111213141516

A0.3 C

0.15

AA1

0.15 C

171819

Millimeters

DIM Min Max

A2.65 3.24

A1 0.79 0.99

A2 1.10 1.30

A3 —0.60

b0.82 0.93

D25.00 BSC

D1 6.75

E25.00 BSC

E1 7.87

e1.27 BSC

0.2

A1 CORNER

0.2

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH VARIOUS

SHAPES. BOTTOM SIDE A1 CORNER IS

DESIGNATED WITH A BALL MISSING

FROM THE ARRAY.

42 PC755/745 2138D–HIREL–06/03

Mechanical Dimensions o f the

PC755 CI-CGA Package Figure 29 provides the mechanical dimensions and bottom surface nomenclature of

PC755, 360 CI-CGA package

Figure 29. Mechanical Dime ns ion s an d Bot to m Sur f ace Nomenclature of PC755 (CI-CGA)

Clock Relationship

Choices The PC755’s PLL is configured by the PLL_CFG[0-3] signals. For a given SYSCLK

(bus) frequency, the PLL configuration signals set the internal CPU and VCO frequency

of operation. The PLL configuration for the PC755 is shown in Figure 31 for example

frequencies.

360X

12345678910111213141516

A0.3 C

0.15

A4 A2

171819

Millimeters

DIM Min Max

A4.04 BSC

A2 1.10 1.30

1.545 1.695

A3 —0.60

b0.79 0.990

D25.00 BSC

D1 6.75

E25.00 BSC

E1 7.87

0.2

A1 CORNER

0.2

A4 0.82 0.9

A5 0.10 BSC

A6 0.25 0.35

1.27 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH VARIOUS

SHAPES. BOTTOM SIDE A1 CORNER IS

DESIGNATED WITH A BALL MISSING

FROM THE ARRAY.

360 X A

0.15

PC755/745

2138D–HIREL–06/03

Notes: 1. PLL_CFG[0:3] settings not listed are reserved.

2. The sample bus-to-core frequencies shown are fo r reference only. Some PLL confi gurations may select bus, core, or VCO

frequencies which are not useful, not supported, or not tested for by the PC755; see Section «Clock AC Specifications»

page 25 for valid SYSCLK, core, and VCO frequencies.

3. In PLL-bypass mode, the SYSCLK input signal clocks the internal processor directly, the PLL is disabled, and the bus m ode

is set for 1:1 mode operation. This mode is intended for factory use and emulator tool use only.

Note: The AC timing specifications given in this document do not apply in PLL-bypass mode.

4. In PLL off mode, no clocking occurs inside the PC755 regardless of th e SYSCLK input.

Table 18. PC755 Microprocessor PLL Configuration

PLL_CFG [0-3]

Example Bus-to-Core Frequ ency in MHz (VCO Frequency in MHz)

Bus-to-Core

Multiplier Core-to VCO

Multiplier Bus 33

MHz Bus 50

MHz Bus 66

MHz Bus 75

MHz Bus 80

MHz Bus 100

MHz

0100 2x 2x -----200

(400)

1000 3x 2x - - 200

(400) 225

(450) 240

(480) 300

(600)

1110 3.5x 2x - - 233

(466) 263

(525) 280

(560) 350

(700)

1010 4x 2x -200

(400) 266

(533) 300

(600) 320

(640) 400

(800)

0111 4.5x 2x -225

(450) 300

(600) 338

(675) 360

(720) -

1011 5x 2x -250

(500) 333

(666) 375

(750) 400

(800) -

1001 5.5x 2x -275

(550) 366

5733°- - -

1101 6x 2x 200

(400) 300

(600) 400

(800) - - -

0101 6.5x 2x 216

(433) 325

(650) - - - -

0010 7x 2x 233

(466) 350

(700) - - - -

0001 7.5x 2x 250

(500) 375

(750) - - - -

1100 8x 2x 266

(533) 400

(800) - - - -

0110 10x 2x 333

(666) -----

0011 PLL off/bypass PLL off, SYSCLK clocks core circuitry directly, 1x bus-to-core implied

1111 PLL off PLL off, no core clocking occurs

44 PC755/745 2138D–HIREL–06/03

The PC755 generates the clock for the external L2 synchronous data SRAMs by divid-

ing the core clock frequency of the PC755. The divided-down clock is then phase-

adjusted by an on-chip delay-lock-loop (DLL) circuit and should be routed from the

PC755 to the external RAMs. A separ ate clock output, L2SYNC_OUT is sent out half

the distance to the SRAMs and then returned as an input to the DLL on pin L2SYNC_IN

so that the rising-edge of the clock as seen at the external RAMs can be aligned to the

clocking of the internal latches in the L2 bus interface.

The core-to-L2 frequency divisor for th e L2 PLL is selected th rough the L2CLK bits of

the L2CR register. Generally, the divisor must be chosen according to the frequency

supported by the external RAMs, the frequency of the PC755 core, and the phase

adjustment range that the L2 DLL supports. Figure 18 shows various example L2 clock

frequencies that can be obtained for a given set of core frequencies. The minimum L2

frequency target is 80 MHz.

Note: The core and L2 frequen cies are for refe rence only. Some examp les may repre-

sent core or L2 frequencies which are not useful, not supported, or not tested

for by the PC755; see Section “L2 Clock AC Specifications” page 28 for valid

L2CLK frequencies. The L2CR[L2SL] bit should be set for L2CLK frequencies

less than 110 MHz.

System Design

Information

PLL Power Supply Filtering The AVDD and L2AV DD power signals are pr ovide d on the PC75 5 to pr ovid e powe r to the

clock generation phase-locked loop and L2 cache delay-locked loop respectively. To

ensure stability of the internal clock, the power supplied to the AVDD input signal should

be filtered of an y noise in the 5 00 kHz to 10 MHz resonant frequency range of the PLL.

A circuit similar to the one shown in Figure 31 using surface mount capacitors with mini-

mum Effective Series Inductance (ESL) is recommended. Consistent with the

recommendations of Dr. Howard Johnson in High Speed Digital Design: A Handbook of

Black Magic (Prentice Hall, 1993), multiple small capacitors of equal value are recom-

mended over a single large value capacitor.

Table 19. Sample Core-to-L2 Frequencies

Core Frequency in MHz 11.5 22.5 3

250 250 166 125 100 83

266 266 177 133 106 89

275 275 183 138 110 92

300 300 200 150 120 100

325 325 217 163 130 108

333 333 222 167 133 111

350 350 233 175 140 117

366 366 244 183 146 122

375 375 250 188 150 125

400 400 266 200 160 133

PC755/745

2138D–HIREL–06/03

The circuit shou ld be placed as close as possible to the AVDD pin to mini mize noise cou-

pled from nearby circuits. An identical but separate circuit should be placed as close as

possible to the L2AVDD pin. It is often possible to route directly from the capacitors to the

AVDD pin, which is on the periphery of th e 360 BGA footprint, without the inductance of

vias. The L2AVDD pin may be more difficult to route but is proportionately less critical.

Figure 30. PLL Power Supply Filter Circuit

Power Supply Voltage

Sequencing The notes in Figure 32 contain cautions about the sequencing of the external bus volt-

ages and core voltage of the PC755 (when they are different). These cautions are

necessary for the long term reliability of the part. If they are violated, the ESD (Electro-

static Discharge) protection diod es will be forward biased and excessive current can

flow through these diodes. If the system power supply design does not control the volt-

age sequencing, the circuit of Figure 32 can be added to meet these requirements. The

MUR420 Schottky diodes of Figure 32 control the maximum potential difference

between the external bus and core power supp lies on power-up and the 1N5820 diodes

regulate the maximum potential difference on power-down.

Figure 31. Example Voltage Sequencing Circuit

Decoupling

Recommendations Due to the PC755’s dynamic power management feature, large address and data

buses, and high operating frequencies, the PC755 can generate transient power surges

and high frequency noise in its power supply, especially while driving large capacitive

loads. This noise must be pr evente d from r eaching o ther co mponents in the PC75 5 sys-

tem, and the PC755 itself require s a clean, tightly re gul ated sour ce of power. Ther efore,

it is recommended that the system designer place at least one decoupling capacitor at

each VDD, OVDD, and L2OVDD pin of the PC755. It is also recommended that these

decoupling capacitors receive thei r power from separate VDD, (L2)OVDD and GND power

planes in the PCB, utilizing short traces to minimize inductance.

These capacitors should have a value of 0.01 µF or 0.1 µF. Only ceramic SMT (surface

mount technology) capacitors should be used to minimize lead inductance, preferably

0508 or 0603 orien tations where connections are made along the length of the part.

VDD AVDD (or L2AVDD)

10 Ω

2.2 µF 2.2 µF

GND

Low ESL Surface Mount Capacitors

3.3V 2.0V

MURS320

1N5820

MURS320

1N5820

46 PC755/745 2138D–HIREL–06/03

In addition, it is recommended that there be several bulk storage capacitors distributed

around the PCB, feeding the VDD, L2OVDD, and OV vplanes, to enable quick recharging

of the smaller chip cap acitors. These bulk ca pacitors should have a low ESR (equivalent

series resistance) rating to ensure the quick response time necessary. They should a lso

be connected to the power and ground planes through two vias to minimize inductance.

Suggested bulk capacitors – 100-330 µF (AVX TPS tantalum or Sanyo OSCON).

Connection

Recommendations To ensure reliable operation, it is highly recommended to connect unus ed inputs to an

appropriate signal level through a resistor. Unused active low inputs should be tied to

OVDD. Unused active high inputs should be connected to GND. All NC (no-connect) sig-

nals must remain unconnected .

Power and ground connections must be made to all external VDD, OVDD, L2OVDD, and

GND pins of the PC755.

Output Buffer DC Impedance The PC755 60x and L2 I/O drivers are characte rized over process, voltage, and temper-

ature. To measure Z0, an external resistor is connected fr om the chip pad to (L2)OV DD or

GND. Then, the value of each resistor is varied until the pad voltage is (L2)OVDD/2 (See

Figure 33).

The output impedance is the average of two components, the resistances of the pull-up

and pull-down devices. When Data is held low, SW2 is closed (SW1 is open), and RN is

trimmed until the voltage at the pad equals (L2)O VDD/2. RN then becomes the resistan ce

of the pull-down devices. When Data is held high, SW1 is closed (SW2 is open), and RP

is trimmed until the voltage at the pad equals (L2)OVDD/2. RP then becomes the resis-

tance of the pull-up devices.

NO TAG describes the driver impedance measurement circuit described above.

Figure 32. Driver Impedance Measurement Circuit

(L2)OVDD

OGND

Pad

Data

SW1

SW2

(L2)OVDD

PC755/745

2138D–HIREL–06/03

Alternately, the following is another method to determine the output impedance of the

PC755. A voltage source, Vforce, i s connected to the outp ut of the PC755 as in Figure 3 3.

Data is held low, the voltage source is set to a value that is equal to (L2)OVDD/2 and the

current sourced by Vforce is measured . The voltage drop across th e pull-down device,

which is equal to (L2)OVDD/2, is divided by the measure d current to dete rmine the ou tput

impedance of the pull-d own device, RN. Similar ly, the impe dance of the pull-up device is

determined by dividing the voltage drop of the pull-up , (L2)OVDD/2, by the current sa nk

by the pull-up when the data is high and Vforce is equal to (L2)OVDD/2. This method can

be employed with either empirical data from a test set up or with data from simulation

models, such as IBIS.

RP and RN are designed to be close to each other in value. Then Z0 = (RP + RN)/2.

Figure 33 describes the alternate driver impe dance measurement circuit.

Figure 33. Alternate Driver Impedance Measurement Circuit

Table 20 summarizes the signal impedance results. The driver impedance values were

characterized at 0°C, 65°C, and 105°C. The impedance increases with junction temper-

ature and is relatively unaffected by bus voltage.

Pull–up Resistor

Requirements The PC755 requires pull-up resistors (1 kΩ – 5 kΩ) on several control pins of the bus

interface to maintain the control signals in the negated state after they have been

actively negated and released by the processor or o ther bus masters. These pins are

TS, ABB, AACK, ARTRY, DBB, DBWO, TA, TEA, and DBDIS. DRTRY should also be

connected to a pull-up resistor (1 kΩ – 5 kΩ) if it will be used by the system; otherwise,

this signal should be connected to HRESET to select NO-DRTRY mode.

Three test pins also require pull-up resistors (100Ω – 1 kΩ). These pins are

L1_TSTCLK, L2_TSTCLK, and LSSD_MODE. These signals are for factory use only

and must be pulled up to OVDD for normal machine operation.

Table 20. Impedance Characteristics

VDD = 2.0V, OVDD = 3.3V, Tc = 0 - 105°C

Impedance Processor bus L2 bus Symbol Unit

RN 25-36 25-36 Z0W

RP 26-39 26-39 Z0W

(L2)OVDD

BGA

Data Pin

OGND

Vforce

48 PC755/745 2138D–HIREL–06/03

In addition, CKSTP_OUT is an open-drain style output that requires a pull-up resistor (1

kΩ – 5 kΩ) if it is used by the system.

During inactive periods on the bus, the address and transfer attributes may not be

driven by any master and may, therefore, float in the high-impedance state for relatively

long periods of time. Since the processor must continually monitor these signals for

snooping, this float condition m ay cause addi tional power dr aw by the input receive rs on

the processor or by other receivers in the system. These signals can be pulled up

through weak (10 kΩ) pull-up resistors by the system or may be otherwise driven by the

system during inactive periods of the bus to avoid this additional power draw, but

address bus pull-up resistors are not neccessary for proper device operation. The

snooped address and transfer attribu te inputs are:

A[0:31], AP[0:3], TT[0:4], TBST, and GBL.

The data bus input receivers are normally turned off when no read operation is in

progress and, therefore, do not require pull-up resistors on the bus. Other data bus

receivers in the system, however, may require pull-ups, or that those signals be other-

wise driven by the system during inactive periods by the system. The data bus signals

are: DH[0:31], DL[0:31], and DP[0:7].

If 32-bit data bus mode is selected, the input receivers of the unused data and parity bits

will be disabled, and their outputs will drive logic zeros w hen they would otherwise nor-

mally be driven. For this mo de, these pins do not require p ull-up resistors, a nd should be

left unconne cte d by the system to minimize possible output switching.

If address or data parity is not used by the system, and the respective parity checking is

disabled through HID0, the input receivers for those pins are disabled, and those pins

do not require pull-up resistors and should be left unconnected by the system. If all par-

ity generation is disabled through HID0, then all parity checking should also be disabled

through HID0, and all parity pins may be left unconnected by the system.

Definitions

Datasheet Status Validity

Objective specification This datasheet contains target and goal specification for

discussion with customer and application validation. Before design phase.

Target specification This datasheet contains target or goal specification for

product development. Valid during the design phase.

Preliminary specification ∝ site This datasheet contains preliminary data. Additional data

may be published later; could include simulati on result. Val id before characterization phase.

Preliminary specification β site This datasheet contains also characterization results. Valid before the industrialization

phase.

Product specification This datasheet contains final product spe ci fication. Valid for production purpose.

Limiting Values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the

limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at

any other conditions above those given in th e Characteristics sections of the specification is not implied. Exposure to limiting values

for extended periods may affect device reliability.

Application Information

Where application information is given, it is advisory and does not form part of the specification.

PC755/745

2138D–HIREL–06/03

Life Support

Applications These products are not designed for use in life support appliances, devices, or systems

where malfunction of these products can reasonably be expected to result in personal

injury. Atmel customers using or selling these products for use in such applications do

so at their own risk and agree to fully indemnity Atmel for any damages resulting from

such improper use or sale.

Differences with

Commercial Part

Ordering Information

Note: For availability of different versions, contact your Atmel sales office.

Commercial part Military part

Temperature range Tj = 0 to 105°C Tj = -55°C to 125°C

PC755C M ZF U 300 L x

Type

Package:

ZF: FC-PBGA

G: CBGA

GS: CI-CGA

GH: HiTCE Screening Level(1)

U: Upscreening Test

Revision Level(1)

E: Rev. 2.8

Temperature Range: Tj

M: -55 C, +125 C

V: -40 C, +110 C

Bus divider

(to be confirmed)

L: Any valid PLL configuration

Max internal processor speed

300: 300 MHz

350: 350 MHz

366: 366 MHz

400: 400 MHz

Printed on recycled paper.

Disclaimer: Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard

warranty which is detailed in Atmel’s Terms and Cond itions loca te d on the Company’s we b site. The Compan y assumes no responsib ility fo r an y

errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any t ime without notice, and

does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are

granted by the Company in connection with the sale of Atmel pr oducts, expressly or by implication. Atmel’s products are not authorized for use

as critical components in life support devices or systems.

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