PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
APPLICATIONS
TRANSDUCER APPLICATIONS
TEMPERATURE MEASUREMENT
ELECTRONIC SCALES
MEDICAL INSTRUMENTATION
BATTERY-POWERED INSTRUMENTS
HANDHELD TEST EQUIPMENT
0.05µV/°C max, SINGLE-SUPPLY
CMOS OPERATIONAL AMPLIFIERS
Zerø-Drift Series
FEATURES
LOW OFFSET VOLTAGE: 5µV (max)
ZERO DRIFT: 0.05µV/°C (max)
QUIESCENT CURRENT: 285µA
SINGLE-SUPPLY OPERATION
SINGLE AND DUAL VERSIONS
SHUTDOWN
Micro
SIZE
PACKAGES
DESCRIPTION
The OPA334 and OPA335 series of CMOS operational
amplifiers use auto-zeroing techniques to simultaneously
provide very low offset voltage (5µV max), and near-zero drift
over time and temperature. These miniature, high-precision,
low quiescent current amplifiers offer high input impedance
and rail-to-rail output swing. Single or dual supplies as low as
+2.7V (±1.35V) and up to +5.5V (±2.75V) may be used.
These op amps are optimized for low-voltage, single-supply
operation.
The OPA334 family includes a shutdown mode. Under logic
control, the amplifiers can be switched from normal operation
to a standby current of 2µA. When the Enable pin is con-
nected high, the amplifier is active. Connecting Enable low
disables the amplifier, and places the output in a high-
impedance state.
The OPA334 (single version with shutdown) comes in
Micro
SIZE SOT23-6. The OPA335 (single version without
shutdown) is available in SOT23-5, and SO-8. The OPA2334
(dual version with shutdown) comes in
Micro
SIZE MSOP-10.
The OPA2335 (dual version without shutdown) is offered in
the MSOP-8 and SO-8 packages. All versions are specified
for operation from –40°C to +125°C.
OPA334
OPA2334
OPA335
OPA2335
SBOS245D – JUNE 2002 – REVISED JULY 2003
Copyright © 2002-2003, Texas Instruments Incorporated
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
Offset Voltage (µV)
3.0
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
3.0
Population
OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION
Offset Voltage Drift (µV/°C)
Population
0
0.005
0.010
0.015
0.020
0.025
0.030
0.035
0.040
0.045
0.050
Absolute Value;
Centered Around Zero
OPA2334
OPA335
OPA2335
OPA2335
www.ti.com
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2www.ti.com
OPA334, OPA2334, OPA335, OPA2335
SBOS245D
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD DESIGNATOR(1) RANGE MARKING NUMBER MEDIA, QUANTITY
Shutdown Version
OPA334 SOT23-6 DBV 40°C to +125°C OAOI OPA334AIDBVT Tape and Reel, 250
"""""OPA334AIDBVR Tape and Reel, 3000
OPA2334 MSOP-10 DGS 40°C to +125°C BHE OPA2334AIDGST Tape and Reel, 250
"""""OPA2334AIDGSR Tape and Reel, 2500
Non-Shutdown Version
OPA335 SOT23-5 DBV 40°C to +125°C OAPI OPA335AIDBVT Tape and Reel, 250
"""""OPA335AIDBVR Tape and Reel, 3000
OPA335 SO-8 D 40°C to +125°C OPA335 OPA335AID Rails, 100
"""""OPA335AIDR Tape and Reel, 2500
OPA2335 SO-8 D 40°C to +125°C OPA2335 OPA2335AID Rails, 100
"""""OPA2335AIDR Tape and Reel, 2500
OPA2335 MSOP-8 DGK 40°C to +125°C BHF OPA2335AIDGKT Tape and Reel, 250
"""""OPA2335AIDGKR Tape and Reel, 2500
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
Supply Voltage .................................................................................... +7V
Signal Input Terminals, Voltage(2) ........................... 0.5V to (V+) + 0.5V
Current(2) .................................................. ±10mA
Output Short Circuit(3) .............................................................. Continuous
Operating Temperature ..................................................40°C to +150°C
Storage Temperature .....................................................65°C to +150°C
Junction Temperature.................................................................... +150°C
Lead Temperature (soldering, 10s)............................................... +300°C
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may de-
grade device reliability. These are stress ratings only, and functional opera-
tion of the device at these, or any other conditions beyond those specified,
is not implied. (2) Input terminals are diode-clamped to the power-supply
rails. Input signals that can swing more than 0.5V beyond the supply rails
should be current-limited to 10mA or less. (3) Short-circuit to ground, one
amplifier per package.
ABSOLUTE MAXIMUM RATINGS(1)
PACKAGE/ORDERING INFORMATION
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper han-
dling and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PIN CONFIGURATIONS
NOTES: (1) NC indicates no internal connection. (2) Pin 1 of the SOT23-6 is
determined by orienting the package marking as indicated in the diagram.
1
2
3
5
4
V+
In
Out
V
+In
OPA335
SOT23-5
1
2
3
4
8
7
6
5
NC(1)
V+
Out
NC(1)
NC(1)
In
+In
V
OPA335
SO-8
1
2
3
4
8
7
6
5
V+
Out B
In B
+In B
Out A
In A
+In A
V
OPA2335
SO-8, MSOP-8
A
B
1
2
3
6
5
4
V+
Enable
In
Out
V
+In
OPA334(2)
OAOI
SOT23-6
1
2
3
4
5
10
9
8
7
6
V+
Out B
In B
+In B
Enable B
Out A
In A
+In A
V
Enable A
OPA2334
MSOP-10
A
B
3
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OPA334, OPA2334, OPA335, OPA2335
SBOS245D
OPA334AI, OPA335AI
OPA2334AI, OPA2335AI
ELECTRICAL CHARACTERISTICS
Boldface limits apply over the specified temperature range, TA = 40°C to +125°C.
At TA = +25°C, VS = +5V, RL = 10k connected to VS/ 2, and VOUT = VS/ 2, unless otherwise noted.
PARAMETER CONDITION MIN TYP MAX UNITS
OFFSET VOLTAGE
Input Offset Voltage VOS VCM = VS/2 1 5 µV
vs Temperature dVOS /dT ±0.02 ±0.05 µV/°C
vs Power Supply PSRR VS = +2.7V to +5.5V, VCM = 0, Over Temperature ±1±2µV/V
Long-Term Stability(1) See Note (1)
Channel Separation, dc 0.1 µV/V
INPUT BIAS CURRENT
Input Bias Current IBVCM = VS/2 ±70 ±200 pA
Over Temperature 1nA
Input Offset Current IOS ±120 ±400 pA
NOISE
Input Voltage Noise, f = 0.01Hz to 10Hz en1.4 µVPP
Input Current Noise Density, f = 10Hz in20 fA/
Hz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range VCM (V) 0.1 (V+) 1.5 V
Common-Mode Rejection Ratio CMRR (V) 0.1V < VCM < (V+) 1.5V, Over Temperature 110 130 dB
INPUT CAPACITANCE
Differential 1pF
Common-Mode 5pF
OPEN-LOOP GAIN
Open-Loop Voltage Gain, Over Temperature AOL 50mV < VO < (V+) 50mV, RL = 100k, VCM = VS/2 110 130 dB
Over Temperature 100mV < VO < (V+) 100mV, RL = 10k, VCM = VS/2 110 130 dB
FREQUENCY RESPONSE
Gain-Bandwidth Product GBW 2 MHz
Slew Rate SR G = +1 1.6 V/µs
OUTPUT
Voltage Output Swing from Rail RL = 10k, Over Temperature 15 100 mV
Voltage Output Swing from Rail RL = 100k, Over Temperature 1 50 mV
Short-Circuit Current ISC ±50 mA
Capacitive Load Drive CLOAD See Typical Characteristics
SHUTDOWN
tOFF 1µs
tON(2) 150 µs
VL(shutdown) 0 +0.8 V
VH(amplifier is active) 0.75 (V+) 5.5 V
Input Bias Current of Enable Pin 50 pA
IQSD 2µA
POWER SUPPLY
Operating Voltage Range 2.7 5.5 V
Quiescent Current: OPA334, OPA335 IQIO = 0 285 350 µA
Over Temperature 450 µA
OPA2334, OPA2335 (totaltwo amplifiers) IO = 0 570 700 µA
Over Temperature 900 µA
TEMPERATURE RANGE
Specified Range 40 +125 °C
Operating Range 40 +150 °C
Storage Range 65 +150 °C
Thermal Resistance
θ
JA °C/W
SOT23-5, SOT23-6 Surface-Mount 200 °C/W
MSOP-8, MSOP-10, SO-8 Surface-Mount 150 °C/W
NOTES: (1) 500-hour life test at 150°C demonstrated randomly distributed variation approximately equal to measurement repeatability of 1µV. (2) Device requires
one complete cycle to return to VOS accuracy.
4www.ti.com
OPA334, OPA2334, OPA335, OPA2335
SBOS245D
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = +5V, RL = 10k connected to VS/ 2, and VOUT = V S/2, unless otherwise noted.
OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION
Offset Voltage Drift (µV/°C)
Population
0
0.005
0.010
0.015
0.020
0.025
0.030
0.035
0.040
0.045
0.050
Absolute Value;
Centered Around Zero
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
Offset Voltage (µV)
3.0
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
3.0
Population
INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE
Input Bias Current (pA)
0
1200
1000
800
600
400
200
02.5 3.02.01.51.00.5
Common-Mode Voltage (V)
3.5
40°C+25°C
+125°C
INPUT BIAS CURRENT vs TEMPERATURE
Input Bias Current (pA)
1000
100
10
Temperature (°C)
40 4020020 1201008060
QUIESCENT CURRENT (per channel)
vs TEMPERATURE
Quiescent Current (µA)
40
400
350
300
250
200
150
100
50
04020020
Temperature (°C)
1201008060
V
S
= +5.5V
V
S
= +2.7V
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
(V+)
(V+) 1
(V) + 1
(V)0246810
Output Current (mA)
Output Voltage Swing (V)
+125°C
5.5V
2.7V
+25°C
40°C
+125°C
+25°C40°C
5
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OPA334, OPA2334, OPA335, OPA2335
SBOS245D
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +5V, RL = 10k connected to VS/ 2, and VOUT = V S/2, unless otherwise noted.
LARGE-SIGNAL RESPONSE
Time (5µs/div)
Output Voltage (1V/div)
G = 1
CL = 300pF
SMALL-SIGNAL RESPONSE
Time (5µs/div)
Output Voltage (50mV/div)
G = +1
CL = 50pF
OPEN-LOOP GAIN/PHASE vs FREQUENCY
A
OL
(dB)
140
120
100
80
60
40
20
0
20
Phase (°)
80
90
100
110
120
130
140
150
160
Frequency (Hz)
0.1 10k1k100101 10M1M100k
Phase
Gain
POSITIVE OVER-VOLTAGE RECOVERY
Time (25µs/div)
200mV/div1V/div
0
0
Input
Output
100
10k
+2.5V
2.5V
OPA335
NEGATIVE OVER-VOLTAGE RECOVERY
Time (25µs/div)
200mV/div1V/div
0
0
Input
Output 100
10k
+2.5V
2.5V
OPA335
COMMON-MODE REJECTION vs FREQUENCY
Common-Mode Rejection (dB)
1
140
120
100
80
60
40
20
010k1k10010
Frequency (Hz)
10M1M100k
6www.ti.com
OPA334, OPA2334, OPA335, OPA2335
SBOS245D
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +5V, RL = 10k connected to VS/ 2, and VOUT = VS/ 2, unless otherwise noted.
NOISE vs FREQUENCY
Noise (nV/Hz)
1
1000
100
10 1k10010
Frequency (Hz)
100k10k
SAMPLING FREQUENCY vs TEMPERATURE
Sampling Frequency (kHz)
40
13
12
11
10
9
810 50 110 125
Temperature (°C)
20 80
SAMPLING FREQUENCY vs SUPPLY VOLTAGE
Frequency (kHz)
2.7
11.0
10.9
10.8
10.7
10.6
10.5
10.4
10.3
10.2
10.1
10.0 3.73.2 5.2 5.5
Supply Voltage (V)
4.74.2
SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE
(VS = 2.7V to 5V)
Overshoot (%)
10
50
45
40
35
30
25
20
15
10
5
0100 1000
Load Capacitance (pF)
RL = 10k
0.01Hz TO 10Hz NOISE
10s/div
400nV/div
POWER-SUPPLY REJECTION RATIO vs FREQUENCY
Power-Supply Rejection Ratio (dB)
140
120
100
80
60
40
20
0
Frequency (Hz)
10 1k100 1M100k10k
+PSRR
PSRR
7
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OPA334, OPA2334, OPA335, OPA2335
SBOS245D
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +5V, RL = 10k connected to VS/2, and VOUT = VS/ 2, unless otherwise noted.
APPLICATIONS INFORMATION
The OPA334 and OPA335 series op amps are unity-gain
stable and free from unexpected output phase reversal. They
use auto-zeroing techniques to provide low offset voltage
and very low drift over time and temperature.
Good layout practice mandates use of a 0.1µF capacitor
placed closely across the supply pins.
For lowest offset voltage and precision performance, circuit
layout and mechanical conditions should be optimized. Avoid
temperature gradients that create thermoelectric (Seebeck)
effects in thermocouple junctions formed from connecting
dissimilar conductors. These thermally-generated potentials
can be made to cancel by assuring that they are equal on
both input terminals.
Use low thermoelectric-coefficient connections (avoid dis-
similar metals).
Thermally isolate components from power supplies or
other heat-sources.
Shield op amp and input circuitry from air currents, such as
cooling fans.
Following these guidelines will reduce the likelihood of junc-
tions being at different temperatures, which can cause ther-
moelectric voltages of 0.1µV/°C or higher, depending on
materials used.
OPERATING VOLTAGE
The OPA334 and OPA335 series op amps operate over a
power-supply range of +2.7V to +5.5V (±1.35V to ±2.75V).
Supply voltages higher than 7V (absolute maximum) can
permanently damage the amplifier. Parameters that vary
over supply voltage or temperature are shown in the Typical
Characteristics section of this data sheet.
OPA334 ENABLE FUNCTION
The enable/shutdown digital input is referenced to the V
supply voltage of the amp. A logic high enables the op amp. A
valid logic high is defined as > 75% of the total supply voltage.
The valid logic high signal can be up to 5.5V above the negative
supply, independent of the positive supply voltage. A valid
logic low is defined as < 0.8V above the V supply pin. If dual
or split power supplies are used, be sure that logic input signals
are properly referred to the negative supply voltage. The
Enable pin must be connected to a valid high or low voltage, or
driven, not left open circuit.
The logic input is a high-impedance CMOS input, with sepa-
rate logic inputs provided on the dual version. For battery-
operated applications, this feature can be used to greatly
reduce the average current and extend battery life.
The enable time is 150µs, which includes one full auto-zero
cycle required by the amplifier to return to VOS accuracy.
Prior to this time, the amplifier functions properly, but with
unspecified offset voltage.
Disable time is 1µs. When disabled, the output assumes a
high-impedance state. This allows the OPA334 to be oper-
ated as a gated amplifier, or to have the output multiplexed
onto a common analog output bus.
INPUT VOLTAGE
The input common-mode range extends from (V) 0.1V to
(V+) 1.5V. For normal operation, the inputs must be limited
to this range. The common-mode rejection ratio is only valid
within the valid input common-mode range. A lower supply
voltage results in lower input common-mode range; there-
fore, attention to these values must be given when selecting
the input bias voltage. For example, when operating on a
single 3V power supply, common-mode range is from 0.1V
below ground to half the power-supply voltage.
COMMON-MODE RANGE vs SUPPLY VOLTAGE
Common-Mode Range (V)
2.7
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0.5 3.73.2 5.2 5.5
Supply Voltage (V)
4.74.2
Minimum Common-Mode
Maximum Common-Mode
SETTLING TIME vs CLOSED-LOOP GAIN
Settling Time (µs)
1
100
10
110
Gain (V/V)
100
0.1%
0.01%
Unity-gain
requires one
complete Auto-Zero
Cyclesee text.
8www.ti.com
OPA334, OPA2334, OPA335, OPA2335
SBOS245D
FIGURE 1. Input Current Protection.
5k
OPA335
10mA max
+5V
V
IN
V
OUT
I
OVERLOAD
Current-limiting resistor
required if input voltage
exceeds supply rails by
0.5V.
Normally, input bias current is approximately 70pA; however,
input voltages exceeding the power supplies can cause
excessive current to flow in or out of the input pins. Momen-
tary voltages greater than the power supply can be tolerated
if the input current is limited to 10mA. This is easily accom-
plished with an input resistor, as shown in Figure 1.
INTERNAL OFFSET CORRECTION
The OPA334 and OPA335 series op amps use an auto-zero
topology with a time-continuous 2MHz op amp in the signal
path. This amplifier is zero-corrected every 100µs using a
proprietary technique. Upon power-up, the amplifier requires
one full auto-zero cycle of approximately 100µs to achieve
specified VOS accuracy. Prior to this time, the amplifier
functions properly but with unspecified offset voltage.
This design has remarkably little aliasing and noise. Zero
correction occurs at a 10kHz rate, but there is virtually no
fundamental noise energy present at that frequency. For all
practical purposes, any glitches have energy at 20MHz or
higher and are easily filtered, if required. Most applications
are not sensitive to such high-frequency noise, and no
filtering is required.
Unity-gain operation demands that the auto-zero circuitry
correct for common-mode rejection errors of the main ampli-
fier. Because these errors can be larger than 0.01% of a full-
scale input step change, one calibration cycle (100µs) can be
required to achieve full accuracy. This behavior is shown in
the typical characteristic section, see
Settling Time vs Closed-
Loop Gain
.
ACHIEVING OUTPUT SWING TO THE OP AMPS
NEGATIVE RAIL
Some applications require output voltage swing from 0V to a
positive full-scale voltage (such as +2.5V) with excellent
accuracy. With most single-supply op amps, problems arise
when the output signal approaches 0V, near the lower output
FIGURE 2. Op Amp with Pull-Down Resistor to Achieve
VOUT = Ground.
swing limit of a single-supply op amp. A good single-supply
op amp may swing close to single-supply ground, but will not
reach ground. The output of the OPA334 or OPA335 can be
made to swing to ground, or slightly below, on a single-
supply power source. To do so requires use of another
resistor and an additional, more negative, power supply than
the op amps negative supply. A pull-down resistor may be
connected between the output and the additional negative
supply to pull the output down below the value that the output
would otherwise achieve, as shown in Figure 2.
The OPA334 and OPA335 have an output stage that allows
the output voltage to be pulled to its negative supply rail, or
slightly below using the above technique. This technique only
works with some types of output stages. The OPA334 and
OPA335 have been characterized to perform well with this
technique. Accuracy is excellent down to 0V and as low as
2mV. Limiting and non-linearity occurs below 2mV, but
excellent accuracy returns as the output is again driven
above 2mV. Lowering the resistance of the pull-down resis-
tor will allow the op amp to swing even further below the
negative rail. Resistances as low as 10k can be used to
achieve excellent accuracy down to 10mV.
LAYOUT GUIDELINES
Attention to good layout practices is always recommended.
Keep traces short. When possible, use a PCB ground plane
with surface-mount components placed as close to the de-
vice pins as possible. Place a 0.1µF capacitor closely across
the supply pins. These guidelines should be applied through-
out the analog circuit to improve performance and provide
benefits such as reducing the EMI (electromagnetic-interfer-
ence) susceptibility.
VOUT
RP = 40k
Op Amps V = Gnd
OPA335
VIN
V+ = +5V
5V
Additional
Negative
Supply
9
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OPA334, OPA2334, OPA335, OPA2335
SBOS245D
FIGURE 3. Temperature Measurement Circuit.
++
+
––
+
4.096V
0.1µF
+5V
Zero Adj.
K-Type
Thermocouple
40.7µV/°C
R
2
549
R
9
150k
R
5
31.6k
R
1
6.04k
R
6
200
+5V
0.1µF
R
2
2.94k
V
O
R
3
60.4
R
4
6.04k
OPA335
D1
REF3040
FIGURE 4. Auto-Zeroed Transimpedance Amplifier.
FIGURE 5. Single Op Amp Bridge Amplifier Circuits.
R1
VEX
VOUT
VREF
R1
OPA335
R
R
RR +5V
a. 5V Supply Bridge Amplifier.
V
EX
= +2.5V
R
1
= 105
@ V
S
= 2.7V,
V
CMmax
= 1.2V
V
OUT
OPA335
300
Bridge
+2.7V
R
2
Select R
1
so bridge
output V
CMmax
.
V
REF
R
2
b. 2.7V Supply Bridge Amplifier.
1M
I
IN
R
1
R
2
C
1
C
2
40k
(1)
5V
OPA343
OPA335
Photodiode
NOTE: (1) Optional pull-down
resistor to allow below
ground output swing.
+5V
+5V
b. Single Supply.
1M
IIN R1
R2
+2.5V
OPA343
2.5V
+2.5V
C1
C2
2.5V
OPA335
Photodiode
a. Split Supply.
10 www.ti.com
OPA334, OPA2334, OPA335, OPA2335
SBOS245D
FIGURE 7. Low-Side Current Measurement.
ADS1100
5V
V
11.5k
I2C
1k RS
Load
(PGA Gain = 8)
5V FS
50mV
Shunt
FS = 0.63V
G = 12.5
NOTE: (1) Pull-down resistor
to allow accurate swing to 0V.
5V
R3(1)
40k
+5V
OPA335
FIGURE 6. Dual Op Amp IA Bridge Amplifier.
R2
5V
VREF
R3(1)
40k
G = 1 + R2
R1
R1
R1
+5V +5V
R2
1/2
OPA2335
R
R
RR VOUT
1/2
OPA2335
NOTE: (1) Optional pull-down resistor
to allow accurate swing to 0V.
11
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OPA334, OPA2334, OPA335, OPA2335
SBOS245D
FIGURE 8. High Dynamic Range Transimpedance Amplifier.
5V
R
2(1)
2k
R
1
4.12k
+5V
R
3
100V
OUT
1MHz Bandwidth
V
OS
10µV
OPA353
C
1
56pF
C
2
0.1µF
C
3
1nF
5V
R
5(1)
40k
+5V
R
6
49.9k
R
4
100k
OPA335
C
4
10nF
Photodiode
2pF
C
6
0.1µF
C
5
10nF
R
7
1k
Photodiode
Bias C
7
1µF
NOTE: (1) Pull-down resistors to allow accurate swing to 0V.
12 www.ti.com
OPA334, OPA2334, OPA335, OPA2335
SBOS245D
PACKAGE DRAWINGS
DBV (R-PDSO-G6) PLASTIC SMALL-OUTLINE
0,10
M
0,20
0,95
08
0,25
0,55
0,35
Gage Plane
0,15 NOM
4073253-5/G 01/02
2,60
3,00
0,50
0,25
1,50
1,70
46
31
2,80
3,00
1,45
0,95 0,05 MIN
Seating Plane
6X
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Leads 1, 2, 3 may be wider than leads 4, 5, 6 for package orientation.
13
www.ti.com
OPA334, OPA2334, OPA335, OPA2335
SBOS245D
DGS (S-PDSO-G10) PLASTIC SMALL-OUTLINE PACKAGE
0,69
0,41
0,25
0,15 NOM
Gage Plane
4073272/B 08/01
4,98
0,17
6
3,05 4,78
2,95
10
5
3,05
2,95
1
0,27
0,15
0,05
1,07 MAX
Seating Plane
0,10
0,50
M
0,08
0°6°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
A. Falls within JEDEC MO-187
PACKAGE DRAWINGS (Cont.)
14 www.ti.com
OPA334, OPA2334, OPA335, OPA2335
SBOS245D
PACKAGE DRAWINGS (Cont.)
DBV (R-PDSO-G5) PLASTIC SMALL-OUTLINE
0,10
M
0,20
0,95
0° 8°
0,25
0,35
0,55
Gage Plane
0,15 NOM
4073253-4/G 01/02
2,60
3,00
0,50
0,30
1,50
1,70
45
31
2,80
3,00
0,95
1,45 0,05 MIN
Seating Plane
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC MO-178
15
www.ti.com
OPA334, OPA2334, OPA335, OPA2335
SBOS245D
PACKAGE DRAWINGS (Cont.)
D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
8 PINS SHOWN
8
0.197
(5,00)
A MAX
A MIN (4,80)
0.189 0.337
(8,55)
(8,75)
0.344
14
0.386
(9,80)
(10,00)
0.394
16
DIM
PINS **
4040047/E 09/01
0.069 (1,75) MAX
Seating Plane
0.004 (0,10)
0.010 (0,25)
0.010 (0,25)
0.016 (0,40)
0.044 (1,12)
0.244 (6,20)
0.228 (5,80)
0.020 (0,51)
0.014 (0,35)
1 4
8 5
0.150 (3,81)
0.157 (4,00)
0.008 (0,20) NOM
0° 8°
Gage Plane
A
0.004 (0,10)
0.010 (0,25)0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012
16 www.ti.com
OPA334, OPA2334, OPA335, OPA2335
SBOS245D
PACKAGE DRAWINGS (Cont.)
DGK (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE
0,69
0,41
0,25
0,15 NOM
Gage Plane
4073329/C 08/01
4,98
0,25
5
3,05 4,78
2,95
8
4
3,05
2,95
1
0,38
1,07 MAX
Seating Plane
0,65 M
0,08
0°6°
0,10
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC MO-187
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
OPA2334AIDGSR ACTIVE MSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2334AIDGSRG4 ACTIVE MSOP DGS 10 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2334AIDGST ACTIVE MSOP DGS 10 250 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2334AIDGSTG4 ACTIVE MSOP DGS 10 250 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2335AID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2335AIDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2335AIDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2335AIDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2335AIDGKT ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2335AIDGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR
OPA2335AIDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA2335AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA334AIDBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA334AIDBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA334AIDBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA334AIDBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA335AID ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
OPA335AIDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
OPA335AIDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
OPA335AIDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
OPA335AIDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
OPA335AIDG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA335AIDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
OPA335AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 3
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF OPA2335 :
Military: OPA2335M
NOTE: Qualified Version Definitions:
Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
OPA2334AIDGSR MSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA2334AIDGST MSOP DGS 10 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA2335AIDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA2335AIDGKT VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
OPA2335AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA334AIDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3
OPA334AIDBVT SOT-23 DBV 6 250 180.0 8.4 3.2 3.1 1.39 4.0 8.0 Q3
OPA335AIDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
OPA335AIDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
OPA335AIDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
OPA2334AIDGSR MSOP DGS 10 2500 367.0 367.0 35.0
OPA2334AIDGST MSOP DGS 10 250 210.0 185.0 35.0
OPA2335AIDGKR VSSOP DGK 8 2500 367.0 367.0 35.0
OPA2335AIDGKT VSSOP DGK 8 250 210.0 185.0 35.0
OPA2335AIDR SOIC D 8 2500 367.0 367.0 35.0
OPA334AIDBVR SOT-23 DBV 6 3000 210.0 185.0 35.0
OPA334AIDBVT SOT-23 DBV 6 250 210.0 185.0 35.0
OPA335AIDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
OPA335AIDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
OPA335AIDR SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2
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