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2005, 2007
BIPOLAR ANALOG INTEGRATED CIRCUIT
μ
PC29xxB Series
THREE-TERMINAL LOW DROPOUT VOLTAGE REGULATOR
(OUTPUT CURRENT: 1.0 A)
DATA SHEET
Document No. G17567EJ4V0DS00 (4th edition)
Date Published August 2007 NS
Printed in Japan The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
DESCRIPTION
The
μ
PC29xxB series is a series of three-terminal low dropout voltage regulators with 1.0 A output current. This
series is suitable for low voltage operated IC and has 4 output voltage types, 1.8 V, 2.5 V, 3.3 V and 5.0 V. Compared
with the
μ
PC29xx and
μ
PC29xxA series, this series has improved output voltage tolerance (VO ± 2%), quiescent
current (1.8 mA TYP. (IO = 0 A)), and short-circuit current.
FEATURES
• Output current capacity: 1.0 A
• Output voltage tolerance: VO ± 2% (TA = 25°C)
• Low quiescent current: 1.8 mA TYP. (IO = 0 A)
• Low short-circuit current: 0.3 A TYP. (
μ
PC2918B), 0.6 A TYP. (
μ
PC2925B,
μ
PC2933B), 0.65 A TYP. (
μ
PC2905B)
• Low dropout voltage: VDIF = 0.6 V MAX. (IO = 0.5 A)
• On-chip inrush current protection circuit at the time of input voltage rising (when input voltage is low)
• On-chip over-current limiter
• On-chip thermal shut down circuit
APPLICATIONS
Digital TV, DVD, LCD Monitors, Printers, Audio, Air Conditioners, and other applications.
PIN CONFIGURATIONS (Marking Side)
1: INPUT
Isolated TO-220 (MP-45G) SC-64 (MP-3) SC-63 (MP-3Z)
2: GND
3: OUTPUT
1: INPUT
2: GND
3: OUTPUT
4: GND (Fin)
1: INPUT
2: GND
3: OUTPUT
4: GND (Fin)
44
321
321
321
TO-252 (MP-3ZK)
1: INPUT
2: GND
3: OUTPUT
4: GND (Fin)
4
321
Note1 Note2 Note2
Notes 1. No.2 pin and No.4 fin are common GND.
2. No.2 pin is cut. No.2 pin and No.4 fin are common GND.
Data Sheet G17567EJ4V0DS
2
μ
PC29xxB Series
BLOCK DIAGRAM
Startup circuit
Reference voltage
Drive circuit
Overcurrent protection
Saturation protection
Thermal shut down
INPUT
OUTPUT
GND
Error
Amp.
+
−
ORDERING INFORMATION
Part Number Package Output Voltage Marking
μ
PC2918BHF Isolated TO-220 (MP-45G) 1.8 V 2918B
μ
PC2918BHB SC-64 (MP-3) 1.8 V 2918B
μ
PC2918BT SC-63 (MP-3Z) 1.8 V 2918B
μ
PC2918BT1D TO-252 (MP-3ZK) 1.8 V 2918BD
μ
PC2925BHF Isolated TO-220 (MP-45G) 2.5 V 2925B
μ
PC2925BHB SC-64 (MP-3) 2.5 V 2925B
μ
PC2925BT SC-63 (MP-3Z) 2.5 V 2925B
μ
PC2925BT1D TO-252 (MP-3ZK) 2.5 V 2925BD
μ
PC2933BHF Isolated TO-220 (MP-45G) 3.3 V 2933B
μ
PC2933BHB SC-64 (MP-3) 3.3 V 2933B
μ
PC2933BT SC-63 (MP-3Z) 3.3 V 2933B
μ
PC2933BT1D TO-252 (MP-3ZK) 3.3 V 2933BD
μ
PC2905BHF Isolated TO-220 (MP-45G) 5.0 V 2905B
μ
PC2905BHB SC-64 (MP-3) 5.0 V 2905B
μ
PC2905BT SC-63 (MP-3Z) 5.0 V 2905B
μ
PC2905BT1D TO-252 (MP-3ZK) 5.0 V 2905BD
Remark Tape-packaged products have the symbol -E1, or -E2 suffixed to the part number. In Pb-free products, any
of -AT, -AZ or -AY is added to the end of their part number. Refer to the following table for details.
<R>
Data Sheet G17567EJ4V0DS 3
μ
PC29xxB Series
Part Number Note1 Package Package Type
μ
PC29xxBHF Isolated TO-220 (MP-45G) • Packed in envelop
μ
PC29xxBHF-AZ Note2 Isolated TO-220 (MP-45G) • Packed in envelop
μ
PC29xxBHB SC-64 (MP-3) • Packed in envelop
μ
PC29xxBHB-AZ Note2 SC-64 (MP-3) • Packed in envelop
μ
PC29xxBHB-AY Note3 SC-64 (MP-3) • Packed in envelop
μ
PC29xxBT SC-63 (MP-3Z) • Packed in envelop
μ
PC29xxBT-AZ Note2 SC-63 (MP-3Z) • Packed in envelop
μ
PC29xxBT-E1 SC-63 (MP-3Z) • 16 mm wide embossed taping
• Pin 1 on draw-out side
• 2000 pcs/reel
μ
PC29xxBT-E1-AZ Note2 SC-63 (MP-3Z) • 16 mm wide embossed taping
• Pin 1 on draw-out side
• 2000 pcs/reel
μ
PC29xxBT-E1-AY Note3 SC-63 (MP-3Z) • 16 mm wide embossed taping
• Pin 1 on draw-out side
• 2000 pcs/reel
μ
PC29xxBT-E2 SC-63 (MP-3Z) • 16 mm wide embossed taping
• Pin 1 at take-up side
• 2000 pcs/reel
μ
PC29xxBT-E2-AZ Note2 SC-63 (MP-3Z) • 16 mm wide embossed taping
• Pin 1 at take-up side
• 2000 pcs/reel
μ
PC29xxBT-E2-AY Note3 SC-63 (MP-3Z) • 16 mm wide embossed taping
• Pin 1 at take-up side
• 2000 pcs/reel
μ
PC29xxBT1D-E1 TO-252 (MP-3ZK) • 16 mm wide embossed taping
• Pin 1 on draw-out side
• 2500 pcs/reel
μ
PC29xxBT1D-E1-AT Note4 TO-252 (MP-3ZK) • 16 mm wide embossed taping
• Pin 1 on draw-out side
• 2500 pcs/reel
μ
PC29xxBT1D-E2 TO-252 (MP-3ZK) • 16 mm wide embossed taping
• Pin 1 at take-up side
• 2500 pcs/reel
μ
PC29xxBT1D-E2-AT Note4 TO-252 (MP-3ZK) • 16 mm wide embossed taping
• Pin 1 at take-up side
• 2500 pcs/reel
Notes 1. xx stands for symbols that indicate the output voltage.
2. Pb-free (This product does not contain Pb in the external electrode.)
3. Pb-free (This product does not contain Pb in the external electrode, Sn100% plating.)
4. Pb-free (This product does not contain Pb in the external electrode and other parts.)
Data Sheet G17567EJ4V0DS
4
μ
PC29xxB Series
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Rating Unit Parameter Symbol
μ
PC29xxBHF
μ
PC29xxBHB,
μ
PC29xxBT,
μ
PC29xxBT1D
Input Voltage VIN −0.3 to +16.0 V
Internal Power Dissipation (TC = 25°C) Note PT 15 10 W
Operating Ambient Temperature TA −40 to +85 °C
Operating Junction Temperature TJ −40 to +150 °C
Storage Temperature Tstg −55 to +150 °C
Thermal Resistance (junction to case) Rth(J-C) 7 12.5 °C/W
Thermal Resistance (junction to ambient) Rth(J-A) 65 125 °C/W
Note Internally limited. When the operating junction temperature rises above 150°C, the internal circuit shuts down
the output voltage.
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on the
verge of suffering physical damage, and therefore the product must be used under conditions that
ensure that the absolute maximum ratings are not exceeded.
TYPICAL CONNECTION
+D
2
D
1
C
IN
C
OUT
INPUT OUTPUT
PC29xxB
μ
CIN : 0.1
μ
F or higher. Be sure to connect CIN to prevent parasitic oscillation. Set this value according to the length
of the line between the regulator and the INPUT pin. Use of a film capacitor or other capacitor with first-rate
voltage and temperature characteristics is recommended. If using a laminated ceramic capacitor, it is
necessary to ensure that CIN is 0.1
μ
F or higher for the voltage and temperature range to be used.
COUT: 10
μ
F or higher. Be sure to connect COUT to prevent oscillation and improve excessive load regulation. Place
CIN and COUT as close as possible to the IC pins (within 1 to 2 cm). Also, use an electrolytic capacitor with low
impedance characteristics if considering use at sub-zero temperatures.
D1 : If the OUTPUT pin has a higher voltage than the INPUT pin, connect a diode.
D2 : If the OUTPUT pin has a lower voltage than the GND pin, connect a Schottky barrier diode.
Caution Make sure that no voltage is applied to the OUTPUT pin from external.
Data Sheet G17567EJ4V0DS 5
μ
PC29xxB Series
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Type Number MIN. TYP. MAX. Unit
μ
PC2918B 2.8 12.0 V
μ
PC2925B 3.5 12.0 V
μ
PC2933B 4.3 12.0 V
Input Voltage VIN
μ
PC2905B 6.0 12.0 V
Output Current IO All 0 1.0 A
Operating Ambient Temperature TA All −40 +85 °C
Operating Junction Temperature TJ All −40 +125 °C
Caution Use of conditions exceeding the above-listed recommended operating conditions is not a problem
as long as the absolute maximum ratings are not exceeded. However, since the use of such
conditions diminishes the margin of safety, careful evaluation is required before such conditions
are used.
ELECTRICAL CHARACTERISTICS
μ
PC2918B (TJ = 25°C, VIN = 2.8 V, IO = 0.5 A, CIN = 0.1
μ
F, COUT = 10
μ
F, unless otherwise specified)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
VO1 1.764 1.8 1.836 V Output Voltage
VO2 2.8 V ≤ VIN ≤ 12 V, 0 A ≤ IO ≤ 1 A (1.746) − (1.854) V
Line Regulation REGIN 2.8 V ≤ VIN ≤ 12 V − 4.0 25.0 mV
Load Regulation REGL 0 A ≤ IO ≤ 1 A − 3.5 30.0 mV
IO = 0 A − 1.8 4.0 mA Quiescent Current IBIAS
IO = 0.5 A − 18.0 (30.0) mA
VIN = 1.7 V, IO = 0 A − 1.0 30.0 mA Startup Quiescent Current IBIAS(S)
VIN = 2.4 V, IO = 1 A − − (80.0) mA
Quiescent Current Change
Δ
IBIAS 2.8 V ≤ VIN ≤ 12 V − (3.0) (15.0) mA
Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz − 50.0 −
μ
Vr.m.s.
Ripple Rejection R•R f = 120 Hz, 2.8 V ≤ VIN ≤ 3.8 V, IO = 0.3 A − 62 − dB
IO = 0.5 A − 0.3 0.6 V Dropout Voltage VDIF
IO = 1 A − (0.7) − V
VIN = 2.8 V (0.1) 0.3 (0.8) A Short Circuit Current IOshort
VIN = 12 V − (0.4) − A
VIN = 2.8 V 1.0 1.3 (1.6) A Peak Output Current IOpeak
VIN = 12 V − (1.1) − A
Temperature Coefficient of
Output Voltage
Δ
VO/
Δ
T 0°C ≤ TJ ≤ 125°C, IO = 5 mA − 0.1 − mV/°C
Remark Values in parentheses are product design values, and are thus provided as reference values.
Data Sheet G17567EJ4V0DS
6
μ
PC29xxB Series
μ
PC2925B (TJ = 25°C, VIN = 3.5 V, IO = 0.5 A, CIN = 0.1
μ
F, COUT = 10
μ
F, unless otherwise specified)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
VO1 2.45 2.5 2.55 V Output Voltage
VO2 3.5 V ≤ VIN ≤ 12 V, 0 A ≤ IO ≤ 1 A (2.425) − (2.575) V
Line Regulation REGIN 3.5 V ≤ VIN ≤ 12 V − 5.5 25.0 mV
Load Regulation REGL 0 A ≤ IO ≤ 1 A − 3.5 40.0 mV
IO = 0 A − 1.8 4.0 mA Quiescent Current IBIAS
IO = 0.5 A − 18.0 (30.0) mA
VIN = 2.4 V, IO = 0 A − 11.0 30.0 mA Startup Quiescent Current IBIAS(S)
VIN = 3.1 V, IO = 1 A − − (80.0) mA
Quiescent Current Change
Δ
IBIAS 3.5 V ≤ VIN ≤ 12 V − (3.0) (15.0) mA
Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz − 62.0 −
μ
Vr.m.s.
Ripple Rejection R•R f = 120 Hz, 3.5 V ≤ VIN ≤ 4.5 V, IO = 0.3 A − 60 − dB
IO = 0.5 A − 0.36 0.6 V Dropout Voltage VDIF
IO = 1 A − (0.7) − V
VIN = 3.5 V (0.1) 0.6 (0.8) A Short Circuit Current IOshort
VIN = 12 V − (0.4) − A
VIN = 3.5 V 1.0 1.3 (1.6) A Peak Output Current IOpeak
VIN = 12 V − (1.1) − A
Temperature Coefficient of
Output Voltage
Δ
VO/
Δ
T 0°C ≤ TJ ≤ 125°C, IO = 5 mA − 0.2 − mV/°C
Remark Values in parentheses are product design values, and are thus provided as reference values.
μ
PC2933B (TJ = 25°C, VIN = 5.0 V, IO = 0.5 A, CIN = 0.1
μ
F, COUT = 10
μ
F, unless otherwise specified)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
VO1 3.234 3.3 3.366 V Output Voltage
VO2 4.3 V ≤ VIN ≤ 12 V, 0 A ≤ IO ≤ 1 A (3.201) − (3.399) V
Line Regulation REGIN 4.3 V ≤ VIN ≤ 12 V − 6.0 25.0 mV
Load Regulation REGL 0 A ≤ IO ≤ 1 A − 4.2 50.0 mV
IO = 0 A − 1.8 4.0 mA Quiescent Current IBIAS
IO = 0.5 A − 18.0 (30.0) mA
VIN = 3.1 V, IO = 0 A − 11.0 30.0 mA Startup Quiescent Current IBIAS(S)
VIN = 3.7 V, IO = 1 A − − (80.0) mA
Quiescent Current Change
Δ
IBIAS 4.3 V ≤ VIN ≤ 12 V − (3.0) (15.0) mA
Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz − 82.0 −
μ
Vr.m.s.
Ripple Rejection R•R f = 120 Hz, 4.3 V ≤ VIN ≤ 5.3 V, IO = 0.3 A − 58 − dB
IO = 0.5 A − 0.36 0.6 V Dropout Voltage VDIF
IO = 1 A − (0.7) − V
VIN = 5.0 V (0.1) 0.6 (0.8) A Short Circuit Current IOshort
VIN = 12 V − (0.4) − A
VIN = 5.0 V 1.0 1.5 (1.6) A Peak Output Current IOpeak
VIN = 12 V − (1.1) − A
Temperature Coefficient of
Output Voltage
Δ
VO/
Δ
T 0°C ≤ TJ ≤ 125°C, IO = 5 mA − 0.4 − mV/°C
Remark Values in parentheses are product design values, and are thus provided as reference values.
Data Sheet G17567EJ4V0DS 7
μ
PC29xxB Series
μ
PC2905B (TJ = 25°C, VIN = 6.0 V, IO = 0.5 A, CIN = 0.1
μ
F, COUT = 10
μ
F, unless otherwise specified)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
VO1 4.90 5.0 5.10 V Output Voltage
VO2 6.0 V ≤ VIN ≤ 12 V, 0 A ≤ IO ≤ 1 A (4.85) − (5.15) V
Line Regulation REGIN 6.0 V ≤ VIN ≤ 12 V − 6.5 25.0 mV
Load Regulation REGL 0 A ≤ IO ≤ 1 A − 5.0 80.0 mV
IO = 0 A − 1.8 4.0 mA Quiescent Current IBIAS
IO = 0.5 A − 18.0 (30.0) mA
VIN = 4.8 V, IO = 0 A − 11.0 30.0 mA Startup Quiescent Current IBIAS(S)
VIN = 5.5 V, IO = 1 A − − (80.0) mA
Quiescent Current Change
Δ
IBIAS 6.0 V ≤ VIN ≤ 12 V − (3.0) (15.0) mA
Output Noise Voltage Vn 10 Hz ≤ f ≤ 100 kHz − 122.0 −
μ
Vr.m.s.
Ripple Rejection R•R f = 120 Hz, 6.0 V ≤ VIN ≤ 7 V, IO = 0.3 A − 57 − dB
IO = 0.5 A − 0.38 0.6 V Dropout Voltage VDIF
IO = 1 A − (0.7) − V
VIN = 6.5 V (0.1) 0.65 (0.8) A Short Circuit Current IOshort
VIN = 12 V − (0.4) − A
VIN = 6.5 V 1.0 1.5 (1.6) A Peak Output Current IOpeak
VIN = 12 V − (1.1) − A
Temperature Coefficient of
Output Voltage
Δ
VO/
Δ
T 0°C ≤ TJ ≤ 125°C, IO = 5 mA − 0.6 − mV/°C
Remark Values in parentheses are product design values, and are thus provided as reference values.
Data Sheet G17567EJ4V0DS
8
μ
PC29xxB Series
TYPICAL CHARACTERISTICS (TA = 25°C)
Pd vs. TA
Δ
VO vs.TJ
Pd - Total Power Dissipation - W
50 85 100 150
5
10
15
20
0
1.0
1.92
0
Solid line: PC29xxBHF
Broken line: PC29xxBT1D,
PC29xxBT,
PC29xxBHB
mm
m
m
With infinite heatsink
Without heatsink
TA - Operating Ambient Temperature - °C
Δ
VO - Output Voltage Change - mV
-100
-80
-60
-40
-20
0
20
40
60
80
100
-50 -25 0 25 50 75 100 125
IO = 5 m
A
μ
PC2918B (V
IN
= 2.8 V)
μ
PC2925B (V
IN
= 3.5 V)
μ
PC2933B (V
IN
= 5.0 V)
μ
PC2905B (V
IN
= 6.0 V)
TJ - Operating Junction Temperature - °C
VO vs. VIN (
μ
PC2918B)
VO vs. VIN (
μ
PC2925B)
VO - Output Voltage - V
0
0.5
1
1.5
2
2.5
02468
T
J
= 25°C
I
O
= 5 mA
I
O
= 0.5 A
I
O
= 1 A
VIN - Input Voltage - V
VO - Output Voltage - V
0
0.5
1
1.5
2
2.5
3
02468
TJ = 25°C
IO = 5 m
A
IO = 0.5
A
IO = 1 A
VIN - Input Voltage - V
VO vs. VIN (
μ
PC2933B)
VO vs. VIN (
μ
PC2905B)
VO - Output Voltage - V
0
0.5
1
1.5
2
2.5
3
3.5
4
02468
TJ = 25°C
IO = 5 mA
IO = 0.5 A
IO = 1 A
VIN - Input Voltage - V
VO - Output Voltage - V
0
1
2
3
4
5
6
02468
TJ = 25°C
IO = 5 mA
IO = 0.5 A
IO = 1 A
VIN - Input Voltage - V
Data Sheet G17567EJ4V0DS 9
μ
PC29xxB Series
IBIAS (IBIAS(s)) vs. VIN (
μ
PC2918B)
IBIAS (IBIAS(s)) vs. VIN (
μ
PC2925B)
IBIAS - Quiescent Current - mA
0 2 4 6 8 10121416
I
O
= 5 m
A
80
70
60
50
40
30
20
10
0
I
O
= 0.5
A
I
O
= 1 A
VIN - Input Voltage - V
IBIAS - Quiescent Current - mA
0 2 4 6 8 10 12 14 16
I
O
= 5 mA
80
70
60
50
40
30
20
10
0
I
O
= 0.5
A
I
O
= 1
A
VIN - Input Voltage - V
IBIAS (IBIAS(s)) vs. VIN (
μ
PC2933B)
IBIAS (IBIAS(s)) vs. VIN (
μ
PC2905B)
IBIAS - Quiescent Current - mA
0246810121416
I
O
= 5 mA
80
70
60
50
40
30
20
10
0
I
O
= 1
A
I
O
= 0.5
A
VIN - Input Voltage - V
IBIAS - Quiescent Current - mA
0 2 4 6 8 10 12 14 16
80
70
60
50
40
30
20
10
0
I
O
= 1
A
I
O
= 0.5 A
I
O
= 5 mA
VIN - Input Voltage - V
VDIF vs. TJ IOpeak vs. VDIF
VDIF - Dropout Voltage - V
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-50 -25 0 25 50 75 100 125 150
μ
PC2918B
I
O
= 0.5 A
μ
PC2933B
μ
PC2925B
μ
PC2905B
TJ - Operating Junction Temperature - °C
IOpeak - Peak Output Current - A
0
0.5
1
1.5
2
03691215
μ
PC2918B
μ
PC2933B
μ
PC2925B
μ
PC2905B
T
J
= 25
°
C
VDIF - Dropout Voltage - V
Data Sheet G17567EJ4V0DS
10
μ
PC29xxB Series
R•R vs. f (
μ
PC2918B)
R•R vs. f (
μ
PC2925B)
R•R - Ripple Rejection - dB
0
10
20
30
40
50
60
70
80
10 100 1000 10000 100000
T
J
= 25°C
V
IN
= 2.8 V
I
O
= 5 mA I
O
= 0.3 A
I
O
= 0.5 A
I
O
= 1 A
f - Frequency - Hz
R•R - Ri
pp
le Re
j
ection - dB
0
10
20
30
40
50
60
70
80
10 100 1000 10000 100000
T
J
= 25°C
V
IN
= 3.5 V
I
O
= 5 mA I
O
= 0.3 A
I
O
= 0.5 A
I
O
= 1 A
f - Frequency - Hz
R•R vs. f (
μ
PC2933B)
R•R vs. f (
μ
PC2905B)
R•R - Ripple Rejection - dB
0
10
20
30
40
50
60
70
80
10 100 1000 10000 100000
T
J
= 25°C
V
IN
= 5.0 V
I
O
= 5 mA I
O
= 0.3 A
I
O
= 0.5 A
I
O
= 1 A
f - Frequency - Hz
R•R - Ri
pp
le Re
j
ection - dB
0
10
20
30
40
50
60
70
80
10 100 1000 10000 100000
T
J
= 25°C
V
IN
= 6.0 V
I
O
= 5 mA I
O
= 0.3 A
I
O
= 0.5 A
I
O
= 1 A
f - Frequency - Hz
VDIF vs. IO VO vs. IO (
μ
PC2918B)
VDIF - Dropout Voltage - V
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
T
J
= 25°C
μ
PC2918B
μ
PC2933B
μ
PC2925B
μ
PC2905B
IO - Output Current - A
V
O
-
Out
p
ut Volta
g
e
-
V
3.0
2.5
0 0.4 0.8 1.2 1.6
2.0
1.5
0.5
02.00.2 0.6 1.0 1.4 1.8
1.0
V
IN
= 2.8 V
IO - Output Current - A
Data Sheet G17567EJ4V0DS 11
μ
PC29xxB Series
VO vs. IO (
μ
PC2925B) VO vs. IO (
μ
PC2933B)
VO - Output Voltage - V
3.0
2.5
0 0.4 0.8 1.2 1.6
2.0
1.5
0.5
2.00.2 0.6 1.0 1.4 1.8
1.0
V
IN
= 3.5 V
IO - Output Current - A
VO - Output Voltage - V
5.0
0 0.4 0.8 1.2 1.6
4.0
3.0
1.0
2.00.2 0.6 1.0 1.4 1.8
2.0
V
IN
= 5.0 V
IO - Output Current - A
VO vs. IO (
μ
PC2905B)
VO - Output Voltage - V
6.0
5.0
0 0.4 0.8 1.2 1.6
4.0
3.0
1.0
2.00.2 0.6 1.0 1.4 1.8
2.0
V
IN
= 6.5 V
IO - Output Current - A
Data Sheet G17567EJ4V0DS
12
μ
PC29xxB Series
PACKAGE DRAWINGS (Unit: mm)
μ
PC2918BHF,
μ
PC2925BHF,
μ
PC2933BHF,
μ
PC2905BHF
D 17.0±0.3
3PIN PLASTIC SIP (MP-45G)
NOTE
Each lead centerline is located within 0.25 mm of
its true position (T.P.) at maximum material condition.
ITEM MILLIMETERS
P3HF-254B-4
G 0.25
H 2.54 (T.P.)
A 10.0±0.2
I 5.0±0.3
U 2.4±0.5
V
Y 8.9±0.7
Z 1.30±0.2
J
K
L 8.5±0.2
B 7.0±0.2
C 1.50±0.2
E
F 0.75±0.10
M 8.5±0.2
N
P 2.8±0.2
3.3±0.2
φ
2.46±0.2
5.0±0.2
4.5±0.2
0.65±0.10
132
M
A
BE
I
D
L
M
K
Y
J
H
C
FG
Z
N
P
U
V
Data Sheet G17567EJ4V0DS 13
μ
PC29xxB Series
μ
PC2918BHB,
μ
PC2925BHB,
μ
PC2933BHB,
μ
PC2905BHB
SC-64 (MP-3)
123
4
2.32.3
0.75
1.1
±
0.1
0.5
1.6
±
0.2
5.0
±
0.2
6.5
±
0.2
5.5
±
0.27.0 MIN.
+0.2
−0.1
1.5+0.2
−0.1
13.7 MIN.
2.3
±
0.2
0.5
±
0.1
0.5+0.2
−0.1
μ
PC2918BT,
μ
PC2925BT,
μ
PC2933BT,
μ
PC2905BT
SC-63 (MP-3Z) (Unit: mm)
123
4
6.5±0.2
4.4±0.2
5.0±0.2
0.5±0.1 0.5±0.1
2.3±0.3 2.3±0.3
5.6±0.3
9.5±0.5
2.5±0.5
1.0±0.5
5.5±0.2
1.5
+0.2
2.3±0.2
0.5±0.1
Note Note
0.4 MIN.
0.5 TYP.
0.15±0.15
−0.1
Note The depth of notch at the top of the fin is from 0 to 0.2 mm.
<R>
Data Sheet G17567EJ4V0DS
14
μ
PC29xxB Series
μ
PC2918BT1D,
μ
PC2925BT1D,
μ
PC2933BT1D,
μ
PC2905BT1D
TO-252 (MP-3ZK)
6.5±0.2 2.3±0.10.5±0.1
0.76±0.12 0 to 0.25
0.5±0.1
1.0
5.1 TYP.
1.0 TYP.6.1±0.2
0.51 MIN.
4.0 MIN.0.8
10.4 MAX. (9.8 TYP.)
4.3 MIN.
1
4
23
1.14 MAX. 2.3 2.3
Data Sheet G17567EJ4V0DS 15
μ
PC29xxB Series
RECOMMENDED MOUNTING CONDITIONS
The
μ
PC29xxB Series should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Surface Mount Device
μ
PC29xxBT Series: SC-63 (MP-3Z)
μ
PC29xxBT1D Series: TO-252 (MP-3ZK)
Process Conditions Symbol
Infrared Ray Reflow Peak temperature: 260°C or below (Package surface temperature),
Reflow time: 60 seconds or less (at 220°C or higher),
Maximum number of reflow processes: 3 times or less.
IR60-00-3
Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 3 times or less.
VP15-00-3
Partial Heating Method Pin temperature: 350°C or below,
Heat time: 3 seconds or less (Per each side of the device).
P350
μ
PC29xxBT-AZ Series Note1,
μ
PC29xxBT-AY Series Note2: SC-63 (MP-3Z)
μ
PC29xxBT1D-AT Series Note3: TO-252 (MP-3ZK)
Process Conditions Symbol
Infrared Ray Reflow Peak temperature: 260°C or below (package surface temperature),
Reflow time: 60 seconds or less (at 220°C or higher),
Maximum number of reflows processes: 3 times or less.
IR60-00-3
Partial Heating Method Pin temperature: 350°C or below,
Heat time: 3 seconds or less (per each side of the device).
P350
Notes 1. Pb-free (This product does not contain Pb in the external electrode.)
2. Pb-free (This product does not contain Pb in the external electrode, Sn100% plating.)
3. Pb-free (This product does not contain Pb in the external electrode and other parts.)
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device
will be damaged by heat stress.
Remark Flux: Rosin-based flux with low chlorine content (chlorine 0.2 Wt% or below) is recommended.
<R>
Data Sheet G17567EJ4V0DS
16
μ
PC29xxB Series
Type of Through-hole Device
μ
PC29xxBHF Series,
μ
PC29xxBHF-AZ Series Note1: Isolated TO-220 (MP-45G)
μ
PC29xxBHB Series,
μ
PC29xxBHB-AZ Series Note1,
μ
PC29xxBHB-AY Series Note2: SC-64 (MP-3)
Process Conditions Symbol
Wave Soldering
(only to leads)
Solder temperature: 260°C or below, Flow time: 10 seconds or less WS60-00-1
Partial Heating Method Pin temperature: 350°C or below, Heat time: 3 seconds or less (per each pin). P350
Notes 1. Pb-free (This product does not contain Pb in the external electrode.)
2. Pb-free (This product does not contain Pb in the external electrode, Sn100% plating.)
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
REFERENCE DOCUMENTS
USER’S MANUAL USAGE OF THREE TERMINAL REGULATORS Document No.G12702E
REVIEW OF QUALITY AND RELIABILITY HANDBOOK Document No.C12769E
INFORMATION VOLTAGE REGULATOR OF SMD Document No.G11872E
SEMICONDUCTOR DEVICE MOUNT MANUAL http://www.necel.com/pkg/en/mount/index.html
<R>
μ
PC29xxB Series
The information in this document is current as of August, 2007. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
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or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
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redundancy, fire-containment and anti-failure features.
NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-
designated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
•
•
•
•
•
•
M8E 02. 11-1
(1)
(2)
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
Computers, office equipment, communications equipment, test and measurement equipment, audio
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Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
"Standard":
"Special":
"Specific":
