SMSC COM20020I Rev D Page 1 Revision 12-05-06
PRODUCT PREVIEW
COM20020I Rev D
5Mbps ARCNET (ANSI
878.1) Controller with
2K x 8 On-Chip RAM
Data Brief
Product Features
New Features for Rev. D
Data Rates up to 5 Mbps
Programmable Reconfiguration Times
28 Pin PLCC and 48 Pin TQFP Packages;
Lead-free RoHS Compliant P ackages also
Available
Ideal for Industrial/Factory/Building
Automation and Transportation Appl ications
Deterministic, (ANSI 878.1), Token Passing
ARCNET Protocol
Minimal Microcontroller and Medi a Interface
Logic Required
Flexible Interface For Use With All
Microcontrollers or Microproc essors
Automatically Detects Type of
Microcontroller Interface
2Kx8 On-Chip Dual Port RAM
Command Chaining for Packet Queuing
Sequential Access to Internal RAM
Software Programmable Node ID
Eight, 256 Byte Pages Allow Four Pages TX
and RX Plus Scratch-Pad Memory
Next ID Readable
Internal Clock Scaler and Clock Multiplier for
Adjusting Network Speed
Operating Temperature Ra nge of -40oC to
+85oC
Self-Reconfiguration Protocol
Supports up to 255 Nodes
Supports Various Network Topologies (Star,
Tree, Bus...)
CMOS, Single +5V Supply
Duplicate Node ID Detection
Powerful Diagnostics
Receive All Packets Mode
Flexible Media Interface:
Traditional Hybrid Interface for Long Distances
up to Four Miles at 2.5 Mbps
RS485 Differential Driver Interface for Low
Cost, Low Power, High Reliability
ORDERING INFORMATION
Order Numbers:
COM20020I-LJP for 28 pin PLCC package
COM20020I-DZD for 28 pin PLCC lead-free RoHS compliant package
COM20020I-HD for 48 pin TQFP package
COM20020I-HT for 48 pin TQFP lead-free RoHS compliant package
Revision 12-05-06 Page 2 SMSC COM20020I Rev D
PRODUCT PREVIEW
80 Arkay Drive
Hauppauge, NY 11788
(631) 435-6000
FAX (631) 273-3123
Copyright © 2006 SMSC or its subsidiaries. All rights reserved.
Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete
information sufficient for construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no
responsibility is assumed for inaccuracies. SMSC reserves the right to make changes to specifications and product descriptions at any time without
notice. Contact your local SMSC sales office to obtain the latest specifications before placing your product order. The provision of this information does
not convey to the purchaser of the described semiconductor devices any licenses under any patent rights or other intellectual property rights of SMSC
or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated version of SMSC's standard
Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or errors
known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request.
SMSC products are not designed, intended, authorized or warranted for use in any life support or other application where product failure could cause
or contribute to personal injury or severe property damage. Any and all such uses without prior written approval of an Officer of SMSC and further
testing and/or modification will be fully at the risk of the customer. Copies of this document or other SMSC literature, as well as the Terms of Sale
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DAMAGES.
SMSC COM20020I Rev D Page 3 Revision 12-05-06
PRODUCT PREVIEW
General Description
SMSC's COM20020ID is a member of the family of Embedded ARCNET Controllers from Standard
Microsystems Corporation. The device is a general purpose communications controller for networking
microcontrollers and intelligent peripherals in industrial, automotive, and embedded control environments
using an ARCNET® protocol engine. The small 28 pin package, flexible microcontroller and media
interfaces, eight- page message support, and extended temperature range of the COM20020ID make it
the only true network controller optimized for use in industrial, embedded, and automotive applications.
Using an ARCNET protocol engine is the ideal solution for embedded control applications because it
provides a deterministic token-passing protocol, a highly reliable and proven networking scheme, and a
data rate of up to 5 Mbps when using the COM20020ID.
A token-passing protocol provides predictable response times because each network event occurs within a
predetermined time interval, based upon the number of nodes on the network. The deterministic nature of
ARCNET is essential in real time applications. The integration of the 2Kx8 RAM buffer on-chip, the
Command Chaining feature, the 5 Mbps maximum data rate, and the internal diagnostics make the
COM20020ID the highest performance embedded communications device available. With only one
COM20020ID and one microcontrol ler, a complete communications node ma y be implem ented.
Revision 12-05-06 Page 4 SMSC COM20020I Rev D
PRODUCT PREVIEW
Block Diagram
Figure 1 - COM20020ID Intern al Blo ck Diagram
MICRO-
SEQUENCER
AND
WORKING
REGISTERS
STATUS/
COMMAND
REGISTER
RESET
LOGIC
RECONFIGURATION
TIMER NODE ID
LOGIC
OSCILLATOR
TX/RX
LOGIC
ADDITIONAL
REGISTERS
ADDRESS
DECODING
CIRCUITRY 2K x 8
AD0-AD2,
BUS
ARBITRATION
CIRCUITRY
nPULSE1
nPULSE2
nTXEN
nINTR
nRESET
RAM
A0/nMUX
A1
A2/BALE
nRD/nDS
nWR/DIR
nCS
D3-D7
RXIN
XTAL1
XTAL2
SMSC COM20020I Rev D Page 5 Revision 12-05-06
PRODUCT PREVIEW
Package Outlines
Figure 2 - 28 Pin PLCC Package Dimensions
A
A1
B
B1
C
D
D1
D2
D3
E
F
G
R
.160-.180
.090-.120
.013-.021
.026-.032
.020-.045
.485-.495
.450-.456
.390-.430
.300 R EF
.050 BS C
.042-.056
.042-.048
.025-.045
DIM 28L
J .000-.020
NOTES:
All dime nsions are in inches.
Circle indicating p in 1 can ap pear on a top surfa ce as shown on the drawing o r
right above it on a b eveled edge.
1.
2.
PIN NO.
1
GEJ
D3
JD1
D
J
B1
B
A
A1
C
D2
F
R
Base
Plane
Seating
Plane
Revision 12-05-06 Page 6 SMSC COM20020I Rev D
PRODUCT PREVIEW
Figure 3 - 48 Pin TQFP Package Outline
Table 1 - 48 Pin TQFP Packa g e Parameters
MIN NOMINAL MAX REMARK
A ~ ~ 1.6 Overall Package Height
A1 0.05 0.10 0.15 Standoff
A2 1.35 1.40 1.45 Body Thickness
D 8.80 9.00 9.20 X Span
D/2 4.40 4.50 4.60 1/2 X Span Measure from Centerline
D1 6.90 7.00 7.10 X body Size
E 8.80 9.00 9.10 Y Span
E/2 4.40 4.50 4.60 1/2 Y Span Measure from Centerline
E1 6.90 7.00 7.10 Y body Size
H 0.09 ~ 0.20 Lead Frame Thickness
L 0.45 0.60 0.75 Lead Foot Length from Centerline
L1 ~ 1.00 ~ Lead Length
e 0.50 Basic Lead Pitch
θ 0o ~ 7o Lead Foot Angle
W 0.17 ~ 0.27 Lead Width
R1 0.08 ~ ~ Lead Shoulder Radius
R2 0.08 ~ 0.20 Lead Foot Radius
ccc ~ ~ 0.0762 Coplanarity (Assemblers)
ccc ~ ~ 0.08 Coplanarity (Test House)
Note 1: Controlling Unit: millimeter