Agilent AFBR-57M5APZ
Digital Diagnostic SFP, 850 nm,
2.125/1.0625 and 1.25 GBd Ethernet,
RoHS Compliant Optical Transceiver
Data Sheet
Features, continued
Link lengths at 2.125 GBd:
300 m with 50 µm MMF,
150 m with 62.5 µm MMF
Link lengths at 1.0625 GBd:
500 m with 50 µm MMF,
300 m with 62.5 µm MMF
Link lengths at 1.25 GBd:
2 to 550 m with 50 µm MMF,
2 to 275 m with 62.5 µm MMF
LC Duplex optical connector
interface conforming to ANSI
TIA/EIA604-10 (FOCIS 10A)
850 nm Vertical Cavity Surface
Emitting Laser (VCSEL) source
technology
IEC 60825-1 Class 1/CDRH Class 1
laser eye safe
Applications
Fibre channel systems
Director class switches
Fabric switches
HBA cards
Disk and tape drive arrays
Related Products
AFBR-59R5LZ: 850 nm +3.3 V LC
SFF 2x7 for 4.25/2.125/1.0625
GBd Fibre Channel
AFBR-57R5APZ: 850 nm +3.3 V LC
SFP for 4.25/2.125/1.0625 GBd
Fibre Channel
850 nm, SFP (Small Form Pluggable), RoHS Compliant,
Low Voltage (3.3 V) Digital Diagnostic Optical Transceiver
Features
Fully RoHS Compliant
Diagnostic features per SFF-8472
“Diagnostic Monitoring Interface
for Optical Transceivers”
Real time monitoring of:
Transmitted optical power
Received optical power
Laser bias current
Temperature
Supply voltage
Wide temperature and supply
voltage operation (-10°C to 85°C)
(3.3 V ± 10%)
Transceiver specifications per SFP
(SFF-8074i) Multi-Source Agree-
ment and SFF-8472 (revision 9.3)
2.125 GBd Fibre Channel
operation for FC-PI 200-M5-SN-I
and 200-M6-SN-I
1.0625 GBd Fibre Channel
operation for FC-PI 100-M5-SN-I
and 100-M6-SN-I
1.25 GBd operation for IEEE 802.3
Gigabit Ethernet 1000Base-SX
Description
Agilent’s AFBR-57M5APZ optical
transceiver supports high-speed
serial links over multimode
optical fiber at signaling rates up
to 2.125 Gb/s. Compliant with
Small Form Pluggable (SFP)
Multi Source Agreement (MSA)
mechanical and electrical
specifications for LC Duplex
transceivers, ANSI Fibre
Channel FC-PI, FC-PI-2 and
compliant with IEEE 802.3 for
gigabit applications. The part is
electrically interoperable with
SFP conformant devices.
2
As an enhancement to the
conventional SFP interface
defined in SFF-8074i, the AFBR-
57M5APZ is compliant to SFF-
8472 (digital diagnostic interface
for optical transceivers). Using
the 2-wire serial interface
defined in the SFF-8472 MSA,
the AFBR-57M5APZ provides
real time temperature, supply
voltage, laser bias current, laser
average output power and
received input power. This
information is in addition to
conventional SFP base data. The
digital diagnostic interface also
adds the ability to disable the
transmitter (TX_DISABLE),
monitor for Transmitter Faults
(TX_FAULT), and monitor for
Receiver Loss of Signal (RX_LOS).
Installation
The AFBR-57M5APZ can be
installed in any SFF-8074i
compliant Small Form Pluggable
(SFP) port regardless of host
equipment operating status. The
AFBR-57M5APZ is hot-
pluggable, allowing the module
to be installed while the host
system is operating and on-line.
Upon insertion, the transceiver
housing makes initial contact
with the host board SFP cage,
mitigating potential damage due
to Electro-Static Discharge (ESD).
Digital Diagnostic Interface
and Serial Identification
The 2-wire serial interface is
based on ATMEL AT24C01A
series EEPROM protocol and
signaling detail. Conventional
EEPROM memory, bytes 0-255 at
memory address 0xA0, is
organized in compliance with
SFF-8074i. New digital diag-
nostic information, bytes 0-255
at memory address 0xA2, is
compliant to SFF-8472. The new
diagnostic information provides
the opportunity for Predictive
Failure Identification, Com-
pliance Prediction, Fault
Isolation and Component
Monitoring.
Predictive Failure Identification
The AFBR-57M5APZ predictive
failure feature allows a host to
identify potential link problems
before system performance is
impacted. Prior identification of
link problems enables a host to
service an application via “fail
over” to a redundant link or
replace a suspect device,
maintaining system uptime in
the process. For applications
where ultra-high system uptime
is required, a digital SFP
provides a means to monitor two
real-time laser metrics asso-
ciated with observing laser
degradation and predicting
failure: average laser bias
current (Tx_Bias) and average
laser optical power (Tx_Power).
Compliance Prediction
Compliance prediction is the
ability to determine if an optical
transceiver is operating within
its operating and environmental
requirements. AFBR-57M5APZ
devices provide real-time access
to transceiver internal supply
voltage and temperature,
allowing a host to identify
potential component compliance
issues. Received optical power is
also available to assess
compliance of a cable plant and
remote transmitter. When
operating out of requirements,
the link cannot guarantee error
free transmission.
Fault Isolation
The fault isolation feature allows
a host to quickly pinpoint the
location of a link failure,
minimizing downtime. For
optical links, the ability to
identify a fault at a local device,
remote device or cable plant is
crucial to speeding service of an
installation. AFBR-57M5APZ
real-time monitors of Tx_Bias,
Tx_Power, Vcc, Temperature
and Rx_Power can be used to
assess local transceiver current
operating conditions. In
addition, status flags Tx_Disable
and Rx Loss of Signal (LOS) are
mirrored in memory and
available via the two-wire serial
interface.
Component Monitoring
Component evaluation is a more
casual use of the AFBR-
57M5APZ real-time monitors of
Tx_Bias, Tx_Power, Vcc,
Temperature and Rx_Power.
Potential uses are as debugging
aids for system installation and
design, and transceiver
parametric evaluation for
factory or field qualification. For
example, temperature per
module can be observed in high
density applications to facilitate
thermal evaluation of blades,
PCI cards and systems.
Description, continued
3
Figure 1. Transceiver functional diagram.
Transmitter Section
The transmitter section includes
consists of the Transmitter
Optical SubAssembly (TOSA)
and laser driver circuitry. The
TOSA, containing an 850 nm
VCSEL (Vertical Cavity Surface
Emitting Laser) light source, is
located at the optical interface
and mates with the LC optical
connector. The TOSA is driven
by a custom IC which uses the
incoming differential high speed
logic signal to modulate the laser
diode driver current. This Tx
laser driver circuit regulates the
optical power at a constant level
provided the incoming data
pattern is dc balanced (8B/10B
code, for example).
Transmit Disable (Tx_Disable)
The AFBR-57M5APZ accepts a
TTL and CMOS compatible
transmit disable control signal
input (pin 3) which shuts down
the transmitter optical output. A
high signal implements this
function while a low signal
allows normal transceiver
operation. In the event of a fault
(e.g. eye safety circuit activated),
cycling this control signal resets
the module as depicted in
Figure 4. An internal pull up
resistor disables the transceiver
transmitter until the host pulls
the input low. Host systems
should allow a 10 ms interval
between successive assertions of
this control signal. Tx_Disable
can also be asserted via the two-
wire serial interface (address
A2h, byte 110, bit 6) and
monitored (address A2h,
byte 110, bit 7).
The contents of A2h, byte 110,
bit 6 are logic OR’d with
hardware Tx_Disable (pin 3) to
control transmitter operation.
Transmit Fault (Tx_Fault)
A catastrophic laser fault will
activate the transmitter signal,
TX_FAULT, and disable the
laser. This signal is an open
collector output (pull-up
required on the host board). A
low signal indicates normal laser
operation and a high signal
indicates a fault. The TX_FAULT
will be latched high when a laser
fault occurs and is cleared by
toggling the TX_DISABLE input
or power cycling the transceiver.
The transmitter fault condition
can also be monitored via the
two-wire serial interface
(address A2, byte 110, bit 2).
Eye Safety Circuit
The AFBR-57M5APZ provides
Class 1 (single fault tolerant) eye
safety by design and has been
tested for compliance with the
requirements listed in Table 1.
The eye safety circuit
continuously monitors the
optical output power level and
will disable the transmitter upon
detecting an unsafe condition
beyond the scope of Class 1
certification. Such unsafe
conditions can be due to inputs
from the host board (Vcc
fluctuation, unbalanced code) or
a fault within the transceiver.
LIGHT FROM FIBER
LIGHT TO FIBER
PHOTO-DETECTOR
RECEIVER
AMPLIFICATION
& QUANTIZATION
RD+ (RECEIVE DATA)
RD (RECEIVE DATA)
Rx LOSS OF SIGNAL
VCSEL
TRANSMITTER
LASER
DRIVER &
SAFETY
CIRCUITRY
TX_DISABLE
TD+ (TRANSMIT DATA)
TD (TRANSMIT DATA)
TX_FAULT
ELECTRICAL INTERFACE
MOD-DEF2 (SDA)
MOD-DEF1 (SCL)
MOD-DEF0
CONTROLLER & MEMORY
OPTICAL INTERFACE
4
Receiver Section
The receiver section includes the
Receiver Optical SubAssembly
(ROSA) and the amplification/
quantization circuitry. The
ROSA, containing a PIN
photodiode and custom
transimpedance amplifier, is
located at the optical interface
and mates with the LC optical
connector. The ROSA output is
fed to a custom IC that provides
post-amplification and
quantization.
Receiver Loss of Signal (Rx_LOS)
The post-amplification IC also
includes transition detection
circuitry which monitors the ac
level of incoming optical signals
and provides a TTL/CMOS
compatible status signal to the
host (pin 8). An adequate optical
input results in a low Rx_LOS
output while a high Rx_LOS
output indicates an unusable
optical input. The Rx_LOS
thresholds are factory set so that
a high output indicates a definite
optical fault has occurred.
Rx_LOS can also be monitored
via the two-wire serial interface
(address A2h, byte 110, bit 1).
Functional Data I/O
The AFBR-57M5APZ interfaces
with the host circuit board
through twenty I/O pins (SFP
electrical connector) identified
by function in Table 2. The
board layout for this interface is
depicted in Figure 6.
The AFBR-57M5APZ high speed
transmit and receive interfaces
require SFP MSA compliant signal
lines on the host board. To
simplify board requirements,
biasing resistors and ac coupling
capacitors are incorporated into
the SFP transceiver module (per
SFF-8074i) and hence are not
required on the host board. The
Tx_Disable, Tx_Fault, and
Rx_LOS lines require TTL lines on
the host board (per SFF-8074i) if
used. If an application chooses
not to take advantage of the
functionality of these pins, care
must be taken to ground
Tx_Disable (for normal
operation).
Figure 2 depicts the recom-
mended interface circuit to link
the AFBR-57M5APZ to
supporting physical layer ICs.
Timing for MSA compliant
control signals implemented in
the transceiver are listed in
Figure 4.
Application Support
An Evaluation Kit and Reference
Designs are available to assist in
evaluation of the AFBR-
57M5APZ. Please contact your
local Field Sales representative
for availability and ordering
details.
Caution
There are no user serviceable
parts nor maintenance
requirements for the AFBR-
57M5APZ. All mechanical
adjustments are made at the
factory prior to shipment.
Tampering with, modifying,
misusing or improperly handling
the AFBR-57M5APZ will void the
product warranty. It may also
result in improper operation and
possibly overstress the laser
source. Performance degradation
or device failure may result.
Connection of the AFBR-
57M5APZ to a light source not
compliant with ANSI FC-PI or
IEEE 802.3 specifications,
operating above maximum
operating conditions or in a
manner inconsistent with it’s
design and function may result in
exposure to hazardous light
radiation and may constitute an
act of modifying or manufacturing
a laser product. Persons
performing such an act are
required by law to re-certify and
re-identify the laser product
under the provisions of U.S. 21
CFR (Subchapter J) and TUV.
Ordering Information
Please contact your local field
sales engineer or one of Agilent
Technologies franchised
distributors for ordering
information. For technical
information, please visit Agilent
Technologies’ WEB page at
www.agilent.com or contact
Agilent Technologies Semicon-
ductor Products Customer
Response Center at 1-800-235-
0312. For information related to
SFF Committee documentation
visit www.sffcommittee.org.
5
Regulatory Compliance
The AFBR-57M5APZ complies with
all applicable laws and regulations
as detailed in Table 1. Certification
level is dependent on the overall
configuration of the host
equipment. The transceiver
performance is offered as a figure
of merit to assist the designer.
Electrostatic Discharge (ESD)
The AFBR-57M5APZ is compatible
with ESD levels found in typical
manufacturing and operating
environments as described in Table
1. In the normal handling and
operation of optical transceivers,
ESD is of concern in two
circumstances.
The first case is during handling of
the transceiver prior to insertion
into an SFP compliant cage. To
protect the device, it’s important
to use normal ESD handling pre-
cautions. These include use of
grounded wrist straps, work-
benches and floor wherever a
transceiver is handled.
The second case to consider is
static discharges to the exterior of
the host equipment chassis after
installation. If the optical interface
is exposed to the exterior of host
equipment cabinet, the transceiver
may be subject to system level ESD
requirements.
Electromagnetic Interference (EMI)
Equipment incorporating gigabit
transceivers is typically subject to
Table 1. Regulatory Compliance
Feature Test Method Performance
Electrostatic Discharge (ESD) MIL-STD-883C Class 1 (> 2000 Volts)
to the Electrical Pins Method 3015.4
Electrostatic Discharge (ESD) Variation of IEC 61000-4-2 Typically, no damage occurs with 25 kV when
to the Duplex LC Receptacle the duplex LC connector receptacle is
contacted by a Human Body Model probe.
GR1089 10 contacts of 8 kV on the electrical faceplate
with device inserted into a panel.
Electrostatic Discharge (ESD) Variation of IEC 801-2 Air discharge of 15 kV (min.) contact to
to the Optical Connector connector without damage.
Electromagnetic Interference FCC Class B System margins are dependent on customer
(EMI) CENELEC EN55022 Class B board and chassis design.
(CISPR 22A)
VCCI Class 1
Immunity Variation of IEC 61000-4-3 Typically shows no measurable effect from a
10 V/m field swept from 10 MHz to 1 GHz.
Laser Eye Safety and US FDA CDRH AEL Class 1 CDRH certification # 9720151-55
Equipment Type Testing US21 CFR, Subchapter J per TUV file # TBD
Paragraphs 1002.10
and 1002.12
(IEC) EN60825-1: 1994 + A11 + A2
(IEC) EN60825-2: 1994 + A1
(IEC) EN60950: 1992 + A1 + A2 +
A3 + A4 + A11
Component Recognition Underwriters Laboratories and UL File #E173874
Canadian Standards Association
Joint Component Recognition
for Information Technology
Equipment including Electrical
Business Equipment
RoHS Compliance Less than 1000 ppm of cadmium, lead, mercury,
hexavalent chromium, polybrominated biphenyls,
and polybrominated biphenyl ethers.
BAUART
GEPRUFT
TYPE
APPROVED
TUV
Rheinland
Product Safety
¨
¨
regulation by the FCC in the United
States, CENELEC EN55022 (CISPR
22) in Europe and VCCI in Japan.
The AFBR-57M5APZ’s compliance
to these standards is detailed in
Table 1. The metal housing and
shielded design of the AFBR-
57M5APZ minimizes the EMI
challenge facing the equipment
designer.
EMI Immunity (Susceptibility)
Due to its shielded design, the EMI
immunity of the AFBR-57M5APZ
exceeds typical industry standards.
Flammability
The AFBR-57M5APZ optical
transceiver is made of metal and
high strength, heat resistant,
chemical resistant and UL 94V-0
flame retardant plastic.
6
Figure 2. Typical application configuration.
Figure 3. Recommended power supply filter.
1 µH
1 µH
0.1 µF
VCCR
SFP MODULE
10 µF
VCCT
0.1 µF 10 µF
3.3 V
HOST BOARD
0.1 µF
NOTE: INDUCTORS MUST HAVE LESS THAN 1 SERIES RESISTANCE TO LIMIT VOLTAGE DROP TO THE SFP MODULE.
LASER DRIVER
MODULE DETECT
LOSS OF SIGNAL
SCL
SDA
Tx_FAULT
Tx_DISABLE
TD+
Tx FAULT
Tx DIS
TD
RD+
RD
MOD_DEF2
MOD_DEF1
MOD_DEF0
GND,R
4.7 k to
10 k50
50
4.7 k to 10 k4.7 k to 10 k
PROTOCOL IC
V
CC
,T
V
CC
,T
V
CC
,R
1 µH
1 µH
10 µF 0.1 µF
0.1 µF
10 µF 0.1 µF
3.3 V
3.3 V
SERDES IC
Rx LOS
GND,T
0.01 µF
0.01 µF
POST AMPLIFIER
100
4.7 k to 10 k
100
6.8 k
0.01 µF
V
CC
,R
0.01 µF
4.7 k to 10 k
V
CC
,R
7
Notes:
1. TX_FAULT is an open collector/drain output, which must be pulled up with a 4.7 k – 10 k resistor on the host board. When high, this output
indicates a laser fault of some kind. Low indicates normal operation. In the low state, the output will be pulled to < 0.8 V.
2. TX_DISABLE is an input that is used to shut down the transmitter optical output. It is internally pulled up (within the transceiver) with a 6.8 k
resistor.
Low (0 – 0.8 V): Transmitter on
Between (0.8 V and 2.0 V): Undefined
High (2.0 – Vcc max) or OPEN: Transmitter Disabled
3. The signals Mod-Def 0, 1, 2 designate the two wire serial interface pins. They must be pulled up with a 4.7 k – 10 k resistor on the host board.
Mod-Def 0 is grounded by the module to indicate the module is present
Mod-Def 1 is serial clock line (SCL) of two wire serial interface
Mod-Def 2 is serial data line (SDA) of two wire serial interface
4. RX_LOS (Rx Loss of Signal) is an open collector/drain output that must be pulled up with a 4.7 k – 10 k resistor on the host board. When high, this
output indicates the received optical power is below the worst case receiver sensitivity (as defined by the standard in use). Low indicates normal
operation. In the low state, the output will be pulled to < 0.8 V.
5. RD-/+ designate the differential receiver outputs. They are AC coupled 100 differential lines which should be terminated with 100 differential
at the host SERDES input. AC coupling is done inside the transceiver and is not required on the host board. The voltage swing on these lines will be
between 600 and 1600 mV differential (300 – 800 mV single ended) when properly terminated.
6. VccR and VccT are the receiver and transmitter power supplies. They are defined at the SFP connector pin. The maximum supply current is 300 mA
and the associated in-rush current will typically be no more than 30 mA above steady state after 2 microseconds.
7. TD-/+ designate the differential transmitter inputs. They are AC coupled differential lines with 100 differential termination inside the module. The
AC coupling is done inside the module and is not required on the host board. The inputs will accept differential swings of 400 – 2400 mV (200 –
1200 mV single ended), though it is recommended that values between 500 and 1200 mV differential (250 – 600 mV single ended) be used for best
EMI performance.
Table 2. Pin Description
Pin Name Function/Description Notes
1 VeeT Transmitter Ground
2 TX_FAULT Transmitter Fault Indication – High indicates a fault condition Note 1
3 TX_DISABLE Transmitter Disable – Module electrical input disables on high or open Note 2
4 MOD-DEF2 Module Definition 2 – Two wire serial ID interface data line (SDA) Note 3
5 MOD-DEF1 Module Definition 1 – Two wire serial ID interface clock line (SCL) Note 3
6 MOD-DEF0 Module Definition 0 – Grounded in module (module present indicator) Note 3
7 N.C.
8 RX_LOS Loss of Signal – High indicates loss of received optical signal Note 4
9 VeeR Receiver Ground
10 VeeR Receiver Ground
11 VeeR Receiver Ground
12 RD- Inverse Received Data Out Note 5
13 RD+ Received Data Out Note 5
14 VeeR Receiver Ground
15 VccR Receiver Power + 3.3 V Note 6
16 VccT Transmitter Power + 3.3 V Note 6
17 VeeT Transmitter Ground
18 TD+ Transmitter Data In Note 7
19 TD- Inverse Transmitter Data In Note 7
20 VeeT Transmitter Ground
8
Table 3. Absolute Maximum Ratings
Parameter Symbol Minimum Maximum Unit Notes
Storage Temperature TS-40 100 C Note 1, 2
Case Operating Temperature TC-40 100 C Note 1, 2
Relative Humidity RH 5 95 % Note 1
Supply Voltage VccT, R -0.5 3.8 V Note 1, 2, 3
Low Speed Input Voltage VIN -0.5 Vcc+0.5 V Note 1
Notes;
1. Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded for other than a short
period of time. See Reliability Data Sheet for specific reliability performance.
2. Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability is not
implied, and damage to the device may occur over an extended period of time.
3. The module supply voltages, VCCT and VCCR must not differ by more than 0.5 V or damage to the device may occur.
Table 4. Recommended Operating Conditions
Parameter Symbol Minimum Maximum Unit Notes
Case Operating Temperature TC-10 85 °C Note 1, 2
Supply Voltage VccT, R 2.97 3.63 V Note 2
Data Rate 1.0625 2.125 Gb/s Note 2
Notes:
1. The Ambient Operating Temperature limitations are based on the Case Operating Temperature limitations and are subject to the host system
thermal design.
2. Recommended Operating Conditions are those values for which functional performance and device reliability is implied.
Table 5. Transceiver Electrical Characteristics
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ±10%)
Parameter Symbol Minimum Typical Maximum Unit Notes
AC Electrical Characteristics
Power Supply Noise Rejection (peak-peak) PSNR 100 mV Note 1
DC Electrical Characteristics
Module Supply Current ICC 210 mA
Power Dissipation PDISS 765 mW
Low Speed Outputs: VOH 2.0 VccT,R+0.3 V Note 2
Transmit Fault (TX_FAULT), Loss of Signal VOL 0.8 V
(RX_LOS), MOD-DEF 2
Low Speed Inputs: VIH 2.0 Vcc V Note 3
Transmit Disable (TX_DIS), VIL 00.8V
MOD-DEF 1, MOD-DEF2
Notes:
1. Filter per SFP specification is required on host board to remove 10 Hz to 2 MHz content.
2. Pulled up externally with a 4.7 k – 10 k resistor on the host board to 3.3 V.
3. Mod-Def1 and Mod-Def2 must be pulled up externally with a 4.7 k – 10 k resistor on the host board to 3.3 V.
9
Table 6. Transmitter and Receiver Electrical Characteristics
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ±10%)
Parameter Symbol Minimum Typical Maximum Unit Notes
High Speed Data Input: VI400 2400 mV Note 1
Transmitter Differential Input Voltage (TD +/-)
High Speed Data Output: Vo 600 1600 mV Note 2
Receiver Differential Output Voltage (RD +/-)
Receiver Contributed Total Jitter TJ 0.26 UI Note 3
(2.125 Gb/s) 124 ps
Receiver Contributed Total Jitter TJ 0.22 UI Note 3
(1.0625 Gb/s) 205 ps
Receiver Contributed Total Jitter TJ 0.332 UI Note 3
(1.25 Gb/s) 266 ps
Receiver Electrical Output Rise & Fall Times tr, tf 50 150 ps Note 4
(20-80%)
Notes:
1. Internally AC coupled and terminated (100 Ohm differential).
2. Internally AC coupled but requires an external load termination (100 Ohm differential).
3. Contributed DJ is measured on an oscilloscope in average mode with 50% threshold and K28.5 pattern. Contributed TJ is the sum of contributed RJ
and contributed DJ. Contributed RJ is calculated for 1x10-12 BER by multiplying the RMS jitter (measured on a single rise or fall edge) from the
oscilloscope by 14. Per FC-PI (Table 13 - MM jitter output, note 1), the actual contributed RJ is allowed to increase above its limit if the actual
contributed DJ decreases below its limits, as long as the component output DJ and TJ remain within their specified FC-PI maximum limits with the
worst case specified component jitter input.
4. 20%-80% electrical rise & fall times measured with a 500 MHz signal utilizing a 1010 data pattern.
10
Table 7. Transmitter Optical Characteristics
(TC = -10°C to 85°C, VccT, VccR = 3.3V ±10%)
Parameter Symbol Minimum Typical Maximum Unit Notes
Modulated Optical Output Power (OMA) Tx,OMA 196 µW Note 1
(Peak-to-Peak) 2.125 Gb/s
Modulated Optical Output Power (OMA) Tx,OMA 156 µW Note 2
(Peak-to-Peak) 1.0625 Gb/s
Average Optical Output Power Pout -9.0 dBm Note 3, 4
Optical Extinction Ratio ER 9 dB Note 5
Center Wavelength lC830 860 nm
Spectral Width – rms s,rms 0.85 nm
Optical Rise/Fall Time (2.125 Gb/s) tr, tf 150 ps 20% - 80%
RIN 12 (OMA) RIN -118 dB/Hz
Transmitter Contributed Total Jitter (2.125 Gb/s) TJ 0.25 UI Note 6
120 ps
Transmitter Contributed Total Jitter (1.0625 Gb/s) TJ 0.27 UI Note 6
252 ps
Transmitter Contributed Total Jitter (1.25 Gb/s) TJ 0.284 UI Note 6
227 ps
Pout TX_DISABLE Asserted POFF -35 dBm
Notes:
1. An OMA of 196 µW is approximately equal to an average power of –9 dBm, avg assuming an Extinction Ratio of 9 dB.
2. An OMA of 156 µW is approximately equal to an average power of –10 dBm, avg assuming an Extinction Ratio of 9 dB.
3. Max Pout is the lesser of Class 1 safety limits (CDRH and EN 60825) or receiver power, max.
4. Into 50/125 µm (0.2 NA) multi-mode optical fiber.
5. Extinction ratio of 9 dB valid when RATE_SELECT signal is driven low.
6. Contributed DJ is measured on an oscilloscope in average mode with 50% threshold and K28.5 pattern. Contributed TJ is the sum of contributed RJ
and contributed DJ. Contributed RJ is calculated for 1x10-12 BER by multiplying the RMS jitter (measured on a single rise or fall edge) from the
oscilloscope by 14. Per FC-PI (Table 13 - MM jitter output, note 1), the actual contributed RJ is allowed to increase above its limit if the actual
contributed DJ decreases below its limits, as long as the component output DJ and TJ remain within their specified FC-PI maximum limits with the
worst case specified component jitter input.
11
Table 8. Receiver Optical Characteristics
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ±10%)
Parameter Symbol Min. Typ. Max. Unit Notes
Input Optical Power [Overdrive] PIN 0 dBm, avg
Input Optical Modulation Amplitude OMA 49 µW, OMA Notes 1, 2
(Peak-to-Peak) 2.125 Gb/s [Sensitivity]
Input Optical Modulation Amplitude OMA 31 µW, OMA Notes 1, 3
(Peak-to-Peak) 1.0625 Gb/s [Sensitivity]
Receiver Sensitivity PRMIN 17 dBm
(Optical Input Power)
Stressed Receiver Sensitivity 96 µW, OMA 50/125 µm fiber, Note 4
(OMA) 2.125 Gb/s 109 µW, OMA 62.5/125 µm fiber, Note 4
Stressed Receiver Sensitivity 55 µW, OMA 50/125 µm fiber, Note 5
(OMA) 1.0625 Gb/s 67 µW, OMA 62.5/125 µm fiber, Note 5
Stressed Receiver Sensitivity -13.5 dBm
(OMA) 1.25 Gb/s -12.5 dBm
Return Loss 12 dB
Bit Error Rate BER 10^-12
Loss of Signal – Assert PA27.5 µW, OMA
-30 -17.5 dBm, avg Note 6
Loss of Signal - De-Assert PD31 µW, OMA
-17.0 dBm, avg Note 6
Loss of Signal Hysteresis PD - PA0.5 dB
Notes:
1. Input Optical Modulation Amplitude (commonly known as sensitivity) requires a valid 8B/10B encoded input.
2. An OMA of 49 µW is approximately equal to an average power of –15 dBm, avg with an Extinction Ratio of 9 dB.
3. An OMA of 31 µW is approximately equal to an average power of –17 dBm, avg with an Extinction Ratio of 9 dB.
4. 2.125 Gb/s stressed receiver vertical eye closure penalty (ISI) min. is 1.26 dB for 50 µm fiber and 2.03 dB for 62.5 µm fiber. Stressed receiver DCD
component min. (at TX) is 40 ps.
5. 1.0625 Gb/s stressed receiver vertical eye closure penalty (ISI) min. is 0.96 dB for 50 µm fiber and 2.18 dB for 62.5 µm fiber. Stressed receiver DCD
component min. (at TX) is 80 ps.
6. These average power values are specified with an Extinction Ratio of 9 dB. The loss of signal circuitry responds to valid 8B/10B encoded peak to
peak input optical power, not average power.
12
Table 9. Transceiver SOFT DIAGNOSTIC Timing Characteristics
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ±10%)
Parameter Symbol Minimum Maximum Unit Notes
Hardware TX_DISABLE Assert Time t_off 10 µs Note 1
Hardware TX_DISABLE Negate Time t_on 1 ms Note 2
Time to initialize, including reset of TX_FAULT t_init 300 ms Note 3
Hardware TX_FAULT Assert Time t_fault 100 µs Note 4
Hardware TX_DISABLE to Reset t_reset 10 µs Note 5
Hardware RX_LOS DeAssert Time t_loss_on 100 µs Note 6
Hardware RX_LOS Assert Time t_loss_off 100 µs Note 7
Software TX_DISABLE Assert Time t_off_soft 100 ms Note 8
Software TX_DISABLE Negate Time t_on_soft 100 ms Note 9
Software Tx_FAULT Assert Time t_fault_soft 100 ms Note 10
Software Rx_LOS Assert Time t_loss_on_soft 100 ms Note 11
Software Rx_LOS De-Assert Time t_loss_off_soft 100 ms Note 12
Analog parameter data ready t_data 1000 ms Note 13
Serial bus hardware ready t_serial 300 ms Note 14
Write Cycle Time t_write 10 ms Note 15
Serial ID Clock Rate f_serial_clock 400 kHz
Notes:
1. Time from rising edge of TX_DISABLE to when the optical output falls below 10% of nominal.
2. Time from falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal.
3. Time from power on or falling edge of Tx_Disable to when the modulated optical output rises above 90% of nominal.
4. From power on or negation of TX_FAULT using TX_DISABLE.
5. Time TX_DISABLE must be held high to reset the laser fault shutdown circuitry.
6. Time from loss of optical signal to Rx_LOS Assertion.
7. Time from valid optical signal to Rx_LOS De-Assertion.
8. Time from two-wire interface assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the optical output falls below 10% of nominal. Measured
from falling clock edge after stop bit of write transaction.
9. Time from two-wire interface de-assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the modulated optical output rises above 90% of nominal.
10. Time from fault to two-wire interface TX_FAULT (A2h, byte 110, bit 2) asserted.
11. Time for two-wire interface assertion of Rx_LOS (A2h, byte 110, bit 1) from loss of optical signal.
12. Time for two-wire interface de-assertion of Rx_LOS (A2h, byte 110, bit 1) from presence of valid optical signal.
13. From power on to data ready bit asserted (A2h, byte 110, bit 0). Data ready indicates analog monitoring circuitry is functional.
14. Time from power on until module is ready for data transmission over the serial bus (reads or writes over A0h and A2h).
15. Time from stop bit to completion of a 1-8 byte write command.
13
Table 10. Transceiver Digital Diagnostic Monitor (Real Time Sense) Characteristics
(TC = -10°C to 85°C, VccT, VccR = 3.3 V ±10%)
Parameter Symbol Min. Units Notes
Transceiver Internal Temperature TINT ±3.0 °C Temperature is measured internal to the transceiver.
Accuracy Valid from = -10°C to 85°C case temperature.
Transceiver Internal Supply VINT ±0.1 V Supply voltage is measured internal to the transceiver
Voltage Accuracy and can, with less accuracy, be correlated to
voltage at the SFP Vcc pin. Valid over 3.3 V ± 10%.
Transmitter Laser DC Bias Current IINT ±10 % IINT is better than ±10% of the nominal value.
Accuracy
Transmitted Average Optical PT±3.0 dB Coupled into 50/125 µm multi-mode fiber. Valid from
Output Power Accuracy 100 µW to 500 µW, avg.
Received Average Optical Input PR±3.0 dB Coupled from 50/125 µm multi-mode fiber. Valid from
Power Accuracy 31 µW to 500 µW, avg.
Figure 4. Transceiver timing diagrams (module installed except where noted).
TX_FAULT
OCCURANCE OF FAULT
t_fault
TX_DISABLE
TRANSMITTED SIGNAL
TX_FAULT
OCCURANCE OF FAULT
TX_DISABLE
TRANSMITTED SIGNAL
t-fault: TX FAULT ASSERTED, TX SIGNAL NOT RECOVERED t-reset: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL RECOVERED
t_reset t_init*
* SFP SHALL CLEAR TX_FAULT IN
< t_init IF THE FAILURE IS TRANSIENT
TX_FAULT
OCCURANCE OF FAULT
t_fault
TX_DISABLE
TRANSMITTED SIGNAL
OPTICAL SIGNAL
LOS
t-fault: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL NOT RECOVERED t-loss-on & t-loss-off
t_loss_on
t_init*
t_reset
* SFP SHALL CLEAR TX_FAULT IN
< t_init IF THE FAILURE IS TRANSIENT
t_loss_off
OCCURANCE
OF LOSS
TX_FAULT
VCCT,R > 2.97 V
t_init
TX_DISABLE
TRANSMITTED SIGNAL
t_init
TX_FAULT
VCCT,R > 2.97 V
TX_DISABLE
TRANSMITTED SIGNAL
t-init: TX DISABLE NEGATED t-init: TX DISABLE ASSERTED
TX_FAULT
VCCT,R > 2.97 V
t_init
TX_DISABLE
TRANSMITTED SIGNAL
t_off
TX_FAULT
TX_DISABLE
TRANSMITTED SIGNAL
t-init: TX DISABLE NEGATED, MODULE HOT PLUGGED t-off & t-on: TX DISABLE ASSERTED THEN NEGATED
INSERTION
t_on
14
Byte # Data Byte # Data
Decimal Hex Notes Decimal Hex Notes
0 03 SFP physical device 37 00 Hex Byte of Vendor OUI[4]
1 04 SFP function defined by serial ID only 38 30 Hex Byte of Vendor OUI[4]
2 07 LC optical connector 39 D3 Hex Byte of Vendor OUI[4]
3 00 40 41 “A” - Vendor Part Number ASCII character
4 00 41 46 “F” - Vendor Part Number ASCII character
5 00 42 42 “B” - Vendor Part Number ASCII character
6 00 43 52 “R” - Vendor Part Number ASCII character
7 20 Intermediate distance (per FC-PI) 44 2D “-” - Vendor Part Number ASCII character
8 40 Shortwave laser without OFC (open fiber control) 45 35 “5” - Vendor Part Number ASCII character
9 0C Multi-mode 50 µm and 62.5 µm optical media 46 37 “7” - Vendor Part Number ASCII character
10 05 100 & 200 Mbytes/sec FC-PI speed[1] 47 4D “M” - Vendor Part Number ASCII character
11 01 Compatible with 8B/10B encoded data 48 35 “5” - Vendor Part Number ASCII character
12 15 2100 MBit/sec nominal bit rate (2.125 Gbit/s) 49 41 “A” - Vendor Part Number ASCII character
13 00 50 50 “P” - Vendor Part Number ASCII character
14 00 51 5A “Z” - Vendor Part Number ASCII character
15 00 52 20 “ ” - Vendor Part Number ASCII character
16 55 300 m of 50/125 µm fiber @ 2.125GBit/sec[2] 53 20 “ ” - Vendor Part Number ASCII character
17 55 150 m of 62.5/125 µm fiber @ 2.125GBit/sec[3] 54 20 “ ” - Vendor Part Number ASCII character
18 00 55 20 “ ” - Vendor Part Number ASCII character
19 00 56 20 “ ” - Vendor Part Number ASCII character
20 41 “A” - Vendor Name ASCII character 57 20 “ ” - Vendor Part Number ASCII character
21 47 “G” - Vendor Name ASCII character 58 20 “ ” - Vendor Part Number ASCII character
22 49 “I” - Vendor Name ASCII character 59 20 “ ” - Vendor Part Number ASCII character
23 4C “L” - Vendor Name ASCII character 60 03 Hex Byte of Laser Wavelength[5]
24 45 “E” - Vendor Name ASCII character 61 52 Hex Byte of Laser Wavelength[5]
25 4E “N” - Vendor Name ASCII character 62 00
26 54 “T” - Vendor Name ASCII character 63 Checksum for Bytes 0-62[6]
27 20 “ ” - Vendor Name ASCII character 64 00
28 20 “ ” - Vendor Name ASCII character 65 3A Hardware SFP TX_DISABLE, TX_FAULT,
& RX_LOS
29 20 “ ” - Vendor Name ASCII character 66 00
30 20 “ ” - Vendor Name ASCII character 67 00
31 20 “ ” - Vendor Name ASCII character 68-83 Vendor Serial Number ASCII characters[7]
32 20 “ ” - Vendor Name ASCII character 84-91 Vendor Date Code ASCII characters[8]
33 20 “ ” - Vendor Name ASCII character 92 68 Digital Diagnostics, Internal Cal, Rx Pwr Avg
34 20 “ ” - Vendor Name ASCII character 93 F0 A/W, Soft SFP TX_DISABLE, TX_FAULT,
& RX_LOS
35 20 “ ” - Vendor Name ASCII character 94 01 SFF-8472 Compliance to revision 9.3
36 00 95 Checksum for Bytes 64-94[6]
96 - 255 00
Notes:
1. FC-PI speed 100 MBytes/sec is a serial bit rate of 1.0625 GBit/sec. 200 MBytes/sec is a serial bit rate of 2.125 GBit/sec.
2. Link distance with 50/125 µm cable at 1.0625 GBit/sec is 500 m. Link distance at 2.125 GBit/sec is 300 m.
3. Link distance with 62.5/125 µm cable at 1.0625 GBit/sec is 300 m. Link distance with 62.5/125 µm cable at 2.125 GBit/sec is 150 m.
4. The IEEE Organizationally Unique Identifier (OUI) assigned to Agilent Technologies is 00-30-D3 (3 bytes of hex).
5. Laser wavelength is represented in 16 unsigned bits. The hex representation of 850 (nm) is 0352.
6. Addresses 63 and 95 are checksums calculated (per SFF-8472 and SFF-8074) and stored prior to product shipment.
7. Addresses 68-83 specify the AFBR-57M5APZ ASCII serial number and will vary on a per unit basis.
8. Addresses 84-91 specify the AFBR-57M5APZ ASCII date code and will vary on a per date code basis.
Table 12. EEPROM Serial ID Memory Contents Conventional SFP Memory (Address A0h)
15
Table 13: EEPROM Serial ID Memory Contents Enhanced Feature Set Memory (Address A2h)
Byte # Byte # Byte #
Decimal Notes Decimal Notes Decimal Notes
0 Temp H Alarm MSB[1] 26 Tx Pwr L Alarm MSB[4] 104 Real Time Rx Pwr
MSB[5]
1 Temp H Alarm LSB[1] 27 Tx Pwr L Alarm LSB[4] 105 Real Time Rx Pwr LSB[5]
2 Temp L Alarm MSB[1] 28 Tx Pwr H Warning MSB[4] 106 Reserved
3 Temp L Alarm LSB[1] 29 Tx Pwr H Warning LSB[4] 107 Reserved
4 Temp H Warning MSB[1] 30 Tx Pwr L Warning MSB[4] 108 Reserved
5 Temp H Warning LSB[1] 31 Tx Pwr L Warning LSB[4] 109 Reserved
6 Temp L Warning MSB[1] 32 Rx Pwr H Alarm MSB[5] 110 Status/Control - See
Table 14
7 Temp L Warning LSB[1] 33 Rx Pwr H Alarm LSB[5] 111 Reserved
8 Vcc H Alarm MSB[2] 34 Rx Pwr L Alarm MSB[5] 112 Flag Bits - See Table 15
9 Vcc H Alarm LSB[2] 35 Rx Pwr L Alarm LSB[5] 113 Flag Bits - See Table 15
10 Vcc L Alarm MSB[2] 36 Rx Pwr H Warning MSB[5] 114 Reserved
11 Vcc L Alarm LSB[2] 37 Rx Pwr H Warning LSB[5] 115 Reserved
12 Vcc H Warning MSB[2] 38 Rx Pwr L Warning MSB[5] 116 Flag Bits - See Table 15
13 Vcc H Warning LSB[2] 39 Rx Pwr L Warning LSB[5] 117 Flag Bits - See Table 15
14 Vcc L Warning MSB[2] 40-55 Reserved 118-127 Reserved
15 Vcc L Warning LSB[2] 56-94 External Calibration Constants[6] 128-247 Customer Writeable
16 Tx Bias H Alarm MSB[3] 95 Checksum for Bytes 0-94[7] 248-255 Vendor Specific
17 Tx Bias H Alarm LSB[3] 96 Real Time Temperature MSB[1]
18 Tx Bias L Alarm MSB[3] 97 Real Time Temperature LSB[1]
19 Tx Bias L Alarm LSB[3] 98 Real Time Vcc MSB[2]
20 Tx Bias H Warning MSB[3] 99 Real Time Vcc LS[2]
21 Tx Bias H Warning LSB[3] 100 Real Time Tx Bias MSB[3]
22 Tx Bias L Warning MSB[3] 101 Real Time Tx Bias LSB[3]
23 Tx Bias L Warning LSB[3] 102 Real Time Tx Power MSB[4]
24 Tx Pwr H Alarm MSB[4] 103 Real Time Tx Power LSB[4]
25 Tx Pwr H Alarm LSB[4]
Notes:
1. Temperature (Temp) is decoded as a 16 bit signed twos compliment integer in increments of 1/256°C.
2. Supply Voltage (Vcc) is decoded as a 16 bit unsigned integer in increments of 100 µV.
3. Laser bias current (Tx Bias) is decoded as a 16 bit unsigned integer in increments of 2 µA.
4. Transmitted average optical power (Tx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 µW.
5. Received average optical power (Rx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 µW.
6. Bytes 56-94 are not intended for use with AFBR-57M5APZ, but have been set to default values per SFF-8472.
7. Byte 95 is a checksum calculated (per SFF-8472) and stored prior to product shipment.
16
Table 14. EEPROM Serial ID Memory Contents Soft Commands (Address A2h, Byte 110)
Status/
Bit # Control Name Description Notes
7 TX_ DISABLE State Digital state of SFP TX_ DISABLE Input Pin (1 = TX_DISABLE asserted) Note 1
6 Soft TX_ DISABLE Read/write bit for changing digital state of TX_DISABLE function Note 1, 2
5 Reserved
4 Reserved
3 Reserved
2 TX_FAULT State Digital state of the SFP TX_FAULT Output Pin (1 = TX_FAULT asserted) Note 1
1 RX_LOS State Digital state of the SFP RX_LOS Output Pin (1 = RX_LOS asserted) Note 1
0 Data Ready (Bar) Indicates transceiver is powered and real time sense data is ready. (0 = Ready) Note 3
Notes:
1. The response time for soft commands of the AFBR-57M5APZ is 100 msec as specified by the MSA SFF-8472.
2. Bit 6 is logic OR’d with the SFP TX_DISABLE input pin 3 ... either asserted will disable the SFP transmitter.
3. AFBR-57M5APZ meets the MSA SFF-8472 data ready timing of 1000 msec.
Table 15. EEPROM Serial ID Memory Contents Alarms and Warnings (Address A2h, Bytes 112, 113, 116, 117)
Byte Bit Flag Bit Name Description
112 7 Temp High Alarm Set when transceiver internal temperature exceeds high alarm threshold
6 Temp Low Alarm Set when transceiver internal temperature exceeds low alarm threshold
5 Vcc High Alarm Set when transceiver internal supply voltage exceeds high alarm threshold
4 Vcc Low Alarm Set when transceiver internal supply voltage exceeds low alarm threshold
3 Tx Bias High Alarm Set when transceiver laser bias current exceeds high alarm threshold
2 Tx Bias Low Alarm Set when transceiver laser bias current exceeds low alarm threshold
1 Tx Power High Alarm Set when transmitted average optical power exceeds high alarm threshold
0 Tx Power Low Alarm Set when transmitted average optical power exceeds low alarm threshold
113 7 Rx Power High Alarm Set when received average optical power exceeds high alarm threshold
6 Rx Power Low Alarm Set when received average optical power exceeds low alarm threshold
0-5 Reserved
116 7 Temp High Warning Set when transceiver internal temperature exceeds high warning threshold
6 Temp Low Warning Set when transceiver internal temperature exceeds low warning threshold
5 Vcc High Warning Set when transceiver internal supply voltage exceeds high warning threshold
4 Vcc Low Warning Set when transceiver internal supply voltage exceeds low warning threshold
3 Tx Bias High Warning Set when transceiver laser bias current exceeds high warning threshold
2 Tx Bias Low Warning Set when transceiver laser bias current exceeds low warning threshold
1 Tx Power High Warning Set when transmitted average optical power exceeds high warning threshold
0 Tx Power Low Warning Set when transmitted average optical power exceeds low warning threshold
117 7 Rx Power High Warning Set when received average optical power exceeds high warning threshold
6 Rx Power Low Warning Set when received average optical power exceeds low warning threshold
0-5 Reserved
17
Figure 5. Module drawing.
AFBR-57M5APZ
AFBR-57M5APZ
18
Figure 6. SFP host board mechanical layout.
2x 1.7
20x 0.5 ± 0.03
0.9
2 ± 0.005 TYP.
0.06 L A S B S
10.53 11.93
20
10
11
PIN 1
20
10 11
PIN 1
0.8
TYP.
10.93
9.6
2x 1.55 ± 0.05
3.2
5
LEGEND
1. PADS AND VIAS ARE CHASSIS GROUND
2. THROUGH HOLES, PLATING OPTIONAL
3. HATCHED AREA DENOTES COMPONENT
AND TRACE KEEPOUT (EXCEPT
CHASSIS GROUND)
4. AREA DENOTES COMPONENT
KEEPOUT (TRACES ALLOWED)
DIMENSIONS ARE IN MILLIMETERS
4
3
2
1
1
26.8 5
11x 2.0
10
3x
41.3
42.3
B
10x 1.05 ± 0.01
16.25
REF. 14.25
11.08
8.58
5.68
2.0
11x
11.93
9.6
4.8
8.48
A
3.68
SEE DETAIL 1
9x 0.95 ± 0.05
2.5
7.17.2
2.5
10
3x
34.5
16.25
MIN. PITCH
YX
DETAIL 1
0.85 ± 0.05
PCB
EDGE
0.06 L A S B S
0.1 L A S B S
0.1 L X A S
0.1 L X A S
0.1 S X Y
19
Figure 7. SFP Assembly drawing.
41.78 ± 0.5
3.5 ± 0.3
1.7 ± 0.9
Tcase REFERENCE POINT
PCB
10 REF
(to PCB)
0.4 ± 0.1
(below PCB)
10.4 ± 0.1
15.25 ± 0.1
16.25 ± 0.1 MIN. PITCH
DIMENSIONS ARE IN MILLIMETERS
11.73 REF
CAGE ASSEMBLY
9.8 MAX.
15 MAX.
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
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Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2005 Agilent Technologies, Inc.
September 21, 2005
5989-2639EN
Customer Manufacturing Processes
This module is pluggable and is
not designed for aqueous wash,
IR reflow, or wave soldering
processes.