NTMFS4C05N
http://onsemi.com
8
PACKAGE DIMENSIONS
DFN5 5x6, 1.27P
(SO−8FL)
CASE 506CX
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH PROTRUSIONS OR GATE BURRS.
DIM MIN
MILLIMETERS
A0.90
b0.30
c0.11
D5.30 BSC
D1 4.80
D2 4.05
E6.00 BSC
E1 4.80
E2 3.30
e1.27 BSC
G0.70
K0.90
L0.50
MAX
1.00
0.50
0.22
5.20
4.45
5.20
3.70
0.90
1.30
0.70
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
1.27 0.75
6.59
5.46
0.79
1
2.10
2X
4X
4.74
0.43
2X
PITCH
1.15
4X
SIDE VIEW
A
cCSEATING
PLANE
PIN 1
TOP VIEW
D1
E1
D
E
3
3
B
A
0.15 C
0.30 C
2X
2X
BOTTOM VIEW
G
e/2 8X
D2
L
E2
K
b
A0.10 BC
0.05 C
IDENTIFIER
0.05 C
0.10 C
4X
4X
e
14
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