LM62 www.ti.com SNIS105E - JUNE 1999 - REVISED MARCH 2013 LM62 2.7V, 15.6 mV/C SOT-23 Temperature Sensor Check for Samples: LM62 FEATURES DESCRIPTION * * The LM62 is a precision integrated-circuit temperature sensor that can sense a 0C to +90C temperature range while operating from a single +3.0V supply. The LM62's output voltage is linearly proportional to Celsius (Centigrade) temperature (+15.6 mV/C) and has a DC offset of +480 mV. The offset allows reading temperatures down to 0C without the need for a negative supply. The nominal output voltage of the LM62 ranges from +480 mV to +1884 mV for a 0C to +90C temperature range. The LM62 is calibrated to provide accuracies of 2.0C at room temperature and +2.5C/-2.0C over the full 0C to +90C temperature range. 1 2 * Calibrated Linear Scale Factor of +15.6 mV/C Rated for Full 0C to +90C Range with 3.0V Supply Suitable for Remote Applications APPLICATIONS * * * * * * * * * Cellular Phones Computers Power Supply Modules Battery Management FAX Machines Printers HVAC Disk Drives Appliances KEY SPECIFICATIONS * * * * * * Accuracy at 25C 2.0 or 3.0C (max) Temperature Slope +15.6 mV/C Power Supply Voltage Range +2.7V to +10V Current Drain @ 25C 130 A (max) Nonlinearity 0.8C (max) Output Impedance 4.7 k (max) Connection Diagram The LM62's linear output, +480 mV offset, and factory calibration simplify external circuitry required in a single supply environment where reading temperatures down to 0C is required. Because the LM62's quiescent current is less than 130 A, selfheating is limited to a very low 0.2C in still air. Shutdown capability for the LM62 is intrinsic because its inherent low power consumption allows it to be powered directly from the output of many logic gates. Typical Application See Package Number DBZ VO = (+15.6 mV/C x TC) + 480 mV Figure 1. Full-Range Centigrade Temp. Sensor (0C to +90C) Stabilizing a Crystal Oscillator Temperature (T) Typical VO +90C +1884 mV +70C +1572 mV +25C 870 mV 0C +480 mV 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1999-2013, Texas Instruments Incorporated LM62 SNIS105E - JUNE 1999 - REVISED MARCH 2013 www.ti.com Absolute Maximum Ratings (1) Supply Voltage +12V to -0.2V Output Voltage (+VS + 0.6V) to -0.6V Output Current 10 mA Input Current at any pin (2) 5 mA -65C to +150C Storage Temperature Junction Temperature, max (TJMAX) ESD Susceptibility (3) +125C Human Body Model 2500V Machine Model (1) (2) (3) 250V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > +VS), the current at that pin should be limited to 5 mA. The human body model is a 100 pF capacitor discharged through a 1.5 k resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. Operating Ratings (1) Specified Temperature Range TMIN TA TMAX LM62B, LM62C 0C TA +90C Supply Voltage Range (+VS) +2.7V to +10V Thermal Resistance, JA (2) 450C/W Soldering process must comply with Texas Instruments' Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging (3) (1) (2) (3) 2 Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. The junction to ambient thermal resistance (JA) is specified without a heat sink in still air. Reflow temperature profiles are different for lead-free and non-lead-free packages. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM62 LM62 www.ti.com SNIS105E - JUNE 1999 - REVISED MARCH 2013 Electrical Characteristics Unless otherwise noted, these specifications apply for +VS = +3.0 VDC. Boldface limits apply for TA = TJ = TMIN to TMAX ; all other limits TA = TJ = 25C. Parameter Conditions Typical (1) Accuracy (3) Output Voltage at 0C Sensor Gain (Average Slope) +16 +3.0V +VS +10V 0C TA +75C, +VS= +2.7V Line Regulation (5) LM62C Limits (2) Units (Limit) 2.0 3.0 C (max) +2.5/-2.0 +4.0/-3.0 C (max) 0.8 1.0 C (max) +16.1 +15.1 +16.3 +14.9 mV/C (max) mV/C (min) 4.7 4.7 k (max) +480 Nonlinearity (4) Output Impedance LM62B Limits (2) mV 4.4 4.4 k (max) +3.0V +VS +10V 1.13 1.13 mV/V (max) +2.7V +VS +3.3V, 0C TA +75C 9.7 9.7 mV (max) 130 165 130 165 A (max) A (max) Quiescent Current +2.7V +VS +10V 82 Change of Quiescent Current +2.7V +VS +10V 5 A 0.2 A/C 0.2 C Temperature Coefficient of Quiescent Current Long Term Stability (6) (1) (2) (3) (4) (5) (6) TJ=TMAX=+100C, for 1000 hours Typicals are at TJ = TA = 25C and represent most likely parametric norm. Limits are ensured to Texas Instruments' AOQL (Average Outgoing Quality Level). Accuracy is defined as the error between the output voltage and +15.6 mV/C times the device's case temperature plus 480 mV, at specified conditions of voltage, current, and temperature (expressed in C). Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's rated temperature range. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered; allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after 1000 hours will not continue at the first 1000 hour rate. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM62 3 LM62 SNIS105E - JUNE 1999 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics To generate these curves the LM62 was mounted to a printed circuit board as shown in Figure 12. 4 Thermal Resistance Junction to Air Thermal Time Constant Figure 2. Figure 3. Thermal Response in Still Air with Heat Sink Thermal Response in Stirred Oil Bath with Heat Sink Figure 4. Figure 5. Thermal Response in Still Air without a Heat Sink Quiescent Current vs. Temperature Figure 6. Figure 7. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM62 LM62 www.ti.com SNIS105E - JUNE 1999 - REVISED MARCH 2013 Typical Performance Characteristics (continued) To generate these curves the LM62 was mounted to a printed circuit board as shown in Figure 12. Accuracy vs Temperature Noise Voltage Figure 8. Figure 9. Supply Voltage vs Supply Current Start-Up Response Figure 10. Figure 11. Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM62 5 LM62 SNIS105E - JUNE 1999 - REVISED MARCH 2013 www.ti.com CIRCUIT BOARD 1/2 Square Printed Circuit Board with 2 oz. Copper Foil or Similar. Figure 12. Printed Circuit Board Used for Heat Sink to Generate All Curves Mounting The LM62 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface. The temperature that the LM62 is sensing will be within about +0.2C of the surface temperature that LM62's leads are attached to. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature measured would be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity the backside of the LM62 die is directly attached to the GND pin. The lands and traces to the LM62 will, of course, be part of the printed circuit board, which is the object whose temperature is being measured. These printed circuit board lands and traces will not cause the LM62's temperature to deviate from the desired temperature. Alternatively, the LM62 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM62 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM62 or its connections. The thermal resistance junction to ambient (JA) is the parameter used to calculate the rise of a device junction temperature due to its power dissipation. For the LM62 the equation used to calculate the rise in the die temperature is as follows: TJ = TA + JA [(+VS IQ) + (+VS - VO) IL] (1) where IQ is the quiescent current and ILis the load current on the output. Since the LM62's junction temperature is the actual temperature being measured care should be taken to minimize the load current that the LM62 is required to drive. The table shown in Table 1 summarizes the rise in die temperature of the LM62 without any loading, and the thermal resistance for different conditions. Table 1. Temperature Rise of LM62 Due to Self-Heating and Thermal Resistance (JA) SOT-23 no heat sink (1) Still air SOT-23 small heat fin (2) JA (C/W) TJ - TA (C) JA (C/W) 450 0.17 260 0.1 180 0.07 Moving air (1) (2) 6 TJ - TA (C) Part soldered to 30 gauge wire. Heat sink used is 1/2 square printed circuit board with 2 oz. foil with part attached as shown in Figure 12 . Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM62 LM62 www.ti.com SNIS105E - JUNE 1999 - REVISED MARCH 2013 Capacitive Loads The LM62 handles capacitive loading well. Without any special precautions, the LM62 can drive any capacitive load as shown in Figure 13. Over the specified temperature range the LM62 has a maximum output impedance of 4.7 k. In an extremely noisy environment it may be necessary to add some filtering to minimize noise pickup. It is recommended that 0.1 F be added from +VS to GND to bypass the power supply voltage, as shown in Figure 14. In a noisy environment it may be necessary to add a capacitor from the output to ground. A 1 F output capacitor with the 4.7 k maximum output impedance will form a 34 Hz lowpass filter. Since the thermal time constant of the LM62 is much slower than the 30 ms time constant formed by the RC, the overall response time of the LM62 will not be significantly affected. For much larger capacitors this additional time lag will increase the overall response time of the LM62. Figure 13. LM62 No Decoupling Required for Capacitive Load Figure 14. LM62 with Filter for Noisy Environment Figure 15. Simplified Schematic Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM62 7 LM62 SNIS105E - JUNE 1999 - REVISED MARCH 2013 www.ti.com Applications Circuits V+ VTEMP R3 VT1 R4 VT2 LM4040 V+ VT R1 4.1V U3 0.1 PF R2 (Low = overtemp alarm) + U1 - VOUT VOUT LM7211 VT1 = (4.1)R2 R2 + R1||R3 VT2 = (4.1)R2||R3 R1 + R2||R3 LM62 VTemp U2 Figure 16. Centigrade Thermostat Figure 17. Conserving Power Dissipation with Shutdown 8 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM62 LM62 www.ti.com SNIS105E - JUNE 1999 - REVISED MARCH 2013 REVISION HISTORY Changes from Revision D (March 2013) to Revision E * Page Changed layout of National Data Sheet to TI format ............................................................................................................ 8 Submit Documentation Feedback Copyright (c) 1999-2013, Texas Instruments Incorporated Product Folder Links: LM62 9 PACKAGE OPTION ADDENDUM www.ti.com 27-Oct-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM62BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 90 T7B LM62BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 90 T7B LM62CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 90 T7C LM62CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 90 T7C (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 1-Oct-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LM62BIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 LM62BIM3X/NOPB SOT-23 DBZ 3 3000 178.0 LM62CIM3/NOPB SOT-23 DBZ 3 1000 178.0 LM62CIM3X/NOPB SOT-23 DBZ 3 3000 178.0 3.3 2.9 1.22 4.0 8.0 Q3 8.4 3.3 2.9 1.22 4.0 8.0 Q3 8.4 3.3 2.9 1.22 4.0 8.0 Q3 8.4 3.3 2.9 1.22 4.0 8.0 Q3 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 1-Oct-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM62BIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM62BIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM62CIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM62CIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 Pack Materials-Page 2 4203227/C PACKAGE OUTLINE DBZ0003A SOT-23 - 1.12 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 2.64 2.10 1.4 1.2 PIN 1 INDEX AREA 1.12 MAX B A 0.1 C 1 0.95 3.04 2.80 1.9 3X 3 0.5 0.3 0.2 2 (0.95) C A B 0.25 GAGE PLANE 0 -8 TYP 0.10 TYP 0.01 0.20 TYP 0.08 0.6 TYP 0.2 SEATING PLANE 4214838/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length. www.ti.com EXAMPLE BOARD LAYOUT DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR PKG 3X (1.3) 1 3X (0.6) SYMM 3 2X (0.95) 2 (R0.05) TYP (2.1) LAND PATTERN EXAMPLE SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214838/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR PKG 3X (1.3) 1 3X (0.6) SYMM 3 2X(0.95) 2 (R0.05) TYP (2.1) SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X 4214838/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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